
MAX-7 / NEO-7 - Hardware Integration Manual
UBX-13003704 - R09 Production Information Contents
Page 5 of 52
3.1.2 Layout checklist ........................................................................................................................... 15
3.1.3 Antenna checklist ........................................................................................................................ 16
3.2 Design considerations for minimal designs.......................................................................................... 16
3.2.1 Minimal design (NEO-7N) ............................................................................................................ 17
3.2.2 Minimal design (MAX-7Q) ........................................................................................................... 18
3.3 Layout ................................................................................................................................................ 19
3.3.1 Footprint and paste mask ............................................................................................................ 19
3.3.2 Placement ................................................................................................................................... 20
3.3.3 Antenna connection and ground plane design ............................................................................ 20
3.3.4 General design recommendations: .............................................................................................. 21
3.3.5 Antenna micro strip..................................................................................................................... 22
3.4 Antenna and Antenna supervision ...................................................................................................... 23
3.4.1 Antenna design with passive antenna ......................................................................................... 23
3.4.2 Active antenna design without antenna supervisor (NEO-7N/7M/7P, MAX-7C/7Q) ...................... 24
3.4.3 Antenna design with active antenna using antenna supervisor (MAX-7W) .................................. 25
3.4.4 Design with GLONASS / GPS active antenna................................................................................ 30
3.4.5 Design with GLONASS / GPS passive antenna .............................................................................. 31
3.5 Recommended parts........................................................................................................................... 32
3.5.1 Recommended GPS & GLONASS active antenna (A1) .................................................................. 33
3.5.2 Recommended GPS & GLONASS passive patch antenna .............................................................. 33
3.5.3 Recommended GPS & GLONASS passive chip antenna ................................................................ 33
4INPAQ (www.inpaq.com.tw).....................................................................................34
55.2 x 3.7 x 0.7 mm GPS+GLONASS.............................................................................34
6Migration to u-blox-7 modules .................................................................................35
6.1 Migrating u-blox 6 designs to a u-blox 7 module................................................................................ 35
6.2 Hardware migration............................................................................................................................ 35
6.2.1 Hardware compatibility: .............................................................................................................. 35
6.2.2 Hardware migration NEO-6 -> NEO-7.......................................................................................... 36
6.2.3 Hardware migration MAX-6 -> MAX-7........................................................................................ 37
6.3 Software migration............................................................................................................................. 38
6.3.1 Software compatibility................................................................................................................. 38
6.3.2 Messages no longer supported.................................................................................................... 38
7Product handling........................................................................................................39
7.1 Packaging, shipping, storage and moisture preconditioning ............................................................... 39
7.1.1 Population of Modules ................................................................................................................ 39
7.2 Soldering ............................................................................................................................................ 39
7.2.1 Soldering paste............................................................................................................................ 39
7.2.2 Reflow soldering ......................................................................................................................... 39
7.2.3 Optical inspection........................................................................................................................ 40
7.2.4 Cleaning...................................................................................................................................... 40
7.2.5 Repeated reflow soldering........................................................................................................... 41