SARA-R5 series - System integration manual
UBX-19041356 - R04 Contents Page 4 of 118
C1-Public
2.4.2 Cellular antenna RF interface (ANT).............................................................................................59
2.4.3 GNSS antenna RF interface (ANT_GNSS)...................................................................................65
2.4.4 Cellular and GNSS RF coexistence................................................................................................69
2.4.5 Cellular antenna detection interface (ANT_DET) ...................................................................... 72
2.4.6 Cellular antenna dynamic tuning control interface ...................................................................74
2.5 SIM interface..............................................................................................................................................76
2.5.1 Guidelines for SIM circuit design ...................................................................................................76
2.5.2 Guidelines for SIM layout design .................................................................................................. 80
2.6 Data communication interfaces ............................................................................................................ 81
2.6.1 UART interfaces................................................................................................................................ 81
2.6.2 USB interface.....................................................................................................................................88
2.6.3 SPI interfaces ....................................................................................................................................88
2.6.4 SDIO interface ...................................................................................................................................89
2.6.5 DDC (I2C) interface...........................................................................................................................89
2.7 Audio............................................................................................................................................................ 91
2.8 General purpose input / output (GPIO) .................................................................................................92
2.8.1 Guidelines for GPIO circuit design .................................................................................................92
2.8.2 Guidelines for general purpose input/output layout design ....................................................93
2.9 Reserved pin (RSVD) ................................................................................................................................93
2.10 Module placement ....................................................................................................................................93
2.11 Module footprint and paste mask .........................................................................................................94
2.12 Schematic for SARA-R5 series module integration ..........................................................................95
2.13 Design-in checklist....................................................................................................................................96
2.13.1 Schematic checklist.........................................................................................................................96
2.13.2 Layout checklist................................................................................................................................97
2.13.3 Antennas checklist...........................................................................................................................97
3Handling and soldering ..................................................................................................................... 98
3.1 Packaging, shipping, storage and moisture preconditioning ..........................................................98
3.2 Handling ......................................................................................................................................................98
3.3 Soldering .....................................................................................................................................................99
3.3.1 Soldering paste .................................................................................................................................99
3.3.2 Reflow soldering................................................................................................................................99
3.3.3 Optical inspection...........................................................................................................................100
3.3.4 Cleaning ............................................................................................................................................100
3.3.5 Repeated reflow soldering .............................................................................................................101
3.3.6 Wave soldering.................................................................................................................................101
3.3.7 Hand soldering .................................................................................................................................101
3.3.8 Rework ...............................................................................................................................................101
3.3.9 Conformal coating ...........................................................................................................................101
3.3.10 Casting...............................................................................................................................................101
3.3.11 Grounding metal covers ................................................................................................................ 102
3.3.12 Use of ultrasonic processes ......................................................................................................... 102