Texas Instruments TPSM846C23 User manual

1
SLVUB26C–May 2017–Revised June 2018
Submit Documentation Feedback Copyright © 2017–2018, Texas Instruments Incorporated
Operating TPSM846C23 in Parallel
User's Guide
SLVUB26C–May 2017–Revised June 2018
Operating TPSM846C23 in Parallel
This user’s guide contains information for the TPSM846C23DEVM-807 evaluation module (PWR807).
Also included are the performance specifications, schematic, bill of materials (BOM), and layout of the
EVM.
Contents
1 Description.................................................................................................................... 2
2 Getting Started............................................................................................................... 2
3 Test Point Descriptions ..................................................................................................... 4
4 Operation Notes.............................................................................................................. 5
5 Performance Data ........................................................................................................... 6
6 Schematic..................................................................................................................... 7
7 Bill of Material ................................................................................................................ 8
8 PCB Layout................................................................................................................... 9
List of Figures
1 EVM User Interface.......................................................................................................... 2
2 Efficiency...................................................................................................................... 6
3 Power Dissipation............................................................................................................ 6
4 Output Voltage Ripple....................................................................................................... 6
5 TPSM846C23DEVM-807 Schematic...................................................................................... 7
6 Top Components ............................................................................................................ 9
7 Topside Copper.............................................................................................................. 9
8 Layer 2 Copper .............................................................................................................. 9
9 Layer 3 Copper .............................................................................................................. 9
10 Layer 4 Copper .............................................................................................................. 9
11 Layer 5 Copper .............................................................................................................. 9
12 Bottom-Side Copper ....................................................................................................... 10
13 Bottom Components ....................................................................................................... 10
List of Tables
1 Test Points.................................................................................................................... 4
2 TPSM846C23DEVM-807 Bill of Material ................................................................................. 8
Trademarks
PMBus is a trademark of SMIF, Incorporated.
All other trademarks are the property of their respective owners.

Description www.ti.com
2SLVUB26C–May 2017–Revised June 2018
Submit Documentation Feedback
Copyright © 2017–2018, Texas Instruments Incorporated
Operating TPSM846C23 in Parallel
1 Description
The TPSM846C23 is a PMBus™ enabled, synchronous buck power module designed to provide up to 35
A of output current. The TPSM846C23 can be paralleled with two devices to achieve output current up to
70 A. The TPSM846C23 is a highly-integrated, PMBus-enabled DC-DC power module that combines a
35-A DC/DC converter with power MOSFETs, a shielded inductor, some input and output capacitors, and
passives into a low profile package. The input voltage range is 4.5 V to 15 V. The output voltage range is
0.35 V to 2 V. The PMBus interface provides for converter configuration as well as monitoring of key
parameters including output voltage, output current, and the internal die temperature, as well as many
user-programmable configuration options.
This evaluation module is designed to demonstrate the ease-of-use and small printed-circuit-board area
that may be achieved when paralleling two TPSM846C23 power modules. Monitoring test points are
provided to allow measurement of efficiency, power dissipation, input ripple, output ripple, line and load
regulation, and transient response. Additionally, control test points are provided for use of the power good,
and synchronization features of the device. The EVM uses a recommended PCB layout that maximizes
thermal performance and minimizes output ripple and noise.
2 Getting Started
Figure 1 highlights the user interface items associated with the EVM. The polarized input power terminal
block (TB1) is used for connection to the host input supply. TB2 and TB3 allow 4 terminals for VOUT and
TB4 and TB5 allow 4 terminals for PGND for connection to the load. These terminal blocks can except up
to 12 AWG wire.
Figure 1. EVM User Interface
The VIN Monitor (VIN and PGND) and VOUT Monitor (VS+ and VS–) test points located near the input
terminal block and the output terminal blocks are intended to be used as voltage monitoring points where
voltmeters can be connected to measure the input and output voltages. Do not use these VIN and VOUT
monitoring test points as the input supply or output load connection points. The PCB traces
connecting to these test points are not designed to support high currents.

www.ti.com Getting Started
3
SLVUB26C–May 2017–Revised June 2018
Submit Documentation Feedback Copyright © 2017–2018, Texas Instruments Incorporated
Operating TPSM846C23 in Parallel
The VIN Scope (J1) and VOUT Scope (J2) test points can be used to monitor VIN and VOUT waveforms
with an oscilloscope. These test points are intended for use with un-hooded scope probes outfitted with a
low-inductance ground lead (ground spring) mounted to the scope probe barrel. The two sockets of each
test point are on 0.1 inch centers. The scope probe tip should be inserted into the socket labeled VIN or
VOUT, and the scope probe ground lead should be inserted into the hole of the socket labeled PGND.
The test points located directly below the device are made available to test the features of the device. Any
external connections made to these test points should be referenced to one of the AGND test points
located along the bottom of the EVM. Refer to the Test Point Descriptions section of this guide for more
information on the individual control test points.
The PMBus connector (P1) is provided to connect the USB-to-GPIO interface pod to the EVM. The USB-
to-GPIO interface pod connects the EVM to a computer USB port which allows the TI “Fusion” Graphical
User Interface (GUI) to communicate and control the EVM. To download the latest software visit,
http://www.ti.com/tool/fusion_digital_power_designer.
The ALERT, DATA, CLK, and CNTL test points are used to monitor and control the module via PMBus.
Reference the TPS546C23 PG1.0 Supported PMBus Commands document for details on the supported
PMBus commands.
The Vout Gain jumper (P4) is used to set the output voltage. Select X1 for an output voltage between
0.35 V–1.65 V and select X2 for output voltages between 0.70 V–2 V. The default loading is the X1
position.
The Comp Select jumper (P2) sets the proper frequency compensation for the total amount of output
capacitance present on the VOUT bus. The EVM is shipped with approximately 2000 µF of output
capacitance loaded on the board. Locations are provided on the board to add another 2000 µF of output
capacitance (C28–C31). The default jumper load is the 2000 µF position.
When two TPSM846C23 devices are paralleled, the SYNC pins of the Master and the Slave must be
supplied with a 50% duty cycle external clock signal at the desired switching frequency. A 500-kHz clock
is present on the EVM which supplies the required 50% duty cycle signal. The Master device (U1) locks to
the rising edge of the clock and the Slave device (U2) locks to the falling edge of the clock.
Resistors R5, R6, R7, and R8 set the PMBus address for the modules. The master module PMBus
address is 54 decimal (36 hex) and the slave address is 52 decimal (34 hex).

Test Point Descriptions www.ti.com
4SLVUB26C–May 2017–Revised June 2018
Submit Documentation Feedback
Copyright © 2017–2018, Texas Instruments Incorporated
Operating TPSM846C23 in Parallel
3 Test Point Descriptions
Wire-loop test points and scope probe test points are provided as convenient connection points for digital
voltmeters (DVM) or oscilloscope probes to aid in the evaluation of the device. A description of each test
point follows:
Table 1. Test Points
VIN Input voltage monitor. Connect DVM to this point for measuring efficiency.
VS+ Supply path output voltage monitor. Connect DVM positive lead to this point for line regulation and load
regulation.
VS– Return path output voltage monitor. Connect DVM negative lead to this point for measuring line regulation
and load regulation.
VOUT Output voltage monitor. Connect DVM to this point and PGND for measuring efficiency.
PGND Input and output voltage monitor grounds. Reference the VIN and VOUT DVMs to these ground points.
VIN MON (J1) Input voltage scope monitor. Connect an oscilloscope to this set of points to measure input ripple voltage.
VOUT MON (J2) Output voltage scope monitor. Connect an oscilloscope to this set of points to measure output ripple voltage
and transient response.
AGND Analog ground point. Use any of the AGND test points as the ground reference for the control signals.
ALERT PMBus ALERT line, used to monitor the ALERT signal.
CLK PMBus CLK line, used to monitor the CLK signal.
DATA PMBus DATA line, used to monitor the DATA signal.
CNTL Control pin. Pull to AGND to stop power conversion. Float or pull to 3.3 V to enable power conversion. An
internal 10-kΩpullup resistor to 3.3 V is present on the EVM.
EXT CLK External clock input. This is the input to a D flip-flop. Apply an external clock at a frequency that is twice the
required switching frequency. Remove R13 before applying the clock signal.
SYNC SYNC monitor pin. This pin is the output of a D flip-flop which supplies a clock to both devices.
PGOOD Monitors the power good signal of the device. This is an open drain signal that has an on-board 10-kΩpullup
resistor the 3.3 V.
DIFFO Output of remote sense differential amplifier.
Signal Signal injection point for Bode plot analyzer. Inject from Signal to CHB.
CHA Input signal monitoring point for Bode plot analyzer.
CHB Output signal monitoring point for Bode plot analyzer.
PH1 Switch node of the TPSM846C23 Master device (U1). Use an unshielded scope probe to monitor this point.
PH2 Switch node of the TPSM846C23 Slave device (U2). Use an unshielded scope probe to monitor this point.
NOTE: Refer to the product data sheet (SLVSDF3) for absolute maximum ratings associated with
features in Table 1.

www.ti.com Operation Notes
5
SLVUB26C–May 2017–Revised June 2018
Submit Documentation Feedback Copyright © 2017–2018, Texas Instruments Incorporated
Operating TPSM846C23 in Parallel
4 Operation Notes
In order to operate the EVM, apply a valid input voltage of 4.5 V to 15 V. The undervoltage lock-out
(UVLO) can be programmed the PMBus commands.
The output voltage is set at the factory to 0.6 V. It can be programmed over the allowable VOUT range by
using the PMBus VOUT_COMMAND.
The Power Good (PGOOD) indicator of the EVM will assert high when the output voltage is within ±5% of
the programmed output voltage value. A 10-kΩpull-up resistor (R18) is populated between the PGOOD
pin and the 3V3 pin.
The TPSM846C23DEVM-807 is set-up to operate at 500 kHz. A clock circuit is present on the bottom of
the EVM. The clock circuit produces a 500 kHz, 50% duty cycle clock that feeds both devices. If another
switching frequency is required, R23 must be removed from the clock circuit on the bottom of the EVM
and an external clock must be connected to the EXT CLK test point. The external clock applied to EXT
CLK test point must be 2× the required frequency. The device can be synchronized to an external clock
over the frequency range of 300 kHz to 1 MHz. Refer to the product data sheet for further information on
synchronization.
The TPSM846C23DEVM-807 includes both input and output capacitors. The EVM includes footprints for
adding additional input and output capacitors to the EVM. Adding additional capacitance will improve
transient response. The actual capacitance required will depend on the input and output voltage conditions
of the particular application, along with the desired transient response. Refer to the product data sheet for
further information on input and output capacitance and transient response.
This EVM is designed to be used with the USB-to-GPIO pod which enables communication over the
PMBus.
Jumper settings should not be changed while the module is powered. Permanent damage may occur.

Output Current (A)
Output Voltage Ripple (mV)
0 10 20 30 40 50 60 70
6
7
8
9
10
11
12
13
D003
1.8 V
1.2 V
0.8 V
Output Current (A)
Efficiency (%)
0 10 20 30 40 50 60 70
55
60
65
70
75
80
85
90
95
100
D001
1.8 V
1.2 V
0.8 V
Output Current (A)
Power Dissipation (W)
0 10 20 30 40 50 60 70
0
2
4
6
8
10
12
14
16
18
D002
1.8 V
1.2 V
0.8 V
Performance Data www.ti.com
6SLVUB26C–May 2017–Revised June 2018
Submit Documentation Feedback
Copyright © 2017–2018, Texas Instruments Incorporated
Operating TPSM846C23 in Parallel
5 Performance Data
VIN = 12 V, Fsw = 500 kHz, COUT = 4× 47-µF ceramic plus 4× 470 µF polymer
Figure 2. Efficiency Figure 3. Power Dissipation
Figure 4. Output Voltage Ripple

VIN
PGND
VS+
VOUT
PGND
PGND
PVIN
USB
0.01µF
C5
TP9
1
2
J1
1
2
J2
10.0k
R18
AGND
AGND
330µF
C1
470µF
C25
PGND
VOUT
VOUT
VIN
AGND
4.7µF
C11
1µF
C15
PGND
49.9
R9
330µF
C2
0.01µF
C6
47µF
C21
47µF
C22
470µF
C26
470µF
C27
470µF
C28
TP1
TP15 TP16 TP17
0.1µF
C12
4.99k
R17
0.01µF
C16
2.2µF
C17
10.0k
R16 TP6
TP5
TP7
10.0k
R15
AGND
USB
Power
Interface
121k
R5
121k
R6
PGND
PGND
2000uF
4000uF
10.0k
R20
TP19
665
R13 1500pF
C33
499
R14 2200pF
C34
AGND
x1
x2
TP13
6V5M
VINBP
3V3M
VIN_RTN
RT
RT_SEL
AGND
PGND
VSHARE
PGOOD
SYNC
DATA
CLK
ALERT
CNTL
ADDR1
ADDR0
Signal CHA CHB
VIN
VOUT
VS-
DIFFO
Comp Sel
Vout Gain
PGood
Data
Alert
Clk
FB
TP23TP22TP21
VS+
VS-
1 2
3 4
P2
1
2
TB1
Green
2
1
D1
TP8
Cntl
Alert
Data
Clk
Cntl
Ishare
Data
Clk
Alert
Cntl
Sync
1
2
TB3
1
2
TB4
TP10
TP11
GND
PGND
TP4
PH2
PH1
TP3
4.7µF
C13 0.1µF
C14
PGND
1µF
C18
0.01µF
C19
2.2µF
C20
3V3S
VIN_RTN_S
PGND
0.01µF
C9
1 2
3 4
P4
Data
Clk
Alert
Cntl
Sync
Vshare
Ishare
AGND
PGND
AGND
121k
R7
51.1k
R8
AGND
10.0
R11
10.0
R12
3V3
3V3
PGND
0.01µF
C10
1.00k
R22
49.9
R10
5.11k
R21
PGND
ISHARE
2
VSHARE
3
RT 13
NC 15
RT_RTN 14
FB 7
DNC 21
COMP 9
SYNC
11
CNTL
12
NC 1
VS- 5
BP_RTN
51
PGOOD
52
DATA
18
CLK
19
ALERT
20
PH 22
PH 23
DNC 30
PH 24
PH 25
PH 26
PH 27
PH 28
PH 29
DNC 31
DNC 8
PGND 35
PGND 34
PGND 59
PGND 42
PGND 43
VOUT 37
VOUT 38
VOUT 39
VOUT 40
VOUT 41
VOUT 55
PGND 33
PGND 54
VIN
45 VIN
44
ADDR0
17
PGND 56
PGND 57
VIN
46
DIFFO 6
VS+ 4
PGND 36
VIN
53
AGND 10
BP6_RTN
48
PGND 32
PGND 58
BP3
47
BP6
49
VINBP
50
ADDR1
16
U2
TPSM846C23MOL
ISHARE
2
VSHARE
3
RT 13
NC 15
RT_RTN 14
FB 7
DNC 21
COMP 9
SYNC
11
CNTL
12
NC 1
VS- 5
BP_RTN
51
PGOOD
52
DATA
18
CLK
19
ALERT
20
PH 22
PH 23
DNC 30
PH 24
PH 25
PH 26
PH 27
PH 28
PH 29
DNC 31
DNC 8
PGND 35
PGND 34
PGND 59
PGND 42
PGND 43
VOUT 37
VOUT 38
VOUT 39
VOUT 40
VOUT 41
VOUT 55
PGND 33
PGND 54
VIN
45 VIN
44
ADDR0
17
PGND 56
PGND 57
VIN
46
DIFFO 6
VS+ 4
PGND 36
VIN
53
AGND 10
BP6_RTN
48
PGND 32
PGND 58
BP3
47
BP6
49
VINBP
50
ADDR1
16
U1
TPSM846C23MOL
PGND
1
2
TB2
1
2
TB5
3V3
VIN 3V3
0.01µF
C35
PGND
1µF
C36
0
R1
D
1
CLK
2
Q4 VCC
5
GND 3
U5
SN74LVC1G80DCKR
0
R3
3V3
PGND
SYNC
TP12
V+
1CLOCK 2
GND 3
U4
MAX7375AXR105-T
PGND
49.9
R23
1MHz Oscillator
PGND
PH1 PH2
Vshare
VOUT
PGND
47µF
C23
47µF
C24
22µF
C7
22µF
C8
22µF
C4
22µF
C3 6V5S
VINBPS
5.11k
R19
ISHARE
470µF
C29
470µF
C30
470µF
C31
470µF
C32
1 2
3 4
5 6
7 8
9 10
P1
AWHW-10G-0202-T
TP2
NT1
Net-Tie
NT2
Net-Tie
TP14
TP18 TP20
TP24
IN
1
7
OUT 6
3
GND
U3A
TPS715A33DRVR
39.2k
R4
39.2k
R2
Copyright © 2017, Texas Instruments Incorporated
www.ti.com Schematic
7
SLVUB26C–May 2017–Revised June 2018
Submit Documentation Feedback Copyright © 2017–2018, Texas Instruments Incorporated
Operating TPSM846C23 in Parallel
6 Schematic
Figure 5 illustrates the TPSM846C23DEVM-807 schematic.
Figure 5. TPSM846C23DEVM-807 Schematic

Bill of Material www.ti.com
8SLVUB26C–May 2017–Revised June 2018
Submit Documentation Feedback
Copyright © 2017–2018, Texas Instruments Incorporated
Operating TPSM846C23 in Parallel
7 Bill of Material
Table 2 lists the TPSM846C23DEVM-807 BOM.
Table 2. TPSM846C23DEVM-807 Bill of Material
Designator Quantity Description Part Number Manufacturer
PCB 1 Printed Circuit Board - Any
U1, U2 2 TPSM846C23 TPSM846C23MOL Texas Instruments
C1, C2 2 CAP, AL, 330 µF, 25 V, +/- 20%, 0.053 ohm, TH 25ZL330MEFC10X12.5 Rubycon
C3, C4, C7, C8 4 CAP, CERM, 22 µF, 25 V, +/- 10%, X5R, 1210 GRM32ER61E226KE15L Murata
C5, C6, C9, C10,
C16, C19, C35 7 CAP, CERM, 0.01 µF, 50 V, +/- 10%, X7R, 0603 GRM188R71H103KA01D Murata
C11, C13 2 CAP, CERM, 4.7 µF, 16 V, +/- 10%, X5R, 0805 GRM21BR61C475KA88L Murata
C12, C14 2 CAP, CERM, 0.1 µF, 16 V, +/- 10%, X7R, 0603 GRM188R71C104KA01D Murata
C15, C18 2 CAP, CERM, 1 µF, 25 V, +/- 10%, X7R, 0805 GRM21BR71E105KA99L Murata
C17, C20 2 CAP, CERM, 2.2 µF, 16 V, +/- 10%, X7R, 0805 GRM21BR71C225KA12L Murata
C21, C22, C23, C24 4 CAP, CERM, 47 µF, 6.3 V, +/- 20%, X5R, 1210 GRM32ER60J476ME20L Murata
C27, C28, C31, C32 4 CAP, Tantalum Polymer, 470 µF, 6.3 V, +/- 20%, 0.01
ohm, 7343-40 SMD 6TPF470MAH Panasonic
C33 1 CAP, CERM, 1500 pF, 50 V, +/- 10%, X7R, 0402 GRM155R71H152KA01D Murata
C34 1 CAP, CERM, 2200 pF, 50 V, +/- 10%, X7R, 0402 GCM155R71H222KA37D Murata
C36 1 CAP, CERM, 1 µF, 16 V, +/- 10%, X7R, 0603 GRM188R71C105KA12D Murata
C25, C26, C29, C30 0 CAP, Tantalum Polymer, 470 µF, 6.3 V, +/- 20%, 0.01
ohm, 7343-40 SMD 6TPF470MAH Panasonic
D1 1 LED, Green, SMD 150060GS75000 Wurth Elektronik
J1, J2 2 Socket Strip, 2x1, 100mil, Black, Tin, TH 310-43-102-41-001000 Mill-Max
P1 1 Header, 2.54mm, 5×2, Gold, TH AWHW-10G-0202-T Assmann WSW
P2, P4 2 Header, 100mil, 2×2, Tin, TH PEC02DAAN Sullins Connector Solutions
R1, R3 2 RES, 0, 5%, 0.063 W, 0402 CRCW04020000Z0ED Vishay-Dale
R5, R6, R7 3 RES, 121 k, 1%, 0.063 W, 0402 CRCW0402121KFKED Vishay-Dale
R8 1 RES, 51.1 k, 1%, 0.063 W, 0402 CRCW040251K1FKED Vishay-Dale
R9, R10, R23 3 RES, 49.9, 1%, 0.1 W, 0603 CRCW060349R9FKEA Vishay-Dale
R11, R12 2 RES, 10.0, 1%, 0.1 W, 0603 CRCW060310R0FKEA Vishay-Dale
R13 1 RES, 665, 1%, 0.063 W, 0402 CRCW0402665RFKED Vishay-Dale
R14 1 RES, 499, 1%, 0.063 W, 0402 CRCW0402499RFKED Vishay-Dale
R15, R16, R18, R20 4 RES, 10.0 k, 1%, 0.063 W, 0402 CRCW040210K0FKED Vishay-Dale
R17 1 RES, 4.99 k, 1%, 0.063 W, 0402 CRCW04024K99FKED Vishay-Dale
R19, R21 2 RES, 5.11 k, 1%, 0.063 W, 0402 CRCW04025K11FKED Vishay-Dale
R22 1 RES, 1.00 k, 1%, 0.063 W, 0402 CRCW04021K00FKED Vishay-Dale
R2, R4 0 RES, 39.2 k, 1%, 0.063 W, 0402 CRCW040239K2FKED Vishay-Dale
TB1, TB2, TB3, TB4,
TB5 5 Terminal Block, 30A, 9.52mm (.375) Pitch, 2-Pos, TH OSTT7022150 On-Shore Technology
TP1, TP5, TP6, TP7,
TP8, TP9, TP10,
TP12, TP15, TP16,
TP17, TP19, R24
13 Test Point, Multipurpose, White, TH 5012 Keystone
TP2, TP11, TP13,
TP18, TP20, TP21,
TP22, TP23 8 Test Point, Multipurpose, Black, TH 5011 Keystone
TP14 1 Test Point, Multipurpose, Red, TH 5010 Keystone
TP3, TP4 0 Test Point, Multipurpose, White, TH 5012 Keystone
U3 1 Single Output LDO, 80 mA, Fixed 3.3 V Output, 2.5 to 24
V Input, 6-pin SON (DRV) TPS715A33DRVR Texas Instruments
U4 1 1MHz CMOS Silicon Oscillator, SOT-323 MAX7375AXR105-T Maxim
U5 1 Single Positive-Edge-Triggered D-Type Flip-Flop, (SOT-5) SN74LVC1G80DCKR Texas Instruments

www.ti.com PCB Layout
9
SLVUB26C–May 2017–Revised June 2018
Submit Documentation Feedback Copyright © 2017–2018, Texas Instruments Incorporated
Operating TPSM846C23 in Parallel
8 PCB Layout
Figure 6 through Figure 13 illustrate the EVM PCB layout images.
Figure 6. Top Components Figure 7. Topside Copper
Figure 8. Layer 2 Copper Figure 9. Layer 3 Copper

PCB Layout www.ti.com
10 SLVUB26C–May 2017–Revised June 2018
Submit Documentation Feedback
Copyright © 2017–2018, Texas Instruments Incorporated
Operating TPSM846C23 in Parallel
Figure 10. Layer 4 Copper Figure 11. Layer 5 Copper
Figure 12. Bottom-Side Copper Figure 13. Bottom Components

www.ti.com Revision History
11
SLVUB26C–May 2017–Revised June 2018
Submit Documentation Feedback Copyright © 2017–2018, Texas Instruments Incorporated
Revision History
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from B Revision (December 2017) to C Revision ........................................................................................... Page
• Corrected resistor references R18 and R23........................................................................................... 5
Changes from A Revision (July 2017) to B Revision ..................................................................................................... Page
• Replaced Figure 6 through Figure 13................................................................................................... 9
Changes from Original (May 2017) to A Revision ........................................................................................................... Page
• Changed the link to the digital power designer tool................................................................................... 3

STANDARD TERMS FOR EVALUATION MODULES
1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3Regulatory Notices:
3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.

FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•Reorient or relocate the receiving antenna.
•Increase the separation between the equipment and receiver.
•Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
•Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.

【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
2. 実験局の免許を取得後ご使用いただく。
3. 技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union
3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.
4EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.

6. Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8. Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated

IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES
Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to,
reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are
developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you
(individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of
this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources.
You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your
applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications
(and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You
represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1)
anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that
might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you
will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any
testing other than that specifically described in the published documentation for a particular TI Resource.
You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include
the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO
ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS.
TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT
LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF
DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL,
COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR
ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES.
You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your non-
compliance with the terms and provisions of this Notice.
This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services.
These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation
modules, and samples (http://www.ti.com/sc/docs/sampterms.htm).
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated