ADLINK Technology VPX3010 Series User manual

Advance Technologies; Automate the World.
Manual Rev.: 0.10
Revision Date: January 25, 2017
Part No: 50-15107-2000
VPX3010 Series
Performance Rugged Conduction Cooled
3U VPX Intel®Xeon®Processor D-1500
Processor Blade

Revision History
Revision Release Date Description of Change(s)
0.10 2017/01/25 Preliminary release

Preface iii
VPX3010
Preface
Copyright 2017 ADLINK Technology Inc.
This document contains proprietary information protected by copy-
right. All rights are reserved. No part of this manual may be repro-
duced by any mechanical, electronic, or other means in any form
without prior written permission of the manufacturer.
Disclaimer
The information in this document is subject to change without prior
notice in order to improve reliability, design, and function and does
not represent a commitment on the part of the manufacturer.
In no event will the manufacturer be liable for direct, indirect, spe-
cial, incidental, or consequential damages arising out of the use or
inability to use the product or documentation, even if advised of
the possibility of such damages.
Environmental Responsibility
ADLINK is committed to fulfill its social responsibility to global
environmental preservation through compliance with the Euro-
pean Union's Restriction of Hazardous Substances (RoHS) direc-
tive and Waste Electrical and Electronic Equipment (WEEE)
directive. Environmental protection is a top priority for ADLINK.
We have enforced measures to ensure that our products, manu-
facturing processes, components, and raw materials have as little
impact on the environment as possible. When products are at their
end of life, our customers are encouraged to dispose of them in
accordance with the product disposal and/or recovery programs
prescribed by their nation or company.
Trademarks
Product names mentioned herein are used for identification pur-
poses only and may be trademarks and/or registered trademarks
of their respective companies.

iv Preface
Conventions
Take note of the following conventions used throughout this
manual to make sure that users perform certain tasks and
instructions properly.
NOTE:
NOTE:
Additional information, aids, and tips that help users perform
tasks.
CAUTION:
Information to prevent minor physical injury, component dam-
age, data loss, and/or program corruption when trying to com-
plete a task.
WARNING:
Information to prevent serious physical injury, component
damage, data loss, and/or program corruption when trying to
complete a specific task.

Table of Contents v
VPX3010
Table of Contents
Revision History...................................................................... ii
Preface.................................................................................... iii
List of Figures....................................................................... vii
List of Tables.......................................................................... ix
1 Introduction ........................................................................ 1
1.1 Overview.............................................................................. 1
1.2 Features............................................................................... 3
1.3 Block Diagrams.................................................................... 5
1.4 Model Number Decoder - Processor Blade ........................ 6
1.5 Package Contents ............................................................... 8
2 Specifications..................................................................... 9
2.1 VPX3010 Blade Specifications ............................................ 9
2.2 VPX-R3010 RTM Specifications........................................ 12
2.3 Power Consumption .......................................................... 13
3 Functional Description .................................................... 17
3.1 Processors......................................................................... 17
3.2 Intel® Turbo Boost Technology ......................................... 20
3.3 USB ................................................................................... 21
3.4 SPI BIOS ........................................................................... 21
3.5 System Management Bus.................................................. 22
3.6 Real Time Clock ................................................................ 22
3.7 Serial ATA Controller ......................................................... 22
3.8 PCI Express Interface........................................................ 22
3.9 Intel ® 82580EB Gigibit Ethernet Controller ...................... 22
3.10 Graphics ............................................................................ 23
3.11 GPIO Expander PCA9554 ................................................. 23

vi Table of Contents
3.12 UART NCT5104................................................................. 23
3.13 TPM AT97SC3204............................................................. 23
3.14 XMC Site............................................................................ 24
4 VPX3010 Board Interfaces ............................................... 25
4.1 VPX3010 Board Layout ..................................................... 25
4.2 VPX3010 Mechanical Drawing .......................................... 26
4.3 VPX3010 Connector Pin Assignments .............................. 27
4.4 Switches and LEDs............................................................ 33
5 VPX-R3010 RTM................................................................ 35
5.1 Connector Allocation.......................................................... 35
5.2 VPX-R3010 Block Diagram................................................ 37
5.3 VPX-R3010 RTM Board Layout......................................... 38
5.4 VPX-R3010 RTM Connector Pin Assignments.................. 41
5.5 VPX-R3010 Switches......................................................... 48
Important Safety Instructions............................................... 49
Getting Service...................................................................... 51

List of Figures vii
VPX3010
List of Figures
Figure 1-1: VPX3010 Functional Block Diagram................................ 5
Figure 4-1: VPX3010 Component Side Layout ................................ 25
Figure 4-2: VPX3010 Component Side Layout ................................ 25
Figure 4-3: VPX3010 Mechanical Dimensions................................. 26
Figure 4-4: VPX3010 Front View ..................................................... 33
Figure 4-5: VPX3010 Switches and LEDs solder side..................... 33
Figure 5-1: VPX-R3010 RTM Functional Block Diagram ................. 37
Figure 5-2: VPX-R3010 RTM Board Layout..................................... 38
Figure 5-3: VPX-R3010 Solder Side Layout .................................... 39
Figure 5-4: VPX-R3010-L2 Board Layout ........................................ 40
Figure 5-5: VPX-R3010-L2-1 Board Layout..................................... 40

viii List of Figures
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List of Tables ix
VPX3010
List of Tables
Table 1-1: VPX3010 SKU Table ....................................................... 7
Table 2-1: VPX3010 Blade Specifications ........................................ 9
Table 2-2: VPX-R3010 RTM Specifications.................................... 12

xListofTables
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Introduction 1
VPX3010
1 Introduction
1.1 Overview
The VPX3010 Series is a 3U VPX processor blade based on the
Intel® Xeon® Processor D-1500 Family on 14nm silicon technol-
ogy and integrating the CPU and chipset in a single sys-
tem-on-chip (SoC). The VPX3010 is available with three different
eTMP processors: D-1559 (12 cores, 1.5GHz, TDP 45W), D-1539
(8 cores, 1.6GHz, TDP 35W) and D-1519 (4 cores, 1.5GHz, TDP
25W). The VPX3010 Series supports DDR4-2133 ECC soldered
memory up to 16GB. For storage, the VPX3010 provides a high
endurance soldered SLC SSD up to 64GB. The VPX3010 is com-
pliant with the VITA48 and VITA 65 specifications.
The VPX3010 Series with Intel® server grade processor brings
extreme computing power with low power consumption. The
VPX3010 supports two Ethernet interface options: 2x 10G-KR and
2x 1000BASE-T or 1x 1000BASE-T and 2x 1000BASE-BX (by
BOM option). The VPX3010 provides one PCI Express x8 Gen3
signal to rear and one PCI Express x8 Gen3 XMC.3 site with VITA
46.9 rear IO, or one PCI Express x16 Gen3 and one PCI Express
x1 Gen3 (by BOM option). Display support is provided by a Silicon
Motion SM750 2D graphics chip with VGA to P2. I/O features
include 1x SATA 6Gb/s to P1 or 1x SATA 6Gb/s to P1 and 1x
SATA 6Gb/s to P2 (by BOM option), 2x USB 3.0 to P1 and P2, 1x
USB 2.0 to P1, one RS-232 to P1 and one RS-232/422/485 to P2.
The ADLINK VPX3010 provides an Atmel TPM 1.2 chip for system
security, dual BIOS functionality, as well as an ADLINK ABSDiag
self-diagnosis tool. These features bring additional value by ensur-
ing high reliability.
All components on the VPX3010 Series are soldered on the PCB
board to ensure product reliability and quality, and enable compli-
ance with MIL-STD-810G shock and vibration. The VPX3010 sup-
ports a wide operating temperature range from -40°C to +75°C
(optionally up to +85°C).

2Introduction
A VPX-R3010 Rear Transition Module is available to access rear
I/O signals for users to validate VPX3010 functionality.
The VPX3010 Series is available in a rugged conduction cooled
version with conformal coating and an air cooled version to meet
different application needs. The rugged conduction cooled version
is ideal for mission critical applications in radar; intelligence, sur-
veillance and reconnaissance (ISR); and UAV/UGV platforms. The
air cooled version is suited for use in defense control centers.

Introduction 3
VPX3010
1.2 Features
X3U VPX VITA 46, OpenVPX VITA 65, VPX REDI 48
X1" rugged conduction cooled and air cooled 3U VPX blade
with conformal coating
X14nm uFC-BGA Intel® Xeon® Processor D-1500 family
ZIntel® Xeon® processor D-1559, 12-core, 18M Cache,
1.50/1.8 GHz, 45W TDP, -40°C to 85°C
ZIntel® Xeon® processor D-1539, 8-core, 12M Cache,
1.60/1.9 GHz, 35W TDP, -40°C to 85°C
ZIntel® Xeon® processor D-1519, 4-core, 6M Cache,
1.50/1.8GHz, 35W TDP, -40°C to 85°C
XDual channel DDR4-2133 SDRAM with ECC soldered
onboard, up to 16GB
XOnboard SLC SATA Solid State Drive up to 64GB
XSilicon Motion SM750 2D graphics chip with VGA output to
P2
XOnboard PCI Express x8 Gen3 XMC site with VITA 46.9
rear I/O
XDual 10G-KR to rear
XData Plane: VITA 46.4 PCI Express x8 Gen3, or 2x PCI
Express x4 Gen3 to P1, supports NTB function
XControl Plane: VITA 46.6 2x 1000BASE-T or 1x
1000BASE-T and 2x 1000BASE-BX (BOM option)
XRear I/O:
ZP1: 1x PCI Express x8, 2x1000BASE-T(or
1x1000BASE-T and 2x 1000BASE-BX), 1x SATA 6
Gb/s, 1x RS-232, 1x USB 3.0 and 1x USB 2.0
ZP2: 2x 10G-KR, 1x VGA, 1x RS-232/422/485, 1x USB 3.0,
XMC to rear IO x8d+x12d
ZP2 (BOM option): 2x 10G-KR, 1x VGA, 1x USB 3.0,
1x RS-232/422/485, 1x PCI Express x8 Gen3, 1x PCI
Express x1, 1x SATA 6Gb/s,
XuEFI BIOS 64Mb SPI flash
XADLINK Dual BIOS mechanism

4Introduction
XABSDiag self-diagnosis tool
XMOD3-PAY-2F2T-16.2.5-3 or MOD3-PAY-2F2U-16.2.3-3
(BOM option)
XSlot Profile: SLT3-PAY-2F2U-14.2.5 or
SLT3-PAY-2F2U-14.2.3 (BOM option)

Introduction 5
VPX3010
1.3 Block Diagrams
Figure 1-1: VPX3010 Functional Block Diagram
P1 P0
P2
DDR4 DDR4NAND Flash
BIOS_0
BIOS_1
SPI
TPM
COM IC
IPMC
SPI Flash
IPMB_0
IPMB_1
RS-232
PCIe x4 Gen2
1000BASE-T
1000BASE-T
1000BASE-BX
1000BASE-BX
1x USB 2.0
SATA 6Gb/s
1x USB 3.0
LPC
*PCIe x8
Gen3
*PCIe x8
Gen3
x8d+x12d
PCIe x1
Gen2
VGA
10G-KR
GPIO
Expansion
SMBus
P2
RS-232/
RS422
PCIe x1
Gen3
SKU2
BOM Option
SKU2
BOM Option
*Optional PCIe x16 Gen3 to P1/P2, no XMC BOM option
2x 1000BASE-T
or
1x1000BASE-T +
2x 1000BASE-BX
*Actual data transfer rate dependent on device specification
10G-KR
1x USB 3.0
GbE
Intel
82580EB
SATA 6Gb/s SATA 6Gb/s
XMC
SM750
Intel®Xeon®Processor D

6Introduction
1.4 Model Number Decoder - Processor Blade
(A) CPU Code
ZD-1559 = Intel® processor D-1559, 12 cores, TDP 45W,
1.5GHz
ZD-1539 = Intel® processor D-1539, 8 cores, TDP 35W,
1.6GHz
ZD-1519 = Intel® processor D-1519, 4 cores, TDP 25W,
1.5GHz
(B) Memory Size Code
ZM8 = 8GB DDR4-2133 ECC soldered SDRAM
ZM16 = 16GB DDR4-2133 ECC soldered SDRAM
(C) SATA NAND Flash Size Code
ZS32 = Soldered SLC NAND flash 32GB
ZS64 = Soldered SLC NAND flash 64GB
(D) PCI Express interface code
ZXMC = XMC interface
ZP16 = PCI Express x16 Gen3 (BOM option)
(E) Ruggedized Level Code
ZR0 = Conduction Cooled version supporting 0°C to
+50°C at card edge
ZR1 = Conduction Cooled version supporting -40°C to
+75°C at card edge
ZR2 = Conduction Cooled version supporting -40°C to
+85°C at card edge
ZA0 = Air Cooled version supporting 0°C to +50°C
ZA1 = Air Cooled version supporting -40°C to +75°C
VPX3010/1559/M16/S32/XMC-R2
(E)(A) (B) (C) (D)

Introduction 7
VPX3010
VPX3010 SKU Table
Note: Items in red differ between SKU options.
XMC Version “No XMC” BOM Option
Item Description Description
XMC PCIe x8 Gen3 with Rear IO to
P2w7-X8d+X12d N/A
Ethernet 2x 1000BASE-T to P1 1x 1000BASE-T + 2x 1000BASE-BX
to P1
2x 10GBASE-KR to P2 2x 10GBASE-KR to P2
PCI
Express
PCIe x8 Gen3 to P1 (or 2 x4 or 1
x8) to P1 with NTB-LAN 0 to LAN 3
PCIe x8 Gen3 to P1 (or 2 x4 or 1 x8)
to P1 with NTB-LAN 0 to LAN 3
N/A
PCIe x8 Gen3 to P2 (or PCIe x16 if
combined with P1 PCIe x8)
1x PCIe x1 Gen3 to P2
SATA
6Gbps
SATA 6 GB/S port 0 to P1 1x SATA 6 GB/S port 0 to P1,
1x SATA 6 GB/S port 2 to P2
SATA 6 GB/S port 1 to SATA 3 GB/s
NAND SLC flash, minimum 32GB,
64GB is optional
SATA 6 GB/S port 1 to SATA 3 GB/s
NAND SLC flash, minimum 32GB,
64GB is optional
GPIO N/A 5V tolerance GPIO 0-7 from IPMC
Serial
1x RS-232 to P1 (full COM) 1x RS-232 to P1 (Tx/Rx only)
1x RS-232/422/485 to P2
(full RS-232/422/485)
1x RS-232/422/485 to P2
(full RS-422/485, RS-232 Tx/Rx only)
Table 1-1: VPX3010 SKU Table

8Introduction
1.5 Package Contents
The VPX3010 is packaged with the following components. If any
of the items on the contents list are missing or damaged, retain the
shipping carton and packing material and contact the dealer for
inspection. Please obtain authorization before returning any prod-
uct to ADLINK. The packing contents of the VPX3010 are
non-standard configurations and may vary depending on customer
requests.
Processor Blade
XVPX3010
ZCPU and memory specifications will differ depending on
options selected
ZThermal module is assembled on the board
Rear Transition Module (optional)
XVPX-R3010 Layer 1 on RTM
XVPX-R3010L2 Layer 2 on RTM
XVPX-R3010L2-1 Layer 2 on RTM
Test Backplane (optional)
XtBP-VPX3000 test backplane
Test Frame (optional)
X3U VPX conduction cooled chassis, up to 9 slots
NOTE:
NOTE:
The contents of non-standard VPX3010 configurations may vary
depending on the customer requirements.
CAUTION:
This product must be protected from static discharge and physi-
cal shock. Never remove any of the components except at a
static-free workstation. Use the anti-static bag shipped with the
product when putting the board on a surface. Wear an anti-static
wrist strap properly grounded on one of the system's ESD ground
jacks when installing or servicing system components.

Specifications 9
VPX3010
2 Specifications
2.1 VPX3010 Blade Specifications
VITA Standards • VITA 46.0 VPX Base Standard
• VITA 46.4 PCI Express on VPX Fabric Connector
• VITA 46.6 Gigabit Ethernet Control Plane on VPX
• VITA 46.9 PMC/XMC/Ethernet Signal Mapping to 3U/6U
VPX
• VITA 48.0 Ruggedized Enhanced Design Implementation
Mechanical Base Specification
• VITA 65 OpenVPX Architecture Framework for VPX
Mechanical • 3U VPX 0.8”
• Dimensions: 100mm x 160mm
Processor 14nm FC-BGA Intel Xeon D series SoC
• Xeon D-1559 12C@ 45W
• Xeon D-1539 8C@ 35W
• Xeon D-1519 4C@ 25W
1.5Mb per core LLC
Passive heatsink
Chipset • Integrated in processor
Memory • Dual channel 1.2V DDR4 2133MT/s SDRAM with ECC,
8Gb density support
• Channel A: soldered on board, up to 8GB
• Channel B: soldered on board, up to 8GB
USB • 1x USB 3.0 to P1 and 1x USB 3.0 to P2
• 1x USB 2.0 to P1
XMC • PCIe x8 Gen3 with rear IO to P2 X8d+X12d
Gigabit
Ethernet • 2x 10/100/1000BASE-T to P1 • 1x 10/100/1000BASE-T + 2x 10/100/1000BASE-BX to P1
(SKU2 by BOM option)
• 2x 10GBASE-KR to P2
PCI Express • PCIe x8 Gen3 to P1 (or 2 PCIe x4, 1 PCIe x8) with NTB-
Lane 0 to lane 3
plus (“no XMC” BOM option only)
• PCIe x8 Gen3 to P2 (when combined with PCIe x8 to P1,
configurable as PCIe x16 Gen3, 2 PCIe x8 or 4 PCIe x4)
• PCIe x1 Gen3 to P2
Table 2-1: VPX3010 Blade Specifications

10 Specifications
SATA • SATA 6Gb/s port 0 to P1
• SATA 6Gb/s port 1 to SATA 3Gb/s NAND SLC flash, 32GB
(64GB optional)
• SATA 6Gb/s port 2 to P2 (“no XMC” BOM option only)
Graphics • Silicon Motion SM750 2D graphics chip via PCIe x1 with
VGA output to P2
IPMC • SmartFusion A2F200M3F-CSG288, compliant to VITA
46.11
• Local event log (SEL) in a non-versatile 32k EEPROM
• FRU data in a 32k EEPROM
• Sensor data record, including CPU, system voltage and
temperature
• Serial over LAN
• IPMI over LAN (via Intel® 82580)
•IPMCWDT
• OVT/UVT warning
•DualBIOS
• Extended SPI flash
GPIO • 5V tolerance GPIO 0-7 from IPMC
• Build option with COM1/2
Serial • 1x RS-232 to P1
• 1x RS-232/422/485 to P2 (COM mode by BIOS setting)
Note: RS-232 supports Tx/Rx only on “no XMC” BOM option
version
RTC •ToP1
TPM • Atmel AT97SC3204 industrial grade
• Version 1.2
Front Panel I/O • XMC front I/O on convection cooled version
LEDs • Power (green, on when power is on, off when powered
down)
• SATA (yellow, blinking when storage is active)
• Reset (red, when system is reset, the LED will light for 2
seconds)
• Dual BIOS LED (green: boot from BIOS1; orange: boot from
BIOS2; off: BIOS1 and BIOS2 fail)
Reset Button • On front panel
Profile • SLT3-PAY-2F2T-14.2.5
• MOD3-PAY-2F2T-16.2.5-3
Table 2-1: VPX3010 Blade Specifications