
8 Hans Turck GmbH & Co. KG | T +49 208 4952-0 | F +49 208 4952-264 | more@turck.com | www.turck.com
Safety Operating Instructions
5.4.2 Average frequency of dangerous failure (Low Demand mode)
With the FMEDA results and the values specified in the following table, the average frequency
of dangerous failure can be calculated:
T1 8760 h
MTTR 24 h
PFDavg
3.91E-05
6 Safety Operating Instructions
6.1 General
➤ The device must be registered online: www.turck.com/SIL or with the supplied SIL registra-
tion card. This must be filled in with all required information first of all and sent to Turck.
➤ The device must only be carried out, fitted, installed, operated, commissioned and main-
tained by trained and qualified personnel.
➤ The device is not specified for acertain application. Make sure that application-specific as-
pects are considered.
➤ Data from other documents, e.g. data sheets, is not valid for functional safety operation. De-
vices must be used in cabinets in an typical industrial field environment only. The following
restrictions describe the operation and storage conditions:
➤ Ensure that the environment complieswith the following ratings
Minimum ambienttemperature -25 °C
Maximum ambient temperature 70 °C
Minimum storage temperature -40 °C
Maximum storage temperature 80 °C
Maximum air humidity 95 %
Minimum air pressure 80 kPa
Maximum air pressure 110 kPa
➤ The average temperature over a long period of time directly on the exterior sidewall of the
housing must be maximum 40°C.
ūThe temperature on the exterior sidewall of the housing can deviate considerably from the
temperature in the control cabinet.
ūThe temperature on the exterior sidewall of the housing must be observed in a steady state.
ūIn case the temperature on the exterior sidewall of the housing is higher, the failure rates
from „5.3 FMEDA results“ on page7 must be adjusted:
For a higher average temperature of 60°C on the exterior sidewall of the housing, the fail-
ure rates are multiplied by an experience factor of 2.5.
➤ Ensure that sufficient heat dissipation is provided.
➤ Protect the device from radiated heat and severe temperature fluctuations.
➤ Protect the device from dust, dirt, moisture, shock, vibration, chemical stress, increased
radiationand other environmental influences.
➤ Ensure a degree of protection of at least IP20 according toIEC 60529 at the mounting
location.
➤ Ensure that the electromagnetic stress does not increase the requirements of IEC
61326-3.1.
➤ If there is a visible error, e. g. defective housing the device must not be used.