Texas Instruments Hercules RM57L User manual

RM57L Hercules Development Kit (HDK)
User's Guide
Literature Number: SPNU598
May 2014

Contents
Preface ........................................................................................................................................ 4
1 Introduction......................................................................................................................... 5
1.1 Scope of Document ......................................................................................................... 5
1.2 RM57L HERCULES Development Kit (HDK) Features................................................................. 5
1.3 HDK Board Block Diagram ................................................................................................. 6
1.4 RM57L HDK Contents ...................................................................................................... 6
1.5 Basic Operation.............................................................................................................. 7
1.6 Memory Map ................................................................................................................. 7
1.7 Power Supply................................................................................................................. 7
2 Physical Description............................................................................................................. 8
2.1 Board Layout ................................................................................................................. 8
2.2 Connectors ................................................................................................................... 9
2.2.1 20-Pin ARM JTAG Header....................................................................................... 10
2.2.2 Ethernet Interface ................................................................................................. 11
2.2.3 CAN Interface...................................................................................................... 11
2.2.4 J19, MIPI ETM Connector........................................................................................ 13
2.2.5 J7, XDS100V2 USB JTAG Interface............................................................................ 15
2.2.6 P1, +5 V to +12 V Input .......................................................................................... 15
2.2.7 SCI Interface....................................................................................................... 15
2.2.8 Daughter Card Interface.......................................................................................... 15
2.3 LEDs ......................................................................................................................... 20
2.4 S2 DIP Switch .............................................................................................................. 20
2.5 Jumpers ..................................................................................................................... 21
2.6 S4, Power On Reset Switch .............................................................................................. 21
2.7 S3, System Reset Switch ................................................................................................. 21
A Operation Notices............................................................................................................... 22
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List of Figures
1-1. RM57L HDK Board Block Diagram........................................................................................ 6
2-1. RM57L HDK Board, Interfaces Top Side................................................................................. 8
2-2. Connectors on RM57L HDK................................................................................................ 9
2-3. CAN Bus Termination...................................................................................................... 12
2-4. J2, J3 CAN Bus Interface (Screw Terminal)............................................................................ 12
2-5. J19, 60 Pin MIPI ETM Header............................................................................................ 13
2-6. +12 V Input Jack ........................................................................................................... 15
2-7. J9, J10, and J11 on HDK ................................................................................................. 16
2-8. DIP Switch Settings........................................................................................................ 20
List of Tables
1-1. RM57L Memory Map........................................................................................................ 7
1-2. Power Test Points ........................................................................................................... 7
2-1. Connectors on HDK Board................................................................................................ 10
2-2. Connectors on HDK Board................................................................................................ 10
2-3. 20-Pin ARM JTAG Header................................................................................................ 10
2-4. J1, Ethernet Interface...................................................................................................... 11
2-5. J19, MIPI Connector Signal Mapping.................................................................................... 13
2-6. J19, MIPI Connector Signal Mapping.................................................................................... 14
2-7. J7, XDS100V2 USB JTAG Interface..................................................................................... 15
2-8. Expansion Connector P1 (J9, Left, BottomView) ...................................................................... 17
2-9. Expansion Connector P2 (J10, Right, BottomView)................................................................... 18
2-10. Expansion Connector P3 (J11, Bottom One, TopView)............................................................... 19
2-11. Demo LEDs ................................................................................................................. 20
2-12. Other LEDs as Indicator................................................................................................... 20
2-13. S2 DIP Switch Functions.................................................................................................. 21
2-14. Jumpers ..................................................................................................................... 21
3
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Preface
SPNU598–May 2014
Read This First
About This Manual
This document describes the board level operations of the RM57L Hercules™ Development Kit (HDK).
The HDK is based on the Texas Instruments RM57L843 Microcontroller. The RM57L HDK is a table top
card that allows engineers and software developers to evaluate certain characteristics of the RM57L843
microcontroller to determine if the microcontroller meets the designer’s application requirements as well as
begin early application development. Evaluators can create software to execute on board or expand the
system in a variety of ways.
Notational Conventions
This document uses the following conventions.
The RM57L HDK will sometimes be referred to as the HDK.
Program listings, program examples, and interactive displays are shown in a special italic typeface. Here
is a sample program listing:
• equations
• !rd = !strobe&rw
Information About Cautions
This book may contain cautions.
This is an example of a caution statement.
A caution statement describes a situation that could potentially damage your software, or hardware, or
other equipment. The information in a caution is provided for your protection. Please read each caution
carefully.
Related Documentation From Texas Instruments
Information regarding this device can be found at the following Texas Instruments website:
http://www.ti.com/product/rm57l843
Hercules, Code Composer Studio are trademarks of Texas Instruments.
ARM is a registered trademark of ARM Limited.
All other trademarks are the property of their respective owners.
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Chapter 1
SPNU598–May 2014
Introduction
This development kit provides a product-ready hardware and software platform for evaluating the
functionality of the Texas Instruments RM57L microcontroller family. Schematics, list of materials, and
PCB layout are available to ease hardware development and reduce time to market.
1.1 Scope of Document
This user's guide lists the contents of the development kit, points out the features of the major
components, and provides the instructions necessary to verify your development kit is in working order.
Any additional usage instructions or details fall outside the scope of this document. Additional resources
will be listed at the end of this user's guide.
1.2 RM57L HERCULES Development Kit (HDK) Features
The HDK comes with a full complement of on board devices that suit a wide variety of application
environments. Key features include:
• A Hercules RM57L843 337-pin BGA microcontroller
• Integrated USB JTAG Emulator (XDS100v2)
• External JTAG Headers (ARM®20 pin and TI Compact 20-pin CTI)
• 10/100 Mbps Ethernet interface
• One USB host connector and one USB device connector
• Two CAN transceivers (SN65HVDA541Q1) and screw terminal blocks
• One ambient light sensor
• One ambient temperature sensor
• Microcontroller’s serial communication interface (SCI) universal asynchronous receiver/transmitter
(UART) accessible through a USB virtual COM port
• One 8MB SDRAM
• Eight user programmable white LEDs around the MCU silicon
• One user programmable pushbutton
• Three expansion connectors for hardware prototyping
• Reset pushbuttons (nPORRST and nRST)
• One SD card slot (SPI mode)
• Embedded trace macrocell (ETM) debug interface via MIPI connector
• Configurable pin mux options
• 5 V and 3.3 V analog-to-digital converter (ADC) option jumper
• Current measurement capability for 3.3 V IO, 1.2 V core, 1.2 V core, 1.2 V PLL, 3.3 V or 5 V ADC, and
3.3 V VCCP
• Accepts an external power supply between +5V and +12V
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SDRAM
CAN1
ETM
SPI/ADC
JTAG
POR
RST
PWR
USB
EMU
EXP Conn1
SPI2
SD
Slot
XDS100V2
CPLD
FTDI
2332
Ext JTAG
EMIF/
ETM/
SPI2
ENET
RJ45
ENET
PHY
MII/
RMII
CAN
PHY
EXP Conn2
EXP Conn3
Pinmux
DIP
PIN MUX
RM57L843
330 MHz
PIN MUX
CAN/
FRAY/LIN/
GIO/HET
Light
Sensor
Temp
Sensor
CAN2
CAN
PHY
GIO
Button
3.3V/5V A/D 3.3V I/O
1.2V Core
HDK Board Block Diagram www.ti.com
1.3 HDK Board Block Diagram
Figure 1-1 illustrates the HDK block diagram.
Figure 1-1. RM57L HDK Board Block Diagram
1.4 RM57L HDK Contents
The kit contains everything needed to develop and run applications for RM57L843 microcontrollers
including:
• Board:
– RM57L Card
• Cables and Accessories
– 12 V power supply with power adapters for US, or Europe
– Type A to mini B USB cable for using on board XDS100V2 JTAG emulator
– Ethernet cable
– Flashlight for light sensor demo
• CCS DVD Containing:
– Texas Instruments’ Code Composer Studio™ Integrated Development Environments (IDE)
• Hercules DVD Containing:
– Hercules Safety Demos
– Hardware Abstraction Layer Code Generator (HALCoGen)
– Training Videos
– Device Documentation
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www.ti.com Basic Operation
HDK Specifications
• Board supply voltage: 5 V–12 V Vdc
• Dimensions: 4.90” x 4.30” x 0.85” (LxWxH)
1.5 Basic Operation
The HDK is designed to work with TI’s Code Composer Studio and other third party ARM IDEs. The IDE
communicates with the board through the embedded emulator or an external JTAG emulator. To start,
follow the instructions in the Quick Start Guide to install Hercules-specific software. This process will install
all of the necessary development tools, documentation and drivers.
1.6 Memory Map
The RM57L family of MCUs have a large byte addressable address space. Table 1-1 shows the address
space of a RM57L843 microcontroller on the left with specific details of how each region is used by the
HDK on the right. By default, the internal memory sits at the beginning of the address space.
The SDRAM is mapped into CS0 space on the EMIF. CS[4:2] are used for synchronous memory for
example SRAM, NOR Flash, NAND Flash, and so forth.
To use EMIF, the MPU has to be enabled, and the CS regions have to be configured as “device mode” or
“strongly ordered mode” through MPU.
Table 1-1. RM57L Memory Map
Start Address End Address HDK
0x0000 0000 0x002F FFFF Flash
0x0800 0000 0x0803 FFFF RAM
0x0840 0000 0x0843 FFFF RAM-ECC
0x6000 0000 0x63FF FFFF CS2 Async RAM
0x6400 0000 0x67FF FFFF CS3 Async RAM
0x6800 0000 0x7BFF FFFF CS4 Async RAM
0x8000 0000 0x87FF FFFF CS0 Sync SDRAM
1.7 Power Supply
The HDK board operates from a single +12 V external power supply connected to the main power input
(P1), a 2.5 mm, barrel-type plug. Internally, the +12 V input is converted into +1.2 V, +3.3 V and +5.0 V
using Texas Instruments swift voltage regulators and PTH power module. The +1.2 V supply is used for
the MCU core while the +3.3 V supply is used for the MCU's I/O buffers and other module on the board.
The +5.0 V supply is used for ADC power (second option) and USB VBUS.
There are multiple power test points on the HDK board. The three main test point pairs provide a
convenient mechanism to check the HDK’s current for each supply. Table 1-2 shows the voltages for each
test point and what the supply is used for.
Table 1-2. Power Test Points
Test Point Pair Voltage Voltage Use
TP14 and TP15 1.2 V MCU core
TP16 and TP17 3.3 V MCU IO and logic
TP18 and TP19 1.2 V MCU PLL
TP20 and TP21 3.3 V MCU Flash pump
TP22 and TP23 3.3 V or 5.0 V MCU MibADC, and ADREFHI
(J8 to enable 5 V)
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Hercules
RM57L843
Chapter 2
SPNU598–May 2014
Physical Description
This section describes the physical layout of the RM57L HDK board and its interfaces.
2.1 Board Layout
The RM57L HDK board is a 4.9 x 4.3 inch (125 x 109 mm) eight layer printed circuit board that is powered
by an external +5 V to approximately +12 V only power supply. Figure 2-1 shows the layout of the RM57L
HDK board.
Figure 2-1. RM57L HDK Board, Interfaces Top Side
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J1
J2 J3
J4
J6
J7
J15
J12
J19
J10
J11
J9
P1
Hercules
RM57L843
www.ti.com Connectors
2.2 Connectors
The HDK board has 13 interfaces to various peripherals. These interfaces are described in the following
sections.
Figure 2-2. Connectors on RM57L HDK
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Connectors www.ti.com
Table 2-1. Connectors on HDK Board
Connector Size Function
J1 RJ45 Ethernet
J2 3 terminal, 2.54mm DCAN1
J3 3 terminal, 2.54mm DCAN2
J4 10x2, 2.54mm ARM 20pin JTAG header
J6 19x2, mictor RTP
J7 4pin, Mini-B USB XDS100V2 USB
J9 33x2, 2mm Exp P1, SPI1, SPI5, ADC
J10 33x2, 2mm EXP P2, SPI2, EMIF, ECLK
J11 40x2, 2mm EXP P3, SPI3, GIO, NHET, DCAN, LIN
J12 19x2, mictor DMM
J15 SD card
J16 4pin, Type B USB Device
J17 4pin, Type A Not Populated
J18 4pin, Type A USB Host
J19 30x2, MIPI ETM MIPI Header
P1 2.5mm +12 V In
Table 2-2. Connectors on HDK Board
Connector Size Function
J1 RJ45 Ethernet
J2 3 terminal, 2.54mm DCAN1
J3 3 terminal, 2.54mm DCAN2
J4 10x2, 2.54mm ARM 20pin JTAG header
J6 19x2, mictor RTP
J7 4pin, Mini-B USB XDS100V2 USB
J9 33x2, 2mm Exp P1, SPI1, SPI5, ADC
J10 33x2, 2mm EXP P2, SPI2, EMIF, ECLK
J11 40x2, 2mm EXP P3, SPI3, GIO, NHET, DCAN, LIN
J12 19x2, mictor DMM
J15 SD card
J19 30x2, MIPI ETM MIPI Header
P1 2.5mm +12 V In
2.2.1 20-Pin ARM JTAG Header
In addition to on board XDS100V2 JTAG, one 20-pin ARM JTAG header is added for using external
emulator. This is the standard interface used by JTAG emulators to interface to ARM microcontrollers. The
pinout for the connector is shown in Table 2-3.
Table 2-3. 20-Pin ARM JTAG Header
Signal Name Pin Number Pin Number Signal Name
Vref 1 2 VCC
nTRST 3 4 GND
TDI 5 6 GND
TMS 7 8 GND
TCK 9 10 GND
RTCK 11 12 GND
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Table 2-3. 20-Pin ARM JTAG Header (continued)
Signal Name Pin Number Pin Number Signal Name
TDO 13 14 GND
nRST 15 16 GND
NC 17 18 GND
NC 19 20 GND
2.2.2 Ethernet Interface
The RM57L843 integrates an MII/RMII Ethernet MAC on chip. This interface is routed to the on board
PHY via CBT switches. The board uses a DP83640 PHY. The interface is isolated and brought out to a
RJ-45 connector with integrated magnetics, J1. The pinmux control DIP S2 is used to control the CBT FET
switch for RMII, MII or other functions.
The J1 connector is used to provide a 10/100 Mbps Ethernet interface. This is a standard RJ-45
connector. The cable end pinout for the J1 connector is shown in Table 2-4.
Table 2-4. J1, Ethernet Interface
Pin Number Signal Pin Number Signal
1 D0+ 2 D0-
3 D1- 4 D2+
5 D2- 6 D1-
7 D3+ 8 D3-
Two LEDs are embedded into the connector to report link status (green LED) and transmit and receive
status of the PHY (yellow LED).
2.2.3 CAN Interface
The RM57L843 has up to three DCAN interfaces that provide a high-speed serial interface. Two 3-pin
screw terminal blocks, J2, J3, are used to interface to the DCAN bus. The pinouts for this connector are
shown in Figure 2-4. H means CAN High (CAN H), and L means CAN Low (CAN L).
CAN Bus termination is used to minimize signal reflection on the bus. ISO-11898 requires that the CAN
bus have a nominal characteristic line impedance of 120 Ω. Therefore, the typical terminating resistor
value for each end of the bus is 120 Ω. A split termination method is used to help increase EMC
performance. Split termination is a concept that is growing in popularity because emission reduction can
be achieved very easily. Split termination is a modified standard termination in which the single 120 Ω
resistor on each end of the bus is split into two 60 Ωresistors, with a bypass capacitor tied between the
resistors and to ground. The two resistors should match as close as possible.
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J2 J3
H L H L
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Figure 2-3. CAN Bus Termination
Figure 2-4. J2, J3 CAN Bus Interface (Screw Terminal)
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Pin 1
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2.2.4 J19, MIPI ETM Connector
Figure 2-5 and Table 2-5Table 2-6 show the 60 pin MIPI header.
Figure 2-5. J19, 60 Pin MIPI ETM Header
Table 2-5. J19, MIPI Connector Signal Mapping
MCU Pin Pin MCU
Signals Number Number Signals
3.3 V 1 2 TMS
TCK 3 4 TDO
TDI 5 6 System reset
RTCK 7 8 nTRST
NC 9 10 NC
NC 11 12 3.3 V
NC 13 14 NC
GND 15 16 GND
NC 17 18 NC
NC 19 20 NC
NC 21 22 NC
NC 23 24 NC
NC 25 26 NC
NC 27 28 NC
NC 29 30 NC
NC 31 32 NC
NC 33 34 NC
NC 35 36 NC
NC 37 38 NC
NC 39 40 NC
NC 41 42 NC
NC 43 44 NC
NC 45 46 NC
NC 47 48 NC
NC 49 50 NC
NC 51 52 NC
NC 53 54 NC
NC 55 56 NC
GND 57 58 GND
NC 59 60 NC
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Table 2-6. J19, MIPI Connector Signal Mapping
MCU Pin Pin MCU
Signals Number Number Signals
3.3V 1 2 TMS
TCK 3 4 TDO
TDI 5 6 System reset
RTCK 7 8 nTRST
NC 9 10 NC
NC 11 12 3.3 V
ETMTACECLKOUT 13 14 NC
To GND thru 0 W 15 16 GND
EMTTRACECTL 17 18 ETMDATA[19]
ETMDATA[0] 19 20 ETMDATA[20]
ETMDATA[1] 21 22 ETMDATA[21]
ETMDATA[2] 23 24 ETMDATA[22]
ETMDATA[3] 25 26 ETMDATA[23]
ETMDATA[4] 27 28 ETMDATA[24]
ETMDATA[5] 29 30 ETMDATA[25]
ETMDATA[6] 31 32 ETMDATA[26]
ETMDATA[7] 33 34 ETMDATA[27]
ETMDATA[8] 35 36 ETMDATA[28]
ETMDATA[9] 37 38 ETMDATA[29]
ETMDATA[10] 39 40 ETMDATA[30]
ETMDATA[11] 41 42 ETMDATA[31]
ETMDATA[12] 43 44 NC
ETMDATA[13] 45 46 NC
ETMDATA[14] 47 48 NC
ETMDATA[15] 49 50 NC
ETMDATA[16] 51 52 NC
ETMDATA[17] 53 54 NC
ETMDATA[18] 55 56 NC
GND 57 58 GND
NC 59 60 NC
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+12V
GND
PC Board
P1
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2.2.5 J7, XDS100V2 USB JTAG Interface
The USB connector J7 is used to connect to the host development system that is running the software
development IDE, Code Composer Studio. The signals on this connector are shown in Table 2-7.
Table 2-7. J7, XDS100V2 USB JTAG Interface
Pin Number Signal Name
1 USBVDD
2 D-
3 D+
4 NC
5 USBVSS
Before the board is shipped, the XDS100V2 port1 is configured as JTAG, and port2 is configured as SCI.
The CPLD on the board is also programmed to route the JTAG signals to the MCU.
There is a circuitry to detect the external JTAG emulator. If a device is plugged onto the header J4 and
J19, the DS1 LED will be turned on, and XDS100V2 JTAG is disabled.
2.2.6 P1, +5 V to +12 V Input
Connector P1 is the input power connector. This connector brings in +5 V to +12 V to the HDK board. This
is a 2.5 mm jack. Figure 2-6 shows this connector as viewed from the card edge.
Figure 2-6. +12 V Input Jack
2.2.7 SCI Interface
The internal SCI on the RM57L843 device is connected to the second port of the XDS100V2. The
XDS100V2 USB driver makes the FT2232H second channel appear as a virtual COM port (VCP). This
allows the user to communicate with the USB interface via a standard PC serial emulation port.
2.2.8 Daughter Card Interface
The HDK provides expansion connectors that can be used to accept plug-in daughter cards. The daughter
card allows users to build on their EVM platform to extend its capabilities and provide customer and
application specific I/O. The expansion connectors are for all major interfaces including asynchronous
memory, peripherals, and A/D expansion.
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J9 J10
J11
Connectors www.ti.com
There are three daughter card interfaces: J9, J10, J11. These connectors are described in Table 2-8.
Figure 2-7. J9, J10, and J11 on HDK
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Table 2-8. Expansion Connector P1 (J9, Left, BottomView)
Signal Name Pin Number Number Pin Number Signal Name
EXP_12V 1 2 GND
EXP_12V 3 4 GND
MibSPI1ENA G19 5 6 F18 MibSPI1CLK
MibSPI1CS[1] F3 7 8 R2 MibSPI1CS[0]
MibSPI1CS[3] J3 9 10 G3 MibSPI1CS[2]
MibSPI1SIMO F19 11 12 G18 MibSPI1SOMI
GND 13 14 GND
MibSPI5ENA H18 15 16 H19 MibSPI5CLK
MibSPI5CS[1] B6 17 18 E19 MibSPI5CS[0]
MibSPI5CS[3] T12 19 20 W6 MibSPI5CS[2]
MibSPI5SIMO[0] J19 21 22 MibSPI5SOMI[0]
MibSPI5SIMO[1] E16 23 24 E17 MibSPI5SOMI[1]
MibSPI5SIMO[2] H17 25 26 H16 MibSPI5SOMI[2]
MibSPI5SIMO[3] G17 27 28 G16 MibSPI5SOMI[3]
GND 29 30 GND
AD1IN[1] V17 31 32 W14 AD1IN[0]
AD1IN[3] T17 33 34 V18 AD1IN[2]
AD1IN[5] R17 35 36 U18 AD1IN[4]
AD1IN[7] V14 37 38 T19 AD1IN[6]
GND 39 40 GND
AD2IN[1] U13 41 42 V13 AD2IN[0]
AD2IN[3] U16 43 44 U14 AD2IN[2]
AD2IN[5] T15 45 46 U15 AD2IN[4]
AD2IN[7] R16 47 48 R19 AD2IN[6]
AGND 49 50 GND
AD1IN[9] W17 51 52 P18 AD1IN[8]
AD1IN[11] U19 53 54 U17 AD1IN[10]
AD1IN[13] T18 55 56 T16 AD1IN[12]
AD1IN[15] P19 57 58 R18 AD1IN[14]
GND 59 60 POR_RSTn
ADREFHI V15 61 62 V16 ADREFLO
AD1EVT N19 63 64 V10 AD2EVT
EXP_12V 65 66 GND
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Table 2-9. Expansion Connector P2 (J10, Right, BottomView)
Signal Name Pin Number Number Pin Number Signal Name
EXP_12V 1 2 GND
ECLK A12 3 4 B14 ERRORn
RST 5 6 M17 EMIF_CS[4]
NC C17 7 8 C16 NC
NC C15 9 10 D15 NC
NC C14 11 12 D14 NC
NC C13 13 14 C12 NC
NC C11 15 16 C10 EMIF_ADDR[12]
EMIF_ADDR[11] C9 17 18 C8 EMIF_ADDR[10]
EMIF_ADDR[9] C7 19 20 C6 EMIF_ADDR[8]
EMIF_ADDR[7] C5 21 22 C4 EMIF_ADDR[6]
EMIF_ADDR[5] D9 23 24 D8 EMIF_ADDR[4]
EMIF_ADDR[3] D7 25 26 D6 EMIF_ADDR[2]
EMIF_ADDR[1] D5 27 28 D4 EMIF_ADDR[0]
GND 29 30 GND
EMIF_Wen D17 31 32 K17 EMIF_CS[3]
EMIF_Oen D12 33 34 L17 EMIF_CS[2]
EMIF_BA[1] D16 35 36 D11 EMIF_DQMn[1]
EMIF_BA[0] D13 37 38 D10 EMIF_DQMn[0]
GND 39 40 GND
EMIFDATA[1] L16 41 42 K16 EMIFDATA[0]
EMIFDATA[3] N16 43 44 M16 EMIFDATA[2]
EMIFDATA[5] F4 45 46 E4 EMIFDATA[4]
EMIFDATA[7] K4 47 48 G4 EMIFDATA[6]
EMIFDATA[9] M4 49 50 L4 EMIFDATA[8]
EMIFDATA[11] P4 51 52 N4 EMIFDATA[10]
EMIFDATA[13] T6 53 54 T5 EMIFDATA[12]
EMIFDATA[15] T8 55 56 T7 EMIFDATA[14]
GND 57 58 GND
SPI2_SOMI D2 59 60 P3 EMIF_nWAIT
SPI2_SIMO D1 61 62 D3 SPI2_CS1
SPI2_CS0 N3 63 64 E2 SPI2_CLK
EXP_12V 65 66 GND
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Table 2-10. Expansion Connector P3 (J11, Bottom One, TopView)
Signal Name Pin Number Number Pin Number Signal Name
EXP_12V 1 2 GND
EXP_12V 3 4 GND
LINRX A7 5 6 B7 LINTX
CAN1RX B10 7 8 A10 CAN1TX
CAN2RX H1 9 10 H2 CAN2TX
CAN3RX M19 11 12 M18 CAN3TX
FRAYRX1 A15 13 14 A8 FRAYRX2
FRAYTX1 B15 15 16 B8 FRAYTX2
FRAYTXEN1 B16 17 18 B9 FRAYTXEN2
GIOA[1] C2 19 20 A5 GIOA[0]
GIOA[3] E1 21 22 C1 GIOA[2]
GIOA[5] B5 23 24 A6 GIOA[4]
GIOA[7] M1 25 26 H3 GIOA[6]
GIOB[1] K2 27 28 M2 GIOB[0]
GIOB[3] W10 29 30 F2 GIOB[2]
GIOB[5] G2 31 32 G1 GIOB[4]
GIOB[7] F1 33 34 J2 GIOB[6]
GND 35 36 GND
NHET1[1] V2 37 38 K18 NHET1[0]
NHET1[3] U1 39 40 W5 NHET1[2]
NHET1[5] V6 41 42 B12 NHET1[4]
NHET1[7] T1 43 44 W3 NHET1[6]
NHET1[9] V7 45 46 E18 NHET1[8]
NHET1[11] E3 47 48 D19 NHET1[10]
NHET1[13] N2 49 50 B4 NHET1[12]
NHET1[15] N1 51 52 A11 NHET1[14]
NHET1[17] A13 53 54 A4 NHET1[16]
NHET1[19] B13 55 56 J1 NHET1[18]
NHET1[21] H4 57 58 P2 NHET1[20]
NHET1[23] J4 59 60 B3 NHET1[22]
NHET1[25] M3 61 62 P1 NHET1[24]
NHET1[27] A9 63 64 A14 NHET1[26]
NHET1[29] A3 65 66 K19 NHET1[28]
NHET1[31] J17 67 68 B11 NHET1[30]
GND 69 70 GND
MibSPI3CS[3] C3 71 72 B2 MibSPI3CS[2]
MibSPI3SIMO W8 73 74 V8 MibSPI3SOMI
MibSPI3CS[1] V5 75 76 V10 MibSPI3CS[0]
MibSPI3ENA W9 77 78 V9 MibSPI3CLK
EXP_12V 79 80 GND
19
SPNU598–May 2014 Physical Description
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2.3 LEDs
The RM57L HDK board has 19 LEDs. Eight of these LEDs (shown in Table 2-11) are under user control.
Those LEDs are controlled and programmed by NHET signals.
LEDs DS2, DS3, DS4, and DS5 indicate the presence of the power (+1.2 V, +5 V, 3.3 V, and 12 V) s on
the board. The LED functions are summarized in Table 2-11 and Table 2-12.
Table 2-11. Demo LEDs
LED Number Location Signals Color
D3 Left Top NHET1[17] White
D4 Top NHET1[31] White
D5 Right Top NHET1[0] White
D6 Right Bottom NHET1[25] White
D7 Bottom NHET1[18] White
D8 Left bottom NHET1[29] White
LED1 Left NHET1[27] White
LED2 Right NHET1[05] White
Table 2-12. Other LEDs as Indicator
Number LED Color
D1 nERROR Red
D10 XDS100V2 SCI RX Blue
D11 XDS100V2 SCI TX Blue
D12 XDS100V2 PWRENn Blue
D2 JTAG TDI Blue
D9 Ethernet Speed Blue
DS1 ARM JTAG Plugin Blue
DS2 VCC_1V2 Blue
DS3 VCC_5V Blue
DS4 VCC_3V3 Blue
DS5 VCC_12V Blue
2.4 S2 DIP Switch
There is one 4-position DIP switches located on the left-bottom corner at reference designator S2. By
default, all of the switches are set to the “OFF” position and should remain in that position when
completing the steps in this user's guide.
Figure 2-8. DIP Switch Settings
20 Physical Description SPNU598–May 2014
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