Texas Instruments HSS-MOTHERBOARDEVM User manual

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High Side Switch Motherboard Evaluation Module
User's Guide
SLVUBD4A–January 2018–Revised December 2018
High Side Switch Motherboard Evaluation Module
The HSS-MOTHERBOARDEVM evaluation module is designed to evaluate the <50-mΩRon devices in
TI's high side switch portfolio. These devices include TPS1HA08-Q1, TPS2HB08-Q1, TPS2HB16-Q1,
TPS2HB35-Q1, and TPS2HB50-Q1. This board does not come with the devices populated but allows any
of the devices to be soldered down on the sample daughter card and used in the main motherboard. This
user's guide provides the connectors and test point description, schematic, bill of materials (BOM), and
board layout of the EVM.
NOTE: This EVM does NOT come with devices populated on the board. The user MUST order
samples separately.
Contents
1 Introduction ................................................................................................................... 2
1.1 Descriptions ......................................................................................................... 2
1.2 Applications.......................................................................................................... 2
1.3 Features.............................................................................................................. 3
2 HSS-MOTHERBOARDEVM Schematic .................................................................................. 4
3 Connections Descriptions................................................................................................... 7
3.1 Connectors and Test Points....................................................................................... 7
3.2 Jumpers.............................................................................................................. 8
4 TPS2HB08-50EVM EVM Assembly Drawings and Layout............................................................. 9
5 Current Limit ................................................................................................................ 11
6 Current Sense .............................................................................................................. 11
7 Transient Protection........................................................................................................ 11
8 Soldering Down U2 ........................................................................................................ 11
9 Bill of Materials ............................................................................................................. 11
List of Figures
1 HSS-MOTHERBOARDEVM Motherboard Schematic.................................................................. 5
2 HSS-MOTHERBOARDEVM Sample Daughter Card Schematic...................................................... 6
3 HSS-MOTHERBOARDEVM Layout and Routing (Top View) ......................................................... 9
4 HSS-MOTHERBOARDEVM Layout and Routing (Bottom View).................................................... 10
List of Tables
1 Connector and Test Point Descriptions................................................................................... 7
2 Jumper Descriptions......................................................................................................... 8
Trademarks
All trademarks are the property of their respective owners.

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High Side Switch Motherboard Evaluation Module
1 Introduction
Texas Instruments' HSS-MOTHERBOARDEVM evaluation module has a central socket for the supporting
daughtercard with the high side switch device to be populated. The EVM supports the entire single-
channel and dual channel low Ron (≤50-mΩ) high-side driver applications. The purpose of this EVM is to
facilitate evaluation of the low Ron high side switches for the diagnostic features and drive resistive,
capacitive, and inductive loads.
The EVM is a combination of a central motherboard and a row of daughterboards. The mother board has
all connectors, jumpers, and test points. The daughter board has different footprints to support the low
Ron family of TI's high side switch portfolio. The daughter board also has limiting resistors for the channel
devices (TPS2HBxx-Q1) and since the 1 channel device (TPS1HA08-Q1) has a NC pin in that location the
daughtercards will work for all of the devices.
The daughterboards have 2 different footprints: 24 pin PWP and 16 pin PWP. For installation, a single
board from the panel has to broken, a device soldered down onto the main footprint, and connected to the
motherboard.
NOTE: Caution must be taken when soldering down the device as the main power pad on the back
needs to be soldered correctly as to not affect performance. Please see PowerPAD
Thermally Enhanced Package app note for more details about the solder profile and
techniques.
The current-limiting resistors are on the bottom side of the daughterboard. They are all 10-kΩ, 0805
package. For the desired current limit value, the resistor can be replaced with different value. Also for the
single channel devices the second resistor should be depopulated.
The jumpers are not installed. Refer to Table 1 and Table 2 for installation.
1.1 Descriptions
The Texas Instruments HSS-MOTHERBOARDEVM helps designers evaluate the operation and
performance of the TPS1HA08-Q1, TPS2HB08-Q1, TPS2HB16-Q1, TPS2HB35-Q1 and TPS2HB50-Q1
devices.
These devices are fully-protected high-side switches, with an integrated NMOS power FET, and charge
pump. Full diagnostics and high-accuracy current sense features enable intelligent control of the load.
The device diagnostic reporting supports load current status and device temperature on an analog sense
output pin SNS. The SNS pin sources a current proportional to the selected parameter. By adding a
pulldown resistor on the SNS pin, the developed voltage is proportional to the selected parameter as well.
The diagnostics can be disabled for multiplexing the sense pin between different devices.
1.2 Applications
The EVM is used in the following applications:
• High-side relay drivers
• High-side power switch for submodule power supply
• Bulb driver
• General resistive, inductive, and capacitive loads
• Replace electromechanical relays and fuses

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1.3 Features
The EVM supports the following features:
• Single or Dual-channel high-side power switches, tested according to AECQ100-12
• Operating voltage 3 V to 18V
• Operating temperature: –40ºC to 125ºC
• Microcontroller input control: 3.3-V and 5-V logic compatible
• High-accuracy current sense
– Analog current sense as a ratio of the load current or device temperature
• Protection:
– Reverse battery protection with external ground network
– Short-circuit protection
– Overvoltage protection
– Thermal shutdown and thermal swing with self-recovery
– ESD protection
• Diagnostic:
– On and off state output open or short to battery detection
– Overload and short-to-ground detection and power limiting
– Thermal shutdown and thermal swing diagnostic
– Immediate shutdown or continuous clamping during fault current condition
– Diagnostic enable function for multiplexing of MCU analog or digital port

HSS-MOTHERBOARDEVM Schematic www.ti.com
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2 HSS-MOTHERBOARDEVM Schematic
Figure 1 and Figure 2 illustrate the TPS2HB08-50EVM motherboard and daughterboard schematics, respectively.

www.ti.com HSS-MOTHERBOARDEVM Schematic
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Figure 1. HSS-MOTHERBOARDEVM Motherboard Schematic

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Figure 2. HSS-MOTHERBOARDEVM Sample Daughter Card Schematic

www.ti.com Connections Descriptions
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3 Connections Descriptions
3.1 Connectors and Test Points
Table 1 lists the EVM connector and test point descriptions.
Table 1. Connector and Test Point Descriptions
Connectors and Test Points Descriptions
J23 High-current input terminal for VBB
J26 High-current output for VOUT1
J27 High-current output for VOUT2
J28 High-current output for paralleling 2 channels into single channel VOUT
J25 High-current input terminal for GND
Vbb_Sense (TP11) Test point used to measure VBB Votlage
Vout1_Sense (TP10) Test point to measure VOUT1 Voltage
Vout2_Sense (TP12) Test point to measure VOUT2 Voltage
EN1 (TP3) Test point used to apply power to EN1, only use when J9 is not connected to 5V or GND
EN2 (TP7) Test point used to apply power to EN2, only use when J13 is not connected to 5V or GND.
Only for 2 channel devices.
DIA_EN (TP4) Test point used to apply power to DIA_EN, only use when J10 is not connected to 5 V or
GND
SEL1 (TP5) Test point used to apply power to SEL1, only use when J12 is not connected to 5 V or GND
SEL2 (TP6) Test point used to apply power to SEL2, only use when J11 is not connected to 5 V or GND
LATCH (TP2) Test point used to apply power to LATCH, only use when J8 is not connected to 5 V or GND
SNS (TP1) Test point used to measure SNS
TP17 Connects to ISNS1 on the daughtercard
TP18 Connects to ISNS2 on the daughtercard. Only for 2 channel devices.
TP8 5-V external input terminal for 5-V EVM
TP13, TP14, TP15, TP16 This is a direct connection to the GND plane of the EVM

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3.2 Jumpers
Table 2 lists the EVM jumper descriptions.
Table 2. Jumper Descriptions
Jumpers Description
J9 This jumper is used to connect the EN1 pin to 5 V (1-2) or GND (2-3).
J13 This jumper is used to connect the EN2 pin to 5V (1-2) or GND (2-3). Only for 2 channel devices
J10 This jumper is used to connect the DIA_EN pin to 5 V (1-2) or GND (2-3)
J12 This jumper is used to connect the SEL1 pin to 5 V (1-2) or GND (2-3).
J11 This jumper is used to connect SEL2 pin to 5 V (1-2) or GND (2-3)
J4 This jumper connects the TLV70450DBVR ground pin 1 to EVM GND. This with J5 enables LDO
J24 This jumper is used to bypass the ground network used for reverse polarity protection
J3 This jumper is used to power the 5-V TLV70450DBVR LDO with the VBB input for the EVM
J8 This jumper is used to connect the LATCH pin to 5 V (1-2) or GND (2-3)
J5 This jumper connects TLV70450DBVR output to LDO_5V. This with J4 enables LDO.
J6 This jumper connects LDO_5V to the 5-V supply net on the EVM (1-2) or Extern_5V (2-3)
J1, J2, J16 These jumpers connect the motherboard to the daughterboard
J17, J18, J19 Connect Vout1 to single channel
J20, J21, J22 Connect Vout2 to single channel

www.ti.com TPS2HB08-50EVM EVM Assembly Drawings and Layout
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4 TPS2HB08-50EVM EVM Assembly Drawings and Layout
Figure 3 show the design of the HSS-MOTHERBOARDEVM and daughterboard PCB. The EVM was
designed using FR4 material on a two-layer board. All components are located in an active area on the
top side and active traces are provided in the top and bottom layers to allow the user to easily view,
probe, and evaluate. Moving components to both sides of the PCB can offer additional size reduction for
space-constrained systems.
Figure 3. HSS-MOTHERBOARDEVM Layout and Routing (Top View)

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Figure 4. HSS-MOTHERBOARDEVM Layout and Routing (Bottom View)