Z3 Technology DM8168-MOD-35 User manual

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Z3-DM8168-MOD-35 Module
Z3-DM8168-APP-41 PCIe Carrier
Manufacturing Test Procedure
VERSION 2.1.1
November 25, 2012

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Z3 Technology, LLC, Lincoln, NE 68508
© Copyright 2012 Z
3
Technology, LLC. All rights reserved.
No part of this document may be copied or reproduced in any form or by any means without prior written consent of Z3
Technology, LLC.
Z3 Technology, LLC assumes no responsibility for any errors that may appear in this document.
This document contains confidential proprietary information that is not to be disclosed to any unauthorized person without
prior written consent of Z3 Technology, LLC.
“Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These
limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can
radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one or more of the following measures:—Reorient or relocate the receiving antenna.—Increase the separation between the equipment
and receiver.—Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.—Consult the dealer or an
experienced radio/TV technician for help.”

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Document Revision History
Version Date Change Note Author
1.0 11/19/12 Based upon 1.0.3 of MOD-35 & APP-22 Test Procedure. Modified for
used with APP-41 and two HDMI inputs
AC
2.0 11/20/12 Added photo MC
2.1 11/21/12 Minor revision to Figure 1 and section 5, 6, and 7. PS
2.1.1 11/25/2012 Minor page and TOC update. Updated address on page 22. AC

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TABLE OF CONTENTS
1 Purpose........................................................................................................................................................ 5
2 General Description ................................................................................................................................... 5
3 Testing modules and application boards ................................................................................................ 6
4 Overview of the Process ........................................................................................................................... 7
5 Test and Programming Setup................................................................................................................... 8
5.1 Materials needed ................................................................................................................................. 8
5.1.1 The HDMI cables............................................................................................................................ 8
5.2 BOOTP Server Setup ......................................................................................................................... 9
5.3 Wiring setup.......................................................................................................................................... 9
5.4 Target configuration........................................................................................................................... 10
6 Flash Programming Step ........................................................................................................................ 10
6.1 Procedure ........................................................................................................................................... 10
6.2 Procedure Test Coverage................................................................................................................. 10
6.3 Pass/Fail Criteria ............................................................................................................................... 11
7 Functional Tests........................................................................................................................................ 11
7.1 Functional test coverage .................................................................................................................. 13
7.2 Procedure.............................................................................................................................................. 13
8 Pass/Fail Criteria......................................................................................................................................... 14
9 Reloading the Flash................................................................................................................................. 14
10 Log of Successful Flash Programming................................................................................................. 15

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1 Purpose
This document specifies the manufacturing test procedure for the Z3-DM8168-MOD-35 modules and
Z3-DM8168-APP-41 application boards. These procedures are necessary in order to load the initial software
into the Flash and perform a functional test with as much coverage as possible of the circuitry of the module for
correctness of assembly.
2 General Description
The Z3-DM8168-MOD-35 is a compact OEM module, supporting H.264 codec at up to two channels of 1080p
at 60 fps (frames per second) encode and stream, decode from stream or store in applications. The
Z3-DM8168-MOD-35 features a unique expansion interface comprised of five high density connectors
providing access to the greatest majority of interface signals available from the DM8168 processor. Figure 1
below shows the Z3-DM8168-MOD-35 system on module mounted on a Z3-DM8168-APP-41 carrier board.
Figure 1: DM8168-APP-41 with DM8168-MOD-35
HDMI In 1
HDMI Out
+12V
Power In
Serial
port
Ethernet
HDMI In 2

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3 Testing modules and application boards
Since the DM8168-MOD-35 module has no I/O ports, it is necessary to use a carrier board of some sort to be
able to connect power and signal to the various inputs and outputs. The Z3-DM8168-APP-41 application
board was selected to be the carrier. The DM8168-MOD-35 requires a DM8168-APP-41 in order to be tested.
The DM8168-APP-41 board has all the I/O connections necessary to interface to the Z3-DM8168-MOD-35.
All the interfaces on the DM8168-APP-41 board match those of the DM8168-MOD-35 module, and therefore
the DM8168-MOD-35 module is required in order to test the DM8168-APP-41.
The DM8168-MOD-35 and the DM8168-APP-41 have to be paired in order for both to be tested.
The preferred method to test newly assembled DM8168-APP-41 boards and newly assembled
DM8168-MOD-35 is to test new boards as a pair:
1) Plug a DM8168-MOD-35 to a DM8168-APP-41.
2) Connect the cables and run the flash programming step followed by the functional test as described in
sections 5, 6 and 7 below.
3) If the flash programming and functional test succeeds, then screw the boards together using 4 pcs of
M2.5 x 4mm screw and ship.
If any of the steps fail it becomes necessary to test each one individually to determine which board
requires rework.
Testing individual Z3-DM8168-MOD-35 modules consists of connecting a module to be tested onto a known
good DM8168-APP-41 application board and running the same programming and functional test processes.
In a similar manner, testing individual DM8168-APP-41 boards can be accomplishing by using a known good
DM8168-MOD-35 module. In this case, the module will already have had its flash programmed by the flash
programming step described in section 6, and therefore that procedure does not need to be executed again.
When testing DM8168-APP-41 boards with a known good module already containing the right firmware in
the flash it is only required to perform the functional tests step.
Please refer to section 9 for the procedure of how to erase and reload the flash.

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4 Overview of the Process
All Z3-DM8168-MOD modules contain a NAND flash chip for storage of firmware and data, including sections
necessary for the board to boot. The Flash also stores the Linux kernel and filesystem. In order to allow the
module to boot, the Flash needs to contain at least the u-boot code and its environment variables.
The Flash chip is initially blank. The various software components that are to be loaded into the flash are
stored in a server on the network. The module can be configured to boot from the network using BOOTP
protocol so that the initial load is provided from the server. This initial load will cause the subsequent blocks of
data to be loaded into the Flash. When the load process is complete a status message will be printed to the
console. If the software load was performed without errors, the message will be “NAND update SUCCESS”.
After the flash content is successfully programmed, the manufacturing tests must be performed. When the
functional test completes without issues, the module will display a success message on the serial console port.
Note that the same process can be used to recover a module that had the content of its Flash compromised
and no longer boots.
Once the flash is programmed, the module can be subject to further functional tests. Such tests can be run
from a USB memory stick plugged into one of the module’s USB ports or by connecting the manufacturing
jumper option.
In summary, the following steps are used to program the Flash and verify the assembly process:
1. Plug the module under test with a blank flash into a known good Z3-DM8168-APP-41 board.
2. Connect the cables according to the setup instructions. Make sure that the power switch is in the “OFF”
position before connecting the power plug.
3. Power up the system.
This will automatically start the Flash programming step procedure described in section 6.
Since the Flash is initially empty, the module retrieves its IPL code from the BOOTP server.
The IPL code runs and retrieves various other portions of software from the TFTP server.
a. Get the file “ u-boot-uartboot.bin.scr ” from the server and write to Flash.
b. Get the file “ u-boot-env.scr' ” from the server and write to Flash.
c. Get the file “ u-boot.bin.img ” from the server and write to Flash.
d. Get the file “ uImage ” from the server and write to Flash.

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e. Get the file “ ubifs-image ” from the server and write to Flash.
4. Once all sections of the Flash are written successfully, a success message is displayed.
If the test succeeds, then proceed to the next step, otherwise troubleshoot.
5. Turn power off.
6. Next run the functional tests as described in section 7 below.
Insert the manufacturing jumper or use a pair of tweezers to place the board into manufacturing test
mode and turn power on again to start the functional tests.
When the jumper or tweezers is detected correctly, the message “ Factory jumper detected. " is
displayed. At this point you can remove the tweezers.
7. The manufacturing functional verification tests will execute in an endless loop.
8. If the test is successful, then remove the manufacturing jumper (if one was used) and the module is
good for shipping.
Otherwise, troubleshoot the module or the process.
5 Test and Programming Setup
5.1 Materials needed
The following materials are required to perform the programming and functional verification steps.
•A Linux PC properly configured with BOOTP and TFTP servers and the programming files
•A serial console terminal, such as a PC running a terminal emulator.
•Two media players to be used as source of video content.
•A TV monitor with HDMI input, capable of displaying 1080p60 video.
•One USB flash drive with standard format.
•One 12V power AC-DC converter rated for 2A.
•One Ethernet RJ-45 cable.
•Three good quality HDMI cables.
•One 2.5mm stereo plug to DB-9 for the serial console port.
5.1.1 The HDMI cables
Please obtain HDMI cables of good quality. For this test setup the cables need to be capable of
operating at 1080p60, so the extra-thin cables will NOT work. Ensure that the cable is capable of
1080p60 by testing it from the media player to the TV monitor, with the media player configured for
1080p60 output.

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5.2 BOOTP Server Setup
1. Set up a BOOTP server as per instructions of the server software provider.
2. Create a directory to contain the files that will be passed on to the module and place the manufacturing
image files there.
3. Configure the BOOTP server so that it serves the u-boot-uartboot.bin file to the BOOTP client modules.
4. The IP address of the BOOTP/TFTP server must be set to 192.168.0.6, and the netmask needs to be
set to 255.255.0.0.
If the IP address of the server is different than 192.168.0.6, then a secondary IP address can be
created to accommodate the requirement, using the command
ifconfig eth0:1 192.168.0.6 netmask 255.255.0.0
5.3 Wiring setup
1. Connect a media player set-top-box “A” to the TV monitor using a HDMI cable. Configure the player to
output 1080p60 (if using Brite-View player set output to HDMI Auto) and set it to playback a video file in
a continuous loop. Do not use a Blu-Ray player as a source for the HDMI input of the APP-41.
2. Once the player is running remove the cable from the TV monitor and connect it to HDMI input 1 of the
Z3-DM8168-APP-41 board.
3. Connect a second HDMI source to the HDMI input of the TV monitor using a HDMI cable. Configure
the player to output 1080p60 (if using Brite-View player set output to HDMI Auto) and set it to playback
a video file in a continuous loop. Do not use a Blu-Ray player as a source for the HDMI input of the
APP-41.
4. Once the player is running remove the cable from the TV monitor and connect it to HDMI input 2 of the
Z3-DM8168-APP-41 board.
5. Connect the network cable to the RJ-45 jack on the Z3-DM8168-APP-41 board. It is possible to
connect the Z3 board directly to the BOOTP server if so desired. If there are switches or hubs between
the module and the server, make sure that they allow BOOTP packets through.
6. Connect a serial terminal to the serial port jack on the Z3-DM8168-APP-41.
7. Configure the terminal with 115200 bps, 8 data bits, 1 stop bit, no parity and no flow control. Since the
functional test takes advantage of ANSI escape codes, using the Teraterm terminal program is highly
recommended.
8. Apply power to the DM8168-APP-41.

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5.4 Target configuration
1. Configure the boot jumpers on the module so that it will boot either from the BOOTP server or from the
Flash.
2. Place jumpers on pins 1-2, 3-4, and 5-6 of the boot jumper block J20 for BOOTP. The default; 5-6, 9-10,
and 15-16 is shown below.
6 Flash Programming Step
6.1 Procedure
To run the procedure and install the firmware in the flash, once the test environment is setup and the system is connected
according to the instructions in section 5 above, simply apply power to the Z3-DM8168-APP-41 board. In about 4 seconds,
the initial BOOTP will complete and the programming will start. The entire procedure is complete in about 40 seconds.
6.2 Procedure Test Coverage
If the test is successful, the result is a module with a programmed Flash chip.
The following functions are also tested and verified working by this procedure:
•All power supplies
•Power switch
•CPU core

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•Certain GPIOs
•Boot jumpers
•I2C bus
•Ethernet interface
•NAND Flash
•DDR3 SDRAM
•Serial console port
6.3 Pass/Fail Criteria
When the procedure completes successfully, the console will display the message below:
*************************************
******** NAND update SUCCESS ********
*************************************
Z3-DM8168-MOD#
Any result different from this represents a failed test.
In this case, please troubleshoot the hardware or the test setup.
7 Functional Tests
Once the software is successfully written to the module’s flash as per section 6 above, further functional tests are
necessary to verify the correct assembly of the board.
The functional test mode is executed by powering up the system with pins while pins 11 and 13 of J20 are connected. It is
possible to insert a jumper block (in addition to the 3 jumper blocks already present) or to use a pair of tweezers to
connect the two pins during the power up sequence. It is necessary to keep the pins connected only for a brief moment.
The system indicates that it will execute the functional tests by printing the line “Factory jumper detected.” At the
beginning of the boot sequence. Once that line is printed, the tweezers can be removed. The pins 11 and 13 of J20 are
shown in Figure 2 below.

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Figure 2: J20 pins 11 and 13 for factory jumper placement
Here is a boot sequence where the factory jumper is detected:
U-Boot 2010.06-00001-g55e9407-dirty (Feb 02 2012 - 23:53:38)
TI8168-GP rev 1.2
ARM clk: 987MHz
DDR clk: 675MHz
I2C: ready
DRAM: 1 GiB
NAND: 256 MiB
Factory jumper detected.
Net: Detected MACID:40:5f:c2:38:48:22
Ethernet PHY: GENERIC (x001cc914) @ 0x01
DaVinci EMAC
Press SPACE to abort autoboot in 0 seconds
Booting from NAND and ubifs...
Set powerlevel to 5

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7.1 Functional test coverage
The functional test is designed to verify the media inputs and outputs, and the Ethernet interface. At the same time, it will
also verify the DDR3 memory, Flash, clock oscillators, PLL, fan and stress the power supplies.
7.2 Procedure
Prepare the test setup as described in section 5 above. If the Z3-DM8168-MOD-35 does not have the proper software
loaded in the flash, then execute the steps described in section 6 above. Then follow the procedure below:
1) Insert a jumper block at J20 connecting pins 11 and 13, or hold a pair of tweezers connecting the pins and turn
power on.
2) Make sure that the fan on the module is running.
If the fan is not running, then the module failed functional test.
3) Once the system starts booting, verify that the manufacturing jumper was detected as indicated by the presence
of the line “Factory jumper detected.” in the console output at the beginning of the boot.
The test will start executing in a loop and print the results:
================================================
Z3 Technology, LLC
Functional test DM8168-PCI-RPS v1.01.00
------------------------------------------------
USB/SATA Media: Found: /dev/sda1 1.9G
Ethernet: OK
HDMI1: 1920x1080p 60fps
COMPONENT2: 1920x1080i 30fps
------------------------------------------------
Display from input HDMI1...OK
Display from input COMPONENT2...OK
------------------------------------------------
******************
**** TEST PASS ***
******************
------------------------------------------------
================================================

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The test will execute in a loop until terminated by the operator. This allows the chance to troubleshoot failures in
real time, without the need to restart the test if it fails.
4) The test will output 3 seconds of video from each input to the monitor TV.
a. Verify that the monitor displays video when the test prints “Display from input HDMI1...OK”.
If not, the module has failed the functional test.
b. Verify that the monitor displays video when the test prints “Display from input COMPONENT2...OK”.
If not, the module has failed the functional test.
5) If all functional tests succeeded, then the “**** TEST PASS ***”message will be displayed and the LED D6 on
the module will light up in green color.
8Pass/Fail Criteria
The functional test is completed successfully when the “**** TEST PASS ***”message is displayed and the monitor
TV shows video from both inputs. The LED D6 on the DM8168-MOD-35 will turn on GREEN when the test succeeds, and
will turn RED or not turn on at all if any test fails.
In addition to pass the flash programming step and the functional tests, modules and application boards that are going to
be shipped must have been assembled completely and properly.
So in order to ship a board or system, ALL of the conditions below must be met:
1) The flash programming step must have executed properly as described in section 5 above.
2) The functional test step must have completed successfully as per section 7 above.
3) If the module is being tested for shipping, its fan must be attached and working.
4) If the APP-41 board is being tested for shipping, the bracket must be mounted and secured with screws and the
screw posts H1, H2, H3 and H4 must be populated.
5) If both module and application board are being shipped as a pair, then the module should be screwed to the
application board.
9 Reloading the Flash
Once the Flash is programmed, the module will no longer attempt to boot from the BOOTP server on power on.
Instead, it will boot much quicker from the internal Flash. The consequence is that the module will no longer be
able to re-flash itself by following the steps described above. There are two possible methods to force the
module to boot to the BOOTP server and therefore reload the Flash contents.

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1. One method is to erase the contents of the Flash. Once the Flash is empty, the module will once again
try to boot from the BOOTP server. Erasing the Flash is possible if the module gets to the u-boot
prompt or pressing space during boot to force the module to stop at the u-boot prompt. Once at the
u-boot prompt, the command below will erase the Flash:
Z3-DM8168-MOD# nand erase
Once the Flash is erased, turn power off and on again to start the Flash procedure.
2. Another method to force booting from the BOOTP server is to set the module boot jumpers to default to
a BOOTP boot. This is accomplished by placing jumper blocks on pins 1-2, 3-4 and 5-6 of the J20
header. The board will boot from the BOOTP server and complete the flash procedure. Once the Flash
initialization is successful, the jumper blocks need to be returned to their default positions on pins 5-6,
9-10 and 15-16 of the J20 header.
10 Log of Successful Flash Programming
The following is a listing of a successful Flash programming step.
DDR OK
U-Boot 2010.06-00001-g55e9407-dirty (Feb 02 2012 - 23:53:38)
TI8168-GP rev 1.2
ARM clk: 987MHz
DDR clk: 675MHz
I2C: ready
DRAM: 1 GiB
NAND: 256 MiB
*** Warning - bad CRC or NAND, using default environment

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Factory jumper detected.
Net: <ethaddr> not set. Reading from E-fuse
Detected MACID:40:5f:c2:38:48:22
Ethernet PHY: GENERIC (x001cc914) @ 0x01
DaVinci EMAC
Press SPACE to abort autoboot in 0 seconds
BOOTP broadcast 1
got BOOTP packet (src=67, dst=68, len=300 want_len=548)
Filtering pkt = 0
Bootfile: /z3/z3-netra/init/images/uImage
[BOOTP] Checking extension (300 bytes)...
[BOOTP] Processing extension 1... (4 bytes)
[BOOTP] Processing extension 53... (1 bytes)
[BOOTP] Processing extension 54... (4 bytes)
[BOOTP] Received fields:
NetOurSubnetMask : 255.255.255.0
Got good BOOTP
Using DaVinci EMAC device
TFTP from server 192.168.0.6; our IP address is 192.168.0.188
Filename '/z3/z3-netra/init/images/uImage.scr'.
Load address: 0x81000000
Loading: ##
done
Bytes transferred = 5978 (175a hex)
## Executing script at 81000000
Saving Environment to NAND...
Erasing Nand...
Warning: Erase size 0x00002000 smaller than one erase block 0x00020000
Erasing 0x00020000 instead
Erasing at 0x260000 -- 100% complete.
Writing to Nand... done
Using DaVinci EMAC device
TFTP from server 192.168.0.6; our IP address is 192.168.81.68
Filename '/z3/z3-netra/init/images/u-boot-env.scr'.

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Load address: 0x81800000
Loading: ##
done
Bytes transferred = 5978 (175a hex)
## Executing script at 81800000
Saving Environment to NAND...
Erasing Nand...
Warning: Erase size 0x00002000 smaller than one erase block 0x00020000
Erasing 0x00020000 instead
Erasing at 0x260000 -- 100% complete.
Writing to Nand... done
NAND erase: device 0 offset 0x260000, size 0x20000
Erasing at 0x260000 -- 100% complete.
OK
Using DaVinci EMAC device
TFTP from server 192.168.0.6; our IP address is 192.168.81.68
Filename '/z3/z3-netra/init/images/u-boot.bin.img'.
Load address: 0x81800000
Loading: ##########################################
done
Bytes transferred = 213340 (3415c hex)
NAND erase: device 0 offset 0x0, size 0x80000
Erasing at 0x60000 -- 100% complete.
OK
HW ECC BCH8 Selected
NAND write: device 0 offset 0x0, size 0x80000
524288 bytes written: OK
SW ECC selected
Using DaVinci EMAC device
TFTP from server 192.168.0.6; our IP address is 192.168.81.68
Filename '/z3/z3-netra/init/images/uImage'.

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Load address: 0x81800000
Loading: #################################################################
#################################################################
#################################################################
#################################################################
#################################################################
#################################################################
#################################################################
######################
done
Bytes transferred = 2440424 (253ce8 hex)
NAND erase: device 0 offset 0x280000, size 0x300000
Erasing at 0x560000 -- 100% complete.
OK
NAND write: device 0 offset 0x280000, size 0x280000
2621440 bytes written: OK
Using DaVinci EMAC device
TFTP from server 192.168.0.6; our IP address is 192.168.81.68
Filename '/z3/z3-netra/init/images/ubifs-image'.
Load address: 0x82000000
Loading: #################################################################
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done
Bytes transferred = 22282240 (1540000 hex)
NAND erase: device 0 offset 0x6c0000, size 0xcee0000
Erasing at 0xd580000 -- 100% complete.
OK
NAND write: device 0 offset 0x6c0000, size 0x1540000
22282240 bytes written: OK
Saving Environment to NAND...
Erasing Nand...
Warning: Erase size 0x00002000 smaller than one erase block 0x00020000
Erasing 0x00020000 instead