
SARA-N2 series - System Integration Manual
UBX-17005143 - R06 Page 4 of 82
2.5 SIM interface..............................................................................................................................................43
2.6 Serial interfaces ........................................................................................................................................46
2.6.1 Asynchronous serial interface (UART) .........................................................................................46
2.6.2 Secondary asynchronous serial interface (Secondary UART).................................................48
2.6.3 DDC (I2C) interface............................................................................................................................49
2.7 General Purpose Input/Output (GPIO) ..................................................................................................49
2.8 Reserved pins (RSVD) ..............................................................................................................................49
2.9 Module placement ....................................................................................................................................50
2.10 Module footprint and paste mask ......................................................................................................... 51
2.11 SARA-N211 integration in devices intended for use in potentially explosive atmospheres.......52
2.11.1 General guidelines ............................................................................................................................52
2.11.2 Guidelines for VCC supply circuit design .....................................................................................54
2.11.3 Guidelines for antenna RF interface design................................................................................55
2.12 Schematic for SARA-N2 series module integration ..........................................................................56
2.13 Design-in checklist....................................................................................................................................57
2.13.1 Schematic checklist.........................................................................................................................57
2.13.2 Layout checklist................................................................................................................................57
2.13.3 Antenna checklist.............................................................................................................................58
3Handling and soldering ..................................................................................................................... 59
3.1 Packaging, shipping, storage and moisture preconditioning ..........................................................59
3.2 Handling ......................................................................................................................................................59
3.3 Soldering .....................................................................................................................................................60
3.3.1 Soldering paste .................................................................................................................................60
3.3.2 Reflow soldering................................................................................................................................60
3.3.3 Optical inspection............................................................................................................................. 61
3.3.4 Cleaning .............................................................................................................................................. 61
3.3.5 Repeated reflow soldering ..............................................................................................................62
3.3.6 Wave soldering ..................................................................................................................................62
3.3.7 Hand soldering ..................................................................................................................................62
3.3.8 Rework ................................................................................................................................................62
3.3.9 Conformal coating ............................................................................................................................62
3.3.10 Casting................................................................................................................................................63
3.3.11 Grounding metal covers ..................................................................................................................63
3.3.12 Use of ultrasonic processes ...........................................................................................................63
4Approvals............................................................................................................................................... 64
4.1 Approvals overview ...................................................................................................................................64