
EVA-8M and EVA-M8 series - Hardware Integration Manual
UBX-16010593 - R06 Page 4 of 47
Early Production Information
2.12Migration considerations ........................................................................................................................22
2.12.1 Hardware migration from EVA-7M to EVA-8M / EVA-M8M / EVA-M8Q ..............................22
2.12.2 C88-M8M - Evaluating EVA-M8M on existing NEO-xM sockets............................................24
2.13EOS/ESD/EMI precautions......................................................................................................................25
2.13.1 Electrostatic Discharge (ESD) .......................................................................................................26
2.13.2 ESD protection measures...............................................................................................................26
2.13.3 Electrical Overstress (EOS) ............................................................................................................26
2.13.4 EOS protection measures...............................................................................................................26
2.13.5 Electromagnetic interference (EMI) .............................................................................................27
2.13.6 Applications with cellular modules ...............................................................................................27
3Product handling & soldering.......................................................................................................... 30
3.1 Packaging, shipping, storage and moisture preconditioning ..........................................................30
3.2 ESD handling precautions.......................................................................................................................30
3.3 Soldering .....................................................................................................................................................30
3.3.1 Soldering paste .................................................................................................................................30
3.3.2 Reflow soldering................................................................................................................................31
3.3.3 Optical inspection.............................................................................................................................31
3.3.4 Repeated reflow soldering ..............................................................................................................31
3.3.5 Wave soldering..................................................................................................................................31
3.3.6 Rework ................................................................................................................................................31
3.3.7 Use of ultrasonic processes ...........................................................................................................31
4Product testing ................................................................................................................................... 32
4.1 Test parameters for OEM manufacturer.............................................................................................32
4.2 System sensitivity test............................................................................................................................32
4.2.1 Guidelines for sensitivity tests ......................................................................................................32
4.2.2‘Go/No go’ tests for integrated devices........................................................................................32
Appendix ....................................................................................................................................................... 33
AReference schematics....................................................................................................................... 33
A.1 Cost optimized circuit..............................................................................................................................33
A.2 Best performance circuit with passive antenna.................................................................................34
A.3 Improved jamming immunity with passive antenna .........................................................................35
A.4 Circuit using active antenna...................................................................................................................36
A.5 USB self-powered circuit with passive antenna .................................................................................37
A.6 USB bus-powered circuit with passive antenna .................................................................................38
A.7 Circuit using 2-pin antenna supervisor ................................................................................................39
A.8 Circuit using 3-pin antenna supervisor ................................................................................................40
BComponent selection ........................................................................................................................ 41
B.1 External RTC (Y1)......................................................................................................................................41
B.2 RF band-pass filter (F1)...........................................................................................................................41
B.3 External LNA protection filter (F2)........................................................................................................42
B.4 USB line protection (D2) ..........................................................................................................................42
B.5 USB LDO (U1).............................................................................................................................................42