Ublox NEO-M8P-2 Quick setup guide

NEO-M8P
u-blox M8 High Precision GNSS Modules
Hardware Integration Manual
Abstract
This document provides design-
in and feature information for the
high-accuracy NEO-M8P modules
. Base and rover module variants
together provide a high precision cm-level RTK position solution. Each
module contains the u-blox M8 concurrent GNSS engine
for
concurrent reception of GPS, GLONASS and BeiDou signals.
www.u
-blox.com
UBX
-15028081 - R05

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Document Information
Title NEO-M8P
Subtitle u-blox M8 High Precision GNSS Modules
Document type Hardware Integration Manual
Document number UBX-15028081
Revision and Date R05 26-May-2017
Document status Early Production Information
Document status explanation
Objective Specification Document contains target values. Revised and supplementary data will be published later.
Advance Information Document contains data based on early testing. Revised and supplementary data will be published later.
Early Production Information Document contains data from product verification. Revised and supplementary data may be published later.
Production Information Document contains the final product specification.
This document applies to the following products:
Product name Type number ROM/FLASH version PCN reference
NEO-M8P NEO-M8P-0-11 FLASH FW3.01 HPG1.40 N/A
NEO-M8P NEO-M8P-2-11 FLASH FW3.01 HPG1.40 N/A
NEO-M8P NEO-M8P-0-10 FLASH FW3.01 HPG1.40 PCN UBX-17023320
NEO-M8P NEO-M8P-2-10 FLASH FW3.01 HPG1.40 PCN UBX-17023320
u-blox reserves all rights to this document and the information contained herein. Products, names, logos and designs described herein
may in whole or in part be subject to intellectual property rights. Reproduction, use, modification or disclosure to third parties of this
document or any part thereof without the express permission of u-blox is strictly prohibited.
The information contained herein is provided “as is” and u-blox assumes no liability for the use of the information. No warranty, either
express or implied, is given, including but not limited, with respect to the accuracy, correctness, reliability and fitness for a particular
purpose of the information. This document may be revised by u-blox at any time. For most recent documents, visit www.u-blox.com.
Copyright © 2017, u-blox AG.
u-blox®is a registered trademark of u-blox Holding AG in the EU and other countries. ARM®is the registered trademark of ARM Limited in
the EU and other countries.

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Contents
Contents..............................................................................................................................3
1Hardware description ..................................................................................................5
1.1 Overview .............................................................................................................................................. 5
1.2 Configuration ....................................................................................................................................... 5
1.3 Connecting power................................................................................................................................ 5
1.3.1 VCC: Main supply voltage ............................................................................................................. 5
1.3.2 V_BCKP: Backup supply voltage .................................................................................................... 5
1.3.3 VDD_USB: USB interface power supply.......................................................................................... 6
1.3.4 VCC_RF: Output voltage RF........................................................................................................... 6
1.4 Communication interfaces.................................................................................................................... 6
1.4.1 UART............................................................................................................................................. 6
1.4.2 USB ............................................................................................................................................... 6
1.4.3 Display Data Channel (DDC) .......................................................................................................... 7
1.4.4 SPI................................................................................................................................................. 7
1.4.5 TX Ready signal ............................................................................................................................. 7
1.5 I/O pins................................................................................................................................................. 8
1.5.1 RESET_N: Reset input .................................................................................................................... 8
1.5.2 EXTINT: External interrupt input..................................................................................................... 8
1.5.3 SAFEBOOT_N: input ...................................................................................................................... 8
1.5.4 D_SEL: input.................................................................................................................................. 8
1.5.5 LNA_EN: Antenna ON (LNA enable), output .................................................................................. 8
1.5.6 TIMEPULSE: output........................................................................................................................ 8
1.5.7 RTK_STAT: output ......................................................................................................................... 8
1.5.8 GEOFENCE_STAT: output .............................................................................................................. 8
1.5.9 Electromagnetic interference on I/O lines....................................................................................... 8
2Design .........................................................................................................................10
2.1 Pin description .................................................................................................................................... 10
2.1.1 Pin name changes ....................................................................................................................... 10
2.2 Minimal design ................................................................................................................................... 11
2.3 Layout: Footprint and paste mask ....................................................................................................... 11
2.4 Antenna ............................................................................................................................................. 12
2.4.1 Antenna design with passive antenna ......................................................................................... 12
2.4.2 Active antenna design ................................................................................................................. 13
3Product handling ........................................................................................................15
3.1 Packaging, shipping, storage and moisture preconditioning ............................................................... 15
3.2 Soldering ............................................................................................................................................ 15
3.3 EOS/ESD/EMI precautions ................................................................................................................... 18
3.4 Applications with cellular modules...................................................................................................... 22

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Appendix ..........................................................................................................................24
A.1 Recommended parts........................................................................................................................... 24
A.2 Design-in recommendations in combination with cellular operation ................................................... 25
Related documents...........................................................................................................26
Revision history................................................................................................................26
Contact..............................................................................................................................27

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1Hardware description
1.1 Overview
The NEO-M8P modules combine the high performance u-blox M8 positioning engine with u-blox’s Real Time
Kinematic (RTK) technology. The NEO-M8P provides cm-level GNSS performance designed to meet the needs of
unmanned vehicles and other machine control applications requiring accurate guidance.
u-blox’s RTK technology introduces the concept of a “rover” (NEO-M8P-0) and a “base” (NEO-M8P-2) on the M8
platform for stunning cm-level accuracy in clear sky environments. The base module sends corrections via the
RTCM protocol to the rover module via a communication link enabling the rover to output its position relative to
the base at cm level accuracies.
Available in industry standard form factors in leadless chip carrier (LCC) packages, the modules are easy to integrate
and combine exceptional positioning performance with highly flexible power, design, and connectivity options.
SMT pads allow fully automated assembly with standard pick & place and reflow-soldering equipment for cost-
efficient, high-volume production enabling short time-to-market.
For all product features, see the NEO-M8P Data Sheet [1].
1.2 Configuration
The configuration settings can be modified using UBX protocol configuration messages, see the u-blox 8 / u-blox
M8 Receiver Description including Protocol Specification [2]. The modified settings remain effective until power-
down or reset. If these settings have been stored in BBR (Battery Backed RAM), then the modified configuration
will be retained, as long as the backup battery supply is not interrupted.
For the NEO-M8P module, the configuration can be saved permanently in SQI flash.
1.3 Connecting power
The NEO-M8P high precision GNSS modules have up to three power supply pins: VCC, V_BCK and VDD_USB.
1.3.1 VCC: Main supply voltage
The VCC pin provides the main supply voltage. During operation, the current drawn by the module can vary by
some orders of magnitude. For this reason, it is important that the supply circuitry be able to support the peak
power for a short time (see the NEO-M8P Data Sheet [1] for specification).
When switching from backup mode to normal operation or at start-up, u-blox M8 modules must charge
the internal capacitors in the core domain. In certain situations, this can result in a significant current draw.
For low power applications using Power Save and/or backup modes, it is important that the power supply
or low ESR capacitors at the module input can deliver this current/charge.
Use a proper GND concept. Do not use any resistors or inductors in the power line.
1.3.2 V_BCKP: Backup supply voltage
If the module supply has a power failure, the V_BCKP pin supplies the real-time clock (RTC) and battery backed
RAM (BBR). Use of valid time and the GNSS orbit data at start-up will improve the GNSS performance of hot or
warm starts. If no backup battery is connected, the module performs a cold start at power up.
Avoid high resistance on the V_BCKP line: During the switch from main supply to backup supply, a short
current adjustment peak can cause high voltage drop on the pin with possible malfunctions.
If no backup supply voltage is available, connect the V_BCKP pin to VCC.
While power is supplied to the NEO-M8P module through the VCC pin, the backup battery is disconnected
from the RTC and the BBR to avoid unnecessary battery drain (see Figure 1). In this case, VCC supplies
power to the RTC and BBR.

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Figure 1: Backup battery and voltage (for exact pin orientation, see the NEO-M8P Data Sheet [1])
1.3.3 VDD_USB: USB interface power supply
VDD_USB supplies the USB interface. If the USB interface is not used, the VDD_USB pin must be connected to
GND. For more information about correctly handling the VDD_USB pin, see section 1.4
1.3.4 VCC_RF: Output voltage RF
The VCC_RF pin can supply an active antenna or external LNA. For more information, see section 2.4
1.4 Communication interfaces
The following interfaces are used for command and control using the UBX proprietary binary protocol and for
reception and transmission of a RTCM message stream when operating in RTK mode.
1.4.1 UART
NEO-M8P positioning modules include a Universal Asynchronous Receiver Transmitter (UART) serial interface
RXD/TXD supporting configurable baud rates. The baud rates supported are specified in the u-blox 8 / u-blox M8
Receiver Description including Protocol Specification [2].
The signal output and input levels are 0 V to VCC. An interface based on RS232 standard levels (+/- 12 V) can be
implemented using level shifters such as a Maxim MAX3232. Hardware handshake signals and synchronous
operation are not supported.
1.4.2 USB
A USB version 2.0 FS (Full Speed, 12 Mb/s) compatible interface is available for communication as an alternative
to the UART. The USB_DP integrates a pull-up resistor to signal a full-speed device to the host. The VDD_USB pin
supplies the USB interface.
u-blox provides Microsoft® certified USB drivers for Windows operating systems (Vista, Windows 7, 8 and 10).
These drivers are available for download from our website: www.u-blox.com
1.4.2.1 USB external components
The USB interface requires some external components to implement the physical characteristics required by the
USB 2.0 specification. These external components are shown in Figure 2 and listed in Table 1. To comply with USB
specifications, VBUS must be connected through an LDO (U1) to pin VDD_USB on the module.
In USB self-powered mode, the power supply (VCC) can be turned off and the digital block is not powered. In
this case, since VBUS is still available, the USB host would still receive a signal indicating that the device is present
and ready to communicate. This should be avoided by disabling the LDO (U1) using the enable signal (EN) of the
VCC-LDO or the output of a voltage supervisor. Depending on the characteristics of the LDO (U1) it is
recommended to add a pull-down resistor (R11) at its output to ensure VDD_USB is not floating if the LDO (U1)
is disabled or the USB cable is not connected i.e. VBUS is not supplied.
USB bus-powered mode is not supported.

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Module
VDD_USB
LDO
VDD_USB
R4
USB_DP
USB_DM
R5
C24 C23
D2
VBUS
DP
DM
GND
USB Device Connector
U1
EN R11
EN
Figure 2: USB Interface
Name Component Function Comments
U1 LDO Regulates VBUS (4.4 …5.25 V)
down to a voltage of 3.3 V.
Almost no current requirement (~1 mA) if the GNSS receiver is operated as a
USB self-powered device.
C23,
C24
Capacitors Required according to the specification of LDO U1
D2 Protection
diodes
Protect circuit from overvoltage
/ ESD when connecting.
Use low capacitance ESD protection such as ST Microelectronics USBLC6-2.
R4, R5 Serial
termination
resistors
Establish a full-speed driver
impedance of 28…44 Ω
A value of 27
Ω
is recommended.
R11 Resistor 100 kΩis recommended.
Table 1: Summary of USB external components
1.4.3 Display Data Channel (DDC)
An I2C compatible Display Data Channel (DDC) interface is available with NEO-M8P modules for serial
communication with an external host CPU. The interface operates in slave mode only (master mode is not
supported). The DDC protocol and electrical interface are fully compatible with the Fast-Mode of the I2C industry
standard. DDC pins SDA and SCL have internal pull-up resistors.
For more information about the DDC implementation, see the u-blox 8 / u-blox M8 Receiver Description Including
Protocol Specification [2]. For bandwidth information, see the NEO-M8P Data Sheet [1]. For timing parameters
consult the I2C-bus specification [4].
The NEO-M8P DDC interface supports serial communication with u-blox cellular modules. See the
specification of the applicable cellular module to confirm compatibility.
1.4.4 SPI
An SPI interface is optionally available for communication to a host CPU.
SPI is not available in the default configuration, because its pins are shared with the UART and DDC
interfaces. The SPI interface can be enabled by connecting D_SEL to ground. For speed and clock
frequency, see the NEO-M8P Data Sheet [1].
1.4.5 TX Ready signal
The TX Ready signal indicates that the receiver has data to transmit. A listener can wait on the TX Ready signal
instead of polling the DDC or SPI interfaces. The UBX-CFG-PRT message enables configuration of signal polarity
and buffer threshold (in bytes) before the TX Ready signal goes active. The TX Ready signal can be mapped to
UART TXD (PIO 06). The TX Ready function is disabled by default.
The TX Ready functionality can be enabled and configured by AT commands sent to the u-blox cellular
module supporting the feature. For more information, see the GPS Implementation and Aiding Features
in u-blox wireless modules [5].

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1.5 I/O pins
1.5.1 RESET_N: Reset input
Driving RESET_N low activates a hardware reset of the system. Use this pin only to reset the module. Do not use
RESET_N to turn the module on and off, since the reset state increases power consumption. With NEO-M8P
module RESET_N is an input only.
1.5.2 EXTINT: External interrupt input
EXTINT is an external interrupt pin with fixed input voltage thresholds with respect to VCC (see the NEO-M8P
Data Sheet [1] for more information). It can be used for functions such as accurate external frequency aiding and
ON/OFF control. Leave open if unused, this function is disabled by default.
1.5.3 SAFEBOOT_N: input
If the SAFEBOOT_N pin is “low” at power up, the NEO-M8P module starts in Safe Boot Mode and doesn’t begin
GNSS operation. The Safe Boot Mode can be used to recover from situations where the Flash has become
corrupted.
1.5.4 D_SEL: input
The D_SEL pin selects the available interfaces between SPI and UART/DDC operation.
If open, the UART and DDC ports are active. If pulled low, the SPI interface is available. See the NEO-M8P Data
Sheet [1].
1.5.5 LNA_EN: Antenna ON (LNA enable), output
In Power Save Mode, the system can turn on/off an optional external LNA using the LNA_EN signal in order to
optimize power consumption.
1.5.6 TIMEPULSE: output
A configurable time pulse signal is available with NEO-M8P modules. The time pulse signal is configured as one
pulse per second by default. For more information on programming this function, see the u-blox 8 / u-blox M8
Receiver Description including Protocol Specification [2].
1.5.7 RTK_STAT: output
The RTK_STAT pin provides an indication of the RTK positioning status. At start up this pin is set high. When
receiving a valid stream of RTCM 3 messages the pin alternates between high and low at the navigation rate, e.g.
the default rate is 1Hz. It is set into a continuous low output when the receiver is operating in RTK fixed mode.
1.5.8 GEOFENCE_STAT: output
This pin indicates the current geofence status, if activated. The pin active polarity and geofence locations are preset
using the UBX-NAV-GEOFENCE message allowing up to four circular areas to be defined. Once activated, the
receiver continuously compares its current position with the preset geofenced areas. The pin state reflects the
current Geofence status as to whether the receiver is inside any of the active areas. See the u-blox 8 / u-blox M8
Receiver Description including Protocol Specification [2] for more information.
1.5.9 Electromagnetic interference on I/O lines
Any I/O signal line with a length greater than a ~3 mm can act as an antenna and may pick up arbitrary RF signals
transferring them as noise into the GNSS receiver. This specifically applies to unshielded lines, in which the
corresponding GND layer is remote or missing entirely, or lines close to the edges of the printed circuit board.
If, for example, a cellular signal radiates into an unshielded I/O line, it is possible to generate noise of the order of
many volts which not only distort receiver operation but can also damage it permanently.

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On the other hand, noise generated at the I/O pins will emit from unshielded I/O lines. Receiver performance can
be degraded when this noise is coupled into the GNSS antenna (see Figure 14).
To avoid interference through improperly shielded lines, it is recommended to use series resistors (e.g. R>20 Ω),
ferrite beads (e.g. BLM15HD102SN1) or inductors (e.g. LQG15HS47NJ02) in the I/O lines. These components will
affect the signal rise times and hence should be chosen with some care.
Figure 3 shows an example of EMI protection measures on the RX/TX line using a ferrite bead. More information
is given in section 3.3.
Figure 3: EMI Precautions

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2Design
2.1 Pin description
Function PIN No I/O Description Remarks
Power VCC 23 Supply Voltage Provide a clean and stable supply.
GND 10,12,
13, 24
Ground Assure a good GND connection to all GND pins of the
module, preferably with a large ground plane.
V_BCKP 22 Backup Supply
Voltage
It is recommended to connect a backup supply voltage to
V_BCKP in order to enable warm and hot start features on
the positioning modules. Otherwise, connect to VCC.
VDD_USB 7 USB Power Supply To use the USB interface, connect this pin to 3.0 – 3.6 V.
If no USB serial port used connect to GND.
Antenna RF_IN 11 I GNSS signal input
from antenna
The connection to the antenna has to be routed on the
PCB. Use a controlled impedance of 50 Ωto connect RF_IN
to the antenna or the antenna connector.
VCC_RF 9 O Output Voltage RF
section
VCC_RF can be used to power an external active antenna.
UART TXD /SPI MISO 20 O Serial Port/ SPI
MISO
Communication interface,.
Can be programmed as TX Ready for DDC interface.
If pin 2 low => SPI MISO.
RXD / SPI MOSI 21 I Serial Port / SPI
MOSI
Serial input. Internal pull-up resistor to VCC. Leave open if
not used.
If pin 2 low => SPI MOSI.
USB USB_DM 5 I/O USB I/O line USB bidirectional communication pin. Leave open if
unused.
USB_DP 6 I/O USB I/O line
System TIMEPULSE 3 O Timepulse Signal Configurable Timepulse 1 signal (one pulse per second by
default). Leave open if not used.
SAFEBOOT_N 1 I SAFEBOOT_N (for future service, updates and
reconfiguration, normally leave OPEN)
EXTINT 4 I External Interrupt 0 External Interrupt Pin.
Internal pull-up resistor to VCC. Leave open if not used.
Function is disabled by default.
RTK_STAT 15 O RTK Status Shows current RTK position status
GEOFENCE_STAT
16
O
Geofence Status
Active if enabled, polarity programmable
SDA /SPI CS_N 18 I/O DDC Data / SPI
CS_N
DDC Data
If pin 2 low => SPI chip select.
SCL /SPI CLK
19
I
DDC Clock / SPI
SCK
DDC Clock.
If pin 2 low => SPI clock.
LNA_EN 14 O ANT_ON LNA Enable can be used to turn on and off an optional
external LNA or active antenna
RESET_N 8 I Reset input Reset input
D_SEL 2 I selects the
interface
Allow selecting UART/DDC or SPI
open-> UART/DDC; low->SPI
RESERVED 17 - Reserved Leave open.
Table 2: NEO-M8P Pinout
2.1.1 Pin name changes
Selected pin names have been updated to agree with a common naming convention across u-blox modules. The
pins have not changed their operation and are the same physical hardware but with updated names. The table
below lists the pins that have changed name along with their old and new names.

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No Previous Name New name
14 ANT_ON LNA_EN
20 TxD
TXD /
SPI MISO
21 RxD RXD /
SPI MOSI
Table 3: NEO-M8P Module Pin renaming
2.2 Minimal design
This is a minimal design for a NEO-M8P GNSS receiver.
Figure 4: NEO-M8P passive antenna design
2.3 Layout: Footprint and paste mask
Figure 5 describes the footprint and provides recommendations for the paste mask for NEO-M8P LCC modules.
These are recommendations only and not specifications. Note that the copper and solder masks have the same
size and position.
To improve the wetting of the half vias, reduce the amount of solder paste under the module and increase the
volume outside of the module by defining the dimensions of the paste mask to form a T-shape (or equivalent)
extending beyond the copper mask. For the stencil thickness, see section 3.2.
Consider the paste mask outline when defining the minimal distance to the next component. The exact
geometry, distances, stencil thicknesses and solder paste volumes must be adapted to the specific
production processes (e.g. soldering) of the customer.

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Stencil: 150 µ m
10.4 mm [409.5 mil]
14.6 mm [575 mil]
12.2 mm [480 mil]
0.8 mm
[31.5 mil]
0.6 mm
[23.5 mil]
2.4 Antenna
With RTK operation, the antenna and its placement are critical system factors, both for the Base and Rover. The
minimum receiver signal strengths to track the signal phase are higher than conventional GNSS receivers, at about
34 dBHz, and require good antenna efficiency with a stable phase center. Hence, use of a relatively large ceramic
patch, i.e. 25 mm square or greater will provide reasonable performance in terms of efficiency and accuracy vs.
cost. For a Base station antenna installation, users should try to mitigate the effects of multi-path reception from
nearby objects or buildings. Use of a ground plane will minimize the effects of ground reflections and enhance
the antenna efficiency. For the Rover, use of a ground plane with a minimum diameter of 10 centimeter is
recommended. It is also recommended that the Rover antenna is positioned away from any potential reflectors on
the vehicle will give the best overall results. Exercise care with Rover vehicles that emit RF energy from motors etc.
as interference may extend into the GNSS band and couple into the GNSS antenna suppressing the wanted signal.
2.4.1 Antenna design with passive antenna
A design using a passive antenna requires more attention to the layout of the RF section. Typically, a passive
antenna is located near electronic components; therefore, care should be taken to reduce electrical noise that may
interfere with the antenna performance. Passive antennas do not require a DC bias voltage and can be directly
connected to the RF input pin RF_IN. Sometimes, they may also need a passive matching network to match the
impedance to 50 Ω.
Figure 6 shows a minimal setup for a design with a good GNSS patch antenna.
Figure 6: Module design with passive antenna (for exact pin orientation see the NEO-M8P Data Sheet [1])
Figure
5: NEO-M8P paste mask / NEO-M8P footprint
12.2 mm [480.3 mil]
16.0 mm [630 mil]
1.0 mm
[39.3 mil]
0.8 mm
[31.5 mil]
0.8 mm
[31.5 mil]
3.0 mm
[118.1 mil]
1.0 mm
[39.3 mil]
1.1 mm
[43.3 mil]

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Use an antenna that has sufficient bandwidth to receive all GNSS constellations. See Appendix A.1.
Figure 7 shows a design using an external LNA to increase the sensitivity for best performance with passive
antenna.
Figure 7: Module design with passive antenna and an external LNA (for exact pin orientation see the NEO-M8P Data Sheet [1])
The LNA_EN pin (LNA enable) can be used to turn on and off an optional external LNA.
The VCC_RF output can be used to supply the LNA with a filtered supply voltage.
Ensure the LNA has enough bandwidth to amplify all the required satellite signals.
An external LNA is only required if the antenna is far away. In that case the LNA has to be placed close to
the passive antenna.
Add a SAW filter before or after the LNA to prevent any blocking issues from out-of-band signals
2.4.2 Active antenna design
Active antennas have an integrated low-noise amplifier. Active antennas require a power supply that will contribute
to the total GNSS system power consumption budget with additional 5 to 20 mA typically.
If the supply voltage of the NEO-M8 receiver matches the supply voltage of the antenna (e.g. 3.0 V), use the
filtered supply voltage available at pin VCC_RF as shown in Figure 8.
Active antenna design using VCC_RF pin to supply the active antenna

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Figure 8: Active antenna design, external supply from VCC_RF (for exact pin orientation see the NEO-M8P Data Sheet [1])
The L,C passive component values and recommended types are given in Appendix A.1. If the VCC_RF voltage does
not match with the supply voltage of the active antenna, use a filtered external supply as shown in Figure 9. To
ensure that the maximum DC input voltage at the LNA input is not exceeded use a DC blocking capacitor (value
C).
Active antenna design powered from external supply
Figure 9: Active antenna design, direct external supply (for exact pin orientation see the NEO-M8P Data Sheet [1])
The circuit shown in Figure 9 works with all u-blox M8 modules, also with modules without VCC_RF
output.

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3Product handling
3.1 Packaging, shipping, storage and moisture preconditioning
For information pertaining to reels and tapes, Moisture Sensitivity levels (MSL), shipment and storage information,
as well as drying for preconditioning see the NEO-M8P Data Sheet [1].
Population of Modules
When populating the modules, make sure that the pick and place machine is aligned to the copper pins
of the module and not on the module edge.
3.2 Soldering
Soldering paste
Use of “No Clean” soldering paste is highly recommended, as it does not require cleaning after the soldering
process has taken place. The paste listed in the example below meets these criteria.
Soldering Paste: OM338 SAC405 / Nr.143714 (Cookson Electronics)
Alloy specification: Sn 95.5/ Ag 4/ Cu 0.5 (95.5% Tin/ 4% Silver/ 0.5% Copper)
Melting Temperature: 217 °C
Stencil Thickness: see section 2.3
The final choice of the soldering paste depends on the approved manufacturing procedures.
The paste-mask geometry for applying soldering paste should meet the recommendations.
The quality of the solder joints on the connectors (’half vias’) should meet the appropriate IPC specification.
Reflow soldering
A convection type-soldering oven is highly recommended over the infrared type radiation oven.
Convection heated ovens allow precise control of the temperature, and all parts will heat up evenly, regardless
of material properties, thickness of components and surface color.
As a reference, see the “IPC-7530 Guidelines for temperature profiling for mass soldering (reflow and wave)
processes”, published in 2001.
Preheat phase
During the initial heating of component leads and balls, residual humidity will be dried out. Note that this
preheat phase will not replace prior baking procedures.
•Temperature rise rate: max. 3 °C/s. If the temperature rise is too rapid in the preheat phase it may cause
excessive slumping.
•Time: 60 – 120 s. If the preheat is insufficient, rather large solder balls tend to be generated. Conversely, if
performed excessively, fine balls and large balls will be generated in clusters.
•End Temperature: 150 – 200 °C. If the temperature is too low, non-melting tends to be caused in areas
containing large heat capacity.
Heating/ Reflow phase
The temperature rises above the liquidus temperature of 217°C. Avoid a sudden rise in temperature as the slump
of the paste could become worse.
•Limit time above 217 °C liquidus temperature: 40 – 60 s
•Peak reflow temperature: 245 °C

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Cooling phase
A controlled cooling avoids negative metallurgical effects (solder becomes more brittle) of the solder and possible
mechanical tensions in the products. Controlled cooling helps to achieve bright solder fillets with a good shape
and low contact angle.
•Temperature fall rate: max 4 °C/s
To avoid falling off, the NEO-M8P modules should be placed on the topside of the motherboard during
soldering.
The final soldering temperature chosen at the factory depends on additional external factors like choice of
soldering paste, size, thickness and properties of the base board, etc. Exceeding the maximum soldering
temperature in the recommended soldering profile may permanently damage the module.
Figure 10: Recommended soldering profile
NEO-M8P modules must not be soldered with a damp heat process.
Optical inspection
After soldering the NEO-M8P module, consider an optical inspection step to check whether:
•The module is properly aligned and centered over the pads
•All pads are properly soldered
•No excess solder has created contacts to neighboring pads, or possibly to pad stacks and vias nearby
Cleaning
In general, cleaning the populated modules is strongly discouraged. Residues underneath the modules cannot be
easily removed with a washing process.
•Cleaning with water will lead to capillary effects where water is absorbed in the gap between the baseboard
and the module. The combination of residues of soldering flux and encapsulated water leads to short circuits
or resistor-like interconnections between neighboring pads.
•Cleaning with alcohol or other organic solvents can result in soldering flux residues flooding into the two
housings, areas that are not accessible for post-wash inspections. The solvent will also damage the sticker and
the ink-jet printed text.
•Ultrasonic cleaning will permanently damage the module, in particular the quartz oscillators.
The best approach is to use a “no clean” soldering paste and eliminate the cleaning step after the soldering.

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Repeated reflow soldering
Only single reflow soldering processes are recommended for boards populated with NEO-M8P modules. NEO-M8P
modules should not be submitted to two reflow cycles on a board populated with components on both sides in
order to avoid upside down orientation during the second reflow cycle. In this case, the module should always be
placed on that side of the board, which is submitted into the last reflow cycle. The reason for this (besides others)
is the risk of the module falling off due to the significantly higher weight in relation to other components.
Two reflow cycles can be considered by excluding the above described upside down scenario and taking into
account the rework conditions described in this section..
Repeated reflow soldering processes and soldering the module upside down are not recommended.
Wave soldering
Base boards with combined through-hole technology (THT) components and surface-mount technology (SMT)
devices require wave soldering to solder the THT components. Only a single wave soldering process is encouraged
for boards populated with NEO-M8P modules.
Hand soldering
Hand soldering is allowed. Use a soldering iron temperature setting equivalent to 350 °C. Place the module
precisely on the pads. Start with a cross-diagonal fixture soldering (e.g. pins 1 and 15), and then continue from
left to right.
Rework
The NEO-M8P module can be unsoldered from the baseboard using a hot air gun. When using a hot air gun for
unsoldering the module, a maximum of one reflow cycle is allowed. In general, we do not recommend using a hot
air gun because this is an uncontrolled process and might damage the module.
Attention: use of a hot air gun can lead to overheating and severely damage the module. Always
avoid overheating the module.
After the module is removed, clean the pads before placing and hand soldering a new module.
Never attempt a rework on the module itself, e.g. replacing individual components. Such actions
immediately terminate the warranty.
In addition to the two reflow cycles, manual rework on particular pins by using a soldering iron is allowed. Manual
rework steps on the module can be done several times.
Conformal coating
Certain applications employ a conformal coating of the PCB using HumiSeal®or other related coating products.
These materials affect the HF properties of the GNSS module and it is important to prevent them from flowing
into the module. The RF shields do not provide 100% protection for the module from coating liquids with low
viscosity; therefore, care is required in applying the coating.
Conformal Coating of the module will void the warranty.
Casting
If casting is required, use viscose or another type of silicon pottant. The OEM is strongly advised to qualify such
processes in combination with the NEO-M8P module before implementing this in the production.
Casting will void the warranty.

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Grounding metal covers
Attempts to improve grounding by soldering ground cables, wick or other forms of metal strips directly onto the
EMI covers is done at the customer’s own risk. The numerous ground pins should be sufficient to provide
optimum immunity to interferences and noise.
u-blox makes no warranty for damages to the NEO-M8P module caused by soldering metal cables or any
other forms of metal strips directly onto the EMI covers.
Use of ultrasonic processes
Some components on the NEO-M8P module are sensitive to Ultrasonic Waves. Use of any Ultrasonic Processes
(cleaning, welding etc.) may cause damage to the GNSS Receiver.
u-blox offers no warranty against damages to the NEO-M8P module caused by any Ultrasonic Processes.
3.3 EOS/ESD/EMI precautions
When integrating GNSS positioning modules into wireless systems, careful consideration must be given to
electromagnetic and voltage susceptibility issues. Wireless systems include components that can produce Electrical
Overstress (EOS) and Electro-Magnetic Interference (EMI). CMOS devices are more sensitive to such influences
because their failure mechanism is defined by the applied voltage, whereas bipolar semiconductors are more
susceptible to thermal overstress. The following design guidelines are provided to help in designing robust yet cost
effective solutions.
To avoid overstress damage during production or in the field it is essential to observe strict
EOS/ESD/EMI handling and protection measures.
To prevent overstress damage at the RF_IN of your receiver, never exceed the maximum input
power (see the NEO-M8P Data Sheet [1]).
Electrostatic discharge (ESD)
Electrostatic discharge (ESD) is the sudden and momentary electric current that flows between
two objects at different electrical potentials caused by direct contact or induced by an
electrostatic field. The term is usually used in the electronics and other industries to describe
momentary unwanted currents that may cause damage to electronic equipment.
ESD handling precautions
ESD prevention is based on establishing an Electrostatic Protective Area (EPA). The EPA can be a small work station
or a large manufacturing area. The main principle of an EPA is that there are no highly charged materials near ESD
sensitive electronics, all conductive materials are grounded, workers are grounded, and charge build-up on ESD

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sensitive electronics is prevented. International standards are used to define typical EPA and can be obtained for
example from the International Electrotechnical Commission (IEC) or American National Standards Institute (ANSI).
GNSS positioning modules are sensitive to ESD and require special precautions when handling. Particular care must
be exercised when handling patch antennas, due to the risk of electrostatic charges. In addition to standard ESD
safety practices, the following measures should be taken into account whenever handling the receiver.
•Unless there is a galvanic coupling between the local GND (i.e.
the work table) and the PCB GND, then the first point of contact
when handling the PCB must always be between the local GND
and PCB GND.
•Ground a patch antenna before mounting.
•When handling the RF pin, do not come into contact with any
charged capacitors and be careful when contacting materials
that can develop charges (e.g. patch antenna ~10 pF, coax cable
~50 – 80 pF/m, soldering iron, …)
•To prevent electrostatic discharge through the RF input, do not
touch any exposed antenna area. If there is any risk that such
exposed antenna area is touched in non ESD protected work
area, implement proper ESD protection measures in the design.
•When soldering RF connectors and patch antennas to the
receiver’s RF pin, make sure to use an ESD safe soldering iron
(tip).
Failure to observe these precautions can result in severe damage to the GNSS module!
ESD protection measures
GNSS positioning modules are sensitive to Electrostatic Discharge (ESD). Special precautions are
required when handling.
For more robust designs, employ additional ESD protection measures. Using an LNA with appropriate ESD
rating can provide enhanced GNSS performance with passive antennas and increases ESD protection.
Most defects caused by ESD can be prevented by following strict ESD protection rules for production and handling.
When implementing passive antenna patches or external antenna connection points, then additional ESD measures
can also avoid failures in the field as shown in Figure 11.
Small passive antennas (<2 dBic
and performance critical)
Passive antennas (>2 dBic or
performance sufficient)
Active antennas
A
RF_IN
GNSS
Receiver
LNA
B
L
RF_IN
GNSS
Receiver
C
D
RF_IN
GNSS
Receiver
LNA with appropriate ESD rating
Figure 11: ESD Precautions

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Protection measure A is preferred because it offers the best GNSS performance and best level of ESD
protection.
Electrical Overstress (EOS)
Electrical Overstress (EOS) usually describes situations when the maximum input power exceeds the maximum
specified ratings. EOS failure can happen if RF emitters are close to a GNSS receiver or its antenna. EOS causes
damage to the chip structures. If the RF_IN circuitry is damaged by EOS, it is hard to determine whether the chip
structures have been damaged by ESD or EOS.