Texas Instruments TPS272C45 User manual

User’s Guide
TPS272C45 Evaluation Module
ABSTRACT
The TPS272C45EVM is a hardware evaluation module (EVM) used to enable hardware engineers to evaluate
the full performance and functionality of the TPS272C45 industrial high side switch. The TPS272C45EVM
contains everything needed to test and assess the TPS272C45 before designing it into part of a greater
application's power system. The evaluation module is designed to either be used as a standalone board with an
attached voltage supply and output load or in conjunction with an underlying Texas Instruments microcontroller
by using the standardized BoosterPack headers. A wide range of application features such as current sensing,
multiplexed current limiting, and transient suppression are enabled and visible through use of this evaluation
module.
Table of Contents
1 Introduction.............................................................................................................................................................................2
2 Compatibility Across Silicon Versions................................................................................................................................. 3
3 BoosterPack Operation..........................................................................................................................................................4
4 TPS272C45EVM Schematic................................................................................................................................................... 5
5 Connection Descriptions....................................................................................................................................................... 6
6 TPS272C45EVM Assembly Drawings and Layout............................................................................................................... 7
7 Current Limit Configuration.................................................................................................................................................10
8 Current Sense .......................................................................................................................................................................11
9 Transient Protection............................................................................................................................................................. 12
10 Bill of Materials................................................................................................................................................................... 13
11 Revision History..................................................................................................................................................................15
List of Figures
Figure 4-1. TPS272C45EVM Schematic Drawing....................................................................................................................... 5
Figure 6-1. 3D Representation.................................................................................................................................................... 7
Figure 6-2. Top Layer...................................................................................................................................................................7
Figure 6-3. Power Layer.............................................................................................................................................................. 8
Figure 6-4. Ground Layer............................................................................................................................................................ 8
Figure 6-5. Bottom Layer............................................................................................................................................................. 9
Figure 7-1. Multiplexed Current Limit.........................................................................................................................................10
List of Tables
Table 2-1. EVM Considerations Across Silicon Versions.............................................................................................................3
Table 3-1. Connected BoosterPack Header Pins on TPS272C45EVM....................................................................................... 4
Table 5-1. Connections and Test Points...................................................................................................................................... 6
Table 5-2. Jumper Configurations................................................................................................................................................6
Table 10-1. TPS272C45 Bill of Materials................................................................................................................................... 13
Trademarks
All trademarks are the property of their respective owners.
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1 Introduction
The Texas Instruments TPS272C45EVM is an evaluation module that is used to demonstrate and showcase
all of the features of the underlying TPS272C45 industrial high side switch. This evaluation board provides a
seamless way to connect a set of power supplies to the inputs of the TPS272C45, connect loads to the output
channels, and switch on and off the device using the control pins of the chip itself. An on-board 3.3-V LDO
is included on the EVM to simplify controlling signals to the TPS272C45 and easily assert and deassert logic
signals by the use of a set of external hardware jumpers. Additionally this EVM includes BoosterPack headers
allowing the user to easily connect the TPS272C45 high side switch to an underlying microcontroller and write
software to control and configure the device.
Features of the TPS272C45EVM include:
• Multiplexed current limit configuration on ILIM1
• BoosterPack headers allowing power switch to be controlled by external microcontroller
• On-board 3.3-V LDO allowing for control signals to be manipulated by set of jumpers
• Ideal board layout and copper area for thermal performance
• Ability to support versions A, B, C, and D of the TPS272C45
• Optional footprint to populate external inductive clamping diodes (version C of TPS272C45)
• Optional footprint to populate TVS diode for Vdd input (version A of TPS272C45)
Introduction www.ti.com
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2 Compatibility Across Silicon Versions
The TPS272C45EVM is compatible across all versions of the TPS272C45. This compatibility includes the
TPS272C45A with the external Vdd rail (A version), the TPS272C45B version without the Vdd rail (B version),
the TPS272C45C with support for the external inductive loading diode (C version), and the TPS272C45D with
fault output for individual channel (D version). By default, the A version of the silicon is populated on the EVM.
The footprints among the A, B, C, and D versions of the TPS272C45 silicon are footprint compatible and can be
interchanged by unpopulating the A version that ships default on the EVM and soldering, populating the desired
version of the silicon.
The A, C and D version of the device includes the ability to power the digital logic of the TPS272C45 from an
external Vdd pin. While the Vdd input pin exists on the A version of the TPS272C45 it does not exist in the B
versions. When using the B versions of silicon on this EVM, disconnect the Vdd line (and associated jumper,
J17) and ground the pin as this pin is classified as GND for B versions of the TPS272C45. Additionally with the
A, C and D version of the silicon it is possible to solder a TVS diode to D6 to filter out transients to the Vdd line.
This TVS diode must have a reverse standoff voltage equal to the logic level of the voltage rail being fed into
Vdd. For example, if the logic level is 5 V, then a SMAJ5.0CA diode is appropriate to filter any transients above 5
V.
When using the C version of the device, populate D2, D3, D8, and D9 with the relevant diodes required for
inductive loading. TI recommends the SMC series of diodes due to their ability to dissipate large energies
and handle current required for discharging charged inductors during switch turn-off. These diodes must be
chosen so that reverse standoff voltage falls within the nominal operating supply voltage of the device and
anything above the breakdown voltage is considered a transient. The SMCJ48A-TR, for example, is able the
absolute device max rating of 48 V and filter any transients above this level. More information about the transient
protections provided by the EVM can be found in Transient Protection.
When using the D version of the device, make sure jumper J23 is connected to the FLT1_IC position to get the
Fault output for each channel.
A table of the versions of TPS272C45 and considerations that have to be taken can be found in Table 2-1.
Table 2-1. EVM Considerations Across Silicon Versions
TPS272C45 Version Considerations
ADefault version populated on EVM. Follow desired settings from Connection
Descriptions.
B
Unable to use external Vdd.
Do not plug supply into J6.
Do not populate J17.
Do no populate TVS diode on D6.
CFollow same guidance of A version.
Populate inductive loading discharge diode on D2, D3, D8, and D9.
DFollow same guidance of A version.
Populate J23 with jumper in position of FLT2_IC.
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3 BoosterPack Operation
While the TPS272C45EVM can be used as a standalone evaluation board without the need of any external
microcontroller, the EVM also comes populated with BoosterPack headers (J1, J2, J3, J4) to enable easy
interface with a Texas Instruments microcontroller. The 40-pin headers of the BoosterPack headers are used,
however all signals can be accessed using headers J1 and J2 enabling use with the 20-pin header. Additionally
by populating jumper J19 the user has the ability to power the underlying LaunchPad through the integrated
3.3-V LDO on the TPS272C45EVM. A list of pins connected to the BoosterPack header can be seen below in
Table 3-1:
Table 3-1. Connected BoosterPack Header Pins on TPS272C45EVM
BoosterPack Pin Function Note
J1-1 3.3-V power rail Disconnect J19 if powering LaunchPad via USB.
J1-2 Current sensing through the SNS pin Populate a Zener diode on D7 if it is required to limit analog
signal of pin
J1-5 DIA_EN pin used to enable diagnostics Can be used to multiplex multiple TPS272C45 switches to one
analog pin
J1-8 SEL pin used to change measurement reported on
SNS pin
J2-11 LATCH pin used to change fault behavior
J2-12 ILIM1 pin used to enable a10-kΩ resistor R13 for
ILIM1 Active high. Do not enable at same time as J2-13.
J2-13 ILIM2 pin used to enable a 4.99-kΩ resistor R14 for
ILIM1 Active high. Do not enable as same time as J2-12.
J2-17 FLT pin used to detect faults Open drain input. Pull-up source can be controlled using
jumper J18.
J2-18 EN2 to enable VOUT2 Active high. Can be connected to PWM.
J2-19 EN1 to enable VOUT1 Active high. Can be connected to PWM.
J2-20 Module GND Do not connect to IC ground if ground network is used
Note that for all IO and analog signals being attached to the BoosterPack, the relevant 4.7-kΩ protection
resistors are populated in series with the pin.
To power the attached LaunchPad from the on-board LDO of the TPS272C45EVM, connect the jumper J19.
Note that this feeds the output of the 3.3-V LDO on the TPS272C45EVM into the 3.3-V rail on the LaunchPad.
If there is another power supply trying to power the LaunchPad (such as the integrated USB power on the
LaunchPad itself) this can potentially cause issues with the separate power sources fighting for contention.
Jumpers J8 through J12 are used to manually configure the control signals going into the TPS272C45.
When using a microcontroller to control these signals these jumpers must be unpopulated to allow for the
microcontroller to drive them high or low. Additionally the header labeled J18 can be used to configure how
the FAULT pin is pulled up. This pin is an open drain output used to report faults on the TPS272C45 such as
overcurrent or open load. If J18 is connected to the pin marked BP on the silkscreen the FAULT pin is pulled
up through the 1-kΩ resistor R9 to the 3.3-V rail of the BoosterPack. Similarly if the jumper labeled J17 is
connected to the BP pin the Vdd rail of the TPS272C45 is connected to the 3.3-V rail of the BoosterPack. If J17
is populated to be fed from the LDO or BoosterPack, it cannot be supplied externally from the J6 banana jack.
Note that one useful feature of the TPS272C45 EVM is the ability to sense the from the SNS pin of the
TPS272C45 through the analog input of the microcontroller attached to the BoosterPack headers. A 1.0-kΩ
resistor is connected to convert the current coming out of the SNS pin to a voltage, however care must be
given to ensure that this value does not violate the input maximum of the microcontroller's analog input. To
mitigate, a Zener diode can be soldered to D7 (do not populate by default) to regulate the voltage going into the
microncontroller's analog input.
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4 TPS272C45EVM Schematic
J5
571-0500
J20
571-0500
J21
571-0500
J22
571-0100
EN1_IC EN2_IC
4.7k
R4
4.7k
R11
4.7k
R12
4.7k
R10
4.7k
R7
DIA_EN_IC SEL_IC LATCH_IC
GND
OUT 1
DNC 2
P G 3
4
EN
5
NC 6 DELAY
7
IN
8
9
EP GND
TPS7A1633DGNRU1
GND
13
D5
BAS21-7-F
1.0k
R8
1
2
J16
961102-6404-AR
1
2
3
J8
961103-680 4-AR
1
2
3
J9
961103-680 4-AR
1
2
3
J10
961103-680 4-AR
1
2
3
J11
961103-680 4-AR
1
2
3
J12
961103-680 4-AR
1
2
3
J13
961103-680 4-AR
GND_IC
1.0 0k
R16
4.7k
R15
100V
100pF
C8
SNS _IC
GND
SNS _BP
TP1
5010
TP2
5010
TP3
5010
TP4
5011
TP5
5011
J7
571-0100
VOUT1
VOUT2
1
2
3
J17
961103-680 4-AR
BP_3V3
VDD_IC
SNS _BP
FLT_IC/FLT1_IC
EN2_IC
EN1_IC
GND
LATCH_IC
SEL_IC
BP_3V3
DIA_EN_BP
4.7k
R1
DIA_EN_IC
VS
VDD_IC
ILIMD_IC/FLT2_IC
1
2
J14
961102-640 4-AR
1
2
J15
961102-640 4-AR
ILIM1_IC
ILIM1_CTL_BP1 ILIM1_CTL_BP 2
ILIM1_CTL_BP1
ILIM1_CTL_BP2
GND_IC
Analog S e nsing
Current Limiting
Booste rP a ck He a de rs
3.3V LDO
Ground Ne twork
Configura tion J umpe rs
GND_IC
22nF
100V
C3
GND
22nF
100V
C6
1.0k
R9
1
2
3
J18
961103-680 4-AR
FLT_PU
BP_3V3
1 3
D1 BAS21-7-F
+3.3V
1
Analog_In
2
LP_UART_RX
3
LP_UART_TX
4
GP IO !
5
Analog In
6
S P I_CLK
7
GP IO !
8
I2C_SCL
9
I2C_SDA
10
+5V 21
GND 22
Analog_In 23
Analog_In 24
Analog_In 25
Analog_In 26
Analog_In/I2S _WS 2 7
Analog_In/I2S _S CLK 28
Analog_O ut/I2S _S Dou t 29
Analog_O ut/I2S _S Din 30
J1/J 3
SS Q-110-03-T-D
GP IO ! 31
GP IO ! 32
GP IO ! 33
GP IO ! 34
Time r_Ca p/GP IO ! 35
Time r_Ca p/GP IO ! 36
P WM/GP IO ! 37
P WM/GP IO ! 38
P WM/GP IO ! 39
P WM/GP IO ! 40
GP IO !
11
S P I_CS /G P IO !
12
S P I_CS /G P IO !
13
S P I_MIS O
14
S P I_MOS I
15
RS T
16
GP IO
17
GP IO !
18
P WM/GP IO !
19
GND
20
J2/J 4
SS Q-110-03-T-D
GND
1
2 3
Q1
2N7002Q-7-F
1
2 3
Q2
2N7002Q-7-F
FLT_PU
48.7
R6
5V
D6
SMAJ5 .0CA
VDD
19 OUT1 1
OUT1 2
OUT1 3
OUT2 5
OUT2 6
OUT2 7
VS
8
VS
9
VS
23
VS
24
EN1
16
EN2
15
FLT
10
DIA_EN
12
ILIMD
18
LATCH
14
PowerPad 25
SEL
13
SNS
11
ILIM1
21
ILIM2
20
NC 4
NC 22
GND 17
TPS 272C45A/D
U2
VDD_IC
GND
EN1_IC
EN2_IC
FLT_IC/FLT1_IC
DIA_EN_IC
SEL_IC
SNS _IC
LATCH_IC
ILIM1_IC
ILIM2_IC
48V
D2
SMCJ48A-TR
48V
D3
SMCJ48A-TR
GND
J6
571-0500
TP6
5011
GND
2.2 µF
50V
C1
3.3 V
D7
MMSZ52 26B-7-F
1
2
J19
961102-640 4-AR
D9
STPS 1150A
D8
STPS 1150A
GND
TP10
5126
TP7
5126
4.7 nF
100V
C4
100nF
100V
C5
100V
2.2 uF
C7
100V
1uF
C2
TP8
5126
TP9
5126
TP11
5011
0
R5
0
R3
4.9 9k
R14
10.0k
R13
36V
D4
SMBJ36A-13-F
10k
R17
10k
R18
1
2
3
J23
961103-680 4-AR
Configura tion for Ver D
ILIMD_IC
ILIMD_IC/FLT2_IC
ILIMD_IC
FLT2_IC
4.7k
R20
1.0k
R19
FLT_PU
FLT2_IC
TP12
5126
19.6k
R2
Figure 4-1. TPS272C45EVM Schematic Drawing
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5 Connection Descriptions
Table 5-1 shows the test points populated on the board as well as the signal connectors.
Table 5-1. Connections and Test Points
Connector and Test Point Description
J1 to J4 BOOST-XL headers to connect to Texas Instruments LaunchPad Ecosystem
J5, TP1 Supply voltage
J6 Supply rail for Vdd (A, C, D version of the TPS272C45 only)
J7, J22, TP4, TP5, TP6 Ground connections
TP7 Current sense output (SNS)
J20, TP3 Output voltage 2 (VOUT2)
J21, TP2 Output voltage 1 (VOUT1)
TP8 Enable for VOUT1 (EN1)
TP9 Enable for VOUT2 (EN2)
TP10 Shared fault line (FAULT)
TP11 IC Ground (IC_GND)
Table 5-2 shows the relevant configuration jumpers of the TPS272C45EVM as well as the associated values.
Please refer to the TPS272C45 data sheet for detailed information on each pin's functionality.
Table 5-2. Jumper Configurations
Jumper Function/Settings
J8 Controls EN1 and enables, disables VOUT1
J9 Controls EN1 and enables, disables VOUT2
J10 Sets DIA_EN and enables, disables diagnostics
J11 Controls the SEL pin to set which diagnostics are reported by the SNS pin
J12 Sets the functionality of the device during fault conditions via the LATCH pin
J13 Enables, disables the on-board 3.3-V LDO. Must be set to top position (marked on silk screen as 3.3-V
LDO) to allow J8 to J12 to be high.
J14, J15
Controls which resistance value that is going into ILIM1. Only populate either J14 or J15 (not both) at a
time. If J14 is populated a 10-kΩ value is used and if J15 is used a 4.99-kΩ value is used for ILIM1. If
controlling from a from a microcontroller do not populate J14 or J15.
J16 Controls whether or not to use the diode/resistor ground network for reverse current blocking. Populate
jumper to bypass ground network.
J17 Selects if Vdd is being supplied by the BoosterPack or the on-board LDO. Do no populate if being supplied
externally through J6.
J18 Controls if the FAULT line is being pulled up by the BoosterPack or the on-board LDO
J19 Connects the BoosterPack 3.3-V rail to the on-board LDO's 3.3-V output giving the ability to power the
connected LaunchPad from the LDO.
J23 Configures pin 18 to be connected to ILIMD in A, B, C version or FLT1 in D version
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6 TPS272C45EVM Assembly Drawings and Layout
Figure 6-1. 3D Representation
Figure 6-2. Top Layer
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Figure 6-3. Power Layer
Figure 6-4. Ground Layer
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Figure 6-5. Bottom Layer
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7 Current Limit Configuration
The TPS272C45EVM has the ability to configure both the ILIM1 and ILIM2 pins of the TPS272C45 to set a wide
range of current limits that are custom tailored to the end design. Additionally the user is able to custom tailor
the duration of time taken before the output current shuts off through the resistor connected to the ILIMD pin.
The external current limits of the TPS272C45EVM are controlled by external resistors R13 and R14 (ILIM1), R2
(ILIM2), and R3 (ILIMD). Note that these resistors are populated in the 0805 package size allowing for easy
soldering and desoldering.
The ILIM1 pin is configured in such a way that multiplexed current limits can be selected from an external
microcontroller through the BoosterPack headers. This feature can seen below in Figure 7-1:
Figure 7-1. Multiplexed Current Limit
With this configuration, the user can choose to enable the MOSFET Q1 if the 10.0-kΩ resistor is desired or
enable the MOSFET Q2 if the 4.99-kΩ resistor is desired. TI does not recommend to enable both channels
simultaneously as this would parallel both of the resistors and add an undesired capacitance to the line. If
multiplexing is not needed, the user can manually populate either the J14 or J15 jumpers. Please refer to the
TPS272C45 data sheet for information on how to calculate delays from relevant resistor values.
Current Limit Configuration www.ti.com
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