ADLINK Technology Q7-AL User manual

Q7-AL
User’s Manual
Qseven Computer On Module (COM) with
Embedded Intel® Atom™, Pentium®, and Celeron® Processors
Manual Rev.: 1.0
Revision Date: March 2, 2018
Part Number: 50-1Z231-1000

ii Preface
Preface
Copyright
Copyright 2018 ADLINK Technology, Inc. This document contains proprietary information protected by copyright.
All rights are reserved. No part of this manual may be reproduced by any mechanical, electronic, or other means in
any form without prior written permission of the manufacturer.
Disclaimer
The information in this document is subject to change without prior notice in order to improve reliability, design, and
function and does not represent a commitment on the part of the manufacturer. In no event will the manufacturer
be liable for direct, indirect, special, incidental, or consequential damages arising out of the use or inability to use
the product or documentation, even if advised of the possibility of such damages.
Environmental Responsibility
ADLINK is committed to fulfill its social responsibility to global environmental preservation through compliance with
the European Union's Restriction of Hazardous Substances (RoHS) directive and Waste Electrical and Electronic
Equipment (WEEE) directive. Environmental protection is a top priority for ADLINK. We have enforced measures to
ensure that our products, manufacturing processes, components, and raw materials have as little impact on the
environment as possible. When products are at their end of life, our customers are encouraged to dispose of them
in accordance with the product disposal and/or recovery programs prescribed by their nation or company.
Trademarks
Product names mentioned herein are used for identification purposes only and may be trademarks and/or
registered trademarks of their respective companies.
Revision History
Revision Description Date By
1.0 Initial release 2018-03-02 DA

Q7-AL
Preface iii
Table of Contents
Preface................................................................................................................................ii
Table of Contents..............................................................................................................iii
List of Figures ....................................................................................................................v
List of Tables.....................................................................................................................vi
1. Introduction................................................................................................................1
2. Specifications ..........................................................................................................13
2.1. Core System...........................................................................................................13
2.2. Expansion Busses ..................................................................................................13
2.3. Video ......................................................................................................................14
2.4. Audio ......................................................................................................................15
2.5. LAN.........................................................................................................................15
2.6. Multi I/O and Storage..............................................................................................16
2.7. Serial I/O on Module ...............................................................................................17
2.8. SEMA Board Controller...........................................................................................17
2.9. Debug.....................................................................................................................18
2.10. Power Specifications...............................................................................................18
2.11. Power Consumption................................................................................................18
2.12. Operating Temperatures.........................................................................................19
2.13. Environmental.........................................................................................................19
2.14. Specification Compliance........................................................................................19
2.15. Operating Systems .................................................................................................19
2.16. Functional Diagram.................................................................................................20
2.17. Mechanical Drawing................................................................................................21
2.18. Q7-AL Heatspreaders.............................................................................................22
2.19. Q7-AL Top View and Bottom View..........................................................................26
3. Pinouts and Signal Descriptions............................................................................13
3.1. Primary/Secondary Pin Definitions..........................................................................13
3.2. Signal Description Terminology...............................................................................18
3.3. Qseven Signal Descriptions....................................................................................19
4. Connector Pinouts on Module................................................................................29
4.1. Connector, Switch, and LED Locations...................................................................29
4.2. Q7-AL and the DB40 Debug Module.......................................................................29
4.3. 36-pin MIPI-CSI2 Camera Connector......................................................................30
4.4. 40-pin Debug Connector.........................................................................................32

iv Preface
4.5. Status LEDs............................................................................................................33
4.6. BIOS Switch Settings..............................................................................................35
5. Smart Embedded Management Agent (SEMA) .....................................................37
5.1. Board Specific SEMA Functions .............................................................................38
6. System Resources ..................................................................................................41
6.1. System Memory Map..............................................................................................41
6.2. Direct Memory Access Channels ............................................................................41
6.3. I/O Map...................................................................................................................41
6.4. Interrupt Request (IRQ) Lines.................................................................................43
6.5. PCI Configuration Space Map.................................................................................44
6.6. PCI Interrupt Routing Map ......................................................................................46
6.7. SMBus Address Table ............................................................................................46
7. BIOS Setup...............................................................................................................47
7.1. Menu Structure .......................................................................................................47
7.2. Main........................................................................................................................48
7.3. Advanced................................................................................................................50
7.4. Chipset ...................................................................................................................60
7.5. Security...................................................................................................................66
7.6. Boot........................................................................................................................67
8. BIOS Checkpoints, Beep Codes.............................................................................69
8.1. Status Code Ranges...............................................................................................70
8.2. Standard Status Codes...........................................................................................70
8.3. OEM-Reserved Checkpoint Ranges .......................................................................77
9. Mechanical Information...........................................................................................79
9.1. Board-to-Board Connector......................................................................................79
9.2. Thermal Solution.....................................................................................................80
9.3. Mounting Requirements..........................................................................................83
Safety Instructions...........................................................................................................84
Getting Service.................................................................................................................85

Q7-AL
Preface v
List of Figures
Figure 1: Q7-AL Functional Block Diagram............................................................................................20
Figure 2: Q7-AL Mechanical Drawing ....................................................................................................21
Figure 3: Q7-AL-HS1 Heat Spreader Mechanical Drawing....................................................................22
Figure 4: Q7-AL-HS2 Heat Spreader Mechanical Drawing....................................................................23
Figure 5: Q7-AL-HS4 Passive Heatsink Mechanical Drawing ...............................................................24
Figure 6: Q7-AL-HS5 Passive Heatsink Mechanical Drawing ...............................................................25
Figure 7: Q7-AL Connector, Switch and LED Locations........................................................................29
Figure 8: Q7-AL and the DB40 Debug Module ......................................................................................30
Figure 9: Q7-AL LED Locations .............................................................................................................33
Figure 10: Q7-AL BIOS Switch Location................................................................................................35
Figure 11: Qseven Mounting Requirements...........................................................................................83

vi Preface
List of Tables
Table 1: Q7-AL Primary/Secondary Pin Definitions ...............................................................................13
Table 2: 36-pin MIPI-CSI Camera Connector Pin Definition on the Qseven Module.............................31
Table 3: 40-pin Debug Connector Pin Definition on the Qseven Module ..............................................32
Table 4: LED Descriptions......................................................................................................................34
Table 5: BIOS Select and Mode Configuration Switch Settings.............................................................35
Table 6: SEMA Onboard Voltage Monitor..............................................................................................38
Table 7: SEMA BMC Status...................................................................................................................38
Table 8: SEMA Exception Codes...........................................................................................................39
Table 9: SEMA BMC Flags.....................................................................................................................39

Q7-AL
Introduction 1
1. Introduction
The Q7-AL Computer-On-Module (COM) combines the QSeven® 2.1 standard with the Intel® (“Apollo Lake”) Atom
E-series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power
consumption and high pin/area density requirements. The module provides the high integration, high performance,
low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients,
digital signage, and in-vehicle infotainment systems.
The QSeven form factor affords a more compact profile and footprint than the other COM platforms. With
mechanical dimensions of 70mm width, 70mm length, and 2.3mm of overall height, Qseven ranks as one of the
smallest COM standards currently available.
The Q7-AL utilizes the upgrades in Intel’s latest (“Apollo Lake”) N-series and E-series SoCs such as the Intel 64
Architecture (“Goldmont”), the new HD graphics 500/505 engine (Gen-9), and a faster, 4-vector image processing
unit. The SoCs are manufactured on Intel’s industry-leading, tri-gate 14nm process, improving system performance
by supporting up to 8GB of system memory. Compared to the previous generation (“Braswell”), the Apollo Lake
SoC comes with a larger package size (24x31mm2) and pin count (1296 pins) and has updated the OS support by
adding Windows 10 IOT and removing support for Windows7/8.1 and WEC7/2013. Because Apollo Lake has more
I/O interfaces than Braswell, no pin compatibility exists between these two generations of SoCs.
New Intel SoC features:
•Integrated heat spreader on Atom E3950, E3940 and E3930
•Extended temperature SKUs (-40°C to +85°C)
•Windows 10 IOT support
•Gen-9 graphics engine with 18 execution units
•Up to 4-vector-unit image processing unit
•Up to 15 simultaneous 1080p30 decode streams
•Memory bandwidth increase to 38.4 GB/s
•4K display resolution with 60Hz
•4K video encode
•Embedded Apollo Lake-I and Apollo Lake have 15-year Intel support lifecycle
The Qseven module primarily targets embedded intelligent systems used in several vertical market segments such
as healthcare, industrial controllers and real-time systems, gaming devices, retail systems, edge IoT gateways, in-
vehicle infotainment systems, printers, thin clients, industrial and ruggedized tablets, and many others. The Q7-AL
supports contemporary, high-bandwidth interfaces such as Ultra HD HDMI, dual-channel LVDS, PCI Express Gen2,
Gigabit Ethernet, USB 2.0/3.0, SATA Gen3, two MIPI CSI cameras, and a state-of-the-art HD audio interface. The
module generates its own LVDS (18/24bit), TMDS, and DisplayPort++ video signals using eDP and DDI output
from the SoC.
Two SPI Flash chips implement a fail-safe BIOS, allowing the user to boot the module even if current BIOS settings
have corrupted the system. Other storage devices on the board include an optional eMMC NAND Flash device and
an optional SATA SSD.
Under the management of the BMC (Board Management Controller), the SEMA (Smart Embedded Management
Agent) utility provides system control, security, and failure protection—counting, monitoring, and measuring
hardware and software events, and using the SMBus to send corrective commands to the SoC.

2 Introduction
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Q7-AL
Specifications 13
2. Specifications
2.1. Core System
CPU Intel® Atom™ E39xx, Pentium® N4200, and Celeron® N3350, x86 dual-core or quad-
core SoCs (System on Chips) with integrated memory, graphics, and I/O (formerly
‘Apollo Lake’)
•Atom E3950 Quad-Core; 12W TDP; 1.6 GHz base freq; 2.0 GHz burst freq; up to 2400
MT/s; 500MHz graphics base freq; 650MHz graphics burst freq
•Atom E3940 Quad-Core; 9.5W TDP; 1.6 GHz base freq; 1.8 GHz burst freq; up to 2133
MT/s; 400MHz graphics base freq; 600MHz graphics burst freq
•Atom E3930 Dual-Core; 6.5W TDP; 1.3 GHz base freq; 1.8 GHz burst freq; up to 2133
MT/s; 400MHz graphics base freq; 550MHz graphics burst freq
•Pentium N4200 Quad-Core; 6W TDP; 1.1 GHz base freq; 2.5 GHz burst freq; up to
2400 MT/s; 200MHz graphics base freq; 750MHz graphics burst freq
•Celeron N3350 Dual-Core; 6W TDP; 1.1 GHz base freq; 2.4 GHz burst freq; up to 2400
MT/s; 200MHz graphics base freq; 650MHz graphics burst freq
Support: Intel VT-x, VT-d, Intel TXT, Intel SSE4.2, Intel 64 Architecture, Intel Turbo Boost
Technology 2.0, Intel AES-NI, and PCLMULQDQ Instruction DRNG
Note: Availability of features may vary between processor SKUs. Only Atom SKUs can
support extreme temperature operating range.
Cache 2MB L2 for all SKUs
Memory Dual channel non-ECC 2133/2400 MHz LPDDR4 memory; up to 8 GB soldered SDRAM
BIOS AMI EFI, 16MB SPI BIOS with CMOS backup
2.2. Expansion Busses
PCI Express 4x PCI Express x1 Gen2 :
Lanes 0/1/2/3, support up to 5 GT/s signal rate
Other •LPC bus
•SMBus (system)
•I2C (user)

14 Specifications
2.3. Video
Integrated on Processor Intel 9
th
Generation Low Power Graphics core architecture (Intel HD Graphics 500/505)
GPU Feature Support •2 to 3 independent and simultaneous display combinations of DisplayPort, HDMI, LVDS
and eDP
•Encode/transcode HD content
•Playback of high definition content including Blu-ray Disc
•Playback of Blu-ray disc S3D content using HDMI (1.4a spec compliant with 3D)
•DirectX Video Acceleration (DXVA2) support for accelerated video processing
•AVC/VC1/MPEG2/HEVC/VP8/JPEG HW decode
•AVC/MPEG2/HEVC/VP8/JPEG HW encode
•Advanced Scheduler 2.0, 1.0, XPDM support
•DirectX 12, OpenGL 4.3, OpenGL ES 3.0 and OpenCL 2.0
•Multi Display Support: 3 independent displays
Note: Availability of features may vary between processor SKUs.
Display Types •Single/dual channel 18/24-bit LVDS via eDP-to-LVDS chip from DDI2, supporting DE
mode and H/V-Sync mode display. Resolutions up to 1920x1200 with dual channel
LVDS.
•With eDP-to-LVDS chip removed (build option):
eDP (4096x2160@60Hz) at LVDS primary channel pins from DDI2 and DP
(4096x2160@60Hz) at LVDS secondary channel pins from DDI0. Requires compatible
carrier board.
•DisplayPort (4096x2160@60Hz)/HDMI (3840x2160@30Hz) from DDI1
Note: Supports HDMI 1.4b, DP 1.2a and eDP 1.3.
The figure below illustrates the default (LVDS) build configuration and the alternative (e)DP configuration: