VIPA System 300S User manual

SM-AIO | | Manual
HB140 | SM-AIO | | GB | Rev. 16-39
VIPA System 300S
Analog signal modules - SM 33x(S)

300S_SM-AIO,4,GB - © 2016
VIPA GmbH
Ohmstr. 4
91074 Herzogenaurach
Telephone: [phone]
Fax: [phone]
Email: [email protected]
Internet: www.vipa.com

Table of contents
1 Basics....................................................................................... 5
1.1 Copyright © VIPA GmbH ................................................... 5
1.2 Über dieses Handbuch....................................................... 6
1.3 Safety information.............................................................. 7
2 Assembly and installation guidelines.................................... 9
2.1 Safety information for users............................................... 9
2.2 Overview............................................................................ 9
2.3 Installation dimensions..................................................... 10
2.4 Assembly SPEED-Bus..................................................... 12
2.5 Assembly standard bus.................................................... 15
2.6 Cabling............................................................................. 17
2.7 Installation guidelines....................................................... 20
2.8 General data I/O modules................................................ 23
2.8.1 General data................................................................. 23
3 Analog Input Modules............................................................ 26
3.1 Principles.......................................................................... 26
3.2 Parameterization - Basics................................................ 27
3.2.1 Parameterization by hardware configuration................. 27
3.2.2 Parameterization during runtime................................... 27
3.3 331-1KF01 - AI 8x13Bit ................................................... 30
3.3.1 331-1KF01 - AI 8x13Bit - Parameterization.................. 34
3.3.2 331-1KF01 - Technical data.......................................... 40
3.4 331-7Kx01 - AI 8(2)x12Bit ............................................... 45
3.4.1 Connection of sensors ................................................. 48
3.4.2 331-7Kx01 - AI 8(2)x12Bit - Parameterization.............. 53
3.4.3 331-7Kx01 - AI 8(2)x12Bit - Diagnostics....................... 61
3.4.4 331-7KB01 - Technical data.......................................... 66
3.4.5 331-7KF01 - Technical data.......................................... 73
4 Analog Output Modules......................................................... 80
4.1 General............................................................................ 80
4.2 Connecting loads and actuators....................................... 80
4.3 Analog value representation............................................ 82
4.4 Parameterization - Basics................................................ 82
4.4.1 Parameterization by hardware configuration................. 82
4.4.2 Parameterization during run time by means of SFCs... 83
4.5 Diagnostics ...................................................................... 86
4.6 332-5HB01 - AO 2/4x12Bit U/I 2-channel........................ 90
4.6.1 Technical data............................................................... 93
4.7 332-5HD01 - AO 2/4x12Bit U/I 4-channel........................ 96
4.7.1 Technical data............................................................... 99
4.8 332-5HD50 - AO 4x12Bit I for manual operation........... 102
4.8.1 Manual operation........................................................ 105
4.8.2 Technical data............................................................. 106
4.9 332-5HD60 - AO 4x12Bit U for manual operation.......... 109
VIPA System 300S Table of contents
HB140 | SM-AIO | | GB | Rev. 16-39 3

4.9.1 Manual operation......................................................... 111
4.9.2 Technical data.............................................................. 112
5 Analog I/O Modules.............................................................. 115
5.1 General........................................................................... 115
5.2 Analog value representation........................................... 115
5.3 Parameterization............................................................ 118
5.3.1 Parameterization by hardware configuration............... 118
5.3.2 Parameterization during run time by means of SFCs.. 119
5.4 334-0KE00 - AI 4/AO 2x12Bit ....................................... 120
5.4.1 Technical data............................................................. 121
6 Analog I/O Modules FAST - SPEED-Bus............................ 128
6.1 General.......................................................................... 128
6.2 Analog value representation.......................................... 129
6.3 Operating modes............................................................ 130
6.4 Addressing at SPEED-Bus............................................. 131
6.5 Project engineering........................................................ 132
6.5.1 Fast introduction.......................................................... 132
6.5.2 Preconditions.............................................................. 132
6.5.3 Steps of project engineering....................................... 133
6.6 Parameterization............................................................ 135
6.6.1 Structure of the parameter bytes................................. 136
6.7 SFC 193 - Oscilloscope-/FIFO function ........................ 140
6.8 Example for the Oscilloscope function........................... 144
6.8.1 Example for the FIFO function.................................... 146
6.9 Diagnostics..................................................................... 150
6.9.1 Process interrupts....................................................... 152
6.10 331-7AF70 - AI 8x16Bit I ............................................. 153
6.10.1 Technical data........................................................... 156
6.11 331-7BF70 - AI 8x16Bit U............................................. 159
6.11.1 Technical data............................................................ 161
VIPA System 300STable of contents
HB140 | SM-AIO | | GB | Rev. 16-39 4

1 Basics
1.1 Copyright © VIPA GmbH
This document contains proprietary information of VIPA and is not to
be disclosed or used except in accordance with applicable agree-
ments.
This material is protected by the copyright laws. It may not be repro-
duced, distributed, or altered in any fashion by any entity (either
internal or external to VIPA), except in accordance with applicable
agreements, contracts or licensing, without the express written con-
sent of VIPA and the business management owner of the material.
For permission to reproduce or distribute, please contact: VIPA,
Gesellschaft für Visualisierung und Prozessautomatisierung mbH
Ohmstraße 4, D-91074 Herzogenaurach, Germany
Tel.: [phone]
Fax.: [phone]
EMail: [email protected]
http://www.vipa.com
Every effort has been made to ensure that the informa-
tion contained in this document was complete and
accurate at the time of publishing. Nevertheless, the
authors retain the right to modify the information.
This customer document describes all the hardware
units and functions known at the present time. Descrip-
tions may be included for units which are not present at
the customer site. The exact scope of delivery is
described in the respective purchase contract.
Hereby, VIPA GmbH declares that the products and systems are in
compliance with the essential requirements and other relevant provi-
sions. Conformity is indicated by the CE marking affixed to the
product.
For more information regarding CE marking and Declaration of Con-
formity (DoC), please contact your local VIPA customer service
organization.
All Rights Reserved
CE Conformity Declara-
tion
Conformity Information
VIPA System 300S Basics
Copyright © VIPA GmbH
HB140 | SM-AIO | | GB | Rev. 16-39 5

VIPA, SLIO, System 100V, System 200V, System 300V, System
300S, System 400V, System 500S and Commander Compact are
registered trademarks of VIPA Gesellschaft für Visualisierung und
Prozessautomatisierung mbH.
SPEED7 is a registered trademark of profichip GmbH.
SIMATIC, STEP, SINEC, TIA Portal, S7-300 and S7-400 are regis-
tered trademarks of Siemens AG.
Microsoft and Windows are registered trademarks of Microsoft Inc.,
USA.
Portable Document Format (PDF) and Postscript are registered trade-
marks of Adobe Systems, Inc.
All other trademarks, logos and service or product marks specified
herein are owned by their respective companies.
Contact your local VIPA Customer Service Organization representa-
tive if you wish to report errors or questions regarding the contents of
this document. If you are unable to locate a customer service centre,
contact VIPA as follows:
VIPA GmbH, Ohmstraße 4, 91074 Herzogenaurach, Germany
Telefax: [phone]
EMail: [email protected]
Contact your local VIPA Customer Service Organization representa-
tive if you encounter problems with the product or have questions
regarding the product. If you are unable to locate a customer service
centre, contact VIPA as follows:
VIPA GmbH, Ohmstraße 4, 91074 Herzogenaurach, Germany
Tel.: [phone] (Hotline)
EMail: [email protected]
1.2 Über dieses Handbuch
The manual is targeted at users who have a background in automa-
tion technology.
The manual consists of chapters. Every chapter provides a self-con-
tained description of a specific topic.
The following guides are available in the manual:
nAn overall table of contents at the beginning of the manual
nReferences with page numbers
Trademarks
Information product
support
Technical support
Target audience
Structure of the manual
Guide to the document
VIPA System 300SBasics
Über dieses Handbuch
HB140 | SM-AIO | | GB | Rev. 16-39 6

The manual is available in:
nprinted form, on paper
nin electronic form as PDF-file (Adobe Acrobat Reader)
Important passages in the text are highlighted by following icons and
headings:
DANGER!
Immediate or likely danger. Personal injury is possible.
CAUTION!
Damages to property is likely if these warnings are not
heeded.
Supplementary information and useful tips.
1.3 Safety information
The system is constructed and produced for:
ncommunication and process control
ngeneral control and automation tasks
nindustrial applications
noperation within the environmental conditions specified in the
technical data
ninstallation into a cubicle
DANGER!
This device is not certified for applications in
– in explosive environments (EX-zone)
The manual must be available to all personnel in the
nproject design department
ninstallation department
ncommissioning
noperation
Availability
Icons Headings
Applications con-
forming with specifica-
tions
Documentation
VIPA System 300S Basics
Safety information
HB140 | SM-AIO | | GB | Rev. 16-39 7

CAUTION!
The following conditions must be met before using
or commissioning the components described in
this manual:
– Hardware modifications to the process control
system should only be carried out when the system
has been disconnected from power!
–Installation and hardware modifications only by
properly trained personnel.
– The national rules and regulations of the respective
country must be satisfied (installation, safety,
EMC ...)
National rules and regulations apply to the disposal of the unit!Disposal
VIPA System 300SBasics
Safety information
HB140 | SM-AIO | | GB | Rev. 16-39 8

2 Assembly and installation guidelines
2.1 Safety information for users
VIPA modules make use of highly integrated components in MOS-
Technology. These components are extremely sensitive to over-vol-
tages that can occur during electrostatic discharges. The following
symbol is attached to modules that can be destroyed by electrostatic
discharges.
The Symbol is located on the module, the module rack or on packing
material and it indicates the presence of electrostatic sensitive equip-
ment. It is possible that electrostatic sensitive equipment is destroyed
by energies and voltages that are far less than the human threshold
of perception. These voltages can occur where persons do not dis-
charge themselves before handling electrostatic sensitive modules
and they can damage components thereby, causing the module to
become inoperable or unusable. Modules that have been damaged
by electrostatic discharges can fail after a temperature change,
mechanical shock or changes in the electrical load. Only the conse-
quent implementation of protection devices and meticulous attention
to the applicable rules and regulations for handling the respective
equipment can prevent failures of electrostatic sensitive modules.
Modules must be shipped in the original packing material.
When you are conducting measurements on electrostatic sensitive
modules you should take the following precautions:
nFloating instruments must be discharged before use.
nInstruments must be grounded.
Modifying electrostatic sensitive modules you should only use sol-
dering irons with grounded tips.
CAUTION!
Personnel and instruments should be grounded when
working on electrostatic sensitive modules.
2.2 Overview
While the standard peripheral modules are plugged-in at the right side
of the CPU, the SPEED-Bus peripheral modules are connected via a
SPEED-Bus bus connector at the left side of the CPU. VIPA delivers
profile rails with integrated SPEED-Bus for 2, 6 or 10 SPEED-Bus
peripheral modules with different lengths.
Handling of electro-
static sensitive modules
Shipping of modules
Measurements and
alterations on electro-
static sensitive modules
General
VIPA System 300S Assembly and installation guidelines
Overview
HB140 | SM-AIO | | GB | Rev. 16-39 9

The single modules are directly installed on a profile rail and con-
nected via the backplane bus coupler. Before installing the modules
you have to clip the backplane bus coupler to the module from the
backside. The backplane bus couplers are included in the delivery of
the peripheral modules.
With SPEED-Bus the bus connection happens via a SPEED-Bus rail
integrated in the profile rail at the left side of the CPU. Due to the par-
allel SPEED-Bus not all slots must be occupied in sequence.
At slot (SLOT 1 DCDC) you may plug either a SPEED-Bus module or
an additional power supply.
You may assemble the System 300 horizontally, vertically or lying.
Please regard the allowed environment temperatures:
nhorizontal assembly: from 0 to 60°C
nvertical assembly: from 0 to 40°C
nlying assembly: from 0 to 40°C
2.3 Installation dimensions
1tier width (WxHxD) in mm: 40 x 125 x 120
Serial Standard bus
Parallel SPEED-Bus
SLOT 1 for additional
power supply
Assembly possibilities
Dimensions Basic
enclosure
VIPA System 300SAssembly and installation guidelines
Installation dimensions
HB140 | SM-AIO | | GB | Rev. 16-39 10

Dimensions
Installation dimensions
VIPA System 300S Assembly and installation guidelines
Installation dimensions
HB140 | SM-AIO | | GB | Rev. 16-39 11

2.4 Assembly SPEED-Bus
For the deployment of SPEED-Bus modules, a pre-manufactured
SPEED-Bus rail is required. This is available mounted on a profile rail
with 2, 6 or 10 extension slots.
Order
number
Number of modules
SPEED-Bus/Standard
bus
A B C D E
391-1AF10 2/6 530 100 268 510 10
391-1AF30 6/2 530 100 105 510 10
391-1AF50 10/0 530 20 20 510 10
391-1AJ10 2/15 830 22 645 800 15
391-1AJ30 6/11 830 22 480 800 15
391-1AJ50 10/7 830 22 320 800 15
Measures in mm
Pre-manufactured
SPEED-Bus profile rail
Dimensions
VIPA System 300SAssembly and installation guidelines
Assembly SPEED-Bus
HB140 | SM-AIO | | GB | Rev. 16-39 12

1. Bolt the profile rail with the background (screw size: M6), so that
you still have minimum 65mm space above and 40mm below
the profile rail. Please look for a low-impedance connection
between profile rail and background.
2. Connect the profile rail with the protected earth conductor. The
minimum cross-section of the cable to the protected earth con-
ductor has to be 10mm2.
1. Dismantle the according protection flaps of the SPEED-Bus slot
with a screw driver (open and pull down).
For the SPEED-Bus is a parallel bus, not every SPEED-Bus slot
must be used in series. Leave the protection flap installed at an
unused SPEED-Bus slot.
2. At deployment of a DC 24V power supply, install it at the shown
position at the profile rail at the left side of the SPEED-Bus and
push it to the left to the isolation bolt of the profile rail.
3. Fix the power supply by screwing.
Installation of the pro-
file rail
Installation SPEED-Bus
module
VIPA System 300S Assembly and installation guidelines
Assembly SPEED-Bus
HB140 | SM-AIO | | GB | Rev. 16-39 13

4. To connect the SPEED-Bus modules, plug it between the trian-
gular positioning helps to a slot marked with "SLOT ..." and pull
it down.
5. Only the "SLOT1 DCDC" allows you to plug-in either a SPEED-
Bus module or an additional power supply.
6. Fix the CPU by screwing.
1. To deploy the SPEED7-CPU exclusively at the SPEED-Bus,
plug it between the triangular positioning helps to the slot
marked with "CPU SPEED7" and pull it down.
2. Fix the CPU by screwing.
1. If also standard modules shall be plugged, take a bus coupler
and click it at the CPU from behind like shown in the picture.
Plug the CPU between the triangular positioning helps to the slot
marked with "CPU SPEED7" and pull it down.
2. Plug the CPU between the triangular positioning helps to the
plug-in location marked with "CPU SPEED7" and pull it down.
Fix the CPU by screwing.
Repeat this procedure with the peripheral modules, by clicking a
backplane bus coupler, stick the module right from the modules
you've already fixed, click it downwards and connect it with the
backplane bus coupler of the last module and bolt it.
Installation CPU without
Standard-Bus-Modules
Installation CPU with
Standard-Bus-Modules
Installation Standard-
Bus-Modules
VIPA System 300SAssembly and installation guidelines
Assembly SPEED-Bus
HB140 | SM-AIO | | GB | Rev. 16-39 14

CAUTION!
– The power supplies must be released before instal-
lation and repair tasks, i.e. before handling with the
power supply or with the cabling you must discon-
nect current/voltage (pull plug, at fixed connection
switch off the concerning fuse)!
– Installation and modifications only by properly
trained personnel!
2.5 Assembly standard bus
The single modules are directly installed on a profile rail and con-
nected via the backplane bus connector. Before installing the mod-
ules you have to clip the backplane bus connector to the module from
the backside. The backplane bus connector is delivered together with
the peripheral modules.
Order number A B C
390-1AB60 160 140 10
390-1AE80 482 466 8.3
390-1AF30 530 500 15
390-1AJ30 830 800 15
390-9BC00* 2000 Drillings only left 15
*) Unit pack: 10 pieces
Measures in mm
General
Profile rail
VIPA System 300S Assembly and installation guidelines
Assembly standard bus
HB140 | SM-AIO | | GB | Rev. 16-39 15

For the communication between the modules the System 300S uses
a backplane bus connector. Backplane bus connectors are included
in the delivering of the peripheral modules and are clipped at the
module from the backside before installing it to the profile rail.
Please regard the allowed environment temperatures:
nhorizontal assembly: from 0 to 60°C
nvertical assembly: from 0 to 50°C
nlying assembly: from 0 to 55°C
If you do not deploy SPEED-Bus modules, the assembly happens
with the following approach:
1. Bolt the profile rail with the background (screw size: M6), so that
you still have minimum 65mm space above and 40mm below
the profile rail.
2. If the background is a grounded metal or device plate, please
look for a low-impedance connection between profile rail and
background.
3. Connect the profile rail with the protected earth conductor. For
this purpose there is a bolt with M6-thread.
4. The minimum cross-section of the cable to the protected earth
conductor has to be 10mm2.
5. Stick the power supply to the profile rail and pull it to the left side
to the grounding bolt of the profile rail.
6. Fix the power supply by screwing.
7. Take a backplane bus connector and click it at the CPU from the
backside like shown in the picture.
8. Stick the CPU to the profile rail right from the power supply and
pull it to the power supply.
Bus connector
Assembly possibilities
Approach
VIPA System 300SAssembly and installation guidelines
Assembly standard bus
HB140 | SM-AIO | | GB | Rev. 16-39 16

9. Click the CPU downwards and bolt it like shown.
10. Repeat this procedure with the peripheral modules, by clicking a
backplane bus connector, stick the module right from the mod-
ules you've already fixed, click it downwards and connect it with
the backplane bus connector of the last module and bolt it.
2.6 Cabling
CAUTION!
– The power supplies must be released before instal-
lation and repair tasks, i.e. before handling with the
power supply or with the cabling you must discon-
nect current/voltage (pull plug, at fixed connection
switch off the concerning fuse)!
– Installation and modifications only by properly
trained personnel!
VIPA System 300S Assembly and installation guidelines
Cabling
HB140 | SM-AIO | | GB | Rev. 16-39 17

For the cabling of power supply of a CPU, a green plug with Cage-
Clamp technology is deployed. The connection clamp is realized as
plug that may be clipped off carefully if it is still cabled.
Here wires with a cross-section of 0.08mm2 to 2.5mm2 may be con-
nected. You can use flexible wires without end case as well as stiff
wires.
1 Test point for 2mm test tip
2 Locking (orange) for screwdriver
3 Round opening for wires
The picture on the left side shows the cabling step by step from top
view.
1. For cabling you push the locking vertical to the inside with a
suiting screwdriver and hold the screwdriver in this position.
2. Insert the de-isolated wire into the round opening. You may use
wires with a cross-section from 0.08mm2 to 2.5mm2
3. By removing the screwdriver the wire is connected safely with
the plug connector via a spring.
In the following the cabling of the two variants are shown.
CageClamp technology
(green)
Front connectors of the
in-/output modules
VIPA System 300SAssembly and installation guidelines
Cabling
HB140 | SM-AIO | | GB | Rev. 16-39 18

1. Open the front flap of your I/O module.
2. Bring the front connector in cabling position.
For this you plug the front connector on the module until it locks.
In this position the front connector juts out of the module and
has no contact yet.
3. De-isolate your wires. If needed, use core end cases.
4. Thread the included cable binder into the front connector.
5. If you want to lead out your cables from the bottom of the
module, start with the cabling from bottom to top, res. from top
to bottom, if the cables should be led out at the top.
6. Bolt also the connection screws of not cabled screw clamps.
7. Fix the cable binder for the cable bundle.
8. Push the release key at the front connector on the upper side of
the module and at the same time push the front connector into
the module until it locks.
9. Now the front connector is electrically connected with your
module.
10. Close the front flap.
11. Fill out the labeling strip to mark the single channels and push
the strip into the front flap.
20pole screw connec-
tion 392-1AJ00
VIPA System 300S Assembly and installation guidelines
Cabling
HB140 | SM-AIO | | GB | Rev. 16-39 19

1. Open the front flap of your I/O module.
2. Bring the front connector in cabling position.
For this you plug the front connector on the module until it locks.
In this position the front connector juts out of the module and
has no contact yet.
3. De-isolate your wires. If needed, use core end cases.
4. If you want to lead out your cables from the bottom of the
module, start with the cabling from bottom to top, res. from top
to bottom, if the cables should be led out at the top.
5. Bolt also the connection screws of not cabled screw clamps.
6. Put the included cable binder around the cable bundle and the
front connector.
7. Fix the cable binder for the cable bundle.
8. Bolt the fixing screw of the front connector.
9. Now the front connector is electrically connected with your
module.
10. Close the front flap.
11. Fill out the labeling strip to mark the single channels and push
the strip into the front flap.
2.7 Installation guidelines
The installation guidelines contain information about the interference
free deployment of a PLC system. There is the description of the
ways, interference may occur in your PLC, how you can make sure
the electromagnetic compatibility (EMC), and how you manage the
isolation.
40pole screw connec-
tion 392-1AM00
General
VIPA System 300SAssembly and installation guidelines
Installation guidelines
HB140 | SM-AIO | | GB | Rev. 16-39 20