Texas Instruments TDC7200EVM User manual

TDC7200EVM User’s Guide
User's Guide
Literature Number: SNAU177
January 2015

Contents
1 EVM Key Features ............................................................................................................... 4
2 EVM.................................................................................................................................... 5
3 Equipment List .................................................................................................................... 6
4 Quick Start.......................................................................................................................... 6
5 Software Installation............................................................................................................. 7
5.1 Installing the TDC7200 GUI............................................................................................. 7
5.2 MSP430 Firmware Upgrade ............................................................................................ 7
5.3 Checking Connection.................................................................................................... 8
5.4 Opening the GUI ......................................................................................................... 9
6 Hardware Configuration ...................................................................................................... 10
6.1 EVM Connections....................................................................................................... 10
6.2 Jumpers ................................................................................................................. 13
7 GUI and Operation.............................................................................................................. 13
8 Board Layout..................................................................................................................... 16
9 Bill of Materials .................................................................................................................. 19
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List of Figures
1 TDC7200EVM Evaluation Board .......................................................................................... 5
2 Upgrading MSP430 Firmware.............................................................................................. 7
3 Device Manager.............................................................................................................. 8
4 TDC7200 GUI ................................................................................................................ 9
5 START and STOP Signals Scope Shot................................................................................. 11
6 TDC7200EVM Connection................................................................................................ 12
7 Recommended TDC7200 Register Configuration (Default Settings)................................................ 13
8 Graphing..................................................................................................................... 14
9 Measurement Results ..................................................................................................... 14
10 Top Assembly Layer....................................................................................................... 16
11 Bottom Layer................................................................................................................ 17
12 Schematic ................................................................................................................... 18
List of Tables
1 TDC7200 Bill of Materials................................................................................................. 19
3
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User's Guide
SNAU177–January 2015
General Description
This guide details the use of the TDC7200EVM evaluation module (referred to as EVM for the remainder
of this document). The TDC7200EVM is an evaluation module that allows users to evaluate the operation
and performance of the TDC7200 Time-to-Digital Converter. One example application that requires
accurate time-to-digital conversion is flow sensing. For this, the TDC7200 can be used with the TDC1000
ultrasonic analog-front-end to capture accurate time sensing for water/gas/heat flow meters. The EVM
connects to the MSP430 LaunchPad evaluation kit for capturing data, and it connects to a user-friendly
Graphic User Interface (GUI) to modify the registers and display the data.
1 EVM Key Features
1. Evaluate TDC7200 Time-to-Digital Converter
2. EVM connect with MSP430 Launch Pad (MSP-EXP430F5529LP)
3. User friendly TDC7200 GUI interface
4. Connection for START and STOP inputs
5. Powered by MSP430 LaunchPad (no external power needed)
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www.ti.com EVM
2 EVM
Figure 1. TDC7200EVM Evaluation Board
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Equipment List www.ti.com
3 Equipment List
1. TDC7200EVM
2. TDC7200 GUI
3. MSP430 launchpad (http://www.ti.com/tool/msp-exp430f5529lp)
4. Micro-USB cable
5. Dual function generator (for example: Tektronix’s AFG3102)
6. PC with Windows XP or Windows 7
7. 2 BNC-to-SMA cables
4 Quick Start
1. Download and Install TDC7200EVM (GUI) Software. See Section 5 for more information.
2. Connect the USB cable from the MSP430 LaunchPad to the PC
3. Connect the TDC7200EVM to the MSP430 LaunchPad via J1 and J2
4. Connect START and STOP pulses to the TDC7200EVM via J5 and J4. See Section 6 for more
information.
5. Launch the GUI. See Section 7 for more information
6. On the “GRAPH” tab, press the “START GRAPH” button.
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5 Software Installation
This section describes software installation, firmware upgrade, and how to update USB Driver.
5.1 Installing the TDC7200 GUI
1. Download the TDC7200 Software GUI zip file to your desktop.
2. Unzip the file.
3. Run the setup.exe file.
4. Follow the instructions to install the GUI.
5. Once done, you should be able to see the installation in your folder, for example, C:\ folder, such as
C:\Program Files (x86)\Texas Instruments\TDC7200EVM.
6. Note: as part of this GUI installation, the GUI driver for the TDC7200EVM is also installed.
5.2 MSP430 Firmware Upgrade
1. Open the TDC7200 GUI.
2. Click on the Debug tab.
3. Click on “Update Firmware”.
4. Click Next to proceed on the first prompt; read and accept the license agreement, and click Next to
continue.
5. Choose “ Select Firmware”, and then hit “Browse”
(a) Go to the folder where you downloaded the TDC7200 GUI. For example: C:\Program Files
(x86)\Texas Instruments\TDC7200EVM
(b) Find the Firmware folder . For example: C:\Program Files (x86)\Texas
Instruments\TDC7200EVM\Firmware
(c) Select the TDC7200 firmware text file
6. On the MSP430 LaunchPad board, press the BSL button (S5 or S3) and connect the MSP430
Launch Pad to your PC using a USB cable. If detected, the text on the Firmware Upgrade tool
changes from No device connected to Found 1 device. See Figure 2.
7. On the MSP430 USB Firmware Upgrade GUI, click “Upgrade Firmware”.
8. Click “Close” when done.
Figure 2. Upgrading MSP430 Firmware
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Software Installation www.ti.com
5.3 Checking Connection
1. If you haven’t done so, connect the USB cable from the MSP430 Launch Pad to your PC.
2. If you haven’t done so, connect the TDC7200EVM to the MSP430 Launch Pad via J1 and J2 as shown
in Figure 6.
3. Open the computer’s Device Manager . This can be done by right clicking on “My Computer", choose
“Properties”, then click on “Device Manager”.
4. Scroll down to “Ports (COM &LPT)”
5. You should be able to see the “TDC7200EVM (COMx)” as shown in Figure 3
Figure 3. Device Manager
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5.4 Opening the GUI
1. If you haven’t done so, connect the USB cable from the MSP430 Launch Pad to your PC.
2. If you haven’t done so, connect the TDC7200EVM to the MSP430 Launch Pad via J1 and J2 as shown
in Figure 6.
3. Run the TDC7200 GUI from the “Start Menu”. By default, it is located in “Programs\Texas
Instruments\TDC7200EVM”
4. GUI should automatically connect and show the screen depicted in Figure 4.
Figure 4. TDC7200 GUI
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Hardware Configuration www.ti.com
6 Hardware Configuration
This section describes how to properly set up the connections on the EVM
6.1 EVM Connections
1. If you haven’t done so, connect the USB cable from the MSP430 Launch Pad to your PC.
2. If you haven't done so, connect the TDC7200EVM to the MSP430 Launch Pad via J1 and J2 as shown
in Figure 6.
3. Setting the Dual Channel Function Generator (for example: Tektronix’s AFG3102):
(a) Set channel 1 of the dual function generator to as follows (see Figure 5):
(i) Pulse 1-Cycle
(ii) Burst mode
(iii) Freq = 40kHz
(iv) Delay = 0s
(v) Amplitude = 3.3Vpp
(vi) Offset = 1.65V
(vii) Duty = 20%
(b) Set channel 2 of the dual function generator to as follows (see Figure 5):
(i) Pulse 1-Cycle
(ii) Burst mode
(iii) Freq = 40 kHz
(iv) Delay = 19us --> this is the time-of-flight (TOF)
(v) Amplitude = 3.3 Vpp
(vi) Offset = 1.65 V
(vii) Duty = 20%
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Figure 5. START and STOP Signals Scope Shot
4. Connecting the Input Signal:
(a) Using a USB-to-SMA cable, connect channel 1 of the dual function generator to TDC7200EVM’s
START connector (J5)
(b) Using a USB-to-SMA cable, connect channel 2 of the dual function generator to TDC7200EVM’s
STOP connector (J4). See Figure 6.
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Figure 6. TDC7200EVM Connection
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www.ti.com Hardware Configuration
6.2 Jumpers
The following shows the jumper connection:
1. Jumper JP1: VCC power
(a) Connect Pin 1 to Pin 2 – power VCC via MSP430 (recommend)
(b) Open Pin 1 and Pin2 – no connection to VCC via MSP430; need to apply external power
2. Jumper JP2: CLOCK source
(a) Connect Pin 1 to Pin 2 – use external clock as the CLOCK source.
(b) Connect Pin 2 to Pin 3 – use Y1 as the CLOCK source (recommend)
7 GUI and Operation
1. If you haven’t done so, open the TDC7200EVMGUI. The EVM GUI software can be run by clicking on
Start >> All Programs >> Texas Instruments >> TDC7200.
2. Click on the “TDC7200” tab and make sure the TDC7200 register configuration is as follows (default
settings):
Figure 7. Recommended TDC7200 Register Configuration (Default Settings)
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GUI and Operation www.ti.com
3. Click on the “Graph” tab, then click on “START GRAPH”. You should be able to read 19 µs
(assuming you follow the instructions as specified in Section 6.1).
Figure 8. Graphing
4. Calculating Time-of-Flight:
(a) In the GUI, click on the “TOF_ONE_SHOT” tab
(b) You should be able to see SIMILAR measurement results register values as shown in Figure 9
(assuming you follow the instructions as specified in Section 6.1).
Figure 9. Measurement Results
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11
CALIBRATION2 CALIBRATION1 (4354 2179)
calCount 2175
(CALIBRATION2_PERIODS) 1 (2) 1
(CLOCKperiod) (1/ 8MHz)
normLSB 5.74 10
(calCount) 2175
TOF1 normLSB(TIME1 TIME2) (CLOCK _COUNT1)(CLOCKperiod)
TOF1 (5.74 1

 
 

 
 11 0 )(1688 1667) (152)(1/ 8MHz)
TOF1 19.001us
 
n n n 1
n n 1 n
TOF (TIME1)(normLSB) offset (CLOCK_COUNT )(CLOCKperiod) (TIME )(normLSB) offset
TOF normLSB(TIME1 TIME ) (CLOCK _COUNT )(CLOCKperiod)
(CLOCKperiod)
normLSB (calCount)
CALIBRATION2 CA
calCount


   
ª º ª º
¬ ¼ ¬ ¼
 

LIBRATION1
(CALIBRATION2_PERIODS) 1
www.ti.com GUI and Operation
(c) To calculate the time-of-flight, use the Measurement Mode 2 Time-of-Flight calculation as shown in
Equation 1 (equation shown below). For more information, refer to the TDC7200 datasheet.
(d) Use the values reported in the Measurement Result Registers (Figure 9) to validate the time-of-
flight as ~19us (assuming you follow the instructions as specified in Section 6.1).
where
• TOFn [second] = time-of-flight measurement from the START to the nth STOP
• normLSB [sec] = normalized LSB value from calibration
• TIME1 = time 1 measurement given by the TDC7200 register address 0x10
• TIMEn+1 = (n+1) time measurement given by the TDC7200 register addresses 0x12, 0x14, 0x16, 0x18,
and 0x1A
• CLOCK_COUNTn = nth clock count values in register addresses 0x11, 0x13, 0x15, 0x17, and 0x19
• CLOCKperiod [sec] = external CLOCK period
• offset [sec]= constant measurement offset
• CALIBRATION1 [count] = TDC count for first calibration cycle, located in register address 0x1B
• CALIBRATION2 [count] = TDC count for second calibration cycle, located in register address 0x1C
• CALIBRATION2_PERIODS = calibration count bits, located in register address 0x01 (1)
(2)
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Board Layout www.ti.com
8 Board Layout
NOTE: The board layout is not to scale. The following figures are intended to show how the board is laid
out; it is not intended to be used for manufacturing.
Figure 10. Top Assembly Layer
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Figure 11. Bottom Layer
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Board Layout www.ti.com
Figure 12. Schematic
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www.ti.com Bill of Materials
9 Bill of Materials
Table 1. TDC7200 Bill of Materials
DESIG- PACKAGE PART MANU-
QTY. VALUE DESCRIPTION
NATOR REFERENCE NUMBER FACTURER
C1 1 10uF CAP, CERM, 10uF, 6.3V, +/-20%, X5R, 0603 0603 C0603C106M9PACTU Kemet
C2 1 0.1uF CAP, CERM, 0.1uF, 16V, +/-5%, X7R, 0603 0603 0603YC104JAT2A AVX
C4 1 1uF CAP, CERM, 1uF, 16V, +/-10%, X7R, 0603 0603 EMK107B7105KA-T Taiyo Yuden
C5 CAP, CERM, 0.01uF, 100V, +/-5%, X7R, 0603 06031C103JAT2A AVX
1 0.01uF 0603
J1, J2 Receptacle, 10x2, 100mil, TH 10x2 Receptacle PPPC102LFBN-RC Sullins
2 Connector
Solutions
J4, J5, J6 3 Connector, End launch SMA, 50 ohm, SMT End Launch SMA 142-0701-801 Johnson
JP1 Header, TH, 100mil, 2x1, Gold plated, 230 mil 2x1 Header TSW-102-07-G-S Samtec
1above insulator
JP2 Header, TH, 100mil, 3x1, Gold plated, 230 mil 3x1 Header TSW-103-07-G-S Samtec
1above insulator
R1, R2 2 49.9 RES, 49.9 ohm, 1%, 0.1W, 0603 0603 CRCW060349R9FKEA Vishay-Dale
R3, R6 2 0 RES, 0 ohm, 5%, 0.1W, 0603 0603 CRCW06030000Z0EA Vishay-Dale
R4 1 1.00k RES, 1.00k ohm, 1%, 0.1W, 0603 0603 CRCW06031K00FKEA Vishay-Dale
R5 1 10.0k RES, 10.0k ohm, 1%, 0.1W, 0603 0603 CRCW060310K0FKEA Vishay-Dale
SH-JP1, Shunt, 100mil, Gold plated, Black Shunt 969102-0000-DA 3M
2 1x2
SH-JP2
TP4, TP5 2 Black Test Point, Multipurpose, Black, TH Black Multipurpose Testpoint 5011 Keystone
U1 STOPWATCH IC FOR TIME PW0014A TDC7200PW Texas
1 MEASUREMENT BETWEEN TWO EVENTS, Instruments
PW0014A
Y1 OSC, 8MHz, 15pF, SMD OSC, 3.2x.85x5mm ASFLMB-8.000MHZ-LY-T Abracon
1Corportation
C3 CAP, CERM, 0.01uF, 100V, +/-5%, X7R, 0603 06031C103JAT2A AVX
0 0.01uF 0603
C6 0 1uF CAP, CERM, 1uF, 16V, +/-10%, X7R, 0603 0603 EMK107B7105KA-T Taiyo Yuden
J3 Header, TH, 100mil, 7x1, Gold plated, 230 mil 7x1 Header TSW-107-07-G-S Samtec
0above insulator
R7 0 10.0k RES, 10.0k ohm, 1%, 0.1W, 0603 0603 CRCW060310K0FKEA Vishay-Dale
TP1, TP2, TP3 Header, TH, 100mil, 1pos, Gold plated, 230 Testpoint TSW-101-07-G-S Samtec
0mil above insulator
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STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3Regulatory Notices:
3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
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