Texas Instruments TMCS1101EVM User manual

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TMCS1101EVM
User's Guide
SLYU051A–August 2019–Revised March 2020
TMCS1101EVM
This user’s guide describes the characteristics, operation, and use of the TMCS1101 evaluation module
(EVM). This EVM is designed to evaluate the performance of the TMCS1101 voltage output isolated Hall-
effect current sense amplifiers in a variety of configurations. Throughout this document, the terms
evaluation board, evaluation module, and EVM are synonymous with the TMCS1101EVM. This document
includes a schematic, reference printed-circuit board (PCB) layouts, and a complete bill of materials
(BOM).

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Contents
1 General Texas Instruments High Voltage Evaluation (TI HV EVM) User Safety Guidelines ...................... 3
2 Overview...................................................................................................................... 4
2.1 Kit Contents.......................................................................................................... 4
2.2 Related Documentation From Texas Instruments.............................................................. 4
3 Hardware...................................................................................................................... 5
3.1 Features.............................................................................................................. 5
3.2 Circuitry .............................................................................................................. 6
3.3 Temperature Sensor ............................................................................................... 6
4 Operation ..................................................................................................................... 7
4.1 Measurements ...................................................................................................... 8
4.2 Advanced Measurement Tips..................................................................................... 8
5 Schematics, PCB Layout, and Bill of Materials.......................................................................... 9
5.1 Schematics .......................................................................................................... 9
5.2 PCB Layout ........................................................................................................ 10
5.3 Bill of Materials .................................................................................................... 12
List of Figures
1 Low-Side Forward Current Setup.......................................................................................... 7
2 Schematic for A1 Device ................................................................................................... 9
3 Top Overlay................................................................................................................. 10
4 Top Layer ................................................................................................................... 10
5 Bottom Overlay............................................................................................................. 11
6 Bottom Layer................................................................................................................ 11
List of Tables
1 TMCS1101Ax Device Summary........................................................................................... 4
2 TMCS1101EVM Kit Contents .............................................................................................. 4
3 Related Documentation..................................................................................................... 4
4 Bill of Materials ............................................................................................................. 12
Trademarks
All trademarks are the property of their respective owners.

WARNING
www.ti.com General Texas Instruments High Voltage Evaluation (TI HV EVM) User Safety Guidelines
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TMCS1101EVM
1 General Texas Instruments High Voltage Evaluation (TI HV EVM) User Safety Guidelines
Always follow TI’s setup and application instructions, including use of all interface components within their
recommended electrical rated voltage and power limits. Always use electrical safety precautions to help
ensure your personal safety and those working around you. Contact TI's Product Information Center
http://support/ti./com for further information.
Save all warnings and instructions for future reference.
WARNING
Failure to follow warnings and instructions may result in personal injury,
property damage or death due to electrical shock and burn hazards.
The term TI HV EVM refers to an electronic device typically provided as an open framed, unenclosed
printed circuit board assembly. It is intended strictly for use in development laboratory environments,
solely for qualified professional users having training, expertise and knowledge of electrical safety risks in
development and application of high voltage electrical circuits. Any other use and/or application are strictly
prohibited by Texas Instruments. If you are not suitable qualified, you should immediately stop from further
use of the HV EVM.
1. Work Area Safety
a. Keep work area clean and orderly.
b. Qualified observer(s) must be present anytime circuits are energized.
c. Effective barriers and signage must be present in the area where the TI HV EVM and its interface
electronics are energized, indicating operation of accessible high voltages may be present, for the
purpose of protecting inadvertent access.
d. All interface circuits, power supplies, evaluation modules, instruments, meters, scopes and other
related apparatus used in a development environment exceeding 50Vrms/75VDC must be
electrically located within a protected Emergency Power Off EPO protected power strip.
e. Use stable and nonconductive work surface.
f. Use adequately insulated clamps and wires to attach measurement probes and instruments. No
freehand testing whenever possible.
2. Electrical Safety
As a precautionary measure, it is always a good engineering practice to assume that the entire EVM
may have fully accessible and active high voltages.
a. De-energize the TI HV EVM and all its inputs, outputs and electrical loads before performing any
electrical or other diagnostic measurements. Revalidate that TI HV EVM power has been safely
de-energized.
b. With the EVM confirmed de-energized, proceed with required electrical circuit configurations,
wiring, measurement equipment connection, and other application needs, while still assuming the
EVM circuit and measuring instruments are electrically live.
c. After EVM readiness is complete, energize the EVM as intended.
WARNING
While the EVM is energized, never touch the EVM or its electrical
circuits, as they could be at high voltages capable of causing electrical
shock hazard.

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TMCS1101EVM
3. Personal Safety
a. Wear personal protective equipment (for example, latex gloves or safety glasses with side shields)
or protect EVM in an adequate lucent plastic box with interlocks to protect from accidental touch.
Limitation for safe use:
EVMs are not to be used as all or part of a production unit.
2 Overview
The TMCS1101 Hall-effect current sense amplifier (also called an isolated current-sense amplifier) senses
magnetic flux generated from current passing through the lead frame at common-mode voltages from 0
VDC to 600 VDC, independent of the supply voltage. In both bidirectional (B) and unidirectional (U)
configurations, four fixed gains are available: 50 mV/A, 100 mV/A, 200 mV/A, and 400 mV/A. These
devices operate from a single 3-V to 5.5-V power supply, drawing a maximum of 5 mA of supply current
per amplifier channel. The TMCS1101 is currently available in an 8-pin, SOIC, surface-mount package.
Table 1 lists the available gain options.
Table 1. TMCS1101Ax Device Summary
Product Direction Gain
TMCS1101A1B Bidirectional 50 mV/A
TMCS1101A2B Bidirectional 100 mV/A
TMCS1101A3B Bidirectional 200 mV/A
TMCS1101A4B Bidirectional 400 mV/A
TMCS1101A1U Unidirectional 50 mV/A
TMCS1101A2U Unidirectional 100 mV/A
TMCS1101A3U Unidirectional 200 mV/A
TMCS1101A4U Unidirectional 400 mV/A
2.1 Kit Contents
Table 2 lists the contents of the TMCS1101EVM kit. Contact the nearest Texas Instruments Customer
Support Center if any component is missing. TI highly recommends checking the TMCS1101 family
product folder on the TI website at www.ti.com for further information regarding this product.
Table 2. TMCS1101EVM Kit Contents
Item Quantity
TMCS1101EVM Test Board 1
2.2 Related Documentation From Texas Instruments
Table 3 provides literature references for TI's integrated circuits used in the assembly of the
TMCS1101EVM. This user's guide is available from the TI website under literature number SLYU051. Any
letter appended to the literature number corresponds to the document revision that is current at the time of
the writing of this document. Newer revisions are available from www.ti.com or the Texas Instruments'
Literature Response Center at [phone] or the Product Information Center at [phone]. When
ordering, identify the document by both title and literature number.
Table 3. Related Documentation
document Literature Number
TMCS1101 product data sheet SBOS825

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TMCS1101EVM
3 Hardware
The TMCS1101 is an isolated, current-sense op amp that provides ease-of-use and high performance.
The TMCS1101EVM is intended to provide basic functional evaluation of all TMCS1101 gain variants. The
TMCS1101EVM is not laid out for electromagnetic compatibility (EMC) testing. The TMCS1101EVM
consists of one PCB that can be snapped apart into eight individual segments; one for each of the four
gain variants in both the bidirectional (B) and unidirectional (U) configurations:
• TMCS1101A1B
• TMCS1101A2B
• TMCS1101A3B
• TMCS1101A4B
• TMCS1101A1U
• TMCS1101A2U
• TMCS1101A3U
• TMCS1101A4U
3.1 Features
The layout of the TMCS1101EVM PCB is designed to provide the following features:
• Evaluation of all gain options for the TMCS1101
• Ease-of-access to device pins with test points
• Evaluation of high-side and low-side configurations
• On-board temperature sensor
See the TMCS1101 data sheet for comprehensive information about the TMCS1101.

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3.2 Circuitry
This section summarizes the TMCS1101EVM components.
For the following circuits:
• x = B for bidirectional, or U for unidirectional
• y = A to D for the A1 to A4 gain variants, respectively.
3.2.1 Bypass Capacitors
C1xy and C2xy are 10-μF and 0.1-μF supply bypass capacitors, respectively, for the TMCS1101. C4xy is
the 0.1-μF bypass capacitor for the optional temperature sensor.
3.2.2 Output Filter
C3xy and R1xy are footprints for the optional output filter. Default values are 10 pF and 0 Ω, but no
capacitors are installed. TP2xy is the test point for the TMCS1101 output.
3.2.3 Measurement Connector
J2x is an additional connector for measuring VCC and VOUT. J2x also provides a connection for
measuring board temperature (TMP).
3.2.4 Load Connectors
T1xy and T2xy correspond to the high-current rated load connectors. By default, the EVM is only
populated with two of these connectors on the bidirectional, lowest gain variant (x = B and y = A). TP3x
and TP6x are Kelvin connections to probe the EVM inputs. The IS+ (T1xy) and IS– (T2xy) inputs accept a
load that is converted to a magnetic field sensed by a Hall element that produces a voltage. This voltage
is amplified by the selected device gain and is presented at the VOUT test point (TP2xy). The acceptable
load input maximum is 20 A for dc measurements. However, the load can be significantly higher for ac
signals, and the load is bound by the safe operating area (SOA) described in the TMCS1101 data sheet.
3.2.5 Ground Test Points
TP3x, TP4x, and TP5x correspond to ground connections of the TMCS1100 device.
3.2.6 TMCS1101 Isolated Current-Sense Amplifier
U1xy is the TMCS1101 isolated current-sense amplifier. Eight segments are supplied within the
TMCS1101EVM board. Each segment is populated with one of the available device gains for bidirectional
or unidirectional sensing. This configuration enables users to test the devices and determine the best gain
setting for a given application. For y = A to D, the gain is 50 mV/A, 100 mV/A, 200 mV/A, and 400 mV/A,
respectively.
• The TMCS1101AnB is used for bidirectional applications, while TMCS1101AnU is used for
unidirectional applications (where n = 1 to 4 for the A1 to A4 gain variants, respectively).
• A magnetic field is generated based on the load current that is connected across the inputs IS+ and
IS–, and flows through the TMCS1101 leadframe.
• The output voltage swing limitation and required load current sensing range are the key factors when
determining device selection.
• The selected device must allow the output voltage to remain within the acceptable range after the load
current is transduced and amplified by the respective device gain. The max output voltage must remain
within the range of 25 mV above ground to 100 mV below the supply voltage.
• Choose an appropriate gain to create the largest appropriate output swing, and to minimize error.
3.3 Temperature Sensor
U2x is a temperature sensor that is not required for TMCS1100 operation. However, U2x provides the
option of measuring board temperature for determining ambient conditions.

+
±
hot-supply
”600V
Electronic Load
+
±
cold-supply
3- 5V
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TMCS1101EVM
4 Operation
The following are instructions to set up and use the TMCS1101EVM. For the following instructions, y = A
to D for the A1 to A4 gain variants, respectively. Figure 1 shows an example of a simple, low-side setup
on the A1B (50 mV/A) gain variant. This device has isolation, and external supplies are distinguished by
hot for load and cold for DUT supply. The hot supply can be isolated and at a different potential than the
cold supply.
Figure 1. Low-Side Forward Current Setup
Step 1. For greater maneuverable flexibility, break apart the EVM sub boards along the score lines.
Otherwise, the board can be left intact.
Step 2. Attach the high-current lug connectors to IS+ and IS– of the gain version to be tested.
Step 3. Connect the terminals of an external cold supply to the GND and VCC test points on the EVM
gain variant of choice. Be sure to connect GND first and make sure that the external cold
supply is between 3 V and 5.5 V.
Step 4. Connect the input per Section 4.1.

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WARNING
Do not leave EVM powered when unattended.
Hot surface. Contact may cause burns. Do not touch!
4.1 Measurements
The following procedures are used to configure a measurement evaluation with an electronic load. For the
following instructions, y = A to D for the A1 to A4 gain variants, respectively.
Step 1. According to Figure 1, for a low-side measurement, connect the electronic load positive input
terminal to the positive terminal of a ≥20-A capable hot-supply. For a high-side
measurement, connect the electronic load positive input terminal to the load sourcing terminal
(IS+ or IS–) of the EVM. For high-side measurement of forward current, IS– sources to the
electronic load; for reverse current, IS+ sources to the load.
Step 2. Connect the electronic load negative output terminal to the external hot supply GND terminal
for high-side measurements, or to the load sinking terminal of the EVM for low-side
measurements.
Step 3. For high-side measurements, connect the external supply to the load sinking terminal of the
EVM. Otherwise, for low-side measurements, connect the load sourcing terminal of the EVM
(IS+ or IS–) to the external supply gnd.
Step 4. Turn on all the connected supplies.
Step 5. Apply load with electronic load.
Step 6. Measure the output voltage at the VOUT test point.
NOTE: The output voltage is equal to the gain of the device multiplied by the load current passing
through the leadframe of the DUT.
4.2 Advanced Measurement Tips
To assess whether the expected load matches the measured load, use a precision shunt resistor rated for
the maximum intended current in series with the DUT. The precision shunt should have a kelvin
connection where the generated sense voltage can be measured by a precision multimeter, such as the
3458a multimeter. Sensing the shunt voltage is preferred as a typical multimeter may have a current limit
far below 20 A. Additionally some meters have better voltage measurement precision than current
measurement precision.
For evaluating performance when the DUT is subjected to quick current pulses, use short, large-gauge
wire, or short bus bars, to reduce the inductance and resistance between the hot-supply, load, and EVM.
By minimizing the inductance, the rate of load slew can be increased. If assessing the performance over
large transient current spikes (>20 A) is desired, be sure to use a supply with sufficient voltage headroom
to accommodate the series resistance of the wires/bus bars, board planes, and DUT lead frame
resistance. A large capacitor bank between the supply terminals should be used to ensure there is an
adequate charge reservoir available to prevent the supply from drooping and helping supply the large
current inrush through the device.
If assessing temperature performance is desired, use wide, thin bus bars to reduce the thermal sinking
ability of the system and minimize the inductance of the system. While the board provides an onboard
temperature sensor, board temperature may not be an exact indicator of DUT temperature. More precise
measurements can be obtained by placing a layer of thermally conductive grease on top of the DUT
package and placing a thermal sensor directly on the thermal grease.

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5 Schematics, PCB Layout, and Bill of Materials
NOTE: Board layouts are not to scale. These figures are intended to show how the board is laid out.
The figures are not intended to be used for manufacturing TMCS1101EVM PCBs.
5.1 Schematics
Figure 2 shows the schematic of the A1B sub board on the TMCS1101EVM PCB. Only the schematic for
the bidirectional A1 (50 mV/A) gain variant is included as all variants use the same circuit and same PCB
layout. All components associated with the 50-mV/A TMCS1101 A1 gain variant have the letter A
appended at the end. The 100-mV/A A2 gain variant has B appended, the 200-mV/A A3 gain variant has
C appended, and the 400-mV/A A4 gain variant has a D appended. All components labeled with a B after
the number correspond to the bidirectional TMCS1101 devices, while all components labeled with a U
after the number correspond to unidirectional TMCS1101 devices.
Figure 2. Schematic for A1 Device

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5.2 PCB Layout
Figure 3 through Figure 6 illustrate the PCB layers of the TMCS1101EVM.
Figure 3. Top Overlay
Figure 4. Top Layer

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Figure 5. Bottom Overlay
Figure 6. Bottom Layer

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5.3 Bill of Materials
Table 4. Bill of Materials
Designator Quantity Value Description PackageReference PartNumber Manufacturer
C1BA, C1BB, C1BC,
C1BD, C1UA, C1UB,
C1UC, C1UD
8 10uF CAP, CERM, 10 uF, 10
V, +/- 10%, X7R, 0805 0805 C2012X7R1A106K125A CTDK
C2BA, C2BB, C2BC,
C2BD, C2UA, C2UB,
C2UC, C2UD, C4BA,
C4BB, C4BC, C4BD,
C4UA, C4UB, C4UC,
C4UD
16 0.1uF CAP, CERM, 0.1 uF, 50
V, +/- 10%, X7R, 0603 0603 06035C104KAT2A AVX
C3UA, C3UB, C3UC,
C3UD 4 10pF CAP, CERM, 10 pF, 10 V, +/- 10%, X7R, 0603 0603 0603ZC100KAT2A AVX
H1BA, H1BB, H1BC,
H1BD, H1UA, H1UB,
H1UC, H1UD, H2BA,
H2BB, H2BC, H2BD,
H2UA, H2UB, H2UC,
H2UD, H3BA, H3BB,
H3BC, H3BD, H3UA,
H3UB, H3UC, H3UD,
H4BA, H4BB, H4BC,
H4BD, H4UA, H4UB,
H4UC, H4UD
32 BUMPER CYLIN 0.312"
DIA BLK SJ61A6 3M
J1BA, J1BB, J1BC,
J1BD, J1UA, J1UB,
J1UC, J1UD
8 Header, 2.54mm, 3x2,
Gold, SMT Header, 2.54mm, 3x2, SMT TSM-103-01-L-DV Samtec
MP1, MP2 2 Passivated 18-8
Stainless Steel Pan Head
Phillips Screws M5 x
0.8mm Thread, 10mm
Long
NPTH_SCREW_M5x0.8
mm 92000A320 McMaster-Carr
MP3, MP4 2 316 Stainless Steel
Washer for M5 Screw
Size, 5.3 mm ID, 10 mm
OD
STEEL_WASHER 90965A160 McMaster-Carr
MP5, MP6 2 JIS Hex Nut Medium-
Strength Zinc-Plated
Steel, Class 8, M5 x 0.8
mm Thread
HEXNUT 91028A415 McMaster-Carr
R1BA, R1BB, R1BC,
R1BD, R1UA, R1UB,
R1UC, R1UD
8 0 RES, 0, 1%, 0.1 W, AEC-
Q200 Grade 0, 0603 0603 RMCF0603ZT0R00 Stackpole Electronics Inc
T1BA, T2BA 2 Terminal 50A Lug CB35-36-CY CB35-36-CY Panduit

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Table 4. Bill of Materials (continued)
Designator Quantity Value Description PackageReference PartNumber Manufacturer
TP1BA, TP1BB, TP1BC,
TP1BD, TP1UA, TP1UB,
TP1UC, TP1UD, TP2BA,
TP2BB, TP2BC, TP2BD,
TP2UA, TP2UB, TP2UC,
TP2UD, TP3BA, TP3BB,
TP3BC, TP3BD, TP3UA,
TP3UB, TP3UC, TP3UD,
TP4BA, TP4BB, TP4BC,
TP4BD, TP4UA, TP4UB,
TP4UC, TP4UD, TP5BA,
TP5BB, TP5BC, TP5BD,
TP5UA, TP5UB, TP5UC,
TP5UD
40 Test Point, Miniature,
SMT Testpoint_Keystone_Mini ature 5015 Keystone
U1BA 1 Precision Isolated
Current Sense Monitor
With External Reference,
D0008A (SOIC-8)
D0008A TMCS1101A1BDR Texas Instruments
U1BB 1 Precision Isolated
Current Sense Monitor
With External Reference,
D0008A (SOIC-8)
D0008A TMCS1101A2BDR Texas Instruments
U1BC 1 Precision Isolated
Current Sense Monitor
With External Reference,
D0008A (SOIC-8)
D0008A TMCS1101A3BDR Texas Instruments
U1BD 1 Precision Isolated
Current Sense Monitor
With External Reference,
D0008A (SOIC-8)
D0008A TMCS1101A4BDR Texas Instruments
U1UA 1 Precision Isolated
Current Sense Monitor
With External Reference,
D0008A (SOIC-8)
D0008A TMCS1101A1UDR Texas Instruments
U1UB 1 Precision Isolated
Current Sense Monitor
With External Reference,
D0008A (SOIC-8)
D0008A TMCS1101A2UDR Texas Instruments
U1UC 1 Precision Isolated
Current Sense Monitor
With External Reference,
D0008A (SOIC-8)
D0008A TMCS1101A3UDR Texas Instruments

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Table 4. Bill of Materials (continued)
Designator Quantity Value Description PackageReference PartNumber Manufacturer
U1UD 1 Precision Isolated
Current Sense Monitor
With External Reference,
D0008A (SOIC-8)
D0008A TMCS1101A4UDR Texas Instruments
U2BA, U2BB, U2BC,
U2BD, U2UA, U2UB,
U2UC, U2UD
8 Temperature Sensor
Analog, Local -40°C ~
150°C 10mV/°C SOT-23-
3
SOT-23 TMP235A2DBZR Texas Instruments
C3BA, C3BB, C3BC,
C3BD 0 10pF CAP, CERM, 10 pF, 10 V, +/- 10%, X7R, 0603 0603 0603ZC100KAT2A AVX
T1BB, T1BC, T1BD,
T1UA, T1UB, T1UC,
T1UD, T2BB, T2BC,
T2BD, T2UA, T2UB,
T2UC, T2UD
0 Terminal 50A Lug CB35-36-CY CB35-36-CY Panduit

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Revision History
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (August 2019) to A Revision ..................................................................................................... Page
• Changed the Hardware section ......................................................................................................... 5
• Added the on-board temperature sensor to the Features list ....................................................................... 5
• Changed the Circuitry section ........................................................................................................... 6
• Changed Unidirectional Setup to Forward Current Setup ........................................................................... 7
• Changed the Advanced Measurement Tips section.................................................................................. 8
• Changed the Bill of Materials table.................................................................................................... 12

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