ADLINK Technology COM Express Express-BD7 User manual

Leading EDGE COMPUTING
Express-BD7
User’s Manual
COM Express Basic Size Type 7 Module with up to 16 cores
Intel® Xeon D and Pentium® D SoC
Manual Rev.: 1.2
Revision Date: November 18, 2021
Part Number: 50M-00057-1020

ii Preface
Preface
Copyright
Copyright © 2017, 2019, 2021 ADLINK Technology, Inc. This document contains proprietary information protected
by copyright. All rights are reserved. No part of this manual may be reproduced by any mechanical, electronic, or
other means in any form without prior written permission of the manufacturer.
Disclaimer
The information in this document is subject to change without prior notice in order to improve reliability, design, and
function and does not represent a commitment on the part of the manufacturer. In no event will the manufacturer
be liable for direct, indirect, special, incidental, or consequential damages arising out of the use or inability to use
the product or documentation, even if advised of the possibility of such damages.
Environmental Responsibility
ADLINK is committed to fulfill its social responsibility to global environmental preservation through compliance with
the European Union's Restriction of Hazardous Substances (RoHS) directive and Waste Electrical and Electronic
Equipment (WEEE) directive. Environmental protection is a top priority for ADLINK. We have enforced measures to
ensure that our products, manufacturing processes, components, and raw materials have as little impact on the
environment as possible. When products are at their end of life, our customers are encouraged to dispose of them
in accordance with the product disposal and/or recovery programs prescribed by their nation or company.
Trademarks
Product names mentioned herein are used for identification purposes only and may be trademarks and/or
registered trademarks of their respective companies.
Revision History
Revision Description Date By
1.0 Initial release 2017-06-20 JC
1.1 Add Windows 10 64-bit support; add GBE0_ACT#, GBE0_LINK# same source
note (pins A8/B2)
2019-11-14 JC
1.2 Remove display from specification; update addresses 2021-11-18 JC

Express-BD7
Preface iii
Table of Contents
Preface................................................................................................................................ii
List of Figures ....................................................................................................................v
List of Tables.....................................................................................................................vi
1. Introduction................................................................................................................1
2. Specifications............................................................................................................3
2.1. Core System ...............................................................................................................3
2.2. Expansion Busses ......................................................................................................3
2.3. 10Gigabit Ethernet......................................................................................................4
2.4. Gigabit Ethernet..........................................................................................................4
2.5. NC-SI ..........................................................................................................................4
2.6. Multi I/O and Storage..................................................................................................4
2.7. Serial I/O on Module ...................................................................................................5
2.8. Trusted Platform Module (TPM) .................................................................................5
2.9. SEMA Board Controller ..............................................................................................5
2.10. Debug......................................................................................................................5
2.11. Power Specifications ...............................................................................................6
2.12. Power Consumption ................................................................................................6
2.13. Operating Temperatures .........................................................................................6
2.14. Environmental .........................................................................................................6
2.15. Specification Compliance ........................................................................................6
2.16. Operating Systems..................................................................................................6
2.17. Functional Diagram .................................................................................................7
2.18. Mechanical Drawing ................................................................................................8
3. Pinouts and Signal Descriptions..............................................................................9
3.1. AB/CD Pin Definitions.................................................................................................9
3.2. Signal Description Terminology ................................................................................12
3.3. AB Signal Descriptions .............................................................................................13
3.4. CD Signal Descriptions.............................................................................................20
4. Connector Pinouts on Module................................................................................25
4.1. Connector, Switch and LED Locations .....................................................................25
4.2. 40-pin Debug Connector...........................................................................................26
4.3. Status LEDs..............................................................................................................27
4.4. XDP Debug Header .................................................................................................. 28
4.5. Fan Connector ..........................................................................................................29

iv Preface
4.6. BIOS Setup Defaults Reset Button...........................................................................30
4.7. Switch Settings .........................................................................................................31
4.8. PCIe x16-to-two-x8 Adapter Card.............................................................................32
4.9. PCIe x8-to-two-x4 Adapter Card...............................................................................32
5. Smart Embedded Management Agent (SEMA) .....................................................33
5.1. Board Specific SEMA Functions...............................................................................34
6. System Resources ..................................................................................................37
6.1. System Memory Map................................................................................................37
6.2. Direct Memory Access Channels..............................................................................39
6.3. Fixed I/O Address Range Map .................................................................................39
6.4. Variable I/O Address Range Map .............................................................................40
6.5. APIC Interrupt Mapping ............................................................................................41
6.6. PCI Configuration Space Map ..................................................................................42
6.7. PCI Interrupt Routing Map ........................................................................................43
6.8. SMBus Address Table ..............................................................................................43
7. BIOS Setup...............................................................................................................45
7.1. Menu Structure .........................................................................................................45
7.2. Main ..........................................................................................................................46
7.3. Advanced..................................................................................................................48
7.4. Chipset......................................................................................................................61
7.5. Security.....................................................................................................................74
7.6. Boot ..........................................................................................................................75
7.7. Save & Exit ...............................................................................................................76
8. BIOS Checkpoints, Beep Codes.............................................................................77
8.1. Status Code Ranges.................................................................................................78
8.2. Standard Status Codes.............................................................................................78
8.3. OEM-Reserved Checkpoint Ranges......................................................................... 85
9. Mechanical Information...........................................................................................87
9.1. Board-to-Board Connectors......................................................................................87
9.2. Thermal Solution.......................................................................................................88
9.3. Mounting Methods ....................................................................................................91
9.4. Standoff Types..........................................................................................................92
Safety Instructions...........................................................................................................93
Getting Service.................................................................................................................94

Express-BD7
Preface v
List of Figures
Figure 1: Express-BD7 Functional Block Diagram...................................................................................7
Figure 2: Express-BD7 Mechanical Drawing............................................................................................8
Figure 3: Express-BD7 Connector, Switch and LED Locations ............................................................ 25
Figure 4: Express-BD7 and the DB40 Debug Module .......................................................................... 25
Figure 5: cExpress Switch Locations .................................................................................................... 31
Figure 6: COM Express Mounting Methods ..........................................................................................91
Figure 7: COM Express Standoff Types................................................................................................ 92

vi Preface
List of Tables
Table 1: Express-BD7 AB/CD Pin Definitions ..........................................................................................9
Table 2: 40-pin Debug Connector Pin Definition ................................................................................... 26
Table 3: Express-BD7 LED Descriptions .............................................................................................. 27
Table 4: XDP Debug Header Pin Definition .......................................................................................... 28
Table 5: Fan Connector Pin Definition .................................................................................................. 29
Table 6: BIOS Select and Mode Configuration Switch Settings............................................................ 31
Table 7: SEMA Onboard Voltage Monitor ............................................................................................. 34
Table 8: SEMA BMC Status .................................................................................................................. 34
Table 9: SEMA Exception Codes .......................................................................................................... 35
Table 10: SEMA BMC Flags.................................................................................................................. 36

Express-BD7
Introduction 1
1. Introduction
The Express-BD7 is a COM Express® COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel® Xeon®
processor D and Intel® Pentium® D processor system-on-chip (SoC) ( formerly “Broadwell-DE”). The Express-BD7
is specifically designed for customers who need excellent computing performance with balanced power
consumption and multiple 10G Ethernet connectivity in a long product life solution.
The Express-BD7 features Intel® Virtualization Technology (including VT-x, VT-d, EPT), Intel® Hyper-Threading
Technology (up to 16 cores, 32 threads), Intel® Trusted Execution Technology, Intel® AES-NI Technology, and
DDR4 ECC (or non-ECC) dual-channel memory at 1866/2133/2400 MHz (dependent on SoC SKU) to provide
excellent overall performance.
An integrated Intel® 10G Ethernet controller supports two 10GBASE-KR interfaces, relevant sideband signals and
NC-SI. The Express-BD7 is designed to serve customers with optimized computing capability per watt and high
speed connectivity requirements who want to outsource the custom core logic of their systems for reduced
development time.
The Express-BD7 has dual stacked SODIMM sockets supporting up to 32 GB of DDR4 ECC (or non-ECC) memory.
Input/output features include 24 PCIe Gen3 lanes, up to 8 PCIe Gen2 lanes, a single onboard Gigabit Ethernet port,
USB 3.0/2.0 ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with
SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, hardware monitor,
and watchdog timer.

2 Introduction
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Express-BD7
Specifications 3
2. Specifications
2.1. Core System
CPU Intel® Xeon® processor D, Pentium® D processor (formerly “Broadwell-DE”)
•Intel® Xeon® D1539 1.6/1.9 GHz 35W (8C, up to 2133MHz) (eTEMP)
•Intel® Xeon® D1519 1.5/1.8 GHz 25W (4C, up to 2133MHz) (eTEMP)
•Intel® Xeon® D1548 2.0/2.3 GHz 45W (8C, up to 2400MHz)
•Intel® Xeon® D1527 2.2/2.5 GHz 35W (4C, up to 2133MHz)
•Intel® Pentium® D1508 2.2/2.5 GHz 25W (2C, up to 1866MHz)
•Intel® Xeon® D1559 1.5/1.8 GHz 45W (12C, up to 2133MHz) (eTEMP)
•Intel® Xeon® D1577 1.3/1.6 GHz 45W (16C, up to 2400MHz)
Note: D1559, D1577 are supported by project basis. Please contact local sales.
Supporting: Intel® VT (including VT-x, VT-d, VT-x with Extended Page Tables), Intel® HT
Technology, Intel® SSE4.2, Intel® 64 Architecture, Intel® Turbo Boost Technology 2.0,
Intel® AVX2, Intel® TSX-NI, Intel® Platform Protection Technology with Intel® TXT and
Execute Disable Bit, Intel® Data Protection Technology with Intel® Secure Key and Intel®
AES-NI
Note: Availability of features may vary between processor SKUs.
Cache 24MB for D1577, 18MB for D1559, 12MB for D1548/D1539, 6MB for D1527/D1519,
3MB for D1508
Memory Dual channel ECC (or non-ECC) 1866/2133/2400 MHz DDR4 memory up to 32GB in dual
stacked SODIMM sockets
Note: Supported memory frequencies may vary between processor SKUs.
Embedded BIOS AMI EFI with CMOS backup in 16MB SPI BIOS
Chipset Integrated in SoC
2.2. Expansion Busses
PCI Express 16 PCI Express Lanes Gen3 (CD):
Lanes 16-31 (four controllers, can be configured to 1 x16, 2 x8 or 4 x4/x2/x1)
8 PCI Express Lanes Gen3 (AB):
Lanes 8-15 (two controllers, can be configured to 1 x8 or 2 x4/x2/x1)
Up to 8 PCI Express Lanes Gen2 (AB/CD):
Lanes 0-7 (two controllers defined by PICMG, can be configured to x4, x2, x1)
Notes:
•PCIe lane 7 is supported by build option, in place of GbE
•Although Broadwell-DE platform supports eight roots on Lanes 0-7, the PICMG COM.0
R3.0 specification for Lanes 0-7 states: “Type7 module may support eight x1 root hubs.
It is expected that future generation products may limit the number of available root
hubs.”
Other •LPC bus
•SMBus (system)
•I2C (user)

4 Specifications
2.3. 10Gigabit Ethernet
Integrated on Processor Intel® 10G Ethernet Controller
10GbE Feature Support •Two 10GBASE-KR (on CD connector)
•Sideband signals (on CD connector) for 10GbE
•10G_INT
•10G_PHY_MDIO_SDA and 10G_PHY_MDC_SCL (manage/control signals
between MAC and PHY)
•10G_PHY_CAP (PHY mode capability pin, used to indicate whether the PHY on
carrier board needs I2C or MDIO signals from module)
•10G_PHY_RST (PHY reset signal, only for Optical PHY)
•10G_LED_SDA and 10G_LED_SCL (LED signals carried through dedicated I2C
bus; additional strapping signal through I2C bus; LED signals programmable for
indicating ACT, LINK, Speed)
•10G_SFP_SDA and 10G_SFP_SCL (dedicated for Optical PHY use, connect to
external SFP module)
•10G_SDP (Software-Definable Pin for general purpose)
2.4. Gigabit Ethernet
Intel Controller Intel® i210 Ethernet Controller
Interface 10/100/1000 Mbit/s connection
2.5. NC-SI
zNC-SI (on AB connector): manageability interface, connecting to IPMI BMC located on carrier board
•Routing from Intel® i210 Ethernet Controller to row AB connector by default
•Build option to support routing from 10GbE controller to row AB connector
2.6. Multi I/O and Storage
I/O Hub Integrated on SoC
USB 4x USB 3.0/2.0 (USB 0,1,2,3)
SATA* 2x SATA 6Gb/s (SATA 0,1)
GPIO 4 GPO and 4 GPI
*Note: For SATA 6Gb/s compatibility, it is strongly recommended to use a SATA redriver on the carrier board.