RF-Star RF-WM-20CMB1 User manual

RF-WM-20CMB1 Ultra-Low-Power 2.4 GHz
802.11b/g/n WLAN Wi-Fi and BLE4.2 Module
Version 1.0
Shenzhen RF-star Technology Co., Ltd.
Jun. 28th, 2021
All rights reserved. Those responsible for unauthorized reproduction will be prosecuted.

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Wi-Fi Module List
Chipset
Core
RAM
(KB)
Tx
Power
(dBm)
Model
FLASH
(Byte)
Antenna
Dimension
(mm)
Distance
(m)
Photo
CC3235S
M4
256
18
RF-WM-
3235A1S
4M
PCB/Pad
20.5  25.0
100
M4
256
18
RF-WM-
3235B1S
4M
Pad
20.5  17.5
100
CC3235SF
M4
256
18
RF-WM-
3235A1
4M +
1M
embedded
PCB/Pad
20.5  25.0
100
M4
256
18
RF-WM-
3235B1
4M +
1M
embedded
Pad
20.5  17.5
100
CC3200
M4
256
17
RF-WM-
3200B1
1M
Chip/IPEX/
Half-hole
20  31
100
RF-WM-
3200B3
1M
Pad
20.5  17.5
100
CC3220
M4
256
17
RF-WM-
3220B1
4M
Chip/IPEX/
Half-hole
20  31
100
RTL8710AF
M3
512
17
RF-WM-
20CMB1
1M
PCB/IPEX/
Half-hole
20  23
100
RTL8711AF
M3
512
17
RF-WM-
11AFB1
1M
PCB/IPEX/
Half-hole
20  23
100
RTL8720CM
Real-
M300
KM4
256
17
RF-WM-
20CMB1
2M
PCB/IPEX/
Half-hole
20  23
100
Note:
1. The communication distance is the longest distance obtained by testing the module's maximum transmission power
in an open and interference-free environment in sunny weather.
2. All modules with PCB / Chip antenna and IPEX connector are dispatched with PCB / Chip antenna only by default.
If IPEX connector is needed, pls check with me before the quotation.

RF-WM-20CMB1
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1 Device Overview
1.1 Description
RF-WM-20CMB1 is an IoT wireless module based on Realtek Wi-Fi SoC RTL8720CM with Real-M300 (KM4) CPU. This
module has on-chip 384 KB ROM, 256 KB RAM, 4 MB pSRAM and 2MB flash, a pin-out of peripherals of SDIO, SPI,
UART, I2C, PWM, GDMA and GPIOs. It has integrated a 40 MHz crystal, three RF RF output modes (an onboard PCB
antenna, an IPEX/U.FL connector and a half-hole interface) for wide coverage. It supports 2.4 GHz 802.11 b/g/n at 20
MHz channel bandwidth. The module supports STA, AP, and STA + AP concurrent modes, advanced security features
include Wi-Fi WEP, WPA, WPA2, and WPS2 with MD5, SHA-1, SHA2-256, DES, 3DES, and AES security engines.
1.2 Key Features
•Wi-Fi Feature
- 802.11b/g/n 1x1, 2.4 GHz
- 802.11e QoS Enhancement (WMM)
- 802.11i (WPA, WPA2). Open, shared key, and
pair-wise key authentication services
- Support low power TX/RX for short-range
application
- Support Wi-Fi WPS
- Frame aggregation for increased MAC
efficiency (A-MSDU, A-MPDU)
- Low latency immediate High-Throughput
Block Acknowledgement (HT-BA)
- Long NAV for media reservation with CF-End
for NAV release
- Integrated balun, PA/LNA
•Bluetooth Low Energy
- Bluetooth Low Energy (BLE4.2)
- Support LE secure connections
- Support LE scatternet
- Support 1 Master/1Slave
•Memory
- ROM: 384 KB
- RAM: 256 KB
- pSRAM: 4 MB
- FLASH: 2 MB
•Secure
- Secure boot
- Wi-Fi WEP, WPA, WPA2, WPS
- Crypto engine: MD5, SHA-1, SHA2-224,
SHA2-256, HMAC, AES
•Peripheral interfaces
- 3xUART, baud rate up to 4 MHz and all of
them can configurable as log UART
- 1xI2C, Max clock 400 Kbps
- 1xSDIO 2.0 Device, up to 50 MHz
- 1xSPI, Master clock up to 25 Mbps/Slave
clock up to 5 Mbps
- 8xPWM with configurable duration and duty
cycle from 0 ~ 100%
- 16xprogrammable GPIOs
- 1 GDMA with 2 channels
•Dimension: 23 mm x 20 mm x 2.4 mm
1.3 Applications
•Cloud connectivity
•Home automation
•Home appliances
•Access control
•Security systems
•Smart energy
40.0 MHz
NFC Out

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•Internet gateway
•Industrial control
•Smart plug
•Smart metering
•Wireless audio
•IP network sensor nodes
1.4 Functional Block Diagram
Figure 1. Functional Block Diagram of RF-WM-20CMB1
1.5 Part Number Conventions
The part numbers are of the form of RF-WM-20CMB1 where the fields are defined as follows:
Figure 2. Part Number Conventions of RF-WM-20CMB1
RF
WM
20CM
Company Name
RF-Star
Wireless Type
Wi-Fi Module
Chipset Model
Realtek RTL8720CM
-
-
B1
Module Version
The First Version
RTL8720CM
Matching
40.0 MHz
Reset
Power Supply
3.3 V
1 MB
flash
IPEX Connector
Antenna Switch
PCB
Antenna
Aantenna
Matching
GPIOs
Peripherals
Half-hole Interface

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Table of Contents
Wi-Fi Module List................................................................................................................................................................ 1
1 Device Overview............................................................................................................................................................. 2
1.1 Description............................................................................................................................................................ 2
1.2 Key Features ....................................................................................................................................................... 2
1.3 Applications.......................................................................................................................................................... 2
1.4 Functional Block Diagram .............................................................................................................................. 3
1.5 Part Number Conventions.............................................................................................................................. 3
Table of Contents................................................................................................................................................................ 4
Table of Figures................................................................................................................................................................... 5
Table of Tables..................................................................................................................................................................... 6
2 Module Configuration and Functions ...................................................................................................................... 7
2.1 Module Parameters........................................................................................................................................... 7
2.2 Module Pin Diagram ......................................................................................................................................... 8
2.3 Pin Functions....................................................................................................................................................... 8
2.4 GPIO Pin Function ..........................................................................................................................................10
3 Specifications .................................................................................................................................................................11
3.1 Recommended Operating Conditions .....................................................................................................11
3.2 Handling Ratings..............................................................................................................................................11
4 Application, Implementation, and Layout.............................................................................................................12
4.1 Module Photos..................................................................................................................................................12
4.2 Recommended PCB Footprint....................................................................................................................12
4.3 Antenna................................................................................................................................................................13
4.3.1 Antenna Design Recommendation ..............................................................................................13
4.3.2 Antenna Output Mode Modification..............................................................................................13
4.3.3 External Antenna Design Recommendation of the Half-Hole ANT Pin..........................14
4.3.4 IPEX Connector Specification........................................................................................................16
4.4 Schematic Diagram.........................................................................................................................................17
4.5 Basic Operation of Hardware Design ......................................................................................................17
4.6 Trouble Shooting..............................................................................................................................................18
4.6.1 Unsatisfactory Transmission Distance........................................................................................18

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4.6.2 Vulnerable Module..............................................................................................................................19
4.6.3 High Bit Error Rate .............................................................................................................................19
4.7 Electrostatics Discharge Warnings ...........................................................................................................19
4.8 Soldering and Reflow Condition.................................................................................................................19
5 Optional Package Specification ..............................................................................................................................21
6 Revision History ............................................................................................................................................................23
7 Contact Us.......................................................................................................................................................................24
Table of Figures
Figure 1. Functional Block Diagram of RF-WM-20CMB1.......................................................................... 3
Figure 2. Part Number Conventions of RF-WM-20CMB1 ......................................................................... 3
Figure 3. Pin Diagram of RF-WM-20CMB1 .................................................................................................... 8
Figure 4. Photos of RF-WM-20CMB1 .............................................................................................................12
Figure 5. Recommended PCB Footprint of RF-WM-20CMB1 (mm)...................................................12
Figure 6. Recommendation of Antenna Layout ...........................................................................................13
Figure 7. IPEX Antenna Output Mode of RF-WM-20CMB1....................................................................14
Figure 8. ANT Pin Antenna Output Mode of RF-WM-20CMB1 .............................................................14
Figure 9. Reference Design of the External Antenna................................................................................15
Figure 10. Reference Design of the External Antenna Traces ..............................................................15
Figure 11. SI9000 Impedance Calculation Diagram ..................................................................................15
Figure 12. Specification of Antenna Seat.......................................................................................................16
Figure 13. Specification of IPEX Wire .............................................................................................................16
Figure 14. Schematic Diagram of RF-WM-20CMB1 .................................................................................17
Figure 15. Recommended Reflow for Lead-Free Solder.........................................................................20
Figure 16. Default Package by Tray.................................................................................................................21
Figure 17. Package by Tape & Reel ................................................................................................................22

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Table of Tables
Table 1. Parameters of RF-WM-20CMB1 ........................................................................................................ 7
Table 2. Pin Functions of RF-WM-20CMB1.................................................................................................... 8
Table 3. GPIO Pin Function of RF-WM-20CMB1........................................................................................10
Table 4. Recommended Operating Conditions of RF-WM-20CMB1...................................................11
Table 5. Handling Ratings of RF-WM-20CMB1...........................................................................................11
Table 6. Temperature Table of Soldering and Reflow................................................................................19

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2 Module Configuration and Functions
2.1 Module Parameters
Table 1. Parameters of RF-WM-20CMB1
Chipset
Realtek RTL8720CM
Supply Power Voltage
2.3 V ~ 3.6 V, recommended to 3.3 V
Frequency
Wi-Fi: 2400 MHz ~ 2500 MHz
BLE: 2402 MHz ~ 2480 MHz
TX power
Wi-Fi:
1 Mbps DSSS@802.11b: 21 dBm
11 Mbps DSSS@802.11b: 21 dBm
6 Mbps OFDM@802.11g: 19 dBm
54 Mbps OFDM@802.11g: 17 dBm
HT20 [email protected]1n: 19 dBm
HT20 [email protected]1n: 16 dBm
BLE: 2.5 dBm ~ 6.5 dBm
RX Sensitivity
Wi-Fi:
1 Mbps DSSS@802.11b: -99.0 dBm
11 Mbps DSSS@802.11b: -901 dBm
6 Mbps OFDM@802.11g: -94.0 dBm
54 Mbps OFDM@802.11g: -76.5 dBm
HT20 [email protected]1n: -93.5 dBm
HT20 [email protected]1n: -74.0 dBm
BLE: -100 dBm
Crystal
40 MHz
Package
SMT Packaging
Dimension
23.0 mm x 20.0 mm x 2.4 mm
Type of Antenna
PCB antenna / IPEX connector / Half-hole ANT interface
Operating Temperature
-20 ℃ ～ +85 ℃
Storage Temperature
-55 ℃ ～ +125 ℃

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2.2 Module Pin Diagram
Figure 3. Pin Diagram of RF-WM-20CMB1
2.3 Pin Functions
Table 2. Pin Functions of RF-WM-20CMB1
Pin
Name
Description
1
RFOUT
RF signal output pin
2
GND
Ground
3
GND
Ground
4
VCC
3.3 V power supply
5
GPIOA_0
GPIO, JTAG CLK
6
GPIOA_1
GPIO, JTAG TMS
7
GPIOA_2
GPIO, JTAG TDO
8
GPIOA_3
GPIO, JTAG TDI
9
GPIOA_4
GPIO, JTAG TRST

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10
NC
None connect
11
CHIP_EN
Chip EN pin can be as reset, for more details, pls refer to the minimum
system
12
GPIOA_13
GPIO, UART RX
13
NC
None connect
14
NC
None connect
15
NC
None connect
16
GPIO_14
GPIO, UART TX
17
NC
None connect
18
GND
Ground
19
VCC
3.3 V power supply
20
NC
None connect
21
NC
None connect
22
NC
None connect
23
NC
None connect
24
NC
None connect
25
GPIOA_17
GPIO
26
GPIOA_18
GPIO
27
GPIOA_19
GPIO
28
GPIOA_20
GPIO
29
GPIOA_23
GPIO
30
GPIOA_15
GPIO, LOG UART RX
31
GPIOA_16
GPIO, LOG UART TX
32
NC
None connect
33
NC
None connect
34
GND
Ground

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2.4 GPIO Pin Function
Table 3. GPIO Pin Function of RF-WM-20CMB1
Pin name
SPIC-Flash/SDIO
JTAG
UART
SPI/WL_LED
I2C
PWM
GPIOA_0
JTAG_CLK
UART1_IN
PWM[0]
GPIOA_1
JTAG_TMS
UART1_OUT
BT_LED
PWM[1]
GPIOA_2
JTAG_TDO
UART1_IN
SPI_CSn
I2C_SCL
PWM[2]
GPIOA_3
JTAG_TDI
UART1_OUT
SPI_SCL
I2C_SDA
PWM[3]
GPIOA_4
JTAG_TRST
UART1_CTS
SPI_MOSI
PWM[4]
GPIOA_7
SPI_M_CS
SPI_CSn
GPIOA_8
SPI_M_CLK
SPI_SCL
GPIOA_9
SPI_M_DATA[2]
UART0_RTS
SPI_MOSI
GPIOA_10
SPI_M_ DATA[1]
UART0_CTS
SPI_MISO
GPIOA_11
SPI_M_ DATA[0]
UART0_OUT
I2C_SCL
PWM[0]
GPIOA_12
SPI_M_ DATA[3]
UART0_IN
I2C_SDA
PWM[1]
GPIOA_13
UART0_IN
PWM[7]
GPIOA_14
SDIO_INT
UART0_OUT
PWM[2]
GPIOA_15
SD_D[2]
UART0_IN
SPI_CSn
I2C_SCL
PWM[3]
GPIOA_16
SD_D[3]
UART0_OUT
SPI_SCL
I2C_SDA
PWM[4]
GPIOA_17
SD_CMD
PWM[5]
GPIOA_18
SD_CLK
UART2_CTS
PWM[6]
GPIOA_19
SD_D[0]
UART2_RTS
SPI_MOSI
I2C_SCL
PWM[7]
GPIOA_20
SD_D[1]
SPI_MOSI
I2C_SDA
PWM[0]
GPIOA_23
LED_0
PWM[7]

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3 Specifications
3.1 Recommended Operating Conditions
Functional operation does not guarantee performance beyond the limits of the conditional parameter values in the table
below. Long-term work beyond this limit will affect the reliability of the module more or less.
Table 4. Recommended Operating Conditions of RF-WM-20CMB1
Items
Condition
Min.
Typ.
Max.
Unit
Operating Supply Voltage
Battery Mode
2.97
3.3
3.63
V
Operating Temperature
/
-20
+25
+85
℃
Environmental Hot Pendulum
/
-20
+20
℃/min
3.2 Handling Ratings
Table 5. Handling Ratings of RF-WM-20CMB1
Items
Condition
Min.
Typ.
Max.
Unit
Storage Temperature
Tstg
-55
+25
+125
℃
Human Body Model
HBM
4000
V
Moisture Sensitivity Level
2
Charged Device Model
750
V

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4 Application, Implementation, and Layout
4.1 Module Photos
Figure 4. Photos of RF-WM-20CMB1
4.2 Recommended PCB Footprint
Figure 5. Recommended PCB Footprint of RF-WM-20CMB1 (mm)

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4.3 Antenna
4.3.1 Antenna Design Recommendation
1. The antenna installation structure has a great influence on the module performance. It is necessary to ensure the
antenna is exposed and preferably vertically upward. When the module is installed inside of the case, a high-quality
antenna extension wire can be used to extend the antenna to the outside of the case.
2. The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly
weakened.
3. The recommendation of antenna layout.
The inverted-F antenna position on PCB is free-space electromagnetic radiation. The location and layout of the
antenna are key factors to increase the data rate and transmission range.
Therefore, the layout of the module antenna location and routing is recommended as follows:
（1）Place the antenna on the edge (corner) of the PCB.
（2）Make sure that there is no signal line or copper foil in each layer below the antenna.
（3）It is best to hollow out the antenna position in the following figure to ensure that the S11 of the module is
minimally affected.
Figure 6. Recommendation of Antenna Layout
Note: The hollow-out position is based on the antenna used.
4.3.2 Antenna Output Mode Modification
1. RF-WM-20CMB1 has three antenna output modes. An onboard PCB antenna, a stamp half-hole output (ANT pin, see
pin function table for details) and one IPEX connecter.

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The default delivery is the onboard PCB antenna. If you want to use the external antenna by the IPEX connector,
pls solder a 0 R Resistor in the red rectangle. The location of the Resister is shown in the figure below.
Figure 7. IPEX Antenna Output Mode of RF-WM-20CMB1
If you want to use the external antenna by the ANT pin, pls solder a 0 R Resistor in the red rectangle. The location of
the Resister is shown in the figure below.
Figure 8. ANT Pin Antenna Output Mode of RF-WM-20CMB1
4.3.3 External Antenna Design Recommendation of the Half-Hole ANT Pin
1. A Π-type matching circuit is reserved for the antenna, and 50 Ω impedance control is performed on the RF traces.
The traces are as short as possible, and 135° or arc traces are used as much as possible. No vias are used to
change layers. More GND vias are placed around the RF traces.

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Figure 9. Reference Design of the External Antenna
Figure 10. Reference Design of the External Antenna Traces
2. The RF trace width and copper-clad spacing can be calculated by SI9000 software, and the impedance is controlled
to 50 Ω according to the actual board thickness, number of layers, plate, dielectric thickness, dielectric constant,
copper thickness, line width, line spacing, and solder mask thickness.
Example: FR4 is a double-layer board with a thickness of 1.0 mm. Through calculation, the width of the trace is
0.8254 mm, and the spacing between traces and copper is 0.22 mm.
Figure 11. SI9000 Impedance Calculation Diagram

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4.3.4 IPEX Connector Specification
RF-WM-20CMB1 module can be integrated with the IPEX version 1 antenna seat, the specification of the antenna seat
is as follows:
Figure 12. Specification of Antenna Seat
The specification of the IPEX wire end is as follows:
Figure 13. Specification of IPEX Wire

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4.4 Schematic Diagram
Figure 14. Schematic Diagram of RF-WM-20CMB1
4.5 Basic Operation of Hardware Design
1. It is recommended to offer the module a DC stabilized power supply, a tiny power supply ripple coefficient, and
reliable ground. Please pay attention to the correct connection between the positive and negative poles of the power
supply. Otherwise, the reverse connection may cause permanent damage to the module;
2. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure a stable power supply and no frequently fluctuating
voltage.

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3. When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the margin,
which is beneficial to the long-term stable operation of the whole machine. The module should be far away from the
power electromagnetic, transformer, high-frequency wiring, and other parts with large electromagnetic interference.
4. The bottom of the module should avoid high-frequency digital routing, high-frequency analog routing, and power
routing. If it has to route the wire on the bottom of the module, for example, it is assumed that the module is soldered
to the Top Layer, the copper must be spread on the connection part of the top layer and the module, and be close
to the digital part of the module and routed in the Bottom Layer (all copper is well-grounded).
5. Assuming that the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer
or other layers, which will affect the spurs and receiving sensitivity of the module to some degree;
6. Assuming that there are devices with large electromagnetic interference around the module, which will greatly affect
the module performance. It is recommended to stay away from the module according to the strength of the
interference. If circumstances permit, appropriate isolation and shielding can be done.
7. Assuming that there are routings of large electromagnetic interference around the module (high-frequency digital,
high-frequency analog, power routings), which will also greatly affect the module performance. It is recommended
to stay away from the module according to the strength of the interference. If circumstances permit, appropriate
isolation and shielding can be done.
8. It is recommended to stay away from devices whose TTL protocol is the same 2.4 GHz physical layer, for example,
USB 3.0.
4.6 Trouble Shooting
4.6.1 Unsatisfactory Transmission Distance
1. When there is a linear communication obstacle, the communication distance will be correspondingly weakened.
Temperature, humidity, and co-channel interference will lead to an increase in the communication packet loss rate.
The performance of ground absorption and reflection of radio waves will be poor when the module is tested close to
the ground.
2. Seawater has a strong ability to absorb radio waves, so the test results by the seaside are poor.
3. The signal attenuation will be very obvious if there is metal near the antenna or if the module is placed inside the
metal shell.
4. The incorrect power register set or the high data rate in the open air may shorten the communication distance. The
higher the data rate, the closer the distance.
5. The low voltage of the power supply is lower than the recommended value at ambient temperature, and the lower
the voltage, the smaller the power is.
6. The unmatchable antennas and modules or the poor quality of the antenna will affect the communication distance.

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4.6.2 Vulnerable Module
1. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure a stable power supply and no frequently fluctuating
voltage.
2. Please ensure the anti-static installation and the electrostatic sensitivity of high-frequency devices.
3. Due to some humidity-sensitive components, please ensure suitable humidity during installation and application. If
there is no special demand, it is not recommended to use at too high or too low temperature.
4.6.3 High Bit Error Rate
1. There are co-channel signal interferences nearby. It is recommended to be away from the interference sources or
modify the frequency and channel to avoid interferences.
2. The unsatisfactory power supply may also cause garbled. It is necessary to ensure the power supply's reliability.
3. If the extension wire or feeder wire is of poor quality or too long, the bit error rate will be high.
4.7 Electrostatics Discharge Warnings
The module will be damaged by the discharge of static. RF-star suggests that all modules should follow the 3 precautions
below:
1. According to the anti-static measures, bare hands are not allowed to touch modules.
2. Modules must be placed in anti-static areas.
3. Take the anti-static circuitry (when inputting HV or VHF) into consideration in product design.
Static may result in the degradation in performance of the module, even causing failure.
4.8 Soldering and Reflow Condition
1. Heating method: Conventional Convection or IR/convection.
2. Solder paste composition: Sn96.5/Ag3.0/Cu0.5
3. Allowable reflow soldering times: 2 times based on the following reflow soldering profile.
4. Temperature profile: Reflow soldering shall be done according to the following temperature profile.
5. Peak temperature: 245 ℃.
Table 6. Temperature Table of Soldering and Reflow
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63 / Pb37
Sn96.5 / Ag3.0 / Cu0.5
Min. Preheating Temperature (Tmin)
100 ℃
150 ℃
Max. Preheating Temperature (Tmax)
150 ℃
200 ℃
Preheating Time (Tmin to Tmax) (t1)
60 s ~ 120 s
60 s ~ 120 s