ADLINK Technology AMSTX-CF Series User manual

Leading EDGE COMPUTING
AMSTX-CF Series
User’s Manual
Embedded Motherboard supporting MXM Graphics Module with
8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
Manual Rev.: 1.1
Revision Date: April 20, 2021
Part Number: 50M-00020-1010

ii Preface
Preface
Copyright
Copyright © 2020, 2021 ADLINK Technology, Inc. This document contains proprietary information protected by
copyright. All rights are reserved. No part of this manual may be reproduced by any mechanical, electronic, or other
means in any form without prior written permission of the manufacturer.
Disclaimer
The information in this document is subject to change without prior notice in order to improve reliability, design, and
function and does not represent a commitment on the part of the manufacturer. In no event will the manufacturer
be liable for direct, indirect, special, incidental, or consequential damages arising out of the use or inability to use
the product or documentation, even if advised of the possibility of such damages.
Environmental Responsibility
ADLINK is committed to fulfill its social responsibility to global environmental preservation
through compliance with the European Union's Restriction of Hazardous Substances (RoHS)
directive and Waste Electrical and Electronic Equipment (WEEE) directive. Environmental
protection is a top priority for ADLINK. We have enforced measures to ensure that our products,
manufacturing processes, components, and raw materials have as little impact on the
environment as possible. When products are at their end of life, our customers are encouraged
to dispose of them in accordance with the product disposal and/or recovery programs
prescribed by their nation or company.
Battery Labels (for products with battery)
廢電池請回收
California Proposition 65 Warning
WARNING: This product can expose you to chemicals including acrylamide, arsenic, benzene,
cadmium, Tris(1,3-dichloro-2-propyl)phosphate (TDCPP), 1,4-Dioxane, formaldehyde, lead, DEHP,
styrene, DINP, BBP, PVC, and vinyl materials, which are known to the State of California to cause
cancer, and acrylamide, benzene, cadmium, lead, mercury, phthalates, toluene, DEHP, DIDP, DnHP,
DBP, BBP, PVC, and vinyl materials, which are known to the State of California to cause birth defects or other
reproductive harm. For more information go to www.P65Warnings.ca.gov.
Trademarks
Product names mentioned herein are used for identification purposes only and may be trademarks and/or
registered trademarks of their respective companies.

AMSTX-CF Series
Preface iii
Revision History
Revision Description Date By
1.0 Initial release 2020-12-21 JC
1.1 Add new models (EGX-MXM-RTX3000 and EGX-MXM-RTX5000); add MXM
cooler for RTX5000 and 500W power supply; update specifications; update block
diagrams; add mating connector list; update DisplayPort BIOS settings
2021-04-20 JC

iv Preface
Table of Contents
Preface................................................................................................................................ii
List of Figures ...................................................................................................................vi
List of Tables....................................................................................................................vii
1Introduction................................................................................................................1
1.1 Packing List ................................................................................................................1
1.2 Available Models.........................................................................................................1
1.3 Optional Accessories ..................................................................................................1
2Specifications............................................................................................................3
2.1 Core System ...............................................................................................................3
2.2 I/O Interface ................................................................................................................3
2.3 Video...........................................................................................................................4
2.4 Audio...........................................................................................................................4
2.5 Power Supply..............................................................................................................4
2.6 Temperatures .............................................................................................................4
2.7 Humidity......................................................................................................................4
2.8 Certificate (EMC) ........................................................................................................5
2.9 Form Factor ................................................................................................................5
2.10 Operating Systems .....................................................................................................5
2.11 Functional Block Diagram...........................................................................................5
3Mechanical Layout ....................................................................................................7
3.1 Connector Locations...................................................................................................7
3.2 Mechanical Dimensions............................................................................................10
4Connector Pinouts ..................................................................................................11
4.1 LEDs .........................................................................................................................11
4.2 Internal Connectors ..................................................................................................12
4.3 Jumper and Switch Settings .....................................................................................21
5Driver Installation....................................................................................................25
6System Resources ..................................................................................................27
6.1 System Memory Map................................................................................................27
6.2 I/O Map .....................................................................................................................27
6.3 Interrupt Request (IRQ) Lines...................................................................................28
6.4 PCI/PCIe Device.......................................................................................................30
6.5 SMBus Slave Addresses ..........................................................................................31

AMSTX-CF Series
Preface v
7Digital Input/Output Function Library....................................................................33
7.1 DI/O with Windows API.............................................................................................33
8DisplayPort BIOS Settings......................................................................................35
8.1 MXM P1000/P2000/T1000/RTX3000/ RTX5000 ......................................................35
8.2 MXM P3000/P5000...................................................................................................35
9BIOS Setup...............................................................................................................37
9.1 Menu Structure .........................................................................................................38
9.2 Main ..........................................................................................................................39
9.3 Advanced..................................................................................................................42
9.4 Chipset......................................................................................................................56
9.5 Security.....................................................................................................................61
9.6 Boot ..........................................................................................................................62
9.7 Save & Exit ...............................................................................................................63
Safety Instructions...........................................................................................................64
Getting Service.................................................................................................................65

vi Preface
List of Figures
Figure 1: Functional Block Diagram .........................................................................................................5
Figure 2: IO Panel Connector Locations ..................................................................................................7
Figure 3: Onboard Connector Locations- Top Side .................................................................................8
Figure 4: Onboard Connector Locations - Bottom Side ...........................................................................9
Figure 5: Mechanical Dimensions - Top View ....................................................................................... 10

AMSTX-CF Series
Preface vii
List of Tables
Table 1: IO Panel Connector Definitions ..................................................................................................7
Table 2: Onboard Connector Definitions - Top Side ................................................................................8
Table 3: Onboard Connector Definitions - Bottom Side ...........................................................................9
Table 4: System Memory Map .............................................................................................................. 27
Table 5: IO Map..................................................................................................................................... 27
Table 6: IRQ Lines PIC Mode................................................................................................................ 28
Table 7 IRQ Lines APIC Mode .............................................................................................................. 28
Table 8 PCI Configuration Space Map.................................................................................................. 30
Table 9 PCI Interrupt Routing Map........................................................................................................ 31
Table 10 SMBus Slave Addresses........................................................................................................ 31

viii Preface
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AMSTX-CF Series
Introduction 1
1 Introduction
Embedded graphics enable system developers to boost the performance of a wide range of workloads, including
medical imaging, image analysis, compute acceleration, and artificial intelligence (AI). Leveraging graphics
processing units (GPUs), embedded graphics can be used to increase application speed and accuracy, as well as
decrease latency. Many embedded system developers use embedded graphics solutions in real-world applications
from the medical and manufacturing industries, to traffic management. System developers, OEMs, and system
integrators can more easily deploy embedded graphics with support from ADLINK’s large portfolio of computing
products designed in a wide range of form factors. The AMSTX-CF Series Micro-STX motherboard features a
socket-type CPU and support for Scalable Graphics Processing Ranging from Pascal to Turing GPUs in a compact
form factor. Combining its strong expertise serving embedded developers and its close relationship with NVIDIA,
ADLINK is delivering high-performance, long-life embedded graphics solutions for a variety of market segments.
1.1 Packing List
•AMSTX-CF embedded motherboard
•CPU cooler bracket (P/N: 32-50015-0100-A0)
•M3 screw, P-head, L4, Ni for M.2 E/B/M Key (P/N: 33-03013-0040) (3 for Q370, 2 for H310)
•2x M3 screw, I-head, L4, Nylok for MXM (P/N: 33-03306-0040)
1.2 Available Models
Model AMSTX-CFP12-Q370 AMSTX-CFP35-Q370 AMSTX-CFP12-H310 AMSTX-CFP35-H310
MXM
Support
EGX-MXM-P1000
EGX-MXM-P2000/
EGX-MXM-T1000
EGX-MXM-RTX3000
EGX-MXM-RTX5000
EGX-MXM-P3000
EGX-MXM-P5000
EGX-MXM-P1000
EGX-MXM-P2000
EGX-MXM-1000
EGX-MXM-RTX3000
EGX-MXM-RTX5000
EGX-MXM-P3000
EGX-MXM-P5000
Chipset Intel® Q370 Chipset Intel® H310 Chipset
1.3 Optional Accessories
•65W CPU cooler (P/N: 32-20495-0000)
•35W CPU cooler (P/N: 32-20378-0000-A0)
•MXM cooler for P1000/P2000 (P/N: 32-20797-0200-A0)
•MXM cooler for P3000/P5000 (P/N: 32-20823-0020-A0)
•MXM cooler for T1000 (P/N: 32-20830-0200-A0)
•MXM cooler for RTX3000 (P/N: 32-20823-1100-A0)
•MXM cooler for RTX5000 (P/N: 32-20839-1000-A0)
•12V/240W adaptor (P/N: 31-62164-0010-A0)
•500W power supply (12V/41.7A) (P/N: 91-95296-000E)
•Wi-Fi Kit Intel® Wireless-AC 9260 non-vPRO (P/N: 91-95266-0020)
•AMSTX/DLAP-3000 CPU cooler bracket (included by default) (PN: 32-50015-0100-A0)

2 Introduction
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AMSTX-CF Series
Specifications 3
2 Specifications
2.1 Core System
zCPU:Desktop 8th/9th Generation Intel® Core™ i7/i5/i3 Processor, LGA1151 socket
•Intel® Core™ i7-9700E, 2.6GHz, 12M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (8C/8T)
•Intel® Core™ i7-9700TE, 1.8GHz, 12M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (8C/8T)
•Intel® Core™ i5-9500E, 3.0GHz, 9M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/6T)
•Intel® Core™ i5-9500TE, 2.2GHz, 9M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/6T)
•Intel® Core™ i3-9100E, 3.1GHz, 6M Cache, 65W TDP, LGA1151, DDR4 2400MHz support (4C/4T)
•Intel® Core™ i3-9100TE, 2.2GHz, 6M Cache, 35W TDP, LGA1151, DDR4 2400MHz support (4C/4T)
•Intel® Core™ i7-8700, 3.2GHz, 12M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/12T)
•Intel® Core™ i7-8700T, 2.4GHz 12M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/12T)
•Intel® Core™ i5-8500, 3.0GHz, 9M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/6T)
•Intel® Core™ i5-8500T, 2.1GHz, 9M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/6T)
•Intel® Core™ i3-8100, 3.6GHz, 6M Cache, 65W TDP, LGA1151, DDR4 2400MHz support (4C/4T)
•Intel® Celeron® G4900, 3.1GHz, 2M Cache, 54W TDP, LGA1151, DDR4 2400MHz support (2C/2T)
•Intel® Celeron® G4900T, 2.9GHz, 2M Cache, 35W TDP, LGA1151, DDR4 2400MHz support (2C/2T)
zChipset: Intel® Q370 or H310 Chipset
zTPM: TPM 2.0 (optional)
zMemory: Non-ECC DDR4 2666/2400 MHz, 2x SODIMM, up to 64 GB (dependent on CPU)
zBIOS: AMI® UEFI BIOS, 256 Mb (Q370) or 128 Mb (H310) SPI flash memory
zMXM Graphics Module Support:
•AMSTX-CFP12-Q370/H310: EGX-MXM-P1000, EGX-MXM-P2000, EGX-MXM-T1000, EGX-MXM-
RTX3000, EGX-MXM-RTX5000
•AMSTX-CFP35-Q370/H310: EGX-MXM-P3000, EGX-MXM-P5000
2.2 I/O Interface
zPCB Edge Connector:
•Q370 SKU: 1x PCIe x8 PCB edge connector (data is from 2x PCIe Gen3 x4 root ports, one set of clocks,
up to 50W), one PCIe power connector up to [email protected] / 5V@4A
•H310 SKU: 1x PCIe x8 PCB edge connector (data is from 1x PCIe Gen2 x1 root ports, one set of clocks,
up to 50W), one PCIe power connector up to [email protected] / 5V@4A
zLAN: 1x GbE (Intel® i219-LM), 3x GbE (Intel® i210-AT)
zSATA:
•Q370 SKU: 2x SATA 6Gb/s, one SATA power connector 2x SATA 6Gb/s signals via M.2 M & B key
connector, Intel® RST RAID Support
•H310 SKU: 2x SATA 6Gb/s, one SATA power connector 1x SATA 6Gb/s signal via M.2 B key connector
zUSB:
•Q370 SKU: 4x USB 3.2 Gen1 x1 ports, 2x USB 2.0 pin headers, 2x USB 3.2 Gen1 x1 pin headers
•H310 SKU: 4x USB 3.2 Gen1 x1 ports, 4x USB 2.0 pin headers
zDIO: 1x 10-pin/2.0mm wafer: DI/DO: 4 in and 4 out
zCOM: 1x RS-232/422/485 pin header, 1x RS-232 pin header (CCtalk supported by jumper setting)

4 Specifications
zM.2:
•Q370 SKU: 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/BT module, 1x M.2 B key supporting 2242 or
2280 for SATA storage module, 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module
•H310 SKU: 1x M.2 E key supporting 1630 or 2230 for Wi-Fi /BT module, 1x M.2 B key supporting 2242 or
2280 for SATA storage module
2.3 Video
zGraphics Engine:
•Integrated Intel® HD Graphics series (based on CPU, Q370 SKU supports three independent display and
H310 SKU supports two independent display)
•ADLINK MXM module (optional)
zInterfaces:
•From Intel® HD Graphics:
2x DP connector, resolution up to 4096 x 2304 @ 60 Hz, and DP++ support
1x HDMI connector (vertical type on PCB), resolution up to 4096 x 2160 @ 24 Hz
1x LVDS (optional, default is WO/LVDS), dual channel 24-bit or 18-bit up to 1920 x 1200 Hz
•From MXM:
4x DP connectors, signal from MXM module, resolution based on MXM module, DP++ support
2.4 Audio
zAudio Codec: Realtek® ALC262-VC2-GR or ALC888S-VD2-GR
•Interfaces:
Default: 1x 10-pin wafer (box header) for Mic-in/Line out/Line in, connector via additional audio module
Optional 1: Mic in / 6W speaker_out_L+6W speaker_out_R. (onboard 10-pin wafer, connector via
additional audio module)
Optional 2: Line in / 6W speaker_out_L+6W speaker_out_R. (onboard 10-pin wafer, connector via
additional audio module)
2.5 Power Supply
zDC input: DC 12V input (Molex DC-in jack)
zAC input:
•Optional: 240W (12V @20A) AC/DC adapter
•Optional: 500W (12V @41.7A) AC/DC power supply
2.6 Temperatures
zOperating Temperature:
•0°C to 60°C (w/o MXM)
•0°C to 55°C (w/MXM, excluding EGX-MXM-RTX5000)
•0°C to 45°C (EGX-MXM-RTX5000)
zStorage Temperature: -40°C to 85°C
2.7 Humidity
z5% to 95%, non-condensing

AMSTX-CF Series
Specifications 5
2.8 Certificate (EMC)
zEN55032/35, EN61000-6-2/-4, CE, FCC Part 15B Class B
2.9 Form Factor
z197.72 x 167.32 mm (W x L)
zADLINK proprietary mounting hole locations, ADLINK proprietary CPU cooler bracket
2.10 Operating Systems
zMicrosoft® Windows® 10 64-bit
zUbuntu 18.04.10 LTS 64-bit
2.11 Functional Block Diagram
DP CN
CPU FAN
DUAL 24/18bits
Channel A
Channel B
eDP(2-Lanes)
8th/9th Gen Intel®
Core™ Processor
(Coffee Lake-S)
DDI 1 (PORT B) : DP
DDI 2 (PORT C) : DP
DDI 3 (PORT D) : HDMI
PCI Express x16 (GEN3)
SATA
Default
Default
JTAG
SMBUS
GPIO
USB2.0x2
DP CN
PCIex1
S
P339E_EXAR
SUPER I/O
F81866AD-I_FINTEK
SW
PI3DBS12212A_Diodes
A
udio Codec
M.2_E_key CNx1
2230 size (default)
SW
P
I3DBS12212A_Diodes
BOM
Option
LAN3
i210_Intel
LAN4
i210_Intel
RJ45
CN
BOM
Option
SW
P
I3DBS12212A_Diodes
M.2_B_key CNx1
2280 size (default)
LAN2
i210_Intel
DP CN
LVDS CN DP CN
SODIMM 2
DDR4 non-ECC Socket
SODIMM 1
DDR4 non-ECC Socket
LPC bus
MXM3.1 slot
Port A
Port B
Port C
Port D
DP CN
DP CN
HDMI CN
AMP
TPA3132D2_TI
DMI
USB3. Gen1x1 *4 + RJ45
x1 CN *2
2
2
2
USB3. Gen1x1
USB2.0
LAN
HD
A
Line In
Mic In
Line Out
USB2.0
Speaker Out
USB3. Gen1x1
PCIex1
USB2.0
PCIex1
SAT
A
USB2.0
PCIex1 *2
USB2.0
A
DM213EA_ADI
UART
UART
System FAN
GPU FAN
BIOS
SPI
PCIex
4
or SAT
A
USB3. Gen1x1
2
USB3. Gen1x1 2
TPM 2.0
SLB9665_Infineon
*2(H310)
*2(Q370)/USB2.0
For Q370 SKU: 1x PCIe x8 PCB edge connector
(data is from 2x PCIe Gen3 x4 root ports, one set of clocks, up to 50W)
For H310 SKU: 1x PCIe x8 PCB edge connector
(data is from 1x PCIe Gen2 x1 root ports, one set of clocks, up to 50W)
DIO 10 pins
Wafer x1
Default: 1x 10-pin wafer (box header) for
Mic-in/Line out/Line in, connector via
additional audio module
Option 1: Mic in / 6W speaker_out_L+6W
speaker_out_R. (onboard 10-pin wafer,
connector via additional audio module)
Option 2: Line in / 6W speaker_out_L+6W
speaker_out_R. (onboard 10-pin wafer,
connector via additional audio module)
GbE LAN1
i219LM_Intel
DP to LVDS
PTN3460IBS_NXP
Lite BMC
STM32L071RBT6_ST
DB40
RS-232
RS-232/422/485
SATA CN x2
M.2_M_key
CNX1 22
80 size
(Q370 only)
Intel®
PCH Q370/H310
Chipset
Figure 1: Functional Block Diagram

6 Specifications
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AMSTX-CF Series
Mechanical Layout 7
3 Mechanical Layout
3.1 Connector Locations
Figure 2: IO Panel Connector Locations
Table 1: IO Panel Connector Definitions
Item Description Remarks
A DisplayPort (from CPU) CN1
B LAN (I210-AT) RJ453
C LAN (I210-AT) CN24
D LAN (I219-LM) CN23
E 2x USB 3.2 Gen1 x1 CN24
F 2x USB 3.2 Gen1 x1 CN23
G HDMI (from CPU) HDMI1
H DisplayPort (from MXM) U13
I DisplayPort (from MXM) U27
J 12V DC-in connector CN3
E F
A B H I
C D
G
J

8 Mechanical Layout
FGH I J K
A
B
C
D
EL
M
N
O
P
Q
R
S
W
XYZb a cd
T
U
V
ef
g
FGH I J K
A
B
C
D
EL
M
N
O
P
Q
R
S
W
XYZb a cd
T
U
V
ef
g
Figure 3: Onboard Connector Locations- Top Side
Table 2: Onboard Connector Definitions - Top Side
Item Description Item Description
A CPU socket R Panel backlight power and resolution jumper (CN13)
B DRAM socket for DIMM1 S MXM connector (CN5)
C DRAM socket for DIMM2 T PCB edge connector
D CPU Fan connector U RTC battery connector (CN16)
E System fan connector V GPU fan connector
F 2x USB2.0 pin header (CN22) W 12V DC in connector (CN3)
G RS-232 pin header for COM1 (CN7) X Display port C and Display port D from MXM
H RS-232/422/485 pin header for COM2 (CN8) Y Display port A and Display port B from MXM
I 2x USB 3.2 Gen1 x1 pin headers (Q370)
2x USB 2.0 pin headers (H310)
Z HDMI from CPU
J Multi-purpose connector (CN6) a LAN1 and USB 3.2 Gen1 x1 ports 1/2
K Audio pin header (CN9) b LAN4 and USB 3.2 Gen1 x1 ports 3/4
L PCIe power connector (CN10) c LAN2 and LAN3
M SATA connector (SATA1) d Display port 1 and Display port 2 from CPU
N SATA connector (SATA2) e BMC status LED (LED2, Blue)
O SATA power connector (CN14) f BMC watchdog LED (LED3, Red)
P Power on module connector (CN12) g Data format and Color Depth selection for LVDS (SW1)
Q DIO connector (CN11)

AMSTX-CF Series
Mechanical Layout 9
E
I
A
DC
B
FG
H
J
E
I
A
DC
B
FG
H
J
Figure 4: Onboard Connector Locations - Bottom Side
Table 3: Onboard Connector Definitions - Bottom Side
Item Description
A DB40 connector (CN19)
B M.2_B Key connector (CN17)
C M.2_M Key connector (CN20)
D M.2_E Key connector (CN15)
E LVDS (CN21)
F Multi-IO voltage selection (SW9)
G RI#,5V,12V selection (SW7)
H HSIO Selection (SW5)
I LVDS Channel selection (SW2)
J DIO voltage selection (SW8)
K LVDS VDD selection (SW6)
K

10 Mechanical Layout
3.2 Mechanical Dimensions
Dimensions: mm
Top View
23.50
162.32
5
162.32
169.80
5
132.35
167.32
183.72
197.72
7.604
12.90
34.93
55.92
77.62
116.87
147.86
Figure 5: Mechanical Dimensions - Top View
Side View
31.051.60
8.50

AMSTX-CF Series
Connector Pinouts 11
4 Connector Pinouts
See 3.1 Connector Locations on page 7 for connector locations.
4.1 LEDs
4.1.1 BMC Status LED and WDT LED
4.1.1.1 Status LED (Blue, LED2)
The Status LED is controlled by SEMA. The Status LED will signal system state changes and power up failures
including HW-Reset, SW-Reset, Power-Up, Power-Down, Reset-Button and Power-Button activity. Power-up
failures can be caused by a corrupted BIOS or failures at the onboard power supply. When the system is in an S3
state, the Status LED will blink to indicate the type of failure.
LED
Blink
Code Status
0 NOERROR
2 NO_SUSCLK
3 NO_SLP_S5
4 NO_RSMRST
5 NO_SLP_S3
7 PLTRST_FAIL
8 NO_SYS_PWRGD
10 CRITICAL_TEMP
11 NO_VIN
12 NO_VRTC
4.1.1.2 WDT LED (Red, LED3)
The WDT LED is driven by SEMA and will light when a watchdog timeout occurs. It stays on until it is cleared by
software or by pressing the reset button.
4.1.2 Ethernet Connectors LEDs
4.1.2.1 Active/Link LED Indicators
LED Color Status Description
OFF Ethernet port is disconnected
ON Ethernet port is connected with no activity
Orange
Flashing Ethernet port is connected and active
4.1.2.2 Speed LED Indicators
LED Color Status Description
OFF 10 Mbps
Green 100 Mbps
Green/Orange
Orange 1000 Mbps

12 Connector Pinouts
4.2 Internal Connectors
4.2.1 USB 2.0 Pin Header (CN22)
Pin Signal
1 P5V_USB1
2 P5V_USB2
3 CN_U2_USB9_N
4 CN_U2_USB14_N
5 CN_U2_USB9_P
6 CN_U2_USB14_P
7 GND
8 GND
9 NC
10 GND
4.2.2 USB 3.2 Gen1 x1 Pin Header (CN4)
Pin Signal Pin Signal
1 NC 11 P5V_USB56
2 CN_U3_USB6_T_P 12 CN_U2_USB5_N
3 CN_U3_USB6_T_N 13 CN_U2_USB5_P
4 GND 14 GND
5 CN_U3_USB6_R_P 15 CN_U3_USB5_R_N
6 CN_U3_USB6_R_N 16 CN_U3_USB5_R_P
7 GND 17 GND
8 CN_U2_USB6_P 18 CN_U3_USB5_T_N
9 CN_U2_USB6_N 19 CN_U3_USB5_T_P
10 P5V_USB56 20 NC
Note: An adapter cable is available to convert the USB 3.2 signals to USB 2.0. Contact your ADLINK
representative for more information.
1
10
120