Texas Instruments LP-MSPM0C1104 User manual

EVM User's Guide: MSPM0C1104 LP-MSPM0C1104
LP-MSPM0C1104 Evaluation Module
Description
The MSPM0C1104 LaunchPad™ Development Kit
is an easy-to-use evaluation module for the
MSPM0C1104 microcontroller (MCU). The kit
contains everything needed to start developing
on the MSPM0C110x microcontroller platform,
including onboard debug probe for programming and
debugging. The board also features an onboard
button and LED for quick integration of a simple user
interface.
The MSPM0C1104 is an Arm® Cortex® 32-bit
-M0+ CPU with frequency up to 24 MHz. The
device features 16KB of embedded flash memory
combined with 1KB of on-chip RAM. This devices
includes an integrated 12-bit 866Ksps SAR ADC
with 10 external channels. Rapid prototyping is
simplified by the 20-pin BoosterPack™ plug-in module
headers, which support a wide range of available
BoosterPack plug-in modules. Users can quickly add
features like wireless connectivity, graphical displays,
environmental sensing, and much more. Design a
BoosterPack plug-in module or choose among many
available from TI and third-party developers.
Get Started
1. Order LP-MSPM0C1104 from ti.com.
2. Navigate to dev.ti.com to browse for code
examples.
3. Plug LP-MSPMC1104 into a PC with the provided
USB cable.
4. Download code directly from the browser to the
MSPM0C1104 with CCS Cloud.
5. Download CCS Theia for a desktop integrated
development environment.
Features
• Onboard XDS110 debug probe
• Backchannel UART through USB to PC
• USB powered
• 20-pin BoosterPack headers
• RC filter for ADC input or PWM DAC output
• One user button
• One red LED
Applications
•Battery charging and management
•Power supplies and power delivery
•Personal electronics
•Building security and fire safety
•Connected peripherals and printers
•Grid infrastructure
•Smart metering
•Communication modules
•Medical and healthcare
•Lighting
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1 Evaluation Module Overview
1.1 Introduction
The MSPM0C1104 is a low-cost microcontroller from the MSPM0 family based on the Arm(r) Cortex-M(r) M0+
processors architecture. These flexible devices can be used in a variety of system tasks from housekeeping
to simple motor control. The easiest way to get started with MSPM0C1104 is with the LP-MSPM0C1104
LaunchPad™. The LaunchPad has all the required features to load code, debug, and prototype right out of
the box.
To make prototyping even easier, TI provides the MSPM0 software development kit (SDK), which has over 50
code examples to use as starting points for application.
Free software development tools are also available, such as TI's Code Composer Studio™ IDE, IAR Embedded
Workbench™ IDE, and Keil® µVision® IDE. Code Composer Studio IDE supports EnergyTrace™ technology
when paired with the MSPM0L1306 LaunchPad development kit. More information about the LaunchPad
development kit, the supported BoosterPack™ plug-in modules, and the available resources can be found at
the TI LaunchPad™ development kit portal. To get started quickly and find available resources in the MSPM0
software development kit (SDK), visit the TI Cloud Developer Zone. MSPM0 MCUs are also supported by
extensive online collateral, training with MSP Academy, and online support through the TI E2E™ support forums.
1.2 Kit Contents
LP-MSPM0C1104 LaunchPad development kit
Quick start guide
1.3 Specification
LP-MSPM0C1104 is designed to be used in conjunction with a PC, Mac®, or Linux® workstation running Code
Composer Studio™ (CCS). CCS can run as a stand-alone on the workstation or be accessed through the web
(CCS Cloud) without the need for a software installation. Alternatively, LP-MSPM0C1104 ships with an example
loaded, which can be controlled by a GUI. See the out-of-box description below.
Once the code has been flashed onto LP-MSPM0C1104, the device can be powered from a power supply other
than the built in USB power supply. This allows the user to forgo the PC connection. Power can be applied
directly to either the 3.3V or 5 V rails. Do not apply power to both rails simultaneously. When using an external
power supply, make sure to not exceed 3.3V or 5 V respectively.
1.4 Device Information
LP-MSPM0C1104 uses the following devices from Texas Instruments.
Device Name Description Purpose
MSP432E401YTPDT SimpleLink™ 32-bit Arm® Cortex®-M4F MCU with ethernet,
CAN, 1MB Flash and 256kB RAM XDS110 host device
TPD4E004DRYR ESD-protection array for high-speed data interfaces, 4
channels
Protect LP-MSPM0C1104 from ESD damage
through USB connector
TPS73533DRBT 500 mA, adjustable, low quiescent current, low-noise, high-
PSRR, single-output LDO regulator 3.3V power XDS110 and MSPM0C1104
LM4040C25IDCKR Precision micropower shunt voltage reference Voltage reference for XDS110 debugger
MSPM0C1104SDGSR
Mixed-signal
Microcontroller with 24 MHz Arm® Cortex®32-bit-M0+ CPU,
16kB flash, and 1kB SRAM
Evaluation device
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2 Hardware
2.1 Hardware Overview
Figure 2-1. Diagram of LP-MSPM0C1104 Jumpers and Connectors
LP-MSPM0C1104 has many hardware features, which allow the user full access to the MSPM0C1104 pins while
still providing onboard connectivity for easy use. Shunt connections provide a way for the user to easily change
the LaunchPad configuration. The location of these shunts is shown in Figure 2-1. The connection of each shunt
is described in Table 2-1. The default configuration is to have all shunts populated.
Table 2-1. Jumper Information
Jumper Description Default Setting Connected Signal
J6 Pullup selection for PA0 (open drain) Installed between center tap and 3.3V 2.2k pullup resistor to 3.3V or 5 V
J7 PA4 LED connection Installed LED1 anode (+)
J8 Pullup selection for PA11 Installed 2.2k pullup resistor to 3.3V
J9 Reset button and pullup circuitry
connection Installed See Section 4.1
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2.2 Power Requirements
Simple nature of LP-MSPM0C1104 only requires 5 V USB power to operate. The onboard LDO generates a
3.3V supply up to 500 mA. The LaunchPad can also be power directly from the BoosterPack or power headers
using a bench supply or battery. Do not exceed 3.3V on the 3.3V rail. Do not exceed 5 V on the 5 V rail. Figure
2-2 shows the power connections on LP-MSPM0C1104.
Figure 2-2. LP-MSPM0C1104 Power Connections
2.3 XDS110 Debug Probe
LP-MSPM0C1104 features a onboard debug probe to streamline prototyping. The debugger used on this
LaunchPad is the XDS110 variant, which supports all MSPM0 device derivatives. The integrated XDS110 debug
probe is physically separated from the rest of the MSPM0C1104 circuitry as shown in figure 2.x. The XDS110
is also electrically separated from the MSPM0C1104. The XDS110 is only connected through signals that pass
through J101, in addition to a common ground.
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Isolation Jumper Block
The isolation jumper block at jumper J101 allows the user to connect or disconnect signals that cross from the
XDS110 domain into the MSPM0C1104 target domain. This includes XDS110 SWD signals, application UART
signals, and 3.3V and 5 V power.
Jumper Description
5 V 5-V VBUS from USB.
3V3 3.3-V rail, derived from VBUS in the XDS110-ET domain.
RXD<< Backchannel UART: The target MSPM0L1306 receives data through this signal. The arrows indicate the direction of the
signal.
TXD>> Backchannel UART: The target MSPM0L1306 sends data through this signal. The arrows indicate the direction of the
signal.
NRST RST signal.
SWDIO Serial wire debug: SWDIO data signal.
SWCLK Serial wire debug: SWDCLK clock signal.
During normal prototyping all shunts are populated. However, there are some scenarios where a user needs to
open these connections:
• To remove any and all influence from the XDS110 debug probe for high accuracy target power
measurements.
• To control 3.3V and 5 V power flow between the XDS110 and target domains.
• To expose the target MCU pins for other use than onboard debugging and application UART communication.
• To expose the programming and UART interface of the XDS110 so that the XDS110 can be used for devices
other than the onboard MCU.
Application (Backchannel) UART
The backchannel UART allows communication with the USB host that is not part of the target application’s
main functionality. This is very useful during development, and also provides a communication channel to the
PC host side. This can be used to create graphical user interfaces (GUIs) and other programs on the PC that
communicate with the LaunchPad development kit.
Figure 2-3 shows the pathway of the backchannel UART. The backchannel UART is connected to UART0 (PA8,
PA9) deepening on the jumper settings on headers J16 and J17.
On the host side, a virtual COM port for the application backchannel UART is generated when the LaunchPad
development kit enumerates on the host. You can use any PC application that interfaces with COM ports,
including terminal applications like Hyperterminal or Docklight, to open this port and communicate with the target
application. You need to identify the COM port for the backchannel. On Windows PCs, Device Manager can
assist.
Figure 2-3. Application Backchannel UART in Device Manager
The backchannel UART is the XDS110 Class Application/User UART port. In this case, Figure 2-3 shows
COM14, but this port can vary from one host PC to the next. After identifying the correct COM port, configure
the port in the host application according to documentation. The user can then open the port and begin
communication from the host.
On the target MSPM0C1104 side, the backchannel is connected to the UART0 module. The XDS110 has a
configurable baud rate; therefore, the PC application configuring the baud rate to be the same as what is
configured on the UART0 is important.
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2.4 Measure Current Draw of the MSPM0C1104
To measure the current draw of the MSPM0L1306 MCU using a multimeter, use the 3V3 jumper on the J101
jumper isolation block. The current measured includes the target device, launchpad circuits, and any current
drawn through the BoosterPack plug-in module headers.
To measure ultra-low power, follow these steps:
1. Remove the 3V3 jumper in the J101 isolation block, and attach an ammeter across this jumper.
2. Consider the effect that the backchannel UART and any circuitry attached to the MSPM0C1104 can have
on the current draw. Consider disconnecting these at the isolation jumper block, or at least consider their
current sinking and sourcing capability in the final measurement.
3. Make sure there are no floating inputs/outputs (I/Os) on the MSPM0C1104. This causes unnecessary extra
current draw. Every I/O is either driven or, if the I/O is an input, is pulled or driven to a high or low level.
4. Begin target execution.
5. For the most accurate current measurements, place the device in Free Run mode and disconnect
programming signals between the MSPM0L1306 and the debug portion of the board (header J101).
6. Measure the current. Keep in mind that if the current levels are fluctuating, then getting a stable
measurement can be difficult. Measuring the quiescent states is easier.
2.5 Clocking
The internal SYSOSC is 24 MHz as default at the accuracy of 2.5%. The MCLK is sourced by 32-MHz SYSOSC
at default. CPUCLK is sourced directly from MCLK in RUN mode and disabled in other modes. The low-power
clock (ULPCLK) can be sourced by MCLK and active in RUN and SLEEP mode by configuration. For more
clock tree details see Section 2.3 Clock Module (CKM) of the MSPM0 C-Series Microcontrollers Technical
Reference Manual.
2.6 BoosterPack Plug-in Module Pinout
The LaunchPad development kit adheres to the 20-pin LaunchPad development kit pinout standard, where
pins are available. A standard was created to aid compatibility between LaunchPad development kits and
BoosterPack plug-in modules across the TI ecosystem.
While most BoosterPack plug-in modules are compliant with the standard, some are not. If the reseller or owner
of the BoosterPack plug-in module does not explicitly indicate compatibility with the MSPM0C1104 LaunchPad
development kit,then compare the schematic of the candidate BoosterPack plug-in module with the LaunchPad
development kit to verify compatibility. Conflicts can be resolved by changing the MSPM0C1104 device pin
function configuration in software.
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3 Software
3.1 Software Development Options
There are multiple ways to prototype with LP-MSPM0C1104:
1. Out-of-box GUI - Choose this option for an easy demo of LP-MSPM0C1104.
2. CCS Cloud - Choose this option to get started quickly with minimal installation.
3. CCS Thiea - Choose this option to work offline and have full access to debug features. See CCS Thiea
documentation to get started.
4. CCS Eclipse - This option is supported but is a legacy tool and is not covered in this guide.
3.2 Out-of-box GUI
Get started right away with the out-of-box example on LP-MSPM0C1104. Simply navigate to the Out-of-box GUI
and plug in LP-MSPM0C1104 to a PC, Mac, or Linux workstation. This GUI provides control of the built in LED
and a dashboard of the current state of LP-MSPM0C1104. Find instructions to start prototyping below.
3.3 CCS Cloud
1. Navigate to dev.ti.com. The user can be required to install CCS Cloud Agent. If so, then follow the steps to
complete this installation.
2. Plug LP-MSPM0C1104 using a micro-USB cable. TI Developer Zone automatically detects that LP-
MSPM0C1104 has been plugged in.
3. Click Browse software and examples, which opens the MSPM0 SDK in a new window.
4. In the left bar, navigate to Arm-based microcontrollers > Embedded Software > MSPM0 SDK > Examples >
Development Tools > DriverLib > gpio_toggle_output > No RTOS > TI Clang Compiler > gpio_toggle_output.
5. Click the Import button in the top right corner of the screen. This action imports the project into CCS Cloud
and open in a new window.
6. In CCS Cloud, click the debug icon in the left bar to open the debug view.
7. Click the play button to deploy the code to the device and open a debug session. By default, the debugger
pauses the first line of code.
8. Click the blue play button to start the application.
9. The red LED on LP-MSPM0C1104 needs to be blinking.
Now, the user is ready to begin prototyping by modifying the code or by importing a different example code.
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4 Hardware Design Files
4.1 Schematics
GND
GND
GNDGND
GND GND GND
3V3
3V3
GND
PA2
PA4
PA4
+5V
5V and 3.3V pullup selector for PA0
GND
LED
RESET Button
PA6
3V3
Power Headers
PA0
1
2
3
J6
1
2
3
J4
3 4
1 2
S1
3 4
1 2
S2
10uF
C1
47k
R2
470
R4
0.47uF
C3
1
2
J7
270
R19
USER Button
PA16
PA20_A6
PA23
PA22_A4
PA24_A3
PA25_A2
PA26_UART_RX_A1
PA11
PA16
PA27_UART_TX_A0
PA17_A9
PA19
PA18_A7
2.2k
R18
2.2k
R21
3V3
6VDD
4PA0
5PA1/RST
11 PA11
12 PA16/A8
13 PA17
14 PA18/A7
15 PA19/SWDIO
8PA2/ROSC
16 PA20/A6/SWCLK
17 PA22/A4
18 PA23/VREF+
19 PA24/A3
20 PA25/A2
1PA26/A1
2PA27/A0
9PA4
10 PA6
3VCORE
VSS 7
MSPM0L1306SDGS20
U1
PA28_A5
PA1_NRST
2
1
J9
GND
+5V
BoosterPack Connectors
GPIO ! 11
SPI_CS/GPIO ! 12
SPI_CS/GPIO ! 13
SPI_POCI 14
SPI_PICO 15
RST 16
GPIO 17
GPIO ! 18
PWM/GPIO ! 19
GND
J2
201
SSQ-110-03-F-S
2
3
4
5
6
7
8
9
10
J1
SSQ-110-03-F-S
5V 21
GND
J3
22
+3.3V
Analog_In
LP_UART_RX
LP_UART_TX
GPIO !
Analog In
SPI_CLK
GPIO !
I2C_SCL
I2C_SDA
3V3
SSQ-102-03-F-S
+5V
GND
PA0_BP
PA22_A4
PA6
PA28_A5
PA24_A3
PA27_UART_TX_A0
PA26_UART_RX_A1
PA25_A2 PA16
PA17_A9_BP
PA19
PA1_NRST
PA18_A7_BP
PA4
PA2
PA23
PA20_A6
GND
GND
1
2
3
J5
PA0_BP
GND
PA17_A9_BP
2.2uF
C4
0
R1
0
R7 PA17_A9
GND
PA18_A7_BP
2.2uF
C5
0
R8
0
R9
RC Filters for ADC or PWM DAC
PA18_A7
2
1
J8
3V3
2.2k
R3
270
R5
PA11_BP PA11
PA0
PA11_BP
3.3V pullup selector for PA11
0.01uF
C6
0.1uF
C2
1
2
3
4VDD
5
6
PA28/A0_5/TIMA0_C0/UART0_RX/TIMG8_IDX
PA0/BEEP/I2C0_SDA/TIMG8_C0/SPI0_CS1/FCC_IN/TIMA_FAL1
NRST/PA1/I2C0_SCL/TIMG8_C1/HFCLK_IN/TIMA0_C1
P
VSS
A2/TIMG8_C1/SPI0_CS0/TIMA0_C0/TIMG8_IDX
7
8
9
10
11
12
13
14
15
16
17
18
19
20
PAD 21
U2
MSPM0C1104SRUK
PA28_A5
PA0
PA1_NRST
PA2
PA4
PA6
PA11
PA16
PA17_A9
PA18_A7
PA19
PA20_A6
PA22_A4
PA23
PA24_A3
PA25_A2
PA26_UART_RX_A1
PA27_UART_TX_A0
GND
0.1uF
C7
3V3
GND
PA4/TIMA0_C0N/SPI0_POCI/LFCLK_IN/HFCLK_IN/TIMA0_C1N
PA6/TIMG0_C1/SPI0_SCK/TIMA0_C1/TIMG0_C2/SPI0_CS0/TIMA_FAL0
PA11/SPI0_SCK/I2C0_SCL/TIMA_FAL0
PA16/A0_8/TIMA0_C1N/SPI0_POCI/TIMG0_C0/FCC_IN
PA17/A0_9/UART0_TX/TIMA0_C0N/SPI0_SCK/TIMA0_C2/SPI0_CS1/TIMA0_C3
PA18/A0_7/UART0_RX/SPI0_PICO/TIMA0_C1N/CLK_OUT/TIMA0_C3/TIMA0_C3N
PA19/SWDIO/SPI0_SCK/SPI0_POCI/TIMA0_C2/TIMG0_C0/UART0_CTS
PA20/A0_6/SWCLK/TIMA_FAL1/SPI0_PICO/TIMA0_C2N/TIMA0_C0/UART0_RTS
PA22/A0_4/UART0_RX/SPI0_POCI/UART0_RTS/CLK_OUT/TIMA0_C1
PA23/UART0_TX/SPI0_CS3/TIMG0_C0/UART0_CTS/TIMA0_C3/TIMG0_C1
PA24/A0_3/SPI0_CS2/TIMG0_C1/UART0_RTS/TIMG0_C2/TIMA0_C3N/UART0_RX
PA25/A0_2 /TIMG0_C3/UART0_TX/SPI0_PICO/TIMG0_C1/TIMA_FAL2
PA26/A0_1 /TIMG8_C0/UART0_RX/SPI0_POCI/BEEP/TIMG0_C0/TIMA_FAL0
PA27/A0_0/TIMG8_C1/SPI0_CS3/TIMA0_C0N/UART0_TX/SPI0_POCI/TIMA_FAL2
Red
1 2
LED1
Place C2 close to MCU
LTST-C190KRKT
U1 uses the VSSOP20 package, however this
LaunchPad also provisions U2 if the user would
like to use the VQFN20 (MSPM0CxxxRUK)
package.
Series resistor helps identify which devices is
pulling down an open-drain bus. MSPM0C LP will
only be able to pull down the bus to about 0.1 *
VDD. Other will be able to pull down to ground.
Figure 4-1.
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XDS_RXD
XDS_TXD
XDS_TCK_SWDCLK
XDS_TMS_SWDIO
XDS_TDO_SWO
XDS_TDI
XDS_RESET_OUT
ITCK
ITMS
ITDI
ITDO
XDS_ID
XDS_VBUS
VBUS_DETECT
XDS_VCC
XDS_VCC
XDS_VCC
XDS_VCC
XDS_USB_D_P
XDS_USB_D_N
XDS_VCC
GND
GND
GND
GND
GND
GND
GNDGND
GND
GND
GND
GND
GND
GND
GND
REF_TARGET_VCC
1PD0
2PD1
3
4P
P
D
D
2
3
PE3 12
PE2 13
PE1 14
PE0 15
PK0 18
PK1 19
PK2 20
PK3 21
PC7
22 PC6
23 PC5
24 PC4
25
PH0 29
PH1 30
PH2 31
PH3 32
PA0
33
PA1
34
PA2
35
PA3
36
PA4
37
PA5
38
PA6
40
PA7
41
PF0 42
PF1 43
PF2 44
PF3 45
PF4 46
PG0 49
PG1 50
PK7 60
PK6 61
PK5 62
PK4 63
91
92 PB
PB
2
3
95
96 PB
PB
0
1
PC3/TDO/SWO
97 PC2/TDI
98
99 PC1/TMS/SWDIO
PC0/TCK/SWCLK
100
PJ0 116
PJ1 117
PB5
120 PB4
121
PE4 123
PE5 124
PD4
125
126
127
128
P
P
P
D
D
D
5
6
7
XDS1A
MSP432E401YTPDTR
5
PQ0 6
PQ1
PQ2 11
PQ3 27
PM7
71 PM6
72 PM5
73 PM4
74 PM3
75 PM2
76 PM1
77 PM0
78
PL0
81
PL1
82
PL2
83
PL3
84
PL4
85
PL5
86
PL7
93 PL6
94
PQ4 102
PP2 103
PP3 104
PP4 105
PP5 106
PN0
107
PN1
108
PN2
109
PN3
110
PN4
111
PN5
112
PP0 118
PP1 119
XDS1B
MSP432E401YTPDTR
53 EN0RXIN
EN0RXIP
54
EN0TXON
56
EN0TXOP
57
RBIAS 59
WAKE
64 HIB 65
XOSC0 66
XOSC1 67
RST
70
OSC0 88
OSC1 89
XDS1C
MSP432E401YTPDTR
7VDD
8VDDA
9VREFA+
GNDA 10
VDD
16
GND 17
VDD
26
VDD
28
VDD
39
VDD
47
GND 48
VDD
51
VDD
52
GND 55
GND 58
VBAT
68
VDD
69
VDD
79
GND 80
VDDC
87
VDD
90
VDD
101
VDD
113
GND 114
VDDC
115
VDD
122
XDS1D
MSP432E401YTPDTR
XDS_VCC
IRSTN
Green
12
LED102
LTST-C190GKT
10k
R31
1
3 4
2
Y3
G
G
0.1uF
C17
0.1uF
C18
0.1uF
C24
0.1uF
C27
0.1uF
C28
0.1uF
C13
0.01uF
C14
0.01uF
C15
0.01uF
C16
0.01uF
C22
0.01uF
C26
1uF
C19
1uF
C21
1uF
C25
12pF
C29
12pF
C30
1.0k
R24
1.0k
R25
1.0k
R26
1.0k
R27
100
R28
4.87k
R32
470
R29
470
R30
1.0k
R34
51
R35
BSL_INVOKE
31
LM4040C25IDCKR
IC5A
0.1uF
C20
XDS_VBUS
XDS_TXD
XDS_RXD
XDS_TMS_SWDIO
XDS_RESET_OUT
XDS_TCK_SWDCLK
5V+ 3V3
XDS_VCC
LaunchPad<<---->> XDS110
XDS_VCC
PA1_NRST
3.30k
R6
PA19
PA20_A6
PA27_UART_TX_A0
1 2
PA26_UART_RX_A1
3 4
5 6
7 8
9 10
11 12
13 14
J101
TSW-107-07-G-D
10V
2.2uF
C23
100
R33
Red
12
LED101
LTST-C190KRKT
Figure 4-2.
XDS_VCC
XDS_ID
XDS_USB_D_P
XDS_VBUS
XDS_USB_D_N
XDS_ID
XDS_VBUS
XDS_USB_D_P
XDS_VBUS
XDS_USB_D_N
VBUS_DETECT
GND
GND
GND GND
GND
GND
GND
1
OUT
NC
2
3
NR
4
GND
5EN
NC
6
7NC
IN
8
9
PAD
IC4
TPS73533DRBT
GND
GND
ITDO
ITDI
XDS_VCC
IRSTN
XDS_VCCITMS
ITCK
10V
2.2uF
C53
IO1
1
IO2
2
GND 3
IO3 4
IO4 5
6VCC
TPD4E004DRYR
IC3
1
VBUS
D- 2
D+ 3
ID 4
GND 5
8 7 611
10
9
USB2
1051640001
10k
R91
10k
R92
TP4
TP5
1uF
C55
2.2uF
C56
0
6R8
0
R89
330k
R87
220k
R88
3300pF
C54
1.00M
R90
TP6
TP7
TP8
TP9
TP10
LDO 3v3 (for XDS)
USB ESD protection
Figure 4-3. Schematic
www.ti.com Hardware Design Files
SLAU908 – OCTOBER 2023
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LP-MSPM0C1104 Evaluation Module 9
Copyright © 2023 Texas Instruments Incorporated

FID1
Fiducial
FID2
Fiducial
FID3
Fiducial
LOGO1
LOGO
CE Mark
PCB
Logo4
LOGO
PCB
ESD Susceptible
Logo6
LOGO
PCB
FCC disclaimer
Logo2
LOGO
PCB
Texas Instruments
Logo7
WEEE logo
E2
MCU0118PCB Number:
PCB Rev: LOGO
PCB
Printed Circuit Board
Logo3
LaunchPad Rocket
ZZ1
Assembly Note
ZZ2
Assembly Note
These assemblies must comply with workmanship standards IPC-A-610 Class 2, unless otherwise specified.
ZZ3
Assembly Note
These assemblies are ESD sensitive, ESD precautions shall be observed.
SH-J1
J101: 1-2
SH-J2
J101: 3-4
SH-J3
These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.
J101: 5-6
SH-J4
J101: 7-8
SH-J5
J101: 9-10
SH-J6
J101: 11-12
SH-J7
J101: 12-13
SH-J9
J7: 1-2
SH-J10
J8: 1-2
J9: 1-2
SH-J11
SH-J8
LOGO
PCB
J6: 1-2
Logo5
Texas Instruments
FID4
Fiducial
FID5
Fiducial
FID6
Fiducial
Figure 4-4.
Hardware Design Files www.ti.com
10 LP-MSPM0C1104 Evaluation Module SLAU908 – OCTOBER 2023
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Copyright © 2023 Texas Instruments Incorporated