Ublox TOBY-L2 series Quick setup guide

TOBY-L2 and MPCI-L2 series
LTE/DC-HSPA+/EGPRS modules
System Integration Manual
Abstract
This document describes the features and the system integration of
TOBY-L2 and MPCI-L2 series multi-mode cellular modules.
These modules are a complete and cost efficient LTE/3G/2G solution
offering up to 150 Mb/s download and 50 Mb/s upload data rates,
covering up to six LTE bands, up to five WCDMA/DC-HSPA+ bands
and four GSM/EGPRS bands in the compact TOBY LGA form factor of
TOBY-L2 modules or in the industry standard PCI Express Mini Card
form factor of MPCI-L2 modules.
TOBY-L2 series
www.u-blox.com
UBX-13004618 - R04
MPCI-L2 series

TOBY-L2 and MPCI-L2 series - System Integration Manual
UBX-13004618 - R04
Page 2 of 141
Document Information
Title
TOBY-L2 and MPCI-L2 series
Subtitle
LTE/DC-HSPA+/EGPRS modules
Document type
System Integration Manual
Document number
UBX-13004618
Revision and date
R04
30-Sep-2014
Document status
Advance Information
Document status explanation
Objective Specification
Document contains target values. Revised and supplementary data will be published later.
Advance Information
Document contains data based on early testing. Revised and supplementary data will be published later.
Early Production Information
Document contains data from product verification. Revised and supplementary data may be published later.
Production Information
Document contains the final product specification.
This document applies to the following products:
Name
Type number
Firmware version
PCN / IN
TOBY-L200
TOBY-L200-00S-00
09.40
UBX-14040967
TOBY-L210
TOBY-L210-00S-00
09.40
UBX-14040967
MPCI-L200
MPCI-L200-00S-00
09.34
UBX-14040967
MPCI-L210
MPCI-L210-00S-00
09.34
UBX-14040967
u-blox reserves all rights to this document and the information contained herein. Products, names, logos and designs described herein may in
whole or in part be subject to intellectual property rights. Reproduction, use, modification or disclosure to third parties of this document or
any part thereof without the express permission of u-blox is strictly prohibited.
The information contained herein is provided “as is” and u-blox assumes no liability for the use of the information. No warranty, either
express or implied, is given, including but not limited, with respect to the accuracy, correctness, reliability and fitness for a particular purpose
of the information. This document may be revised by u-blox at any time. For most recent documents, please visit www.u-blox.com.
Copyright © 2014, u-blox AG
u-blox®is a registered trademark of u-blox Holding AG in the EU and other countries. PCI, PCI Express, PCIe, and PCI-SIG are trademarks or
registered trademarks of PCI-SIG. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the
United States and/or other countries. ARM®is a registered trademark of ARM Limited in the EU and other countries. All other registered
trademarks or trademarks mentioned in this document are property of their respective owners.

TOBY-L2 and MPCI-L2 series - System Integration Manual
UBX-13004618 - R04 Advance Information Preface
Page 3 of 141
Preface
u-blox Technical Documentation
As part of our commitment to customer support, u-blox maintains an extensive volume of technical
documentation for our products. In addition to our product-specific technical data sheets, the following manuals
are available to assist u-blox customers in product design and development.
AT Commands Manual: This document provides the description of the AT commands supported by the
u-blox cellular modules.
System Integration Manual: This document provides the description of u-blox cellular modules’ system
from the hardware and the software point of view, it provides hardware design guidelines for the optimal
integration of the cellular modules in the application device and it provides information on how to set up
production and final product tests on application devices integrating the cellular modules.
Application Note: These documents provide guidelines and information on specific hardware and/or
software topics on u-blox cellular modules. See Related documents for a list of Application Notes related to
your Cellular Module.
How to use this Manual
The TOBY-L2 and MPCI-L2 series System Integration Manual provides the necessary information to successfully
design and configure the u-blox cellular modules.
This manual has a modular structure. It is not necessary to read it from the beginning to the end.
The following symbols are used to highlight important information within the manual:
An index finger points out key information pertaining to module integration and performance.
A warning symbol indicates actions that could negatively impact or damage the module.
Questions
If you have any questions about u-blox Cellular Integration:
Read this manual carefully.
Contact our information service on the homepage http://www.u-blox.com/
Technical Support
Worldwide Web
Our website (http://www.u-blox.com/) is a rich pool of information. Product information, technical documents
can be accessed 24h a day.
By E-mail
Contact the closest Technical Support office by email. Use our service pool email addresses rather than any
personal email address of our staff. This makes sure that your request is processed as soon as possible. You will
find the contact details at the end of the document.
Helpful Information when Contacting Technical Support
When contacting Technical Support, have the following information ready:
Module type (TOBY-L200) and firmware version
Module configuration
Clear description of your question or the problem
A short description of the application
Your complete contact details

TOBY-L2 and MPCI-L2 series - System Integration Manual
UBX-13004618 - R04 Advance Information Contents
Page 4 of 141
Contents
Preface ................................................................................................................................3
Contents..............................................................................................................................4
1System description.......................................................................................................8
1.1 Overview .............................................................................................................................................. 8
1.2 Architecture........................................................................................................................................ 10
1.2.1 Internal blocks ............................................................................................................................. 11
1.3 Pin-out ............................................................................................................................................... 12
1.3.1 TOBY-L2 series pin assignment .................................................................................................... 12
1.3.2 MPCI-L2 series pin assignment .................................................................................................... 16
1.4 Operating modes................................................................................................................................ 18
1.5 Supply interfaces ................................................................................................................................ 20
1.5.1 Module supply input (VCC or 3.3Vaux) ....................................................................................... 20
1.5.2 RTC supply input/output (V_BCKP) .............................................................................................. 27
1.5.3 Generic digital interfaces supply output (V_INT)........................................................................... 28
1.6 System function interfaces.................................................................................................................. 29
1.6.1 Module power-on ....................................................................................................................... 29
1.6.2 Module power-off ....................................................................................................................... 31
1.6.3 Module reset ............................................................................................................................... 33
1.6.4 Module configuration selection by host processor ....................................................................... 33
1.7 Antenna interface............................................................................................................................... 34
1.7.1 Antenna RF interfaces (ANT1 / ANT2) .......................................................................................... 34
1.7.2 Antenna detection interface (ANT_DET) ...................................................................................... 37
1.8 SIM interface ...................................................................................................................................... 37
1.8.1 SIM interface ............................................................................................................................... 37
1.8.2 SIM detection interface ............................................................................................................... 37
1.9 Data communication interfaces .......................................................................................................... 38
1.9.1 Universal Serial Bus (USB) ............................................................................................................ 38
1.9.2 Asynchronous serial interface (UART)........................................................................................... 42
1.9.3 DDC (I2C) interface ...................................................................................................................... 44
1.9.4 Secure Digital Input Output interface (SDIO)................................................................................ 45
1.10 Audio.............................................................................................................................................. 45
1.10.1 Digital audio over I2S interface ..................................................................................................... 45
1.11 General Purpose Input/Output ........................................................................................................ 46
1.12 Mini PCIe specific signals (W_DISABLE#, LED_WWAN#) .................................................................. 47
1.13 Reserved pins (RSVD) ...................................................................................................................... 47
1.14 Not connected pins (NC) ................................................................................................................. 47
1.15 System features............................................................................................................................... 48
1.15.1 Network indication ...................................................................................................................... 48
1.15.2 Antenna supervisor ..................................................................................................................... 48

TOBY-L2 and MPCI-L2 series - System Integration Manual
UBX-13004618 - R04 Advance Information Contents
Page 5 of 141
1.15.3 Jamming detection ...................................................................................................................... 48
1.15.4 IP modes of operation ................................................................................................................. 49
1.15.5 Dual stack IPv4/IPv6 ..................................................................................................................... 49
1.15.6 TCP/IP and UDP/IP ....................................................................................................................... 49
1.15.7 FTP and FTPS ............................................................................................................................... 49
1.15.8 HTTP and HTTPS.......................................................................................................................... 50
1.15.9 SSL .............................................................................................................................................. 50
1.15.10 AssistNow clients and GNSS integration................................................................................... 50
1.15.11 Hybrid positioning and CellLocate®.......................................................................................... 50
1.15.12 Firmware update Over AT (FOAT)............................................................................................. 53
1.15.13 Firmware update Over The Air (FOTA)...................................................................................... 53
1.15.14 In-band Modem (eCall / ERA-GLONASS) .................................................................................. 54
1.15.15 SIM Access Profile (SAP)........................................................................................................... 54
1.15.16 Smart temperature management ............................................................................................. 56
1.15.17 Power saving ........................................................................................................................... 58
2Design-in.....................................................................................................................59
2.1 Overview ............................................................................................................................................ 59
2.2 Supply interfaces ................................................................................................................................ 60
2.2.1 Module supply (VCC or 3.3Vaux)................................................................................................. 60
2.2.2 RTC supply output (V_BCKP) ....................................................................................................... 72
2.2.3 Generic digital interfaces supply output (V_INT)........................................................................... 74
2.3 System functions interfaces ................................................................................................................ 75
2.3.1 Module power-on (PWR_ON) ...................................................................................................... 75
2.3.2 Module reset (RESET_N or PERST#) .............................................................................................. 76
2.3.3 Module configuration selection by host processor ....................................................................... 77
2.4 Antenna interface............................................................................................................................... 78
2.4.1 Antenna RF interfaces (ANT1 / ANT2) .......................................................................................... 78
2.4.2 Antenna detection interface (ANT_DET) ...................................................................................... 86
2.5 SIM interface ...................................................................................................................................... 88
2.5.1 Guidelines for SIM circuit design.................................................................................................. 88
2.5.2 Guidelines for SIM layout design ................................................................................................. 94
2.6 Data communication interfaces .......................................................................................................... 95
2.6.1 Universal Serial Bus (USB) ............................................................................................................ 95
2.6.2 Asynchronous serial interface (UART)........................................................................................... 97
2.6.3 DDC (I2C) interface .................................................................................................................... 101
2.6.4 Secure Digital Input Output interface (SDIO).............................................................................. 105
2.7 Audio interface................................................................................................................................. 106
2.7.1 Digital audio interface ............................................................................................................... 106
2.8 General Purpose Input/Output .......................................................................................................... 108
2.9 Mini PCIe specific signals (W_DISABLE#, LED_WWAN#).................................................................... 109
2.10 Reserved pins (RSVD) .................................................................................................................... 110
2.11 Module placement ........................................................................................................................ 111
2.12 TOBY-L2 series module footprint and paste mask ......................................................................... 112

TOBY-L2 and MPCI-L2 series - System Integration Manual
UBX-13004618 - R04 Advance Information Contents
Page 6 of 141
2.13 MPCI-L2 series module installation ................................................................................................ 113
2.14 Thermal guidelines ........................................................................................................................ 115
2.15 ESD guidelines .............................................................................................................................. 116
2.15.1 ESD immunity test overview ...................................................................................................... 116
2.15.2 ESD immunity test of TOBY-L2 and MPCI-L2 series reference designs ........................................ 117
2.15.3 ESD application circuits.............................................................................................................. 117
2.16 Schematic for TOBY-L2 and MPCI-L2 series module integration .................................................... 118
2.17 Design-in checklist ........................................................................................................................ 120
2.17.1 Schematic checklist ................................................................................................................... 120
2.17.2 Layout checklist ......................................................................................................................... 121
2.17.3 Antenna checklist ...................................................................................................................... 121
3Handling and soldering ...........................................................................................122
3.1 Packaging, shipping, storage and moisture preconditioning ............................................................. 122
3.2 Handling........................................................................................................................................... 122
3.3 Soldering .......................................................................................................................................... 123
3.3.1 Soldering paste.......................................................................................................................... 123
3.3.2 Reflow soldering ....................................................................................................................... 123
3.3.3 Optical inspection...................................................................................................................... 124
3.3.4 Cleaning.................................................................................................................................... 124
3.3.5 Repeated reflow soldering......................................................................................................... 125
3.3.6 Wave soldering.......................................................................................................................... 125
3.3.7 Hand soldering .......................................................................................................................... 125
3.3.8 Rework...................................................................................................................................... 125
3.3.9 Conformal coating .................................................................................................................... 125
3.3.10 Casting...................................................................................................................................... 125
3.3.11 Grounding metal covers ............................................................................................................ 125
3.3.12 Use of ultrasonic processes........................................................................................................ 125
4Approvals..................................................................................................................126
4.1 Product certification approval overview............................................................................................. 126
4.2 Federal Communications Commission and Industry Canada notice ................................................... 127
4.2.1 Safety warnings review the structure ......................................................................................... 127
4.2.2 Declaration of Conformity –United States only ......................................................................... 127
4.2.3 Modifications ............................................................................................................................ 127
4.3 R&TTED and European Conformance CE mark ................................................................................. 129
5Product testing .........................................................................................................130
5.1 u-blox in-series production test......................................................................................................... 130
5.2 Test parameters for OEM manufacturer ............................................................................................ 131
5.2.1 “Go/No go” tests for integrated devices.................................................................................... 131
5.2.2 RF functional tests ..................................................................................................................... 131
Appendix ........................................................................................................................133

TOBY-L2 and MPCI-L2 series - System Integration Manual
UBX-13004618 - R04 Advance Information Contents
Page 7 of 141
AGlossary ....................................................................................................................133
BMigration between TOBY-L1 and TOBY-L2 ............................................................135
B.1 Overview .......................................................................................................................................... 135
B.2 Pin-out comparison between TOBY-L1 and TOBY-L2 ........................................................................ 136
B.3 Schematic for TOBY-L1 and TOBY-L2 integration.............................................................................. 138
Related documents.........................................................................................................139
Revision history..............................................................................................................140
Contact............................................................................................................................141

TOBY-L2 and MPCI-L2 series - System Integration Manual
UBX-13004618 - R04 Advance Information System description
Page 8 of 141
1System description
1.1 Overview
TOBY-L2 and MPCI-L2 series comprises LTE/3G/2G multi-mode modules supporting up to six LTE bands, up to
five UMTS/DC-HSPA+ bands and four GSM/(E)GPRS bands for voice and/or data transmission as following:
TOBY-L200 and MPCI-L200 are designed primarily for operation in America
TOBY-L210 and MPCI-L210 are designed primarily for operation in Europe, Asia and other countries
TOBY-L2 and MPCI-L2 series are designed in two different form-factors suitable for applications as following:
TOBY-L2 modules are designed in the small TOBY 152-pin Land Grid Array form-factor (35.6 x 24.8 mm),
easy to integrate in compact designs and form-factor compatible with the u-blox cellular module families:
this allows customers to take the maximum advantage of their hardware and software investments, and
provides very short time-to-market.
MPCI-L2 modules are designed in the industry standard PCI Express Full-Mini Card form-factor (51 x 30 mm)
easy to integrate into industrial and consumer applications and also ideal for manufacturing of small series.
With LTE Category 4 data rates at up to 150 Mb/s (down-link) and 50 Mb/s (up-link), the modules are ideal for
applications requiring the highest data-rates and high-speed internet access. TOBY-L2 and MPCI-L2 series
modules are the perfect choice for consumer fixed-wireless terminals, mobile routers and gateways, and
applications requiring video streaming. They are also optimally suited for industrial (M2M) applications, such as
remote access to video cameras, digital signage, telehealth, and security and surveillance systems.
Table 1 summarizes the TOBY-L2 and MPCI-L2 series main features and interfaces.
Module
LTE
UMTS
GSM
Positioning
Interfaces
Audio
Features
LTE category
Bands
HSDPA category
HSUPA category
Bands
GPRS/EDGE multi-slot class
Bands
GNSS receiver
GNSS Via Modem
Assist Now Software
CellLocate®
UART
USB 2.0
SDIO
DCC (I2C)
GPIOs
MIMO 2x2 / Rx Diversity
Analog audio
Digital Audio
Network indication
Antenna supervisor
Jamming detection
Embedded TCP/UDP stack
Embedded HTTP,FTP,SSL
FOTA
eCall / ERA GLONASS
Dual stack IPv4/IPv6
TOBY-L200
4
2,4,5,
7,17
24
6
850/900/AWS
1900/2100
12
Quad
F
F
F
F
•
F
F
F
•
F
•
F
F
F
F
F
F
•
TOBY-L210
4
1,3,5,
7,8,20
24
6
850/900
1900/2100
12
Quad
F
F
F
F
•
F
F
F
•
F
•
F
F
F
F
F
F
•
MPCI-L200
4
2,4,5,
7,17
24
6
850/900/AWS
1900/2100
12
Quad
•
•
•
F
F
F
F
•
MPCI-L210
4
1,3,5,
7,8,20
24
6
850/900
1900/2100
12
Quad
•
•
•
F
F
F
F
•
F = will be supported in future product version “01”
Table 1: TOBY-L2 and MPCI-L2 series main features summary

TOBY-L2 and MPCI-L2 series - System Integration Manual
UBX-13004618 - R04 Advance Information System description
Page 9 of 141
Table 2 reports a summary of LTE, 3G and 2G cellular radio access technologies characteristics and features of
the TOBY-L2 and MPCI-L2 series modules.
4G LTE
3G UMTS/HSDPA/HSUPA
2G GSM/GPRS/EDGE
3GPP Release 9
Long Term Evolution (LTE)
Evolved Uni.Terrestrial Radio Access (E-UTRA)
Frequency Division Duplex (FDD)
DL Multi-Input Multi-Output (MIMO) 2 x 2
3GPP Release 8
Dual-Cell HS Packet Access (DC-HSPA+)
UMTS Terrestrial Radio Access (UTRA)
Frequency Division Duplex (FDD)
DL Rx diversity
3GPP Release 8
Enhanced Data rate GSM Evolution (EDGE)
GSM EGPRS Radio Access (GERA)
Time Division Multiple Access (TDMA)
DL Advanced Rx Performance (DARP) Phase 1
Band support:
TOBY-L200 / MPCI-L200:
Band 17 (700 MHz)
Band 5 (850 MHz)
Band 4 (1700 MHz)
Band 2 (1900 MHz)
Band 7 (2600 MHz)
TOBY-L210 / MPCI-L210:
Band 20 (800 MHz)
Band 5 (850 MHz)
Band 8 (900 MHz)
Band 3 (1800 MHz)
Band 1 (2100 MHz)
Band 7 (2600 MHz)
Band support:
TOBY-L200 / MPCI-L200:
Band 5 (850 MHz)
Band 8 (900 MHz)
Band 4 (AWS, 1700 MHz)
Band 2 (1900 MHz)
Band 1 (2100 MHz)
TOBY-L210 / MPCI-L210:
Band 5 (850 MHz)
Band 8 (900 MHz)
Band 2 (1900 MHz)
Band 1 (2100 MHz)
Band support
TOBY-L200 / MPCI-L200:
GSM 850 MHz
E-GSM 900 MHz
DCS 1800 MHz
PCS 1900 MHz
TOBY-L210 / MPCI-L210:
GSM 850 MHz
E-GSM 900 MHz
DCS 1800 MHz
PCS 1900 MHz
LTE Power Class
Power Class 3 (23 dBm)
for LTE mode
WCDMA/HSDPA/HSUPA Power Class
Power Class 3 (24 dBm)
for UMTS/HSDPA/HSUPA mode
GSM/GPRS Power Class
Power Class 4 (33 dBm)
for GSM/E-GSM bands
Power Class 1 (30 dBm)
for DCS/PCS bands
EDGE Power Class
Power Class E2 (27 dBm)
for GSM/E-GSM bands
Power Class E2 (26 dBm)
for DCS/PCS bands
Data rate
LTE category 4:
up to 150 Mb/s DL, 50 Mb/s UL
Data rate
TOBY-L200 / MPCI-L200:
HSDPA cat.14, up to 21 Mb/s DL1
HSUPA cat.6, up to 5.6 Mb/s UL
TOBY-L210 / MPCI-L210:
HSDPA cat.24, up to 42 Mb/s DL
HSUPA cat.6, up to 5.6 Mb/s UL
Data rate2
GPRS multi-slot class 123, CS1-CS4,
up to 85.6 kb/s DL/UL
EDGE multi-slot class 123, MCS1-MCS9
up to 236.8 kb/s DL/UL
Table 2: TOBY-L2 and MPCI-L2 series LTE, 3G and 2G characteristics summary
1
HSDPA category 24 capable
2
GPRS/EDGE multi-slot class determines the number of timeslots available for upload and download and thus the speed at which data can
be transmitted and received, with higher classes typically allowing faster data transfer rates.
3
GPRS/EDGE multi-slot class 12 implies a maximum of 4 slots in DL (reception) and 4 slots in UL (transmission) with 5 slots in total.

TOBY-L2 and MPCI-L2 series - System Integration Manual
UBX-13004618 - R04 Advance Information System description
Page 10 of 141
1.2 Architecture
Figure 1 summarizes the internal architecture of TOBY-L2 series modules.
Cellular
Base-band
Processor
Memory
Power Management Unit
26 MHz
32.768 kHz
ANT1
RF
Transceiver
ANT2
V_INT (I/O)
V_BCKP (RTC)
VCC (Supply)
SIM
USB
GPIO
Power On
External Reset
PAs
LNAs Filters
Filters
Duplexer
Filters
PAs
LNAs Filters
Filters
Duplexer
Filters
LNAs FiltersFilters
LNAs FiltersFilters
Switch
Switch
DDC(I2C)
SDIO
UART
Digital audio (I2S)
ANT_DET
Host Select
Figure 1: TOBY-L2 series block diagram
As described in the Figure 2, each MPCI-L2 series module integrates one TOBY-L2 series module:
The MPCI-L200 integrates a TOBY-L200 module
The MPCI-L210 integrates a TOBY-L210 module
The TOBY-L2 module represents the core of the device, providing the related LTE/3G/2G modem and processing
functionalities. Additional signal conditioning circuitry is implemented for PCI Express Mini Card compliance, and
two UF.L connectors are available for easy antenna integration.
ANT1
SIM
USB
W_DISABLE#
TOBY-L2
series
Signal
Conditioning
ANT2
PERST#
LED_WWAN#
U.FL
U.FL
3.3Vaux (Supply)
Boost
Converter
VCC
Figure 2: MPCI-L2 series block diagram

TOBY-L2 and MPCI-L2 series - System Integration Manual
UBX-13004618 - R04 Advance Information System description
Page 11 of 141
1.2.1 Internal blocks
As described in Figure 2, each MPCI-L2 series module integrates one TOBY-L2 series module, which consists of
the following internal sections: RF, baseband and power management.
RF section
The RF section is composed of RF transceiver, PAs, LNAs, crystal oscillator, filters, duplexers and RF switches.
Tx signal is pre-amplified by RF transceiver, then output to the primary antenna input/output port (ANT1) of the
module via power amplifier (PA), SAW band pass filters band, specific duplexer and antenna switch.
Dual receiving paths are implemented according to LTE Down-Link MIMO 2 x 2 and 3G Receiver Diversity radio
technologies supported by the modules as LTE category 4 and HSDPA category 24 User Equipments: incoming
signals are received through the primary (ANT1) and the secondary (ANT2) antenna input ports which are
connected to the RF transceiver via specific antenna switch, diplexer, duplexer, LNA, SAW band pass filters.
RF transceiver performs modulation, up-conversion of the baseband I/Q signals for Tx, down-conversion and
demodulation of the dual RF signals for Rx. The RF transceiver contains:
Automatically gain controlled direct conversion Zero-IF receiver,
Highly linear RF demodulator / modulator capable GMSK, 8-PSK, QPSK, 16-QAM, 64-QAM,
Fractional-N Sigma-Delta RF synthesizer,
VCO.
Power Amplifiers (PA) amplify the Tx signal modulated by the RF transceiver
RF switches connect primary (ANT1) and secondary (ANT2) antenna ports to the suitable Tx / Rx path
Low Noise Amplifiers (LNA) enhance the received sensitivity
SAW duplexers separate the Tx and Rx signal paths and provide RF filtering
SAW band pass filters enhance the rejection of out-of-band signals
26 MHz crystal oscillator generates the clock reference in active-mode or connected-mode.
Baseband and power management section
The Baseband and Power Management section is composed of the following main elements:
A mixed signal ASIC, which integrates
Microprocessor for control functions
DSP core for LTE/3G/2G Layer 1 and digital processing of Rx and Tx signal paths
Memory interface controller
Dedicated peripheral blocks for control of the USB, SIM and GPIO digital interfaces
Analog front end interfaces to RF transceiver ASIC
Memory system, which includes NAND flash and LPDDR
Voltage regulators to derive all the subsystem supply voltages from the module supply input VCC
Voltage sources for external use: V_BCKP and V_INT (not available on MPCI-L2 series modules)
Hardware power on
Hardware reset
Low power idle-mode support
32.768 kHz crystal oscillator to provide the clock reference in the low power idle-mode, which can be set by
enable power saving configuration using the AT+UPSV command.

TOBY-L2 and MPCI-L2 series - System Integration Manual
UBX-13004618 - R04 Advance Information System description
Page 12 of 141
1.3 Pin-out
1.3.1 TOBY-L2 series pin assignment
Table 3 lists the pin-out of the TOBY-L2 series modules, with pins grouped by function.
Function
Pin Name
Pin No
I/O
Description
Remarks
Power
VCC
70,71,72
I
Module supply input
VCC pins are internally connected each other.
VCC supply circuit affects the RF performance and
compliance of the device integrating the module with
applicable required certification schemes.
See section 1.5.1 for functional description and
requirements for the VCC module supply.
See section 2.2.1 for external circuit design-in.
GND
2, 30, 32, 44,
46, 69, 73, 74,
76, 78, 79, 80,
82, 83, 85, 86,
88-90, 92-152
N/A
Ground
GND pins are internally connected each other.
External ground connection affects the RF and thermal
performance of the device.
See section 1.5.1 for functional description.
See section 2.2.1 for external circuit design-in.
V_BCKP
3
I/O
RTC supply
input/output
V_BCKP = 3.0 V (typical) generated by internal regulator
when valid VCC supply is present.
See section 1.5.2 for functional description.
See section 2.2.2 for external circuit design-in.
V_INT
5
O
Generic digital
interfaces supply
output
V_INT = 1.8 V (typical) generated by internal regulator
when the module is switched on.
See section 1.5.3 for functional description.
See section 2.2.3 for external circuit design-in.
System
PWR_ON
20
I
Power-on input
Internal active pull-up to the VCC enabled.
See section 1.6.1 for functional description.
See section 2.3.1 for external circuit design-in.
RESET_N
23
I
External reset input
Internal active pull-up to the VCC enabled.
See section 1.6.3 for functional description.
See section 2.3.2 for external circuit design-in.
HOST_SELECT0
26
I
Selection of module
configuration by the
host processor
Note: Not supported by TOBY-L2x0-00S product version
See section 1.6.4 for functional description.
See section 2.3.3 for external circuit design-in.
HOST_SELECT1
62
I
Selection of module
configuration by the
host processor
Note: Not supported by TOBY-L2x0-00S product version
See section 1.6.4 for functional description.
See section 2.3.3 for external circuit design-in.
Antennas
ANT1
81
I/O
Primary antenna
Main Tx / Rx antenna interface.
50 nominal characteristic impedance.
Antenna circuit affects the RF performance and application
device compliance with required certification schemes.
See section 1.7 for functional description / requirements.
See section 2.4 for external circuit design-in.
ANT2
87
I
Secondary antenna
Rx only for MIMO 2x2 and Rx diversity.
50 nominal characteristic impedance.
Antenna circuit affects the RF performance and application
device compliance with required certification schemes.
See section 1.7 for functional description / requirements
See section 2.4 for external circuit design-in.
ANT_DET
75
I
Antenna detection
Note: antenna detection not supported by TOBY-L2x0-00S.
See section 1.7.2 for functional description.
See section 2.4.2 for external circuit design-in.

TOBY-L2 and MPCI-L2 series - System Integration Manual
UBX-13004618 - R04 Advance Information System description
Page 13 of 141
Function
Pin Name
Pin No
I/O
Description
Remarks
SIM
VSIM
59
O
SIM supply output
VSIM = 1.8 V / 3 V automatically generated according to
the connected SIM type.
See section 1.8 for functional description.
See section 2.5 for external circuit design-in.
SIM_IO
57
I/O
SIM data
Data input/output for 1.8 V / 3 V SIM
Internal 4.7 kpull-up to VSIM.
See section 1.8 for functional description.
See section 2.5 for external circuit design-in.
SIM_CLK
56
O
SIM clock
3.25 MHz clock output for 1.8 V / 3 V SIM
See section 1.8 for functional description.
See section 2.5 for external circuit design-in.
SIM_RST
58
O
SIM reset
Reset output for 1.8 V / 3 V SIM
See section 1.8 for functional description.
See section 2.5 for external circuit design-in.
USB
VUSB_DET
4
I
USB detect input
Input for VBUS (5 V typical) USB supply sense.
See section 1.9.1 for functional description.
See section 2.6.1 for external circuit design-in.
USB_D-
27
I/O
USB Data Line D-
USB interface for AT commands, data communication,
FOAT, FW update by u-blox EasyFlash tool and diagnostic.
90 nominal differential impedance (Z0)
30 nominal common mode impedance (ZCM)
Pull-up or pull-down resistors and external series resistors
as required by the USB 2.0 specifications [4] are part of the
USB pad driver and need not be provided externally.
See section 1.9.1 for functional description.
See section 2.6.1 for external circuit design-in.
USB_D+
28
I/O
USB Data Line D+
USB interface for AT commands, data communication,
FOAT, FW update by u-blox EasyFlash tool and diagnostic.
90 nominal differential impedance (Z0)
30 nominal common mode impedance (ZCM)
Pull-up or pull-down resistors and external series resistors
as required by the USB 2.0 specifications [4] are part of the
USB pad driver and need not be provided externally.
See section 1.9.1 for functional description.
See section 2.6.1 for external circuit design-in.
UART
RXD
17
O
UART data output
Note: UART not supported by TOBY-L2x0-00S.
1.8 V output, Circuit 104 (RXD) in ITU-T V.24,
for AT command, data communication, FOAT.
Add Test-Point and series 0 to access for diagnostic.
See section 1.9.2 for functional description.
See section 2.6.2 for external circuit design-in.
TXD
16
I
UART data input
Note: UART not supported by TOBY-L2x0-00S.
1.8 V input, Circuit 103 (TXD) in ITU-T V.24,
for AT command, data communication, FOAT.
Add Test-Point and series 0 to access for diagnostic.
See section 1.9.2 for functional description.
See section 2.6.2 for external circuit design-in.
CTS
15
O
UART clear to send
output
Note: UART not supported by TOBY-L2x0-00S.
1.8 V output, Circuit 106 (CTS) in ITU-T V.24.
Add Test-Point and series 0 to access for diagnostic.
See section 1.9.2 for functional description.
See section 2.6.2 for external circuit design-in.
RTS
14
I
UART ready to send
input
Note: UART not supported by TOBY-L2x0-00S.
1.8 V input, Circuit 105 (RTS) in ITU-T V.24.
Add Test-Point and series 0 to access for diagnostic.
See section 1.9.2 for functional description.
See section 2.6.2 for external circuit design-in.

TOBY-L2 and MPCI-L2 series - System Integration Manual
UBX-13004618 - R04 Advance Information System description
Page 14 of 141
Function
Pin Name
Pin No
I/O
Description
Remarks
DSR
10
O /
I/O
UART data set ready
output / GPIO
Note: UART / GPIO not supported by TOBY-L2x0-00S.
1.8 V, Circuit 107 in ITU-T V.24, configurable as GPIO.
Add Test-Point and series 0 to access for diagnostic.
See section 1.9.2 and 1.11 for functional description.
See section 2.6.2 and 2.8 for external circuit design-in.
RI
11
O /
I/O
UART ring indicator
output / GPIO
Note: UART / GPIO not supported by TOBY-L2x0-00S.
1.8 V, Circuit 125 in ITU-T V.24, configurable as GPIO.
Add Test-Point and series 0 to access for diagnostic.
See section 1.9.2 and 1.11 for functional description.
See section 2.6.2 and 2.8 for external circuit design-in.
DTR
13
I /
I/O
UART data terminal
ready input / GPIO
Note: UART / GPIO not supported by TOBY-L2x0-00S.
1.8 V, Circuit 108/2 in ITU-T V.24, configurable as GPIO.
Add Test-Point and series 0 to access for diagnostic.
See section 1.9.2 and 1.11 for functional description.
See section 2.6.2 and 2.8 for external circuit design-in.
DCD
12
O /
I/O
UART data carrier
detect output / GPIO
Note: UART / GPIO not supported by TOBY-L2x0-00S.
1.8 V, Circuit 109 in ITU-T V.24, configurable as GPIO.
Add Test-Point and series 0 to access for diagnostic.
See section 1.9.2 and 1.11 for functional description.
See section 2.6.2 and 2.8 for external circuit design-in.
DDC
SCL
54
O
I2C bus clock line
Note: I2C not supported by TOBY-L2x0-00S.
1.8 V open drain, for communication with u-blox GNSS
receivers and other I2C-slave devices as an audio codec.
External pull-up required.
See section 1.9.3 for functional description.
See section 2.6.3 for external circuit design-in.
SDA
55
I/O
I2C bus data line
Note: I2C not supported by TOBY-L2x0-00S.
1.8 V open drain, for communication with u-blox GNSS
receivers and other I2C-slave devices as an audio codec.
External pull-up required.
See section 1.9.3 for functional description.
See section 2.6.3 for external circuit design-in.
SDIO
SDIO_D0
66
I/O
SDIO serial data [0]
Note: SDIO not supported by TOBY-L2x0-00S.
SDIO interface for communication with external Wi-Fi chip
See section 1.9.4 for functional description.
See section 2.6.4 for external circuit design-in.
SDIO_D1
68
I/O
SDIO serial data [1]
Note: Not supported by TOBY-L2x0-00S.
SDIO interface for communication with external Wi-Fi chip
See section 1.9.4 for functional description.
See section 2.6.4 for external circuit design-in.
SDIO_D2
63
I/O
SDIO serial data [2]
Note: SDIO not supported by TOBY-L2x0-00S.
SDIO interface for communication with external Wi-Fi chip
See section 1.9.4 for functional description.
See section 2.6.4 for external circuit design-in.
SDIO_D3
67
I/O
SDIO serial data [3]
Note: SDIO not supported by TOBY-L2x0-00S.
SDIO interface for communication with external Wi-Fi chip
See section 1.9.4 for functional description.
See section 2.6.4 for external circuit design-in.
SDIO_CLK
64
O
SDIO serial clock
Note: SDIO not supported by TOBY-L2x0-00S.
SDIO interface for communication with external Wi-Fi chip
See section 1.9.4 for functional description.
See section 2.6.4 for external circuit design-in.

TOBY-L2 and MPCI-L2 series - System Integration Manual
UBX-13004618 - R04 Advance Information System description
Page 15 of 141
Function
Pin Name
Pin No
I/O
Description
Remarks
SDIO_CMD
65
I/O
SDIO command
Note: SDIO not supported by TOBY-L2x0-00S.
SDIO interface for communication with external Wi-Fi chip
See section 1.9.4 for functional description.
See section 2.6.4 for external circuit design-in.
Audio
I2S_TXD
51
O /
I/O
I2S transmit data /
GPIO
Note: I2S and GPIO not supported by TOBY-L2x0-00S.
I2S transmit data output, alternatively configurable as GPIO.
See sections 1.10 and 1.11 for functional description.
See sections 2.7 and 2.8 for external circuit design-in.
I2S_RXD
53
I /
I/O
I2S receive data /
GPIO
Note: I2S and GPIO not supported by TOBY-L2x0-00S.
I2S receive data input, alternatively configurable as GPIO.
See sections 1.10 and 1.11 for functional description.
See sections 2.7 and 2.8 for external circuit design-in.
I2S_CLK
52
I/O /
I/O
I2S clock /
GPIO
Note: I2S and GPIO not supported by TOBY-L2x0-00S.
I2S serial clock, alternatively configurable as GPIO.
See sections 1.10 and 1.11 for functional description.
See sections 2.7 and 2.8 for external circuit design-in.
I2S_WA
50
I/O /
I/O
I2S word alignment /
GPIO
Note: I2S and GPIO not supported by TOBY-L2x0-00S.
I2S word alignment, alternatively configurable as GPIO.
Note: I2S not supported by TOBY-L2x0-00S.
See sections 1.10 and 1.11 for functional description.
See sections 2.7 and 2.8 for external circuit design-in.
GPIO
GPIO1
21
I/O
GPIO
Note: GPIO not supported by TOBY-L2x0-00S except for
Wireless Network status indication configured on GPIO1.
1.8 V GPIO with alternatively configurable functions
See section 1.11 for functional description.
See section 2.8 for external circuit design-in.
GPIO2
22
I/O
GPIO
Note: GPIO not supported by TOBY-L2x0-00S.
1.8 V GPIO with alternatively configurable functions
See section 1.11 for functional description.
See section 2.8 for external circuit design-in.
GPIO3
24
I/O
GPIO
Note: GPIO not supported by TOBY-L2x0-00S.
1.8 V GPIO with alternatively configurable functions
See section 1.11 for functional description.
See section 2.8 for external circuit design-in.
GPIO4
25
I/O
GPIO
Note: GPIO not supported by TOBY-L2x0-00S.
1.8 V GPIO with alternatively configurable functions
See section 1.11 for functional description.
See section 2.8 for external circuit design-in.
GPIO5
60
I/O
GPIO
Note: GPIO not supported by TOBY-L2x0-00S.
1.8 V GPIO with alternatively configurable functions
See section 1.11 for functional description.
See section 2.8 for external circuit design-in.
GPIO6
61
I/O
GPIO
Note: GPIO not supported by TOBY-L2x0-00S.
1.8 V GPIO
See section 1.11 for functional description.
See section 2.8 for external circuit design-in.
Reserved
RSVD
6
N/A
Reserved pin
This pin must be connected to ground.
See section 2.10
RSVD
1, 7-9, 18,
19, 29, 31,
33-43, 45,
47-49, 77,
84, 91
N/A
Reserved pin
Leave unconnected.
See section 2.10
Table 3: TOBY-L2 series module pin definition, grouped by function

TOBY-L2 and MPCI-L2 series - System Integration Manual
UBX-13004618 - R04 Advance Information System description
Page 16 of 141
1.3.2 MPCI-L2 series pin assignment
Table 4 lists the pin-out of the MPCI-L2 series modules, with pins grouped by function.
Function
Pin Name
Pin No
I/O
Description
Remarks
Power
3.3Vaux
2, 24, 39,
41, 52
I
Module supply input
3.3Vaux pins are internally connected each other.
3.3Vaux supply circuit affects the RF performance and
compliance of the device integrating the module with
applicable required certification schemes.
See section 1.5.1 for functional description and
requirements for the 3.3Vaux module supply.
See section 2.2.1 for external circuit design-in.
GND
4, 9, 15, 18,
21, 26, 27,
29, 34, 35,
37, 40, 43, 50
N/A
Ground
GND pins are internally connected each other.
External ground connection affects the RF and thermal
performance of the device.
See section 1.5.1 for functional description.
See section 2.2.1 for external circuit design-in.
Auxiliary
Signals
PERST#
22
I
External reset input
Internal 45 kpull-up to 3.3 V supply.
See section 1.6.3 for functional description.
See section 2.3.2 for external circuit design-in.
Antennas
ANT1
U.FL
I/O
Primary antenna
Main Tx / Rx antenna interface.
50 nominal characteristic impedance.
Antenna circuit affects the RF performance and
compliance of the device integrating the module with
applicable required certification schemes.
See section 1.7 for functional description / requirements.
See section 2.4 for external circuit design-in.
ANT2
U.FL
I
Secondary antenna
Rx only for MIMO 2x2 and Rx diversity.
50 nominal characteristic impedance.
Antenna circuit affects the RF performance and
compliance of the device integrating the module with
applicable required certification schemes.
See section 1.7 for functional description / requirements
See section 2.4 for external circuit design-in.
SIM
UIM_PWR
8
O
SIM supply output
UIM_PWR = 1.8 V / 3 V automatically generated
according to the connected SIM type.
See section 1.8 for functional description.
See section 2.5 for external circuit design-in.
UIM_DATA
10
I/O
SIM data
Data input/output for 1.8 V / 3 V SIM
Internal 4.7 kpull-up to UIM_PWR.
See section 1.8 for functional description.
See section 2.5 for external circuit design-in.
UIM_CLK
12
O
SIM clock
3.25 MHz clock output for 1.8 V / 3 V SIM
See section 1.8 for functional description.
See section 2.5 for external circuit design-in.
UIM_RESET
14
O
SIM reset
Reset output for 1.8 V / 3 V SIM
See section 1.8 for functional description.
See section 2.5 for external circuit design-in.

TOBY-L2 and MPCI-L2 series - System Integration Manual
UBX-13004618 - R04 Advance Information System description
Page 17 of 141
Function
Pin Name
Pin No
I/O
Description
Remarks
USB
USB_D-
36
I/O
USB Data Line D-
USB interface for AT commands, data communication,
FOAT, FW update by u-blox EasyFlash tool and diagnostic.
90 nominal differential impedance (Z0)
30 nominal common mode impedance (ZCM)
Pull-up or pull-down resistors and external series resistors
as required by the USB 2.0 specifications [4] are part of the
USB pad driver and need not be provided externally.
See section 1.9.1 for functional description.
See section 2.6.1 for external circuit design-in.
USB_D+
38
I/O
USB Data Line D+
USB interface for AT commands, data communication,
FOAT, FW update by u-blox EasyFlash tool and diagnostic.
90 nominal differential impedance (Z0)
30 nominal common mode impedance (ZCM)
Pull-up or pull-down resistors and external series resistors
as required by the USB 2.0 specifications [4] are part of the
USB pad driver and need not be provided externally.
See section 1.9.1 for functional description.
See section 2.6.1 for external circuit design-in.
Specific
Signals
LED_WWAN#
42
O
LED indicator output
Open drain active low output.
See section 1.12 for functional description.
See section 2.9 for external circuit design-in.
W_DISABLE#
20
I
Wireless radio
disable input
Internal 22 kpull-up to 3.3Vaux.
See section 1.12 for functional description.
See section 2.9 for external circuit design-in.
Not
Connected
NC
1, 3, 5-7, 11,
13, 16, 17, 19,
23, 25, 28,
30-33, 44-46,
47-49, 51
N/A
Not connected
Internally not connected.
See section 1.14 for the description.
Table 4: MPCI-L2 series module pin definition, grouped by function

TOBY-L2 and MPCI-L2 series - System Integration Manual
UBX-13004618 - R04 Advance Information System description
Page 18 of 141
1.4 Operating modes
TOBY-L2 and MPCI-L2 series modules have several operating modes. The operating modes are defined in Table 5
and described in detail in Table 6, providing general guidelines for operation.
General Status
Operating Mode
Definition
Power-down
Not-Powered Mode
VCC or 3.3Vaux supply not present or below operating range: module is switched off.
Power-Off Mode
VCC or 3.3Vaux supply within operating range and module is switched off.
Normal Operation
Idle-Mode
Module processor core runs with 32 kHz reference generated by the internal oscillator.
Active-Mode
Module processor core runs with 26 MHz reference generated by the internal oscillator.
Connected-Mode
RF Tx/Rx data connection enabled and processor core runs with 26 MHz reference.
Table 5: TOBY-L2 and MPCI-L2 series modules operating modes definition
Operating Mode
Description
Transition between operating modes
Not-Powered Mode
Module is switched off.
Application interfaces are not accessible.
When VCC or 3.3Vaux supply is removed, the modules
enter not-powered mode.
When in not-powered mode, TOBY-L2 modules cannot be
switched on by PWR_ON, RESET_N or RTC alarm and
enter active-mode after applying VCC supply (see 1.6.1).
When in not-powered mode, MPCI-L2 modules cannot be
switched on by RTC alarm and enter active-mode after
applying 3.3Vaux supply (see 1.6.1).
Power-Off Mode
Module is switched off: normal shutdown by an
appropriate power-off event (see 1.6.2).
Application interfaces are not accessible.
MPCI-L2 modules do not support Power-Off Mode
but halt mode (see 1.6.2 and u-blox AT Commands
Manual [3], AT+CFUN=127 command).
When the modules are switched off by an appropriate
power-off event (see 1.6.2), the modules enter power-off
mode from active-mode.
When in power-off mode, TOBY-L2 modules can be
switched on by PWR_ON, RESET_N or an RTC alarm.
When in power-off mode, TOBY-L2 modules enter the
not-powered mode after removing VCC supply.
Idle-Mode
Module is switched on with application interfaces
disabled or suspended: the module is temporarily not
ready to communicate with an external device by
means of the application interfaces as configured to
reduce the current consumption.
The module enters the low power idle-mode
whenever possible if power saving is enabled by
AT+UPSV (see u-blox AT Commands Manual [3])
reducing current consumption (see 1.5.1.5).
Power saving configuration is not enabled by default:
it can be enabled by the AT+UPSV command (see
the u-blox AT Commands Manual [3]).
The modules automatically switch from active-mode to low
power idle-mode whenever possible if power saving is
enabled (see sections 1.5.1.5, 1.9.1.4, 1.9.2.4 and u-blox
AT Commands Manual [3], AT+UPSV).
The modules wake up from idle-mode to active-mode in
the following events:
Automatic periodic monitoring of the paging channel
for the paging block reception according to network
conditions (see 1.5.1.5)
The connected USB host forces a remote wakeup of
the module as USB device (see 1.9.1.4)
A preset RTC alarm occurs (see u-blox AT Commands
Manual [3], AT+CALA)
Active-Mode
Module is switched on with application interfaces
enabled or not suspended: the module is ready to
communicate with an external device by means of
the application interfaces unless power saving
configuration is enabled by AT+UPSV (see 1.9.1.4,
1.9.2.4 and u-blox AT Commands Manual [3]).
When the modules are switched on by an appropriate
power-on event (see 1.6.1), the module enter active-mode
from power-off mode.
If power saving configuration is enabled by the AT+UPSV
command, the module automatically switches from active
to idle-mode whenever possible and the module wakes up
from idle to active-mode in the events listed above (see
idle-mode to active-mode transition description above).
When a RF Tx/Rx data connection is initiated or when RF
Tx/Rx is required due to a connection previously initiated,
the module switches from active to connected-mode.

TOBY-L2 and MPCI-L2 series - System Integration Manual
UBX-13004618 - R04 Advance Information System description
Page 19 of 141
Operating Mode
Description
Transition between operating modes
Connected-Mode
RF Tx/Rx data connection is in progress.
The module is prepared to accept data signals from
an external device unless power saving configuration
is enabled by AT+UPSV (see sections 1.9.1.4, 1.9.2.4
and u-blox AT Commands Manual [3]).
When a data connection is initiated, the module enters
connected-mode from idle-mode.
If power saving configuration is enabled by the AT+UPSV
command, the module automatically switches from
connected to active and then idle-mode whenever possible
and the module wakes up from idle to active and then
connected mode if RF Transmission/Reception is necessary.
When a data connection is terminated, the module returns
to the active-mode.
Table 6: TOBY-L2 and MPCI-L2 series modules operating modes description
Figure 3 describes the transition between the different operating modes.
TOBY-L2 Switch ON:
•Apply VCC
MPCI-L2 Switch ON:
•Apply 3.3Vaux
If power saving is enabled
and there is no activity for
a defined time interval
Any wake up event described
in the module operating
modes summary table above
Incoming/outgoing call or
other dedicated device
network communication
No RF Tx/Rx in progress,
Call terminated,
Communication dropped
TOBY-L2x0
Switch ON:
•PWR_ON
•RESET_N
•RTC alarm
Not
powered
Power off
ActiveConnected Idle
TOBY-L2x0
Switch OFF:
•AT+CPWROFF
•RESET_N
MPCI-L2:
•Remove 3.3Vaux
TOBY-L2:
•Remove VCC
Figure 3: TOBY-L2 and MPCI-L2 series modules operating modes transition

TOBY-L2 and MPCI-L2 series - System Integration Manual
UBX-13004618 - R04 Advance Information System description
Page 20 of 141
1.5 Supply interfaces
1.5.1 Module supply input (VCC or 3.3Vaux)
TOBY-L2 modules are supplied via the three VCC pins, and MPCI-L2 modules are supplied via the five 3.3Vaux
pins. All supply voltages used inside the modules are generated from the VCC or the 3.3Vaux supply input by
integrated voltage regulators, including the V_BCKP RTC supply, the V_INT generic digital interface supply, and
the VSIM or UIM_PWR SIM interface supply.
The current drawn by the TOBY-L2 and MPCI-L2 series modules through the VCC or 3.3Vaux pins can vary by
several orders of magnitude depending on radio access technology, operation mode and state. It is important
that the supply source is able to support both the high peak of current consumption during 2G transmission at
maximum RF power level (as described in the section 1.5.1.2) and the high average current consumption during
3G and LTE transmission at maximum RF power level (as described in the sections 1.5.1.3 and 1.5.1.4).
1.5.1.1 VCC or 3.3Vaux supply requirements
Table 7 summarizes the requirements for the VCC or 3.3Vaux modules supply. See section 2.2.1 for suggestions
to properly design a VCC or 3.3Vaux supply circuit compliant with the requirements listed in Table 7.
The supply circuit affects the RF compliance of the device integrating TOBY-L2 and MPCI-L2
series modules with applicable required certification schemes as well as antenna circuit design.
Compliance is guaranteed if the requirements summarized in the Table 7 are fulfilled.
Item
Requirement
Remark
VCC or 3.3Vaux
nominal voltage
Within VCC or 3.3Vaux normal operating range:
See “Supply/Power pins” section in the TOBY-L2 Data
Sheet [1] or in the MPCI-L2 Data Sheet [2].
The modules cannot be switched on if the supply voltage
is below the normal operating range minimum limit.
VCC or 3.3Vaux
voltage during
normal operation
Within VCC or 3.3Vaux extended operating range:
See “Supply/Power pins” section in the TOBY-L2 Data
Sheet [1] or in the MPCI-L2 Data Sheet [2].
The modules may switch off if the supply voltage drops
below the extended operating range minimum limit.
VCC or 3.3Vaux
average current
Support with adequate margin the highest averaged
current consumption value in connected-mode
conditions specified for VCC in TOBY-L2 Data Sheet [1]
or specified for 3.3Vaux in MPCI-L2 Data Sheet [2].
The maximum average current consumption can be
greater than the specified value according to the actual
antenna mismatching, temperature and supply voltage.
Sections 1.5.1.2, 1.5.1.3 and 1.5.1.4 describe current
consumption profiles in 2G, 3G and LTE connected-mode.
VCC or 3.3Vaux
peak current
Support with margin the highest peak current
consumption value in 2G connected-mode conditions
specified for VCC in TOBY-L2 Data Sheet [1] or
specified for 3.3Vaux in MPCI-L2 Data Sheet [2].
The specified maximum peak of current consumption
occurs during GSM single transmit slot in 850/900 MHz
connected-mode, in case of mismatched antenna.
Section 1.5.1.2 describes 2G Tx peak/pulse current.
VCC or 3.3Vaux
voltage drop during
2G Tx slots
Lower than 400 mV
Supply voltage drop values greater than recommended
during 2G TDMA transmission slots directly affect the RF
compliance with applicable certification schemes.
Figure 5 describes supply voltage drop during 2G Tx slots.
VCC or 3.3Vaux
voltage ripple during
RF transmission
Noise in the supply has to be minimized
High supply voltage ripple values during LTE/3G/2G RF
transmissions in connected-mode directly affect the RF
compliance with applicable certification schemes.
Figure 5 describes supply voltage ripple during RF Tx.
VCC or 3.3Vaux
under/over-shoot at
start/end of Tx slots
Absent or at least minimized
Supply voltage under-shoot or over-shoot at the start or
the end of 2G TDMA transmission slots directly affect the
RF compliance with applicable certification schemes.
Figure 5 describes supply voltage under/over-shoot
Table 7: Summary of VCC or 3.3Vaux modules supply requirements