ADLINK Technology HPERC-KBL-MC User manual

Leading EDGE COMPUTING
Manual Rev.: 1.1
Rev. Date: September 28, 2021
Part Number: 50M-00048-1010
HPERC-KBL-MC/MH
High Performance Extreme Rugged Computer System
User’s Manual

ii Revision History
Revision History
Revision Description of Changes Release Date
1.0 Initial release 2020-03-02
1.1 Add MXM-T1000 MXM module; update specifiations and pin
definitions 2021-09-28

Preface iii
HPERC-IBR-H
Preface
Copyright © 2020, 2021 ADLINK Technology Inc.
This document contains proprietary information protected by copyright. All rights are reserved.
No part of this manual may be reproduced by any mechanical, electronic, or other means in
any form without prior written permission of the manufacturer.
Disclaimer
The information in this document is subject to change without prior notice in order to improve
reliability, design, and function and does not represent a commitment on the part of the manu-
facturer.
In no event will the manufacturer be liable for direct, indirect, special, incidental, or conse-
quential damages arising out of the use or inability to use the product or documentation, even
if advised of the possibility of such damages.
Environmental Responsibility
ADLINK is committed to fulfill its social responsibility to global environmental
preservation through compliance with the European Union's Restriction of
Hazardous Substances (RoHS) directive and Waste Electrical and Electronic
Equipment (WEEE) directive. Environmental protection is a top priority for
ADLINK. We have enforced measures to ensure that our products, manufac-
turing processes, components, and raw materials have as little impact on the
environment as possible. When products are at their end of life, our custom-
ers are encouraged to dispose of them in accordance with the product dis-
posal and/or recovery programs prescribed by their nation or company.
Battery Labels (for products with battery)
California Proposition 65 Warning
WARNING: This product can expose you to chemicals including acrylamide, arsenic,
benzene, cadmium, Tris(1,3-dichloro-2-propyl)phosphate (TDCPP), 1,4-Dioxane,
formaldehyde, lead, DEHP, styrene, DINP, BBP, PVC, and vinyl materials, which are
known to the State of California to cause cancer, and acrylamide, benzene, cadmium, lead,
mercury, phthalates, toluene, DEHP, DIDP, DnHP, DBP, BBP, PVC, and vinyl materials, which
are known to the State of California to cause birth defects or other reproductive harm. For
more information go to www.P65Warnings.ca.gov.
ᑜ㔚ᳰ⺧࿁ᡴ

iv Preface
Trademarks
Product names mentioned herein are used for identification purposes only and may be trade-
marks and/or registered trademarks of their respective companies.
Conventions
Take note of the following conventions used throughout this manual to make sure that users
perform certain tasks and instructions properly.
NOTE:
NOTE:
Additional information, aids, and tips that help users perform tasks.
CAUTION:
Information to prevent minor physical injury, component damage, data loss, and/or
program corruption when trying to complete a task.
WARNING:
Information to prevent serious physical injury, component damage, data loss, and/or
program corruption when trying to complete a specific task.

Table of Contents v
HPERC-KBL-M
Table of Contents
Revision History.................................................................................... ii
Preface .................................................................................................. iii
List of Figures ..................................................................................... vii
List of Tables........................................................................................ ix
1 Introduction........................................................................................ 1
1.1 About the HPERC-KBL-M.......................................................................... 1
1.2 Using this Guide ........................................................................................ 1
1.3 Requirements............................................................................................. 1
1.4 Specifications............................................................................................. 2
1.5 Block Diagram............................................................................................ 4
1.6 Power Specifications................................................................................. 5
1.7 What’s in the Box....................................................................................... 6
2 Getting Started................................................................................... 7
2.1 Preparation................................................................................................. 7
2.2 Setting Up the Work Space ...................................................................... 7
2.3 Mounting the Enclosure............................................................................ 7
2.4 Connecting Peripherals........................................................................... 11
2.5 Front Panel Connectors & LEDs ............................................................ 12
2.6 Breakout Cable Descriptions.................................................................. 14
2.7 P2 and P3 Military Connectors............................................................... 15
2.7.1 P2 and P3 Connector Locations..................................................................15
2.7.2 P2 Pin Definitions..........................................................................................16
2.7.3 P3 Pin Definitions..........................................................................................19
2.8 Powering Up the HPERC-KBL-M............................................................ 23
2.9 Internal Components............................................................................... 24
3 BIOS Setup....................................................................................... 25
3.1 Menu Structure......................................................................................... 25
3.2 Main........................................................................................................... 26
3.2.1 BIOS Information...........................................................................................26
3.2.2 Processor Information.................................................................................. 26
3.2.3 PCH Information............................................................................................26
3.2.4 ME FW Version..............................................................................................27
3.2.5 ME Firmware SKU.........................................................................................27
3.2.6 SPI Clock Frequency ....................................................................................27
3.2.7 Hardware Version..........................................................................................27
3.2.8 System Management ....................................................................................28
3.2.9 System Language .........................................................................................30

vi Table of Contents
3.2.10 System Date and Time..................................................................................30
3.3 Advanced.................................................................................................. 31
3.3.1 CPU Configuration........................................................................................31
3.3.2 Power & Performance...................................................................................32
3.3.3 PCH-FW Configuration.................................................................................33
3.3.4 Trusted Computing.......................................................................................33
3.3.5 NCT6106D Super IO Configuration..............................................................34
3.3.6 NCT5104DSEC Super IO Configuration......................................................36
3.3.7 Serial Port Console Redirection..................................................................37
3.3.8 Network Stack Configuration.......................................................................41
3.3.9 CSM Configuration........................................................................................41
3.3.10 USB Configuration........................................................................................42
3.4 Chipset ..................................................................................................... 43
3.4.1 System Agent (SA) Configuration...............................................................43
3.4.2 PCH-IO Configuration...................................................................................44
3.5 Security .................................................................................................... 47
3.5.1 Password Description ..................................................................................47
3.6 Boot........................................................................................................... 48
3.6.1 Boot Configuration .......................................................................................48
3.7 Save & Exit ............................................................................................... 49
Important Safety Instructions ............................................................ 51
Getting Service.................................................................................... 53

List of Figures vii
HPERC-KBL-M
List of Figures
Figure 1-1: HPERC-KBL-M Block Diagram ........................................................................... 4
Figure 1-2: HPERC-KBL-M Unit with Optional Accessories .................................................. 6
Figure 2-1: Top and Front Views of “MH” Enclosure with Mounting Dimensions .................. 8
Figure 2-2: Top and Front Views of “MC” Enclosure with Mounting Dimensions .................. 9
Figure 2-3: Bottom View of “MC” Enclosure with Mounting Holes....................................... 10
Figure 2-4: Front View of HPERC-KBL-M I/O Panel ........................................................... 12
Figure 2-5: P2 and P3 Military Interface Connector Pin Locations ...................................... 15

viii List of Figures
This page intentionally left blank.

List of Tables ix
HPERC-KBL-M
List of Tables
Table 1-1: HPERC-KBL-M Specifications ............................................................................ 2
Table 1-2: System Power Requirements.............................................................................. 5
Table 2-1: I/O Panel Connectors ........................................................................................ 13
Table 2-2: DB9 Male Connector Pin Definition................................................................... 14
Table 2-3: GPIO Breakout Wires........................................................................................ 14
Table 2-4: P2 Connector Pin Definitions and Signal Maps................................................. 16
Table 2-5: P3 Connector Pin Definitions and Signal Maps................................................. 19

xList of Tables
This page intentionally left blank.

1
HPERC-KBL-M
1 Introduction
1.1 About the HPERC-KBL-M
The HPERC products are intended for users of embedded systems requiring long life-cycles,
configuration control, and ruggedness in hardened military packages. HPERC models feature
Extreme Rugged computer boards available with varieties of processors and memory. An
optional operating system (OS) can be pre-loaded onto an optional internal storage device
(two 2.5" SSDs).
1.2 Using this Guide
This guide provides the most efficient way to set up your HPERC-KBL-M with your desired
OS. The instructions provided in this guide include:
XPreparing to use the HPERC-KBL-M and inspecting the accessories
XConnecting peripherals to the HPERC-KBL-M
XPowering up the HPERC-KBL-M
Information not provided in this User’s Guide includes:
XBoard or Module specifications
XBoard or Module header signals and descriptions
XOperating system programming or operating instructions
1.3 Requirements
The following peripherals and devices are needed to make full use of the HPERC-KBL-M.
XPeripherals (user-provided):
ZUSB or PS/2 keyboard
ZUSB or PS/2 mouse
ZDisplay monitor
XPower Supply (optional):
ZAC Adapter (with plug-type mating cord)
NOTE:
NOTE:
Refer to OS manufacturers’ manuals for instructions when using OS software.
NOTE:
NOTE:
The items listed above are not available from ADLINK.

2
1.4 Specifications
Table 1-1: HPERC-KBL-M Specifications
VITA Standards VITA 75
Mechanical
MC:
• Form Factor: VITA-75.22 Conductive Cold Plate
• Dimensions: 223.65(L) x 177.80(W) x 98.70(H) mm (with mounting brackets)
• Weight: 4.7kg
MH:
• Form Factor: VITA-75 Finned Passive Convection
• Dimensions: 304.80(L) x 150.00(W) x 129.95(H) mm (with mounting brackets)
• Weight: 5.6kg
Processor Intel® Xeon® Processor E3-1505M v6
• 4C/8T Intel® Xeon® Processor E3-1505M v6, 3.00 GHz, 8MB Cache, TDP 45W
Chipset Intel® CM238 Chipset
Host Memory 16GB dual channel DDR4-2400 DRAM with ECC, soldered onboard
BIOS AMI EFI BIOS, 64Mbit SPI flash memory
Graphics Intel® HD Graphics P630
• 2x DVI and 1x VGA (3 simultaneous display outputs)
GPGPU Optional: • NVIDIA Quadro P1000/P2000 w/ 4GB GDDR5 memory in MXM slot
• NVIDIA Quadro T1000 w/ 4GB GDDR6 memory in MXM slot
Gigabit Ethernet Four Intel® i210 10/100/1000 Ethernet ports
Serial Port Seven RS-232/RS-422 serial ports
USB 2.0 Six USB 2.0 ports routed (500 mA)
PS/2 One PS/2 Keyboard port
One PS/2 Mouse port
SMBus SMBus 2.0 supported
GPIO Eight GPIO
Audio High Definition Audio Controller (ALC262) • 1x amplified stereo output
• 1x stereo input
TPM Infineon SLB9665XT2.0 Module
Storage Interface Two SATA 6 Gb/s ports for 2.5” onboard drives (removable)
One SDHC slot supports up to 32GB SDHC
RAID Supports RAID 0/1 via Intel chipset
I/O Connector MIL-DTL-38999 (uniquely-keyed)
Expansion Busses MXM (PCIe x16 Gen3) PCI/104 Express® Type 2 (PCIe Gen2)
PCI Express Mini Card (PCIe Gen2)
OS Compatibility Microsoft Windows 10 RHEL 7.3
Other OS support by request
Power States S0, S1, S3, S4

3
HPERC-KBL-M
Operating
Temperature
MC: Cold plate conduction, VITA 75.22 mount
•CPU Only: -40°C to +85°C at cold plate*
•With MXM-P1000/P2000: -40°C to +74°C at cold plate*
•With MXM T1000: -40°C to +71°C at cold plate*
*Note: Dependent on an external thermal solution design that maintains the temperature at
any point on the cold plate surface within the indicated temperature range.
MH: Top-cover heatsink cooled (free air convection), VITA 75.21 mount
•CPU Only: -40°C to +75°C ambient*
•With MXM-P1000/P2000: -40°C to +70°C ambient (with 30 CFM airflow)
•With MXM T1000: -40°C to +69°C ambient (with 43.6 CFM airflow)
Storage Temperature -40°C to +85°C
Power 18 to 36VDC input
Relative Humidity 95% at +60°C non-condensing
Certifications
Temperature • MIL-STD-810G - 501.5 Procedure II
• MIL-STD-810G - 502.5, Procedure 1 and 2
Immersion IEC60529 Edition 2.2: 2013; IP67
Shock
• MIL-STD-810G, Method 516.6, Procedure I (Functional Shock),
Table 516.6-I (40 G for Ground Equipment)
• MIL-STD-810G, Method 516.6, Procedure V (Crash Hazard),
Table 516.6-I (75 G for Crash Hazard Shock)
Vibration
• MIL-STD-810G, Method 514.6, Table 514.6C-X,
Category 9 - Helicopter vibration exposure (General)
• MIL-STD-810G, Method 514.6, Figure 514.6C-10,
Category 11 - Rail cargo vibration exposure.
• MIL-STD-810G, Method 514.6, Figure 514.6D-9,
Category 21 - Shipboard random vibration exposure
• MIL-STD-810G, Method 514.6, Table 514.6C-VI,
Category 4 - Composite wheeled vehicle vibration exposure
EMI/EMC
MIL-STD-461F Certification: Ground Army, Aircraft, Navy compliance
• CE101: Navy ASW aircraft & Army aircraft (incl. flight line, below 28V)
• CE102: Ground Army, Aircraft, Navy
• CS101: Ground Army, Aircraft, Navy
• CS115: Ground Army, Aircraft, Navy
• RE102: Air & space (Fixed Wing External and Helicopters)
• RS101: Ground Army
• RS103: 100V/m (Ground Army, Ground Navy)
• RE101: Ground Navy
• CS106: Ground Army, Aircraft, Navy (Vpeak=400V)
• CS114: Aircraft (external or safety critical) -Curve5
• CS116: Ground Army, Aircraft, Navy (Imax=10A)
Power • MIL-STD-704F
• MIL-STD-1275E
Table 1-1: HPERC-KBL-M Specifications

4
1.5 Block Diagram
Figure 1-1: HPERC-KBL-M Block Diagram
4x PCIe x1
Intel® Xeon®
Processor
E3-1505M v6
DDR4 2133MHz
DDR4 2133MHz
MXM
Connector
PCIe x16 Link
Intel® CM238
Chipset
DMI
6x SATA
2x DVI-D
VGA
HD Audio
4x USB 2.0
PCIe x4
PCIe
Switch
(1 & 2)
XIO2001
PCIe-to-PCI
Bridge
PCIe x1
PCI/104-Express – Type-B Connector
PCI-32bit
33/66MHz
PCIe x4
PCI/104-Express – Type-A connector (Type-2)
SMBus
2x USB2.0
PCIe x1 Mini-PCIe
slot
Super I/O
SCH31141
LPC Bus
2x USB3.
PS/2
4x RS232/422
3x RS232/422
HDMI
PEX 8618
LPC Bus
2x SATA
4x PCIe x1
2x PCIe x4
SDIO
SDI USB to
SDIO
USB 2.0
4x Intel® i210 GbE
F81216AU-I

5
HPERC-KBL-M
1.6 Power Specifications
Table 1-2 lists the current and power draw of the HPERC-KBL-M, featuring the Intel® Xeon®
Processor E3-1505M v6 (3.00GHz). Input power is +24 VDC regulated.
Table 1-2: System Power Requirements
Parameter Current (Power)
Idle
(Windows 10) 1.1A (26.4W)
Intel TA tool @100%
(Windows 10) 3.16A (75.9W)
Inrush Current 1.5A (36W)

6
1.7 What’s in the Box
Check the items in the shipping box for the HPERC-KBL-M Unit and optional accessories
(sold separately).
Figure 1-2: HPERC-KBL-M Unit with Optional Accessories
SATA
Cooling Fins
(pre-installed on MH
version only)
Mounting Brackets
Breakout
Cables
HPERC Accessories (sold separately)
AC Mating
Cable
DC Cable
Connector
Breakout
Cables
ACAdapter
HPERC-KBL-MH
Cold Plate
(pre-installed on MC
version, only)
HPERC-KBL-MC

7
HPERC-KBL-M
2 Getting Started
2.1 Preparation
Follow the setup steps in this section in the order listed. Skip any steps that do not apply to
your application.
XVerify the contents of the shipping box are the same as your HPERC-KBL-M order.
XIf anything is missing or damaged, call your sales representative. Refer to the Getting
Service chapter for contact information.
2.2 Setting Up the Work Space
2.3 Mounting the Enclosure
Install mounting screws (not included) for surface or wall mounting to the mounting brackets of
the HPERC-KBL-M. Refer to Figure 2-1 and Figure 2-2 for the mounting hole locations of your
model.
Torque Values
NOTE:
NOTE:
To prevent damage to the HPERC-KBL-M, ensure sufficient clearance exists around the
cooling solution for unrestricted airflow.
The air temperature inside the enclosure could rise above the specified operating
temperature limits if the airflow through the cooling solution is restricted.
Select workbench
location.
• The workbench location should be a flat clean surface for setup and
operation (including the connection of any external peripherals and
optional devices).
• Ensure sufficient airflow clearance exists around the complete
enclosure.
Unpack
HPERC-KBL-M.
• Remove the HPERC-KBL-M from its shipping container and place it on
a flat work surface.
• The HPERC-KBL-M enclosure combined with CPU, storage (SSD),
and the desired OS form a complete system, ready for operation.
NOTE:
NOTE:
There are no limitations to the mounting orientation of the device.
Nominal Diameter Material: Stainless Steel
A2-70 and A4-70 Material: Stainless Steel A2-80 and A4-80 Material: SCM3 (SCM435) Strength Grade: 12.9
M6 (HPERC-KBL-MC) 7.6 Nm 11.1 Nm 13.83 Nm
M8 (HPERC-KBL-MH) 18.4 Nm 26.7 Nm 33.34 Nm

8
Figure 2-1: Top and Front Views of “MH” Enclosure with Mounting Dimensions
12.000 ±0.022
304.80 ±0.55
5.906 ±0.016
150 ±0.4
4.331 ±0.014
110 ±0.35
1.575
40
0.622 ±0.008
15.8 ±0.2
8.000 ±0.006
203.20 ±0.15
1.000 ±0.008
25.4 ±0.2
2.000 ±0.016
50.8 ±0.4
1.000 ±0.008
25.4 ±0.2
2.756 ±0.008
70 ±0.2
0.374 ±0.008
9.5 ±0.2
8.587 ±0.020
218.1 ±0.5
8.805 ±0.026
223.65 ±0.65
10.000 ±0.022
254 ±0.55
2.433 ±0.014
61.80 ±0.35
2.200 ±0.014
55.87 ±0.35
1.410 ±0.014
35.82 ±0.35
2.953 ±0.014
75 ±0.35
4.495 ±0.014
114.18 ±0.35
5.116
+
-
0.022 0.012
129.95
+
-
0.55 0.30
Dimensions in mm [inches]

9
HPERC-KBL-M
Figure 2-2: Top and Front Views of “MC” Enclosure with Mounting Dimensions
5.906 ±0.008
150 ±0.2
6.500 ±0.008
165.1 ±0.2
7.000 ±0.014
177.80 ±0.35
0.547
13.9
8.000 ±0.008
203.2 ±0.2
8.587 ±0.020
218.1 ±0.5
2.000 ±0.008
50.8 ±0.2
6.000 ±0.008
152.4 ±0.2
8.805 ±0.026 223.65 ±0.65
1.410 ±0.014
35.82 ±0.35
2.953 ±0.014
75 ±0.35
4.495 ±0.014
114.18 ±0.35
0.354
9
3.886
+
-
0.022 0.012
98.70
+
-
0.55 0.30
1.453 ±0.014
36.90 ±0.35
1.686 ±0.014
42.83 ±0.35
Dimensions in mm [inches]

10
Figure 2-3: Bottom View of “MC” Enclosure with Mounting Holes
Optional mounting points for
surface/wall mounting or heat
sink (HPERC-KBL-MC only)
• Mounting holes “A” and “B” are shown below in Figure 2-3. Note
the recommended torque values and maximum depth of hole
“B”.
6.100 ±0.008
154.94 ±0.20
2.287 ±0.008
58.1 ±0.2
2.000 ±0.008
50.8 ±0.2
2.000 ±0.008
50.8 ±0.2
1.398 ±0.008
35.5 ±0.2
3.500 ±0.008
88.9 ±0.2
5.138 ±0.008
130.5 ±0.2
5.843 ±0.008
148.4 ±0.2
1.398 ±0.008
35.5 ±0.2
7.646 ±0.008
194.2 ±0.2
1.723 ±0.008
43.78 ±0.20
4.022 ±0.008 102.15 ±0.20
2.854 ±0.008
72.5 ±0.2
6.173 ±0.008
156.8 ±0.2
2.126 ±0.008
54 ±0.20
574.80 ±7.87
14.6 ±0.2
2000.00 ±7.87
50.8 ±0.2
A
A
A
A
B
B
B
B
B
B
B
AA
Mounting Hole “A” Size: M4 threaded
Recommended Torque: 30 Kgf-cm (2.85 N-m)
Mounting Hole “B” Size: M4 threaded, max. depth 7mm
Recommended Torque: 41 Kgf-cm (4 N-m)