Texas Instruments SimpleLink BoosterPack BOOSTXL-CC3120MOD User manual

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BOOSTXL‐CC3120MODSimpleLink™
BoosterPack™Plug‐inModuleandIoTSolution
TheCC3120MODRNMMOB(CC3120MOD)moduleispartoftheSimpleLink™microcontroller(MCU)
platformthatsharesacommon,easy‐to‐usedevelopmentenvironmentwithasinglecoresoftware
developmentkit(SDK)andrichtoolset.Aone‐timeintegrationoftheSimpleLinkplatformletsyouadd
anycombinationofdevicesfromtheportfoliointoyourdesign.TheultimategoaloftheSimpleLink
platformistoachieve100percentcodereusewhenyourdesignrequirementschange.Formore
information,visitwww.ti.com/simplelink.
TheBOOSTXL‐CC3120MODisa2.4GHzWi‐Fi®SimpleLink™BoosterPack™withtheTICC3120MOD
module.TheCC3120MODisFCC,IC,CE,MIC,andSRRCcertified.Thepurposeofthisdocumentisto
providetheendintegratorwiththeinformationnecessarytoincorporatetheCC3120MODmoduleinto
theirfinalproduct.ItalsoprovidedinformationhowtoruntheBOOSTXL‐CC3120MODSimpleLink
BoosterPacktoevaluatetheCC3120MODmodule.
Contents
1.Overview...............................................................................................................................................3
1.1GeneralFeatures...........................................................................................................................7
1.2KeyBenefits..................................................................................................................................8
1.3KeyBenefits................................................................................................................................10
2.ConnectorsandJumpers.............................................................................................................10
2.1ConnectorsandJumpers.............................................................................................................11
2.2JumperSettings...........................................................................................................................12
2.32x20Pinconnectorassignment..................................................................................................12
3.ElectricalCharacteristics.....................................................................................................................13
4.AntennaCharacteristics......................................................................................................................13
5.CircuitDesign......................................................................................................................................13
5.1CC3120MODReferenceschematic.............................................................................................13
5.2BillofMaterials(BOM)........................................................................................................................14
6.LayoutGuidelines................................................................................................................................15
6.1BoardLayout...............................................................................................................................15
6.2GeneralLayoutRecommendations.............................................................................................16
6.3RFLayoutRecommendations.....................................................................................................17
6.4AntennaPlacementandRouting................................................................................................18
6.5TransmissionLineConsiderations...............................................................................................18
7.BOOSTXL‐CC3120MODOperationalSetupandTesting.....................................................................19
7.1Power..........................................................................................................................................20
7.1.1PowerfromtheLaunchPadkitortheCC31XXEMUBOOST........................................................20
7.1.2OnboardLDOPower...................................................................................................................22
7.2MeasuringtheCC3120MODCurrentDraw................................................................................22
7.2.1Low‐CurrentMeasurements(HibernateandLPDS)...................................................................22
7.2.2ActiveCurrentMeasurements....................................................................................................23
7.3Clocking.......................................................................................................................................24

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7.4PerformingConductedTests......................................................................................................24
7.5ConnectingtoPCUsingtheCC31XXEMUBOOST........................................................................25
7.5.1CC31XXEMUBOOST.....................................................................................................................25
7.5.1.1Overview.....................................................................................................................................25
7.5.1.2Hardwaredetails.........................................................................................................................25
7.5.1.3DriverRequirements...................................................................................................................27
7.5.2ConnectingtoBoard...................................................................................................................27
7.5.3BOOSTXL‐CC3120MODJumperSettings.....................................................................................28
7.5.4CC31XXEMUBOOSTJumperSettings..........................................................................................29
7.5.5ConnectingtoaLaunchPadKit...................................................................................................29
7.5.5.1LaunchPadCurrentLimitations...................................................................................................29
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ManualInformationtotheEnduser
1.RFFunctionandFrequencyRange......................................................................................................31
2.FCC/ICCertificationandStatement...................................................................................................31
2.1FCC......................................................................................................................................................32
2.2CANICES‐3(A)/NMB‐3(A)CertificationandStatement......................................................................32
2.3EndProductLabeling..........................................................................................................................33
2.4DeviceClassifications..........................................................................................................................34
2.5FCCDefinitions....................................................................................................................................34
2.6SimultaneousTransmissionEvaluation..............................................................................................35
3.EUCertificationandStatement..........................................................................................................35
3.1RFExposureInformation(MPE)..................................................................................................35
3.2SimplifiedDoCstatement...........................................................................................................35
3.3WasteElectricalandElectronicEquipment(WEEE)...................................................................36
3.4OEM/Hostmanufacturerresponsibilities.................................................................................36
3.5Antennaspecifications................................................................................................................36
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Trademarks
SimpleLink, BoosterPack, Internet-on-a chip, Texas Instruments, LaunchPad, MSP432 are trademarks of
Texas Instruments.
Bluetooth is a registered trademark of Bluetooth SIG, Inc.
Wi-Fi is a trademark of Wi-Fi Alliance.
 

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1. Overview
Figure1‐1showsafunctionalblockdiagramoftheCC3120MODmodule.
PM
MAC/PHY
SPI WRF
BGN
HIB
VBAT
F
RF_ANT1
2.3 – 3.6V
CC3X20
UART
nReset
32Mbit
SFlash
32.768 kHz
40Mhz
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Figure1‐1:CC3120MODFunctionalBlockDiagram
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Figure1‐2showsafunctionalblockdiagramoftheBOOSTXL‐CC3120MODSimpleLinkBoosterPack

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Figure1‐2:FunctionalblockdiagramoftheBOOSTXL‐CC3120MOD
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Figure1‐3showsthehardwareimplementationoftheBOOSTXL‐CC3120MOD
CC3120MODRNMMOB

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Figure1‐3:HardwareimplementationoftheBOOSTXL‐CC3120MOD
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Figure1‐4showstheTopOverlayoftheBOOSTXL‐CC3210MODSimpleLinkBoosterPack.

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Figure1‐4:BOOSTXL‐CC3120MODTopOverlay
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Figure1‐5showstheTopSolderoftheBOOSTXL‐CC3210MODSimpleLinkBoosterPack.

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
Figure1‐5:BOOSTXL‐CC3120MODTopSolder

1.1 GeneralFeatures
TheBOOSTXL‐CC3120MODSimpleLinkBoostPackincludesthefollowingfeatures:
Two20‐pinstackableconnectorscompatiblewiththeTISimpleLinkLaunchpad™and
BoosterPackarchitecture.
Built‐inchipantenna
OptionalU.FLconnectorforexternalantennasorconductedbasedtesting.
PowerfromanonboardLDObyusingtheUSBor3.3‐VconnectorformtheLaunchPadMCU
Threepush‐buttons
TwoLEDs
Jumperforcurrentmeasurementswithprovisionstomounta0.1‐ohmresistorfor
measurementwithavoltmeter
32‐MbitserialFlash
Two‐layerPCB

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Dimensions:58.52mm(L)x43.18(W)

1.2 KeyBenefits
TheCC3120MODmoduleoffersthefollowingbenefits:
TheCC3120MOD(CC3120MODRNMMOB)isaWi‐Fi®ModuleWhichIncludesthe
CC3120RNMARGKWi‐FiNetworkProcessor(NWP).TheFullyIntegrated,Industrial
TemperatureGrade,GreenModule,IncludesAllRequiredClocks,SerialPeripheralInterface
(SPI)Flash,andPassives.
FCC,IC,CE,MIC,andSRRCCertified
Wi‐FiCERTIFIED™Modules,WithAbilitytoRequestCertificateTransferforWi‐FiAlliance
Members
FeaturingaDedicatedInternet‐on‐achip™Wi‐FiNWPWhichCompletelyOffloadsWi‐Fiand
InternetProtocolsfromtheApplicationMCU
Wi‐FiModes
o802.11b/g/nStation
o802.11b/g/nAccessPoint(AP)SupportinguptoFourStations
oWi‐FiDirect®Client/GroupOwner
oWPA2PersonalandEnterpriseSecurity:WEP,WPA/WPA2PSK,WPA2Enterprise
(802.1x)
IPv4andIPv6TCP/IPStack
oIndustry‐StandardBSDSocketApplicationProgrammingInterfaces(APIs)
16SimultaneousTCPorUDPSockets
6SimultaneousTLSandSSLSockets
IPAddressing:StaticIP,LLA,DHCPv4,andDHCPv6WithDuplicateAddressDetection(DAD)
SimpleLink™ConnectionManagerforAutonomousandFastWi‐FiConnections
FlexibleWi‐FiProvisioningWithSmartConfig™Technology,APMode,andWPS2Options
RESTfulAPISupportUsingInternalHTTPServer
WideSetofSecurityFeatures
oHardwareFeatures
SeparateExecutionEnvironments
DeviceIdentity
oNetworkingSecurity
PersonalandEnterpriseWi‐FiSecurity
SecureSockets(SSLv3,TLS1.0/1.1/TLS1.2)
HTTPSServer
TrustedRoot‐CertificateCatalog
TIRoot‐of‐TrustPublickey
oSoftwareIPProtection


SecureKeyStorage
FileSystemSecurity
SoftwareTamperDetection
CloningProtection
EmbeddedNetworkApplicationsRunningonaDedicatedNWP
oHTTP/HTTPSWebServerWithDynamicUserCallbacks
omDNS,DNS‐SD,DHCPServer
oPing
RecoveryMechanism–AbilitytoRecovertoFactoryDefaults
Wi‐FiTXPower
o17dBmat1DSSS
o16.5dBmatMCS0
Wi‐FiRXSensitivity
o–95dBmat1DSSS
o–73.5dBmat54OFDM
ApplicationThroughput
oUDP:16Mbps
oTCP:13Mbps
Power‐ManagementSubsystem
oIntegratedDC‐DCConvertersSupportaWideRangeofSupplyVoltage:
VBATWide‐VoltageMode:2.3Vto3.6V
oAdvancedLow‐PowerModes
Shutdown:1μA
Hibernate:6μA
Low‐PowerDeepSleep(LPDS):115μA
RXTraffic:59mAat54OFDM
TXTraffic:229mAat54OFDM,MaximumPower
IdleConnected(MCUinLPDS):690μAatDTIM=1
AdditionalIntegratedComponentsonModule
o40.0‐MHzCrystalWithInternalOscillator
o32.768‐kHzCrystal(RTC)
o32‐MbitSPISerialFlashRFFilterandPassiveComponents
LGAPackage
o1.27‐mmPitch,63‐Pin,20.5‐mm×17.5‐mmLGAPackageforEasyAssemblyand
Low‐CostPCBDesign
OperatingTemperature
oAmbientTemperatureRange:–40°Cto+85°C
ModuleSupportsSimpleLinkDeveloper'sEcosystem



1.3 KeyBenefits
TheCC3120MODmoduleisdesignedforthefollowinginternetofThings(IoT)applications,including:

Cloud Connectivity 

Internet Gateway 

Home and Building Automation 

Appliances 

Access Control 

Security Systems 

Smart Energy 

Industrial Control 

Smart Plug and Metering 

Wireless Audio 

IP Network Sensor Nodes 

Asset Tracking 

Medical Devices 

2. ConnectorsandJumpers
Figure2‐1showsthetopviewoftheBOOSTXL‐CC3120MODSimpleLinkBoosterPack

Figure2‐1:BOOSTXL‐CC3120MODTopView

Figure2‐2showsthebottomviewoftheBOOSTXL‐CC3120MODSimpleLinkBoosterPack

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
Figure2‐2:BOOSTXL‐CC3120MODBottomView
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2.1 ConnectorsandJumpers
Table2‐1liststhepush‐buttonsontheBOOSTXL‐CC3120MOD
Reference Usage Comments
SW1 Factory Reset This is used to restore the serial flash to the factory default image. Hold the
button pressed and then toggle the RESET push button.
SW2 RESET This can be used to Reset the device. Holding the button down sets the device
to the shutdown state.
SW3 nHIB This boots the device to the bootloader RMe for flashing the firmware over a
universal asynchronous receiver/transmitter (UART).
Table2‐1:BOOSTXL‐CC3120MODpush‐buttons

Table2‐2liststheLEDsontheBOOSTXL‐CC3120MOD
Reference Colour Usage Comments
D5 RED PWR
indication
ON, when the 3.3 V power is provided to the board.
D1 Yellow nRESET This LED indicates the state of the nRESET pin. If this LED is glowing, the device is
ftil
D6 Green nHIB
This LED indicates the state of the nHIB pin. When the LED is OFF, the device is in
hibernate state.
D7 Red Factory
Default
This LED indicates if the Factory default switch is pressed ON. Note that the RESET
button needs to be pressed for this LED to function.
Table2‐2:BOOSTXL‐CC3120MODLEDs



2.2 JumperSettings
Table2‐3liststhejumpersettingsontheBOOSTXL‐CC3120MD
Reference Usage Comments
J7 USB connector For powering the BoosterPack when connected with a LaunchPad which cannot source enough
current.
di
(f
l
J8 Power selection
Choose the power supply from the LauchPad kit or the on-
board USB. J8 (1-2) power from MCU LaunchPad
J8 (2-3) power from on-board USB using 3.3 V LDO
J6
Current
measurement
For Hibernate and LPDS currents, connect an ammeter across J6 : Range (< 500 µA)
For Active current, mount a 0.1 Ωresistor on R35 and measure the voltage across the 0.1 Ω
resistor using a voltmeter (range (< 50 mV peak-peak)).
P1, P2,
P3, P4
BoosterPack
header
2x10 pins each connected to the LaunchPad.
J3 LED EN. For Enabling/Disabling the LED’s.
J4 Reset Pullup For keeping the reset up
J2 RF Test U.FL connector for conducted testing in the lab. Using this requires an ECO to be made to the board
by swapping two resistors.
Table2‐3:BOOSTXL‐CC3120MODjumpersettings

2.3 2x20Pinconnectorassignment
Table2‐4liststheouterrowconnectorsofthetwo20‐pinheaders.
Note:Allsignalsare3.3VCMOSlogiclevelsandarereferredwithrespecttotheCC3120IC.
Forexample,UART1_TXisanoutputfromtheCC3120IC.

FortheSPIlines,theCC3120MODalwaysactslikeaslave

Pin No Signal Name Direction Pin No Signal Name Direction
P1.1 VCC (3.3 V) IN P2.1 GND IN
P1.2 UNUSED NA P2.2 IRQ OUT
P1.3 UART1_TX OUT P2.3 SPI_CS IN
P1.4 UART1_RX IN P2.4 UNUSED NA
P1.5 nHIB IN P2.5 nRESET IN
P1.6 UNUSED NA P2.6 SPI_MOSI IN
P1.7 SPI_CLK IN P2.7 SPI_MISO OUT
P1.8 FACTORY
DEFAULT
NA P2.8 UNUSED NA
P1.9 UNUSED NA P2.9 UNUSED NA
P1.10 UNUSED NA P2.10 UNUSED NA
Table2‐4:BOOSTXL‐CC3120MODouterrowpinconnectors
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






Table2‐5liststheinnerrowconnectorsofthetwo20‐pinheaders.
Pin No Signal Name Direction Pin No Signal Name Direction
P3.1 +5 V IN P4.1 UNUSED OUT
P3.2 GND IN P4.2 UNUSED OUT
P3.3 UNUSED NA P4.3 UNUSED NA
P3.4 UNUSED NA P4.4 UART1_CTS IN
P3.5 UNUSED NA P4.5 UART1_RTS OUT
P3.6 UNUSED NA P4.6 UNUSED NA
P3.7 UNUSED NA P4.7 NWP_LOG_TX OUT
P3.8 UNUSED NA P4.8 WLAN_LOG_TX OUT
P3.9 UNUSED NA P4.9 UNUSED IN
P3.10 UNUSED NA P4.10 UNUSED OUT
Table2‐5:BOOSTXL‐CC3120MODinnerrowpinconnectors
3. ElectricalCharacteristics
Forelectricalcharacteristics,seetheCC3120MODSimpleLink™Wi‐FiCERTIFIED™NetworkProcessor
Internet‐of‐ThingsModuleSolutionforMCUApplicationsDatasheet.
4. AntennaCharacteristics
TheBOOSTXL‐CC3120MODcontainsanon‐chipantenna.ForinformationontheantennaVSWR,
efficiency,andelectricalcharacteristicspleasesee:
http://ds.yuden.co.jp/TYCOMPAS/ap/detail.do?productNo=AH316M245001‐T&dataUnit=M

5. CircuitDesign
5.1 CC3120MODReferenceschematic
TheCC3120MODmainengineareareferenceschematicisshowinFigure5‐1below.ThefullBOOSTXL‐
CC3120MODreferenceschematiccanbefoundat:http://www.ti.com/lit/zip/swrc339.



Figure5‐1:CC3120MODEngineareareferenceschematic

5.2 BillofMaterials(BOM)
TheCC3120MODmainengineareareferenceBOMisshowinTable5‐1below.ThefullBOOSTXL‐
CC3120MODreferenceBOMcanbefoundat:http://www.ti.com/lit/zip/swrc339.

Table5‐1:CC3120MODEngineareareferenceBOM


6. LayoutGuidelines
TheintegratoroftheCC3120MODmodulemustcomplywiththePCBlayoutrecommendations
describedinthefollowingsubsectionstopreserve/minimizetheriskwithregulatorycertificationsfor
FCC,IC,CE,MIC,andSRRC.Moreover,TIrecommendscustomersfollowtheguidelinesdescribedinthis
sectiontoachievesimilarperformance.
6.1 BoardLayout
Thereferencelayoutconsistsofa2layerdesign.Figure6‐1showsBOOSTXL‐CC3120MODToplayer.

Figure6‐1:BOOTXL‐CC3120MODTopLayer

Figure6‐2showstheBOOSTXL‐CC3120MODBottomlayer.



Figure6‐2:BOOSTXL‐CC3120MODBottomLayer

6.2 GeneralLayoutRecommendations
Ensurethatthefollowinggenerallayoutrecommendationsarefollowed:

Have a solid ground plane and ground vias under the module for stable system and thermal
dissipation.


Do not run signal traces underneath the module on a layer where the module is mounted. 

RF traces must have 50-Ωimpedance. 

RF trace bends must be made with gradual curves, and 90 degree bends must be avoided. 

RF traces must not have sharp corners. 

There must be no traces or ground under the antenna section. 

RF traces must have via stitching on the ground plane beside the RF trace on both sides. 

RF traces must be as short as possible. The antenna, RF traces, and the module must be on the
edge of the PCB product in consideration of the product enclosure material and proximity.




6.3 RFLayoutRecommendations
TheRFsectionofthiswirelessdevicegetstoppriorityintermsoflayout.ItisveryimportantfortheRF
sectiontobelaidoutcorrectlytoensureoptimumperformancefromthedevice.Apoorlayoutcan
causelow‐outputpower,EVMdegradation,sensitivitydegradation,andmaskviolations.
Figure6‐3showstheRFplacementandroutingoftheCC3120MODmodule.

Figure6‐3:RFSectionLayout
ForoptimalRFperformance,ensurethecoppercutoutonthetoplayerundertheRF‐BG‐pin(pin31),is
asshowninFigure6‐4below:

Figure6‐4:ToplayercopperpullbackonRFpads


6.4 AntennaPlacementandRouting
TheantennaistheelementusedtoconverttheguidedwavesonthePCBtracestothefreespace
electromagneticradiation.Theplacementandlayoutoftheantennaarethekeystoincreasedrangeand
datarates.Table6‐2providesasummaryoftheantennaguidelines.
ItemGuidelines
1PlacetheantennaonanedgeorcornerofthePCB.
2EnsurethatnosignalsareroutedacrosstheantennaelementsonallthelayersofthePCB.
3Mostantennas,includingthechipantennausedontheboosterpack,requireground
clearanceonallthelayersofthePCB.Ensurethatthegroundisclearedoninnerlayersas
well.
4Ensurethatthereisprovisiontoplacematchingcomponentsfortheantenna.Thesemustbe
tunedforbestreturnlosswhenthecompleteboardisassembled.Anyplasticsorcasingmust
alsobemountedwhiletuningtheantennabecausethiscanimpacttheimpedance.
5Ensurethattheantennaimpedanceis50Ωbecausethedeviceisratedtoworkonlywitha
50‐Ωsystem.
6Incaseofprintedantenna,ensurethatthesimulationisperformedwiththesoldermaskin
consideration.
7Ensurethattheantennahasanearomni‐directionalpattern.
8Thefeedpointoftheantennaisrequiredtobegrounded.Thisisonlyfortheantennatype
usedontheCC3120MODBoosterPack.Refertothespecificantennadatasheetsforthe
recommendations.
Table6‐2:AntennaGuidelines

6.5 TransmissionLineConsiderations
TheRFsignalfromthedeviceisroutedtotheantennausingaCoplanarWaveguidewithground(CPW‐
G)structure.TheCPW‐Gstructureoffersthemaximumamountofisolationandthebestpossible
shieldingtotheRFlines.InadditiontothegroundontheL1layer,placingGNDviasalongthelinealso
providesadditionalshielding.Figure6‐5showsacrosssectionofthecoplanarwaveguidewiththe
criticaldimensions.

Figure6‐5:CoplanarWaveguide(CrossSection)




Figure6‐6showsthetopviewofthecoplanarwaveguidewithGNDandviastitching.

Figure6‐6:CPWwithGNDandviastitching(Topview)
TherecommendedvaluesforthePCBareprovidedfor2‐layerboardsitTable6‐3and4‐layerboardsin
Table6‐4.

Table6‐3:RecommendedPCBValuesfor2‐LayerBoard(L1toL2=42.1mils)


Table6‐4:RecommendedPCBValuesfor4‐layerBoard(L1toL2=16mils)

7. BOOSTXL‐CC3120MODOperationalSetupandTesting
TheSimpleLinkWi‐FiCC3120MODwirelessnetworkprocessorprovidestheflexibilitytoaddWi‐Fitoany
microcontroller(MCU).ThisuserguideexplainsthevariousconfigurationsoftheCC3120MOD


BoosterPack™plug‐inmodule.ThisInternet‐on‐achip™solutioncontainsallthatisneededtoeasily
createInternet‐of‐thingssolutions–enhancedsecurityfeatures,quickconnectionestablishment,cloud
supportandmore.TheCC3120MODmoduleBoosterPackcanbeusedinseveralways.Itcanbe
connectedtoaTexasInstruments™MCULaunchpad™developmentkit(softwareexamplesprovidedfor
MSP‐EXP430F5529LP).ItcanalsobepluggedintoaCC31XXEMUBOOSTboardandconnectedtoaPCfor
MCUemulation.Finally,thedevicecanbeconnectedontoanadapterboard(BOOST‐CCEMADAPTER),
allowingcustomerstousetheBOOSTXL‐CC3120MODdevicewithadditionalplatformsbeyondTI
Launchpadkits.
Note:TheCC31XXEMUBOOSTdeviceisanadvancedemulationboardthatisrequiredfor
flashingtheBOOSTXL‐CC3120MOD,usingtheradiotool(radioperformancetesting
orputtingintocertificationmodules),capturingnetworkprocessorlogs,andusingSL
studio.

Thiskitcomesinthreeconfigurations:
BOOSTXL‐CC3120MODwhichcontainsthefollowing:
oOneBOOSTXL‐CC3120MODboard
oOnemicroUSBcable
oOnequickstartguide
BOOSTXL‐CC3120MOD+MSP432P401Rwhichcontainsthefollowing:
oSimpleLinkWi‐FiCC3120MODBoosterPack
oMSP‐EXP432P401RLaunchPad
BOOSTXL‐CC3120MOD+CC31XXEMUBOOSTwhichcontainsthefollowing:
oSimpleLinkWi‐FiCC3120BoosterPack
oAdvancedEmulationBoosterPack

7.1 Power
TheboardisdesignedtoacceptpowerfromaconnectedLaunchPadkitorthroughthe
CC31XXEMUBOOSTboard.SomeoftheLaunchPadkitsarenotcapableofsourcingthepeakcurrent
requirementsofWi‐Fi,whichmaybeashighas400mA.IftheLaunchPadkitcannotsourcethepeak
currentrequirementsofWi‐Fi,theUSBconnectorontheBOOSTXL‐CC3120RMcanbeusedtoaidthe
peakcurrent.TheuseofSchottkydiodesensuresthattheloadsharinghappensbetweentheUSB
connectorsontheLaunchPadkitandtheBoosterPackmodulewithoutanyboardmodifications.Also,
the3.3‐VpowercanbesourcedfromtheLaunchPadkitorfromthe3.3‐VLDOontheboard.This
sourcingiscompletedbyusingjumperJ8.IftheLaunchPadkitisnotabletosourcethe3.3Vupto350
mA,thenJ8mustbeconfiguredtoworkfromtheonboardLDO.

7.1.1 PowerfromtheLaunchPadkitortheCC31XXEMUBOOST
Inthiscase,theLaunchPadkitprovides3.3VtotheBoosterPackmoduleforitsoperation(seeFigure7‐
1).Inadditiontothe3.3V,someLaunchPadkitsprovide5VfromtheUSB(seeFigure7‐2),whichisused
todrivea3.3‐VLDOontheBoosterPackmodule.IftheLaunchPadkitisnotabletoprovidethe5V(for