Texas Instruments bq24165 User manual

User's Guide
SLUU497B –December 2011–Revised June 2012
Chipscale-Packaged bq24165, 24166, 24167 Evaluation
Modules
The bq24165, 24166, 24167 evaluation module is a complete charger module for evaluating a compact,
flexible, high-efficiency, USB-friendly, switch-mode charge management solution for single-cell, Li-ion and
Li-polymer batteries used in a wide range of portable applications.
Contents
1 Introduction .................................................................................................................. 2
1.1 bq2416x IC Features .............................................................................................. 2
1.2 bq24165, 24166, 24167 EVM Features ......................................................................... 2
1.3 Schematic ........................................................................................................... 3
1.4 I/O Description ...................................................................................................... 4
1.5 Test Points .......................................................................................................... 4
1.6 Control and Key Parameters Setting ............................................................................ 5
1.7 Recommended Operating Conditions ........................................................................... 5
2 Test Summary ............................................................................................................... 6
2.1 Definitions ........................................................................................................... 6
2.2 Recommended Test Equipment ................................................................................. 6
2.3 Recommended Test Equipment Setup .......................................................................... 7
2.4 Recommended Test Procedure .................................................................................. 8
3 Printed-Circuit Board Layout Guideline ................................................................................. 10
4 Bill of Materials and Board Layout ...................................................................................... 11
4.1 Bill of Materials .................................................................................................... 11
4.2 Board Layout ...................................................................................................... 13
List of Figures
1 bq24165/166/167EVM (HPA741) Schematic............................................................................ 3
2 BAT Load (PR1010) Schematic........................................................................................... 7
3 Original Test Setup for bq24165/166/167 EVM (HPA741) ............................................................ 8
4 Top Assembly Layer ...................................................................................................... 13
5 Top Layer .................................................................................................................. 13
6 Bottom Layer............................................................................................................... 14
7 First Internal Layer ........................................................................................................ 14
8 Second Internal Layer .................................................................................................... 15
List of Tables
1 Bill of Materials - HPA741A ............................................................................................. 11
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Introduction www.ti.com
1 Introduction
1.1 bq2416x IC Features
The bq24165, 24166, 24167 integrates a synchronous PWM controller, power MOSFETs, input current
sensing, high-accuracy current and voltage regulation, charge termination and power path management
into a chipscale package. Key integrated circuit (IC) features include:
• High-efficiency, fully integrated, NMOS-NMOS, synchronous buck charger with 1.5-MHz frequency
• Integrated power FETs for up to 2.5-A charge rate
• Power path management between battery and system voltages
For details, see the bq24165, 24166, 24167 data sheet (SLUSAP4).
1.2 bq24165, 24166, 24167 EVM Features
The bq24165, 24166, 24167 evaluation module (EVM) is a complete charger module for evaluating
compact, flexible, high-efficiency, USB-friendly, switch-mode battery charge and power path management
solution for single-cell, Li-ion and Li-polymer battery-powered systems used in a wide range of portable
applications. Key EVM features include:
• Programmable charge current, input current on, and VINDPM threshold using jumpers
• Input power connectors for both USB input and ac adapter
• Programmable charge current, input current on, and VINDPM threshold using jumpers
• IN operating range of 4.2 V – 10 V
• USB operating range of 4.2 V – 6 V
• LED indication for status signals
• Test points for key signals available for testing purposes. Easy probe hook-up
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www.ti.com Introduction
1.3 Schematic
Figure 1. bq24165/166/167EVM (HPA741) Schematic
NOTE: EVMs with a printed-circuit board label that contain the suffix -X may have been assembled with
incorrectly marked ICs. Regardless of the IC’s marking, the EVM was assembled with the correct part
number as specified in the EVM bill of material.
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1.4 I/O Description
Header/Terminal Block Description
J1-IN Adapter positive header
J2-IN Adapter positive terminal
J2-GND Adapter negative terminal
J3-GND Adapter negative header
J4-USB USB positive header
J5-SYS System output positive header
J6-USB USB positive terminal
J6-GND USB negative terminal
J7-SYS System output positive terminal
J7-GND System output negative terminal
J8-GND USB negative header
J9-GND System output negative header
J10-BAT+ Battery positive header
J11-BAT+ Battery positive terminal
J11-GND Battery negative terminal
J12-GND Battery negative header
J13-DRV DRV reference voltage positive header
J14-DRV DRV reference voltage positive terminal
J14-GND DRV reference voltage negative terminal
J15-GND DRV reference voltage negative header
J16–IN External thermistor positive terminal
J16–GND Ground connection for external thermistor
1.5 Test Points
Test Point Description
TP1 Kelvin to IN
TP2 Kelvin to USB
TP3 SW
TP4 Kelvin to SYS
TP5 GND
TP6 GND
TP7 IUSB3
TP8 Kelvin to BAT
TP9 IUSB1
TP10 IUSB2
TP11 ISET
TP12 ILIM
TP13 CE2 for bq24165 or TS for bq24166/167
TP14 CE1 for'bq24165 or CE for bq24166/167
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www.ti.com Introduction
1.6 Control and Key Parameters Setting
Jum Default Factory
IC Description
per Setting
1-2: FET GATE = BGATE: External PFET's gate tied to BGATE pin and therefore controlled
by IC. 1-2 (FET GATE =
All JP1 2-3: FET GATE = SYS: External PFET's gate tied to SYS and therefore disabled. BGATE)
It is recommended that this jumper be changed only when the device is not enabled or in Hi-Z
mode so that the PFET's gate is never left open.
1-2: CE1 = HI: Active-low enable for reduced VBAT voltage (if CE2 = LO) or suspended
bq241 charging (if CE2 = HI)
JP2 2-3 (CE1 = LO)
65 2-3: CE1 = LO: Active-low enable for full current charging (if CE2 = LO) or charging at half
current (if CE2 = HI)
bq241
66 1-2: CE = HI: Active-low charge enable high to disable charge and enter Hi-Z mode
JP2 2-3 (CE = LO)
bq241 2-3: CE = LO: Active-low charge enable low for normal operation
67 1-2: IUSB3 = HI
2-3: IUSB3 = LO
All JP3 2-3 (IUSB3 = LO)
See data sheet Table 1 for description of USB input current limit and VINDPM threshold
setting. Default setting is for 500-mA input current limit and 4.68-V threshold.
1-2: IUSB2 = HI
2-3: IUSB2 = LO
All JP4 2-3 (IUSB2 = LO)
See data sheet Table 1 for description of USB input current limit and VINDPM threshold
setting. Default setting is for 500-mA input current limit and 4.68-V threshold.
1-2: IUSB1 = HI
2-3: IUSB1 = LO
All JP5 1-2 (IUSB1 = HI)
See data sheet Table 1 for description of USB input current limit and VINDPM threshold
setting. Default setting is for 500-mA input current limit and 4.68-V threshold.
1-2 (CE2 = HI): Active-low enable for charging at half current (if CE1 = LO) or suspended
bq241 charging (if CE1 = HI)
JP6 2-3 (CE2 = LO)
65 2-3 (CE2 = LO): Active-low enable for full current charging (if CE1 = LO) or reduced VBAT
voltage (if CE1 = HI)
1-2 (TS = EXT): Connects the TS pin to an external thermistor. The resistor divider formed by
bq241 R4 and R5 has been sized to accommodate a 10-kΩthermistor. If a different thermistor is
66 used, R4 and R5 need to be resized.
JP6 2-3 (TS = INT)
bq241 2-3 (TS = INT): Connects a potentiometer to the TS pin so the potentiometer can emulate a
67 thermistor. The potentiometer has been preset to approximately 3.4 kΩso that the TS voltage
is 0.5 x V(DRV).
1.7 Recommended Operating Conditions
Min Typ Max Unit
Supply voltage, VIN Operating input voltage from ac adapter 4.2 10 V
USB voltage, VUSB Operating input voltage from USB or equivalent supply 4.2 6 V
Battery voltage, VBAT Voltage applied at VBAT terminal (depends on status of CE1 4.02 4.2 4.24 V
and CE2)
System voltage, VSYS Voltage output at SYS terminal (depends on VBAT voltage 3.4 4.37 V
and status of VINDPM)
Supply current, IIN(MAX) Maximum input current limit for ac adapter input (set by 1.5 2.5 A
user-selectable resistor)
Supply current, IUSB(MAX) Maximum input current limit for USB input (set by USBx 0.1 0.5 1.5 A
input pins)
Max fast charge current, Battery charge current 0.550 2.5 A
ICHRG(MAX)
Operating junction temperature range, TJ-40 125 °C
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Test Summary www.ti.com
2 Test Summary
This procedure describes one test configuration of the HPA741 evaluation board for bench evaluation.
2.1 Definitions
The following naming conventions are followed.
VXXX : External voltage supply name (VIN, VUSB)
LOAD#: External load name
V(TPyyy): Voltage at internal test point TPyyy. For example, V(TP12) means the voltage at
TP12.
V(Jxx): Voltage at header Jxx
V(TP(XXX)): Voltage at test point XXX. For example, V(ACDET) means the voltage at the test
point which is marked as ACDET.
V(XXX, YYY): Voltage across point XXX and YYY.
I(JXX(YYY)): Current going out from the YYY terminal of header XX.
Jxx(BBB): Terminal or pin BBB of header xx
JPx ON : Internal jumper Jxx terminals are shorted.
JPx OFF: Internal jumper Jxx terminals are open.
JPx (-YY-) ON: Internal jumper Jxx adjacent terminals marked as YY are shorted.
Measure: →A,B Check specified parameters A, B. If measured values are not within specified limits
the unit under test has failed.
Observe →A,B Observe if A, B occur. If they do not occur, the unit under test has failed.
Assembly drawings have location for jumpers, test points, and individual components.
2.2 Recommended Test Equipment
2.2.1 Power Supplies
1. Power Supply number 1 (PS1) capable of supplying 6 V at 3 A is required.
2. If not using a battery as the load, then power supply number 2 (PS2) capable of supplying up to 5 V at
5 A is required to power the circuit shown in Figure 2.
2.2.2 Load #1 between BAT and GND
Testing with an actual battery is the best way to verify operation in the system. If a battery is unavailable,
then a circuit similar to the one shown inFigure 2 can simulate a battery when connected to a second
power supply.
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Figure 2. BAT Load (PR1010) Schematic
2.2.3 Load #2 Between SYS and GND
Although not required, a resistive load capable of sinking up to 3 A can be used.
2.2.4 Meters
Four equivalent voltage meters (VMx) and two equivalent current meters (CMx) are required. The current
meters must be able to measure at least 3-A current.
2.3 Recommended Test Equipment Setup
1. For all power connections, use short, twisted-pair wires of appropriate gauge wire for the amount of the
current.
2. Set Power Supply number 1 for 6 V ± 100 mV, 3-A current limit, and then turn off supply.
3. If BAT_Load (PR1010) as shown in Figure 2 is used, connect Power Supply number 2 (PS2) set to
approximately 3.6 V to the input side (PS2+/-) of BAT_Load (PR1010), then turn off PS2.
4. Connect the output side of the battery or BAT_Load (PR1010) in series with current meter (multimeter)
number 2 (CM2) to J2 and J6 or J3 (BAT, GND). Ensure that a voltage meter is connected across J2
or TP3 and J6 or TP9 (BAT, GND).
5. Connect VM3 across J5 or TP4 and J9 (SYS, GND).
6. Connect VM4 across J13 and J15 (DRV, GND).
7. Ensure jumpers are at the default factory settings per Section 1.6
8. After the preceding steps are accomplished, the test setup for HPA741 is as shown in Figure 3
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AV
VM#2
CM#2
ICHRG
PS
#1
A
V
VM#3
CM#1
IIN
V
+
-
VM#1
+
-
+
-
-
-+ +
VM#4
V+
-
BAT_Load
PS#2
Test Summary www.ti.com
Figure 3. Original Test Setup for bq24165/166/167 EVM (HPA741)
2.4 Recommended Test Procedure
The following test procedure may be useful for evaluating the charger IC outside of a real system, if no
battery is available to connect to the output and a simulated battery is needed.
2.4.1 Charge Voltage and Current Regulation of IN
1. Ensure that the Section 2.3 steps are followed.
2. Move JP2 (CE1 or CE) = HI and JP6 = HI.
3. Connect the output of Power Supply #1 (PS #1) in series with current meter number 1 (CM1) to J2 (IN,
GND).
4. Connect voltage meter number 1 (VM1) across J1 or TP1 and J3 or TP6 (IN, GND).
5. With PS2 disabled, turn on PS1.
6. Measure:
Measure on VM3 →V(J5/TP4(SYS),J9(GND)) = 4.3 ± 100 mV
Measure on VM4 →V(J13(DRV),J15(GND)) = 5.2 ± 200 mV
7. Move JP2 (CE1 or CE) = LO and JP6 = LO. Adjust the power supply so that VM1 still reads 6 V ± 100
mV if necessary.
8. Enable PS2 and adjust PS2 so that the voltage measured by VM2, across BAT and GND, measures
3.2 V + 50 mV
9. Measure and Observe:
Measure on CM2→ICHRG = 2500 mA ± 150 mA
Measure on CM1 →IIN = 1800 mA ± 180 mA
Observe →D1 and D2 are on.
10. Turn off PS1 and PS2.
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2.4.2 Charge Voltage and Current Regulation of USB
1. Ensure that the Section 2.3 steps are followed.
2. Move JP2 (CE1 or CE) = HI and JP6 = HI.
3. Connect the output of Power Supply number 1 (PS1) in series with current meter (multimeter) number
1 (CM1) to J4 and J8 or J6 (USB, GND).
4. Connect voltage meter 1 (VM1) across J4 or TP2 and J8 or TP5 (USB, GND).
5. With PS2 disabled, turn on PS1.
6. Measure:
Measure on VM3 →V(J5/TP4(SYS),J9(GND)) = 4.3 ± 100 mV
Measure on VM4 →V(J13(DRV),J15(GND)) = 5.2 ± 200 mV
7. Move JP2 (CE1 or CE) = LO and JP6 = LO while keeping the default settings for JP3 (USB3), JP4
(USB2) and JP5 (USB1). Adjust PS1 so that VM1 still reads 6 V ± 100 mV if necessary.
8. Enable PS2 and adjust PS2 so that the voltage measured by VM2, across BAT and GND, measures
3.2 V ± 50 mV.
9. Measure:
Measure on CM2→ICHRG = 735 mA ± 75 mA
Measure on CM1 →IIN = 475 mA ± 50 mA
Observe →D1 and D2 are on.
10. Turn off PS1 and PS2.
2.4.3 Helpful hints
1. To observe the taper current as the battery voltage approaches the set regulation voltage, allow the
battery to charge or, if using BAT_Load (PR1010), slowly increase the PS2 voltage powering
BAT_Load (PR1010). Use VM2 across BAT and GND to measure the battery voltage seen by the IC.
2. To observe the VINDPM function, lower the current limit on PS1.
3. To observe battery supplement mode, apply a resistive load across SYS and GND that is higher than
the maximum charge current.
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Printed-Circuit Board Layout Guideline www.ti.com
3 Printed-Circuit Board Layout Guideline
1. To obtain optimal performance, the power input capacitors, connected from the PMID input to PGND,
must be placed as close as possible to the bq2416x.
2. Place 4.7-µF input capacitor as close to PMID pin and PGND pin as possible to make high-frequency
current loop area as small as possible. Place 1-µF input capacitor GNDs as close to the respective
PMID capacitor GND and PGND pins as possible to minimize the ground difference between the input
and PMID_.
3. The local bypass capacitor from SYS to GND must be connected between the SYS pin and PGND of
the IC. The intent is to minimize the current path loop area from the SW pin through the LC filter and
back to the PGND pin.
4. Place all decoupling capacitors close to their respective IC pins and as close as to PGND (do not place
components such that routing interrupts power stage currents). All small control signals must be routed
away from the high-current paths.
5. The PCB must have a ground plane (return) connected directly to the return of all components through
vias (two vias per capacitor for power-stage capacitors, one via per capacitor for small-signal
components). It is also recommended to put vias inside the PGND pads for the IC, if possible. A star
ground design approach is typically used to keep circuit block currents isolated (high-power/low-power
small-signal) which reduces noise-coupling and ground-bounce issues. A single ground plane for this
design gives good results. With this small layout and a single ground plane, no ground-bounce issue
occurs, and having the components segregated minimizes coupling between signals.
6. The high-current charge paths into IN, USB, BAT, SYS, and from the SW pins must be sized
appropriately for the maximum charge current in order to avoid voltage drops in these traces. The
PGND pins must be connected to the ground plane to return current through the internal low-side FET.
7. For high-current applications, the balls for the power paths must be connected to as much copper in
the board as possible. This allows better thermal performance because the board conducts heat away
from the IC.
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www.ti.com Bill of Materials and Board Layout
4 Bill of Materials and Board Layout
4.1 Bill of Materials
Table 1. Bill of Materials - HPA741A
Count RefDes Value Description Size Part Number MFR
-001 -002 -003
0 0 0 C1, C6 Open Capacitor, Ceramic 805 Std Std
2 2 2 C2, C7 1.0µF Capacitor, Ceramic, 25V, X5R, 10% 603 Std Std
2 2 2 C3, C8 4.7µF Capacitor, Ceramic, 25V, X5R, 10% 805 Std Std
1 1 1 C4 10µF Capacitor, Ceramic, 10V, X5R, 20% 603 Std Std
1 1 1 C5 47µF Capacitor, Ceramic, 6.3V, X5R, 20% 805 Std Std
1 1 1 C9 0.01µF Capacitor, Ceramic, 16V, X7R, 10% 603 Std Std
1 1 1 C10 47µF Capacitor, Ceramic, 6.3V, X5R, 20% 1206 Std Std
2 2 2 C11, C12 1.0µF Capacitor, Ceramic, 6.3V, X5R, 10% 402 Std Std
2 2 2 D1, D2 LTST-C190GKT Diode, LED, Green, 2.1-V, 20-mA, 6-mcd 603 LTST-C190GKT Liteon
1 1 1 D3 BAT54C Diode, Dual Schottky, 200-mA, 30-V SOT23 BAT54C Fairchild
10 10 10 J1, J3, J4, J5, J8, J9, J10, PEC02SAAN Header, Male 2-pin, 100mil spacing, 0.100 inch x 2 PEC02SAAN Sullins
J12, J13, J15
5 5 5 J2, J6, J7, J11, J14 ED555/2DS Terminal Block, 2-pin, 6-A, 3.5mm 0.27 x 0.25 ED555/2DS OST
0 1 1 J16 ED555/2DS Terminal Block, 2-pin, 6-A, 3.5mm 0.27 x 0.25 ED555/2DS OST
6 6 6 JP1, JP2, JP3, JP4, JP5, PEC03SAAN Header, Male 3-pin, 100mil spacing, 0.100 inch x 3 PEC03SAAN Sullins
JP6
1 1 1 L1 1.5µH Inductor, SMT, 3.5A, 70 mΩ4.1 x 4.4 mm SPM4012T-1R5M TDK Alternate: Toko
Alternate: FDSD0415-
H-1R5M
1 1 1 Q1 CSD25401Q3 MOSFET, PChan, -20V, 60A, 8.7 mΩchipscale3.3X3.3mm CSD25401Q3 TI
1 1 1 R1 26.7kΩResistor, Chip, 1/16W, 1% 603 Std Std
1 1 1 R2 100ΩResistor, Chip, 1/16W, 1% 402 Std Std
1 1 1 R3 10kΩResistor, Chip, 1/16W, 1% 603 Std Std
0 1 1 R4 1870ΩResistor, Chip, 1/16W, 1% 603 Std Std
0 1 1 R5 4120ΩResistor, Chip, 1/16W, 1% 603 Std Std
1 1 1 R6 196ΩResistor, Chip, 1/16W, 1% 402 Std Std
2 2 2 R7, R8 1.50kΩResistor, Chip, 1/16W, 1% 603 Std Std
0 1 1 R9 50.0kΩPotentiometer, 3/8 Cermet, 12-Turn 0.25x0.17 inch 3266W-1-503LF Bourns
2 0 0 R10, R11 0 Resistor, Chip, 1/16W 603 Std Std
14 14 14 TP1, TP2, TP3, TP4, TP7, 5002 Test Point, White, Thru Hole Color Keyed 0.100 x 0.100 inch 5002 Keystone
TP8, TP9, TP10, TP11,
TP12, TP13, TP14, TP15,
TP16
2 2 2 TP5, TP6 5001 Test Point, Black, Thru Hole Color Keyed 0.100 x 0.100 inch 5001 Keystone
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Table 1. Bill of Materials - HPA741A (continued)
Count RefDes Value Description Size Part Number MFR
-001 -002 -003
1 0 0 U1 BQ24165YFF IC, 2.5A, Dual-Input, Single Cell Switch-mode Li-Ion BGA BQ24165YFF TI
BATTERY CHARGER with
0 1 0 U1 BQ24166YFF IC, 2.5A, Dual-Input, Single Cell Switch-mode Li-Ion BGA BQ24166YFF TI
BATTERY CHARGER with
0 0 1 U1 BQ24167YFF IC, 2.5A, Dual-Input, Single Cell Switch-mode Li-Ion BGA BQ24167YFF TI
BATTERY CHARGER with
6 6 6 -- Shunt, 100-mil, Black 0.100 929950-00 3M
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T
I
EXAS
NSTRUMENTS
www.ti.com Bill of Materials and Board Layout
4.2 Board Layout
Figure 4. Top Assembly Layer
Figure 5. Top Layer
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Figure 6. Bottom Layer
Figure 7. First Internal Layer
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Figure 8. Second Internal Layer
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EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS
Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions:
The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims
arising from the handling or use of the goods.
Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days from
the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO
BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF
MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH
ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL
DAMAGES.
Please read the User's Guide and, specifically, the Warnings and Restrictions notice in the User's Guide prior to handling the product. This
notice contains important safety information about temperatures and voltages. For additional information on TI's environmental and/or safety
programs, please visit www.ti.com/esh or contact TI.
No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or
combination in which such TI products or services might be or are used. TI currently deals with a variety of customers for products, and
therefore our arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design,
software performance, or infringement of patents or services described herein.
REGULATORY COMPLIANCE INFORMATION
As noted in the EVM User’s Guide and/or EVM itself, this EVM and/or accompanying hardware may or may not be subject to the Federal
Communications Commission (FCC) and Industry Canada (IC) rules.
For EVMs not subject to the above rules, this evaluation board/kit/module is intended for use for ENGINEERING DEVELOPMENT,
DEMONSTRATION OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end product fit for general consumer
use. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing
devices pursuant to part 15 of FCC or ICES-003 rules, which are designed to provide reasonable protection against radio frequency
interference. Operation of the equipment may cause interference with radio communications, in which case the user at his own expense will
be required to take whatever measures may be required to correct this interference.
General Statement for EVMs including a radio
User Power/Frequency Use Obligations: This radio is intended for development/professional use only in legally allocated frequency and
power limits. Any use of radio frequencies and/or power availability of this EVM and its development application(s) must comply with local
laws governing radio spectrum allocation and power limits for this evaluation module. It is the user’s sole responsibility to only operate this
radio in legally acceptable frequency space and within legally mandated power limitations. Any exceptions to this are strictly prohibited and
unauthorized by Texas Instruments unless user has obtained appropriate experimental/development licenses from local regulatory
authorities, which is responsibility of user including its acceptable authorization.
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant
Caution
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause
harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the
equipment.
FCC Interference Statement for Class A EVM devices
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to
cause harmful interference in which case the user will be required to correct the interference at his own expense.

FCC Interference Statement for Class B EVM devices
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment
generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and
on, the user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
For EVMs annotated as IC – INDUSTRY CANADA Compliant
This Class A or B digital apparatus complies with Canadian ICES-003.
Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the
equipment.
Concerning EVMs including radio transmitters
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this
device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired
operation of the device.
Concerning EVMs including detachable antennas
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain
approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should
be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.
This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum
permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain
greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.
Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada.
Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité de
l'utilisateur pour actionner l'équipement.
Concernant les EVMs avec appareils radio
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est
autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout
brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain
maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à
l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente
(p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.
Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel
d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans
cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.
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【【Important Notice for Users of this Product in Japan】】
This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan
If you use this product in Japan, you are required by Radio Law of Japan to follow the instructions below with respect to this product:
1. Use this product in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and
Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of
Japan,
2. Use this product only after you obtained the license of Test Radio Station as provided in Radio Law of Japan with respect to this
product, or
3. Use of this product only after you obtained the Technical Regulations Conformity Certification as provided in Radio Law of Japan with
respect to this product. Also, please do not transfer this product, unless you give the same notice above to the transferee. Please note
that if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan.
Texas Instruments Japan Limited
(address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan
http://www.tij.co.jp
【ご使用にあたっての注】
本開発キットは技術基準適合証明を受けておりません。
本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。
1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。
2. 実験局の免許を取得後ご使用いただく。
3. 技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。
日本テキサス・インスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
http://www.tij.co.jp
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EVALUATION BOARD/KIT/MODULE (EVM)
WARNINGS, RESTRICTIONS AND DISCLAIMERS
For Feasibility Evaluation Only, in Laboratory/Development Environments. Unless otherwise indicated, this EVM is not a finished
electrical equipment and not intended for consumer use. It is intended solely for use for preliminary feasibility evaluation in
laboratory/development environments by technically qualified electronics experts who are familiar with the dangers and application risks
associated with handling electrical mechanical components, systems and subsystems. It should not be used as all or part of a finished end
product.
Your Sole Responsibility and Risk. You acknowledge, represent and agree that:
1. You have unique knowledge concerning Federal, State and local regulatory requirements (including but not limited to Food and Drug
Administration regulations, if applicable) which relate to your products and which relate to your use (and/or that of your employees,
affiliates, contractors or designees) of the EVM for evaluation, testing and other purposes.
2. You have full and exclusive responsibility to assure the safety and compliance of your products with all such laws and other applicable
regulatory requirements, and also to assure the safety of any activities to be conducted by you and/or your employees, affiliates,
contractors or designees, using the EVM. Further, you are responsible to assure that any interfaces (electronic and/or mechanical)
between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to
minimize the risk of electrical shock hazard.
3. You will employ reasonable safeguards to ensure that your use of the EVM will not result in any property damage, injury or death, even
if the EVM should fail to perform as described or expected.
4. You will take care of proper disposal and recycling of the EVM’s electronic components and packing materials.
Certain Instructions. It is important to operate this EVM within TI’s recommended specifications and environmental considerations per the
user guidelines. Exceeding the specified EVM ratings (including but not limited to input and output voltage, current, power, and
environmental ranges) may cause property damage, personal injury or death. If there are questions concerning these ratings please contact
a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the
specified output range may result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or
interface electronics. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the
load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures
greater than 60°C as long as the input and output are maintained at a normal ambient operating temperature. These components include
but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors which can be identified using the
EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during normal operation, please
be aware that these devices may be very warm to the touch. As with all electronic evaluation tools, only qualified personnel knowledgeable
in electronic measurement and diagnostics normally found in development environments should use these EVMs.
Agreement to Defend, Indemnify and Hold Harmless. You agree to defend, indemnify and hold TI, its licensors and their representatives
harmless from and against any and all claims, damages, losses, expenses, costs and liabilities (collectively, "Claims") arising out of or in
connection with any use of the EVM that is not in accordance with the terms of the agreement. This obligation shall apply whether Claims
arise under law of tort or contract or any other legal theory, and even if the EVM fails to perform as described or expected.
Safety-Critical or Life-Critical Applications. If you intend to evaluate the components for possible use in safety critical applications (such
as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, such as devices
which are classified as FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separate
Assurance and Indemnity Agreement.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated

IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
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TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
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Products Applications
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Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
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DSP dsp.ti.com Energy and Lighting www.ti.com/energy
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Interface interface.ti.com Medical www.ti.com/medical
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Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
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Copyright ©2012, Texas Instruments Incorporated