ADLINK Technology VPX3020 Series User manual

Manual Rev.: 1.0
Revision Date: August 25, 2022
Part No: 50M-00050-1000
VPX3020 Series
Performance Rugged Conduction Cooled
3U VPX Intel®Xeon®Processor E
Processor Blade
User’s Manual

ii Revision History
Revision History
Revision Release Date Description of Change(s)
1.0 2022/08/25 Initial release

Preface iii
VPX3020
Preface
Copyright © 2022 ADLINK Technology, Inc.
This document contains proprietary information protected by copy-
right. All rights are reserved. No part of this manual may be repro-
duced by any mechanical, electronic, or other means in any form
without prior written permission of the manufacturer.
Disclaimer
The information in this document is subject to change without prior
notice in order to improve reliability, design, and function and does
not represent a commitment on the part of the manufacturer.
In no event will the manufacturer be liable for direct, indirect, spe-
cial, incidental, or consequential damages arising out of the use or
inability to use the product or documentation, even if advised of
the possibility of such damages.
Environmental Responsibility
ADLINK is committed to fulfill its social responsi-
bility to global environmental preservation
through compliance with the European Union's
Restriction of Hazardous Substances (RoHS)
directive and Waste Electrical and Electronic
Equipment (WEEE) directive. Environmental
protection is a top priority for ADLINK. We have
enforced measures to ensure that our products,
manufacturing processes, components, and raw
materials have as little impact on the environment as possible.
When products are at their end of life, our customers are encour-
aged to dispose of them in accordance with the product disposal
and/or recovery programs prescribed by their nation or company.
Battery Labels (for products with battery)
ᑜ㔚ᳰ⺧࿁ᡴ

iv Preface
California Proposition 65 Warning
WARNING: This product can expose you to chemicals
including acrylamide, arsenic, benzene, cadmium,
Tris(1,3-dichloro-2-propyl)phosphate (TDCPP), 1,4-Diox-
ane, formaldehyde, lead, DEHP, styrene, DINP, BBP, PVC, and
vinyl materials, which are known to the State of California to cause
cancer, and acrylamide, benzene, cadmium, lead, mercury,
phthalates, toluene, DEHP, DIDP, DnHP, DBP, BBP, PVC, and
vinyl materials, which are known to the State of California to cause
birth defects or other reproductive harm. For more information go
to www.P65Warnings.ca.gov.
Trademarks
Product names mentioned herein are used for identification pur-
poses only and may be trademarks and/or registered trademarks
of their respective companies.
Conventions
Take note of the following conventions used throughout this
manual to make sure that users perform certain tasks and
instructions properly.
NOTE:
NOTE:
Additional information, aids, and tips that help users perform
tasks.
CAUTION:
Information to prevent minor physical injury, component dam-
age, data loss, and/or program corruption when trying to com-
plete a task.
WARNING:
Information to prevent serious physical injury, component
damage, data loss, and/or program corruption when trying to
complete a specific task.

Table of Contents v
VPX3020
Table of Contents
Revision History...................................................................... ii
Preface .................................................................................... iii
List of Figures ....................................................................... vii
List of Tables.......................................................................... ix
1 Introduction ........................................................................ 1
1.1 Overview.............................................................................. 1
1.2 Features............................................................................... 1
1.3 Block Diagrams.................................................................... 2
1.4 Model Number Decoder - Processor Blade ......................... 3
1.5 Package Contents ............................................................... 5
2 Specifications..................................................................... 7
2.1 VPX3020 Blade Specifications ............................................ 7
2.2 VPX-R3020 RTM Specifications.......................................... 9
2.3 Power Consumption .......................................................... 10
3 Functional Description .................................................... 13
3.1 Processors......................................................................... 13
3.2 Intel® Turbo Boost Technology ......................................... 15
3.3 Chipset............................................................................... 16
3.4 USB ................................................................................... 16
3.5 SPI BIOS ........................................................................... 16
3.6 System Management Bus.................................................. 17
3.7 Real Time Clock ................................................................ 17
3.8 Serial ATA Controller ......................................................... 17
3.9 PCI Express Interface........................................................ 17
3.10 Intel ® Gigibit Ethernet Controller I350 .............................. 17
3.11 Graphics ............................................................................ 18
3.12 GPIO Expander PCA9554 ................................................. 18

vi Table of Contents
3.13 UART NCT5104................................................................. 18
3.14 TPM ................................................................................... 18
3.15 XMC Site............................................................................ 18
4 VPX3020 Board Interfaces ............................................... 19
4.1 VPX3020 Board Layout ..................................................... 19
4.2 VPX3020 Mechanical Dimensions..................................... 20
4.3 VPX3020 Connector Pin Assignments .............................. 22
4.4 Status LEDs ....................................................................... 27
5 VPX-R3020 RTM ................................................................ 29
5.1 Connector Allocation.......................................................... 29
5.2 VPX-R3020 Block Diagram................................................ 30
5.3 VPX-R3020 RTM Board Layout......................................... 31
5.4 VPX-R3020 RTM Connector Pin Assignments.................. 32
6 Getting Started .................................................................. 37
6.1 Installing the VPX3020 to the Chassis............................... 37
6.2 Installing the VPX-R3020 to the Chassis........................... 37
6.3 Driver Installation ............................................................... 38
7 Utilities ............................................................................... 39
7.1 Watchdog Timer................................................................. 39
8 BIOS Setup ........................................................................ 45
8.1 Starting the BIOS ............................................................... 45
8.2 Main Setup Menu............................................................... 47
8.3 Advanced ........................................................................... 49
8.4 Server Mgmt ...................................................................... 58
8.5 Chipset............................................................................... 59
8.6 Boot ................................................................................... 71
8.7 Save & Exit ........................................................................ 73
Important Safety Instructions............................................... 75
Getting Service ...................................................................... 77

List of Figures vii
VPX3020
List of Figures
Figure 1-1: VPX3020 Functional Block Diagram................................ 2
Figure 4-1: VPX3020 Top Side Layout ............................................ 19
Figure 4-2: VPX3020 Bottom Side Layout ....................................... 19
Figure 4-3: VPX3020 Conduction-Cooled Mechanical Dimensions. 20
Figure 4-4: VPX3020 Air-Cooled Mechanical Dimensions............... 21
Figure 4-5: VPX3020 Front View ..................................................... 27
Figure 5-1: VPX-R3020 RTM Functional Block Diagram ................. 30
Figure 5-2: VPX-R3020 RTM Board Layout..................................... 31

viii List of Figures
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List of Tables ix
VPX3020
List of Tables
Table 1-1: VPX3020 SKU Table ....................................................... 4
Table 2-1: VPX3020 Blade Specifications ........................................ 7
Table 2-2: VPX-R3020 RTM Specifications...................................... 9

x List of Tables
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Introduction 1
VPX3020
1 Introduction
1.1 Overview
The VPX3020 Series is a 3U VPX processor blade based on the
Intel® Xeon® Processor E-2254ML (formerly "Coffee Lake-H
Refresh"), supporting DDR4-2666 ECC soldered memory up to
16GB. For storage, the VPX3020 provides a high endurance sol-
dered 32GB SLC SSD. The VPX3020 is compliant with the VITA
48 and VITA 65 specifications.
The VPX3020 Series with server grade Intel® processor brings
extreme computing power with low power consumption. A total of
PCIe x16 Gen3 lanes are supported, with PCIe x8 to rear support-
ing DMA and non-transparent bridge for peer-to-peer communica-
tion and PCIe x8 Gen3 to XMC. Graphics is supported by
integrated Intel GPU with DisplayPort to P2.
The ADLINK VPX3020 provides an Infineon TPM 2.0 chip for sys-
tem security, dual BIOS functionality, as well as an ADLINK ABS-
Diag self-diagnosis tool. These features bring additional value by
ensuring high reliability. All components on the VPX3020 Series
are soldered on the PCB board to ensure product reliability and
quality, and enable compliance with MIL-STD-810G shock and
vibration. The VPX3020 supports a wide operating temperature
range from -40°C to +75°C (optionally up to +85°C).
The VPX3020 Series is available in a rugged conduction cooled
version with conformal coating and an air cooled version to meet
different application needs. A VPX-R3020 Rear Transition Module
is available to access rear I/O signals for users to validate
VPX3020 functionality.
1.2 Features
Intel® Xeon® Processor E-2254ML
(formerly "Coffee Lake-H Refresh")
DDR4-2666 soldered ECC SDRAM up to 16GB
32GB SATA SLC SSD option
Up to PCIe x16 Gen3 interface supporting non-transparent
bridge
One XMC expansion slot, PCIe x8 Gen3 with Rear I/O to P2

2 Introduction
1.3 Block Diagrams
Figure 1-1: VPX3020 Functional Block Diagram
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Introduction 3
VPX3020
1.4 Model Number Decoder - Processor Blade
(A) CPU Code
E-2254ML = Intel® processor E-2254ML, 4 cores, 25W
TDP
(B) Memory Size Code
M16 = 16GB DDR4-2666 ECC soldered SDRAM
(C) SATA NAND Flash Size Code
S32 = SLC NAND flash 32GB SATA 6Gb/s via add-on card
(D) PCI Express interface code
XMC = XMC interface
P8 = PCI Express x8 Gen3 (BOM option)
(E) Ruggedized Level Code
R1 = Conduction Cooled version supporting -40°C to
+75°C at card edge
R2 = Conduction Cooled version supporting -40°C to
+85°C at card edge
A1 = Air Cooled version supporting -40°C to +75°C
VPX3020/2254/M16/S32/XMC-R2
(E)(A) (B) (C) (D)

4 Introduction
VPX3020 SKU Table
Note: Items in red differ between SKU options.
Function XMC Version PCIe Version
XMC PCIe x8 Gen3 (or 2x PCIe x4)
w/ rear IO to P2 (X8d+X12d) N/A
Ethernet 1x 1000BASE-T + 2x 1000BASE-BX to P1
PCI
Express
PCIe Switch downstream port to P1
Station 0 port: 2 x4
Station 1 port: 1 x4
N/A 2x PCIe Gen3 x4 to P2
SATA
6Gbps
SATA 6Gb/s to P2
SATA 6Gb/s SLC NAND flash 32GB
GPIO 3x GPIO
Serial
1x RS-232/422 (COM1) to P2
1x RS-232/422/485 (COM2) to P2 (BOM option as 4x GPIO)
Table 1-1: VPX3020 SKU Table

Introduction 5
VPX3020
1.5 Package Contents
The VPX3020 is packaged with the following components. If any
of the items on the contents list are missing or damaged, retain the
shipping carton and packing material and contact the dealer for
inspection. Please obtain authorization before returning any prod-
uct to ADLINK. The packing contents of the VPX3020 are
non-standard configurations and may vary depending on customer
requests.
Processor Blade
VPX3020
CPU and memory specifications will differ depending on
options selected
Thermal module is assembled on the board
Rear Transition Module (optional)
VPX-R3020 RTM
Test Backplane (optional)
tBP-VPX3020 test backplane
NOTE:
NOTE:
The contents of non-standard VPX3020 configurations may vary
depending on the customer requirements.
CAUTION:
This product must be protected from static discharge and physi-
cal shock. Never remove any of the components except at a
static-free workstation. Use the anti-static bag shipped with the
product when putting the board on a surface. Wear an anti-static
wrist strap properly grounded on one of the system's ESD ground
jacks when installing or servicing system components.

6 Introduction
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Specifications 7
VPX3020
2 Specifications
2.1 VPX3020 Blade Specifications
VITA
Standards
• VITA 46.0 VPX Base Standard
• VITA 46.4 PCI Express on VPX Fabric Connector
• VITA 46.6 Gigabit Ethernet Control Plane on VPX
• VITA 46.9 PMC/XMC/Ethernet Signal Mapping to 3U/6U VPX
• VITA 46.10 Rear Transition Module on VPX
• VITA 46.11 System Management on VPX
• VITA 48.0 Ruggedized Enhanced Design Implementation
Mechanical Base Specification
• VITA 65 OpenVPX Architecture Framework for VPX
Mechanical • Conduction-cooled 3U VPX
• Air-cooled 3U VPX
Processor • Intel® Xeon® Processor E-2254ML, 4 cores, 25W TDP
Chipset • Intel® CM246 Chipset
Memory • Dual channel 1.2V DDR4 2666MT/s SDRAM with ECC,
up to 16GB
USB • 1x USB 3.0 (backwards compatible) to P2
(can be separated to USB 3.0 only + USB 2.0)
XMC • PCIe x8 Gen3 w/ rear IO (X8d+X12d) to P2 (XMC SKU only)
Gigabit
Ethernet
• 1x 10/100/1000BASE-T + 2x 10/100/1000BASE-BX to P1
PCI Express • 2x PCIe switch downstream port configuration to P1:
Station 0 port: 2 x4
Station 1 port: 1 x4
• 2x PCIe 3.0 x4 to P2 (PCIe SKU only)
SATA • SATA 6Gb/s to P2
• SATA 6Gb/s SLC NAND flash 32GB
Graphics • 1x DisplayPort to P2
• Integrated Intel® GPU engine
IPMC • Smart Fusion A2F200 with VPX code base
GPIO • 3x GPIO to P1
Table 2-1: VPX3020 Blade Specifications

8 Specifications
Note: Specifications are subject to change without prior notice.
Serial • 1x RS-232/422 (COM1) to P2
• 1x RS-232/422/485 (COM2) to P2
Note: RS-422 on COM1 & RS-485 on COM2 are not
simultaneously supported.
RTC •ToP1
TPM • Infineon TPM version 2.0
LEDs • Status LEDs on front and rear
Reset Button • On front panel
Watchdog
Timer
• System reset or NMI with programmable interva
Environmental • Operating Temperature: -40°C to +85°C at wedge locks
• Storage Temperature: -50°C to +100°C
• Relatively Humidity: 95% non-condensing
• Shock: sawtooth 40G, 11ms, each axis, operating
• Vibration: 15Hz-2KHz, 12Grms, random, each axis, operating
• Thermal Dissipation: convection and conduction
• Operating Altitude: 60,000 feet (VITA 47)
EMI • CE, FCC Class A
Table 2-1: VPX3020 Blade Specifications

Specifications 9
VPX3020
2.2 VPX-R3020 RTM Specifications
Note: Specifications are subject to change without prior notice.
Ethernet • 2x 1000BASE-BX via RP1
• 1x 1000BASE-T via RP1
Graphics • 1x DisplayPort signal via RP1
SATA • 1x SATA 6Gb/s via RP1 (7 pin vertical SATA connector)
USB • 1x USB 3.0 (backwards compatible) via RP1
Serial • Serial Port 1: RS232 (2T2R) via RP1 (DB-9 connector)
• Serial Port 2: RS232 (2T2R) via RP2 (2x5 pin header)
GPIO • 2-bit GPIO signal via RP1 (2x3 pin header)
PCIe • 1x PCIe x4 via RP0, 2x PCIe x4 via RP1
• 2x PCIe x4 via RP2
JTAG • JTAG via RP0 (2x5 pin header)
Reset • Reset via RP0
SMBus • SMBus signal via RP0
Power • Power terminal for +12V, +5V, +3.3V, GND
Table 2-2: VPX-R3020 RTM Specifications

10 Specifications
2.3 Power Consumption
This section provides information on the power consumption of the VPX3020
Series when using Intel® Xeon® E-2254ML processors with Dual Channel
8GB DDR4-2666 soldered memory and SATA SSD. The VPX3020 is pow-
ered by 5V and 3.3V. Windows 10 Typical power consumption was measured
running BurnInTest at 100% loading. Windows 10 Max Loading power con-
sumption was measured running Intel TAT test at 100% loading.
Processor Xeon® E-2254ML (1.7 GHz)
Windows Idle mode, EIST Enabled
3.3V (A) 2.03
5V (A) 0.77
Power Cons. (W) 10.55
Windows Idle mode, EIST Disabled
3.3V (A) 2.02
5V (A) 0.78
Power Cons. (W) 10.57
Windows Typical mode, EIST Enabled
3.3V (A) 3.5
5V (A) 6.3
Power Cons. (W) 43.05
Windows Typical mode, EIST Disabled
3.3V (A) 3.1
5V (A) 6.1
Power Cons. (W) 40.73
Windows Max Loading mode, EIST Enabled
Package Power reading (TAT) 25.00W
Package Temperature reading (TAT) 74°C
CPU DTS reading (TAT) 72°C
CPU frequency reading (TAT) 1287MHz
3.3V (A) 2.7
5V (A) 6.45
Power Cons. (W) 41.74