Texas Instruments TPS6381 EVM Series User manual

1
SLVUBK9A–July 2019–Revised October 2019
Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated
TPS6381xEVM
User's Guide
SLVUBK9A–July 2019–Revised October 2019
TPS6381xEVM
This user’s guide describes the operation and use of the TPS6381xEVM evaluation module (EVM). The
EVM is designed to help users easily evaluate and test the operation and functionality of the TPS6381x
buck-boost converter family. The EVM has the output voltage set to 3.3 V or 3.45 V, depending on jumper
setting. The output voltage can be programmed via I2C interface between 1.8 V and 5.2 V. The EVM
operates with an input voltage between 2.2 V and 5.5 V. The output current can go up to 2.5 A in buck
mode and up to 2 A in boost mode. This document includes setup instructions for the hardware, together
with the schematic and the PCB layout of the EVM. Throughout this document, the abbreviations EVM,
TPS6381xEVM, and the term evaluation module are synonymous with the TPS6381x, unless otherwise
noted.
Figure 1. TPS6381xEVM

www.ti.com
2SLVUBK9A–July 2019–Revised October 2019
Submit Documentation Feedback
Copyright © 2019, Texas Instruments Incorporated
TPS6381xEVM
Contents
1 Introduction ................................................................................................................... 3
2 Setup .......................................................................................................................... 3
3 Board Layout ................................................................................................................. 4
4 Schematic and Bill of Materials ............................................................................................ 8
5 Software User Interface..................................................................................................... 9
6 Register Map................................................................................................................ 12
List of Figures
1 TPS6381xEVM............................................................................................................... 1
2 TPS6381xEVM PCB - Assembly Layer................................................................................... 5
3 TPS6381xEVM PCB - Top Layer.......................................................................................... 5
4 TPS6381xEVM PCB - Signal Layer 1 (Top View)....................................................................... 6
5 TPS6381xEVM PCB - Signal Layer 2 (Top View)....................................................................... 6
6 TPS6381xEVM PCB - Bottom Layer (Top View)........................................................................ 7
7 TPS6381xEVM Schematic ................................................................................................. 8
8 Quick Connection Overview .............................................................................................. 10
9 GUI Home Screen.......................................................................................................... 11
10 GUI Settings Screen....................................................................................................... 11
11 GUI Register Map Screen................................................................................................. 12
List of Tables
1 Performance Specification Summary ..................................................................................... 3
2 TPS63810EVM Bill of Materials ........................................................................................... 9
3 TPS63811EVM Bill of Materials ........................................................................................... 9
4 Device Registers ........................................................................................................... 12
5 CONTROL Register Field Descriptions ................................................................................. 13
6 STATUS Register Field Descriptions.................................................................................... 14
7 DEVID Register Field Descriptions ...................................................................................... 15
8 VOUT1 Register Field Descriptions...................................................................................... 16
9 VOUT2 Register Field Descriptions...................................................................................... 17
Trademarks
All trademarks are the property of their respective owners.

www.ti.com Introduction
3
SLVUBK9A–July 2019–Revised October 2019
Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated
TPS6381xEVM
1 Introduction
The Texas Instruments TPS6381x is a highly efficient, single-inductor, internally compensated buck-boost
converter in a 15-pin, 2.3-mm × 1.4-mm WCSP package. The output voltage can be selected between two
I2C-programmable values in the range from 1.8 V to 5.2 V in 25-mV steps. There are two versions of the
EVM, depending on the device being used:
• TPS63810EVM uses the TPS63810, in which the power-up value of the ENABLE bit is 1.
• TPS63811EVM uses the TPS63811, in which the power-up value of the ENABLE bit is 0.
The ENABLE bit in the control register controls the output state of the power stage. See Section 6 for
more details.
1.1 Background
The TPS6381xEVM uses the TPS6381x integrated circuit (IC) , and is set to 3.3 V or 3.45 V output
voltage, depending on jumper setting. The EVM operates with an input voltage between 2.2 V and 5.5 V.
1.2 Performance Specification
Table 1 provides a summary of the TPS6381xEVM performance specifications. All specifications are given
for ambient temperature of 25°C.
Table 1. Performance Specification Summary
SPECIFICATION TEST CONDITIONS MIN TYP MAX UNIT
Input voltage 2.2 5.5 V
Output voltage 1.8 5.2 V
Output current VIN ≥2.5 V, VOUT = 3.3 V 2.5 A
1.3 Modifications
The printed-circuit board (PCB) for the EVM is designed to accommodate the TPS6381x. Extra positions
are available for additional input and output capacitors, EN pin voltage divider, and I2C pullup resistors.
1.3.1 IC U1 Operation
This EVM requires an appropriate I2C interface, such as the TI USB2ANY, to reconfigure the TPS6381x.
The output voltage can be chosen between two I2C-programmable values by using an on-board jumper.
See Section 6 for the available output voltage values.
2 Setup
This section describes how to properly use the TPS6381xEVM.
2.1 Input and Output Connectors, Test Points, and Headers Description
2.1.1 J1, Pin 1 and 2 – VIN
Positive input voltage connection from the input power supply for the EVM.
2.1.2 J1, Pin 3 and 4 – S+/S-
Input voltage sense connections. Measure the input voltage at this point.
2.1.3 J1, Pin 5 and 6 – GND
Input voltage GND return connection from the input power supply for the EVM, common with J2 GND
connection

Setup www.ti.com
4SLVUBK9A–July 2019–Revised October 2019
Submit Documentation Feedback
Copyright © 2019, Texas Instruments Incorporated
TPS6381xEVM
2.1.4 J2, Pin 1 and 2 – VOUT
Positive output voltage connection
2.1.5 J2, Pin 3 and 4 – S+/S-
Output voltage sense connections. Measure the output voltage at this point.
2.1.6 J2, Pin 5 and 6 – GND
Output voltage GND return connection, common with J1 GND connection
2.1.7 TP1, TP2 – L1, L2
Test points connected to L1 and L2 switch node pins of the TPS6381x
2.1.8 TP3, TP4 – GND
Test points connected to SDA and SCL pins of the TPS6381x
2.1.9 J3 – I2C
10-pin header used to connect the USB2ANY adaptor to the EVM
2.1.10 JP1 – VSEL
Placing a jumper across VSEL and VOUT1 pins sets the output voltage to the value in VOUT1 register.
Placing a jumper across VSEL and VOUT2 pins sets the output voltage to the value in VOUT2 register.
2.1.11 JP2 – ENABLE
Placing a jumper across pins EN and ON enables the device. Placing a jumper across pins EN and OFF
disables the device.
2.2 Setup
To operate the EVM, connect a power supply with the positive lead to J1 VIN pins and the negative lead
to J1 GND pins. Connect a load with the positive lead to J2 VOUT pins and the negative lead to J2 GND
pins. Place a jumper across VSEL and VOUT1 or VOUT2 pins on JP1 to select the corresponding output
voltage register. Place a jumper across EN and ON pins on JP2 to enable the device.
3 Board Layout
This section provides the TPS6381xEVM board layout and illustrations.
3.1 Layout
Figure 2 through Figure 6 show the component placement and PCB layout of the TPS6381xEVM.

www.ti.com Board Layout
5
SLVUBK9A–July 2019–Revised October 2019
Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated
TPS6381xEVM
Figure 2. TPS6381xEVM PCB - Assembly Layer
Figure 3. TPS6381xEVM PCB - Top Layer

Board Layout www.ti.com
6SLVUBK9A–July 2019–Revised October 2019
Submit Documentation Feedback
Copyright © 2019, Texas Instruments Incorporated
TPS6381xEVM
Figure 4. TPS6381xEVM PCB - Signal Layer 1 (Top View)
Figure 5. TPS6381xEVM PCB - Signal Layer 2 (Top View)

www.ti.com Board Layout
7
SLVUBK9A–July 2019–Revised October 2019
Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated
TPS6381xEVM
Figure 6. TPS6381xEVM PCB - Bottom Layer (Top View)

Schematic and Bill of Materials www.ti.com
8SLVUBK9A–July 2019–Revised October 2019
Submit Documentation Feedback
Copyright © 2019, Texas Instruments Incorporated
TPS6381xEVM
4 Schematic and Bill of Materials
This section provides the TPS6381xEVM schematic and bill of materials.
4.1 Schematic
Figure 7. TPS6381xEVM Schematic

www.ti.com Schematic and Bill of Materials
9
SLVUBK9A–July 2019–Revised October 2019
Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated
TPS6381xEVM
4.2 Bill of Materials
Table 2. TPS63810EVM Bill of Materials
QTY DESIGNATO
RVALUE DESCRIPTION SIZE PART NUMBER MANUFACTURER
1 C1 10 µF CAP, CERM, 10 µF, 6.3 V, ±20%, X5R, 0603 0603 GRM188R60J106ME84 Murata
1 C5 150 µF CAP, TA, 150 µF, 10 V, ±20%, 0.005 Ω7343-31 T530D157M010ATE005 Kemet
2 C6, C7 47 µF CAP, CERM, 47 µF, 6.3 V, ±20%, X5R, 0603 0603 GRM188R60J476ME15D Murata
1 L1 470 nH Inductor, Shielded, Composite, 470 nH, 3.5A, 7.6
mΩ
4x4x1.5 mm XFL4015-471MEC Coilcraft
1 R2, R5 1.00 MΩRES, 1.00 M, 1%, 0.1 W, 0603 0603 CRCW06031M00FKEA Vishay-Dale
1 U1 N/A IC, Single Inductor Buck-Boost Converter 2.3x1.4x1 mm TPS63810YFFR TI
Table 3. TPS63811EVM Bill of Materials
QTY DESIGNATO
RVALUE DESCRIPTION SIZE PART NUMBER MANUFACTURER
1 C1 10 µF CAP, CERM, 10 µF, 6.3 V, ±20%, X5R, 0603 0603 GRM188R60J106ME84 Murata
1 C5 150 µF CAP, TA, 150 µF, 10 V, 20%, 0.005 Ω7343-31 T530D157M010ATE005 Kemet
2 C6, C7 47 µF CAP, CERM, 47 µF, 6.3 V, ±20%, X5R, 0603 0603 GRM188R60J476ME15D Murata
1 L1 470 nH Inductor, Shielded, Composite, 470 nH, 3.5 A, 7.6
mΩ
4x4x1.5 mm XFL4015-471MEC Coilcraft
1 R2, R5 1.00 MΩRES, 1.00 M, 1%, 0.1 W, 0603 0603 CRCW06031M00FKEA Vishay-Dale
1 U1 N/A IC, Single Inductor Buck-Boost Converter 2.3x1.4x1 mm TPS63811YFFR TI
5 Software User Interface
5.1 Software Setup
A graphical user interface (GUI) is available from ti.com website
(http://www.ti.com/product/TPS63810/toolssoftware) which allows simple and convenient programming of
the device through the TI USB2ANY (http://www.ti.com/tool/USB2ANY) device. Alternatively, the user can
use any I2C-standardized programming tool or I2C host to configure the device. Mind the I2C pins
specification, such as timing parameters and proper pullup resistors, provided with the High Current, High
Efficiency Single Inductor Buck-Boost Converter Data Sheet.
5.2 Interface Hardware Setup
Connect the USB2ANY adapter to your PC using the supplied USB cable. Connect the EVM connector J3
to the USB2ANY adapter using the supplied 10-pin ribbon cable. The connectors on the ribbon cable are
keyed to prevent incorrect installation.
Figure 8 shows a quick adapter connection overview.

Host
Computer
USB Cable
USB
Interface
Adapter
Green LED
Indicates
Power
10-Pin
Ribbon
Cable
EVM Board
USB Interface Adaptor Quick Connection Diagram
Software User Interface www.ti.com
10 SLVUBK9A–July 2019–Revised October 2019
Submit Documentation Feedback
Copyright © 2019, Texas Instruments Incorporated
TPS6381xEVM
Figure 8. Quick Connection Overview