ADLINK Technology nanoX-AL User manual

Leading EDGE COMPUTING
nanoX-AL
User’s Manual
COM Express Mini Size Type 10 Module with
Intel Atom®, Pentium®, Celeron® SoC
Manual Rev.: 1.3
Revision Date: July 16, 2020
Part Number: 50-1J088-1030

ii Preface
Preface
Copyright
Copyright © 2018-2020 ADLINK Technology, Inc. This document contains proprietary information protected by
copyright. All rights are reserved. No part of this manual may be reproduced by any mechanical, electronic, or other
means in any form without prior written permission of the manufacturer.
Disclaimer
The information in this document is subject to change without prior notice in order to improve reliability, design, and
function and does not represent a commitment on the part of the manufacturer. In no event will the manufacturer
be liable for direct, indirect, special, incidental, or consequential damages arising out of the use or inability to use
the product or documentation, even if advised of the possibility of such damages.
Environmental Responsibility
ADLINK is committed to fulfill its social responsibility to global environmental preservation
through compliance with the European Union's Restriction of Hazardous Substances (RoHS)
directive and Waste Electrical and Electronic Equipment (WEEE) directive. Environmental
protection is a top priority for ADLINK. We have enforced measures to ensure that our products,
manufacturing processes, components, and raw materials have as little impact on the
environment as possible. When products are at their end of life, our customers are encouraged
to dispose of them in accordance with the product disposal and/or recovery programs
prescribed by their nation or company.
Battery Labels (for products with battery)
廢電池請回收
California Proposition 65 Warning
WARNING: This product can expose you to chemicals including acrylamide, arsenic, benzene,
cadmium, Tris(1,3-dichloro-2-propyl)phosphate (TDCPP), 1,4-Dioxane, formaldehyde, lead, DEHP,
styrene, DINP, BBP, PVC, and vinyl materials, which are known to the State of California to cause
cancer, and acrylamide, benzene, cadmium, lead, mercury, phthalates, toluene, DEHP, DIDP, DnHP,
DBP, BBP, PVC, and vinyl materials, which are known to the State of California to cause birth defects or other
reproductive harm. For more information go to www.P65Warnings.ca.gov.
Trademarks
Product names mentioned herein are used for identification purposes only and may be trademarks and/or
registered trademarks of their respective companies.
Revision History
Revision Description Date By
1.0 Initial release 2018-04-02 JC
1.1 Correct LVDS specification 2019-11-18 JC
1.2 Update dual BIOS to “build option”; update Ethernet controller temperature support 2019-12-06 JC
1.3 Correct GBE0_MDI0- pin number 2020-07-16 JC

nanoX-AL
Preface iii
Table of Contents
Preface................................................................................................................................ii
List of Figures ..................................................................................................................vii
List of Tables...................................................................................................................viii
1. Introduction................................................................................................................1
2. Specifications............................................................................................................3
2.1. Core System ...............................................................................................................3
2.2. Expansion Busses ......................................................................................................3
2.3. Video...........................................................................................................................4
2.4. Audio...........................................................................................................................4
2.5. LAN.............................................................................................................................4
2.6. Multi I/O and Storage..................................................................................................4
2.7. Serial I/O on Module ...................................................................................................5
2.8. Trusted Platform Module (TPM) .................................................................................5
2.9. SEMA Board Controller ..............................................................................................5
2.10. Debug......................................................................................................................6
2.11. Power Specifications ...............................................................................................6
2.12. Power Consumption ................................................................................................6
2.13. Operating Temperatures .........................................................................................6
2.14. Environmental .........................................................................................................6
2.15. Specification Compliance ........................................................................................6
2.16. Operating Systems..................................................................................................7
2.17. Functional Diagram .................................................................................................8
2.18. Mechanical Drawing ................................................................................................9
3. Pinouts and Signal Descriptions............................................................................11
3.1. AB/CD Pin Definitions...............................................................................................11
3.2. Signal Description Terminology ................................................................................14
3.3. AB Signal Descriptions .............................................................................................15
3.3.1. Audio Signals ..................................................................................................................... 15
3.3.2. LVDS/eDP.......................................................................................................................... 15
3.3.3. DDI0 Channel ....................................................................................................................16
3.3.4. Gigabit Ethernet ................................................................................................................. 16
3.3.5. SATA.................................................................................................................................. 17
3.3.6. PCI Express ....................................................................................................................... 17
3.3.7. Express Card (Not supported) ........................................................................................... 18
3.3.8. LPC Bus ............................................................................................................................. 18

iv Preface
3.3.9. USB 1.1/2.0........................................................................................................................ 18
3.3.10. USB 3.0 Extension........................................................................................................... 19
3.3.11. USB Root Segmentation.................................................................................................. 20
3.3.12. SPI (BIOS only) ................................................................................................................ 21
3.3.13. Miscellaneous .................................................................................................................. 21
3.3.14. SMBus.............................................................................................................................. 22
3.3.15. I2C Bus ............................................................................................................................ 22
3.3.16. General Purpose I/O (GPIO)............................................................................................ 22
3.3.17. Serial Interface Signals .................................................................................................... 23
3.3.18. Power And System Managemen t .................................................................................... 23
3.3.19. Power and Ground........................................................................................................... 24
4. Module Interfaces....................................................................................................25
4.1. Connector, Switch and LED Locations .....................................................................25
4.2. 40-pin Debug Connector...........................................................................................26
4.3. Status LEDs..............................................................................................................28
4.4. MIPI60 Debug Header (build option) ........................................................................29
4.5. Switch Settings .........................................................................................................30
5. Smart Embedded Management Agent (SEMA) .....................................................31
5.1. Board Specific SEMA Functions...............................................................................32
5.1.1. Voltages ............................................................................................................................. 32
5.1.2. Main Current ...................................................................................................................... 32
5.1.3. BMC Status........................................................................................................................ 32
5.1.4. Exception Codes................................................................................................................ 33
5.1.5. BMC Flags ......................................................................................................................... 33
6. System Resources ..................................................................................................35
6.1. System Memory Map................................................................................................35
6.2. I/O Map .....................................................................................................................35
6.3. Interrupt Request (IRQ) Lines...................................................................................37
6.4. PCI Configuration Space Map ..................................................................................40
6.5. PCI Interrupt Routing Map ........................................................................................41
6.6. SMBus Address Table ..............................................................................................42
7. BIOS Setup...............................................................................................................43
7.1. Menu Structure .........................................................................................................43
7.2. Main ..........................................................................................................................44
7.2.1. Main > BIOS Information ................................................................................................... 44
7.2.2. Main > System Information ................................................................................................ 44
7.2.3. Main > Board Information .................................................................................................. 45
7.2.4. Main >System Date/Time .................................................................................................. 45

nanoX-AL
Preface v
7.2.5. Main >Access Level........................................................................................................... 45
7.3. Advanced..................................................................................................................46
7.3.1. Advanced > CPU Configuration......................................................................................... 46
7.3.2. Advanced > Graphics Configuration .................................................................................. 48
7.3.3. Advanced > Power Management....................................................................................... 49
7.3.4. Advanced > System Management..................................................................................... 50
7.3.5. Advanced > Thermal Management.................................................................................... 50
7.3.6. Advanced > Watchdog Timer ............................................................................................ 51
7.3.7. Advanced > CSM Configuration ........................................................................................ 51
7.3.8. Advanced > Super IO Configuration.................................................................................. 51
7.3.9. Advanced > Serial Console Redirection ............................................................................ 53
7.3.10. Advanced > USB.............................................................................................................. 55
7.3.11. Advanced > Network........................................................................................................ 56
7.3.12. Advanced > Miscellaneous .............................................................................................. 56
7.3.13. Advanced > Driver Health................................................................................................ 56
7.3.14. Advanced > Trusted Computing ...................................................................................... 56
7.3.15. Advanced > Trusted Computing ...................................................................................... 57
7.4. Chipset......................................................................................................................58
7.4.1. Chipset > North Bridge ...................................................................................................... 58
7.4.2. Chipset > South Bridge...................................................................................................... 58
7.4.3. Chipset > Uncore Configuration......................................................................................... 58
7.4.4. Chipset > South Cluster Configuration .............................................................................. 60
7.5. Security.....................................................................................................................69
7.5.1. Security > Password Description ....................................................................................... 69
7.6. Boot ..........................................................................................................................70
7.6.1. Boot > Boot Configuration.................................................................................................. 70
7.6.2. Boot > FIXED BOOT ORDER Priorities............................................................................. 70
7.7. Save & Exit ...............................................................................................................71
8. BIOS Checkpoints, Beep Codes.............................................................................73
8.1. Status Code Ranges.................................................................................................74
8.2. Standard Status Codes.............................................................................................74
8.2.1. SEC Phase......................................................................................................................... 74
8.2.2. SEC Beep Codes............................................................................................................... 75
8.2.3. PEI Phase .......................................................................................................................... 75
8.2.4. PEI Beep Codes ................................................................................................................ 77
8.2.5. DXE Status Codes ............................................................................................................. 78
8.2.6. DXE Beep Codes............................................................................................................... 80
8.2.7. ACPI/ASL Checkpoint........................................................................................................ 80
8.3. OEM-Reserved Checkpoint Ranges......................................................................... 81

vi Preface
9. Mechanical Information...........................................................................................83
9.1. Board-to-Board Connectors......................................................................................83
9.2. Thermal Solution.......................................................................................................84
9.2.1. Heat Spreaders..................................................................................................................84
9.2.2. Heat Sinks.......................................................................................................................... 84
9.2.3. Installation.......................................................................................................................... 84
9.3. Mounting Methods ....................................................................................................86
9.4. Standoff Types..........................................................................................................87
Safety Instructions...........................................................................................................88
Getting Service.................................................................................................................89

nanoX-AL
Preface vii
List of Figures
Figure 1: nanoX-AL Functional Block Diagram ........................................................................................8
Figure 2: nanoX-AL Mechanical Drawing.................................................................................................9
Figure 3: nanoX-AL Connector, Switch and LED Locations ................................................................. 25
Figure 4: nanoX-AL and the DB40 Debug Module................................................................................ 25
Figure 5: cExpress Switch Locations .................................................................................................... 30
Figure 6: COM Express Mounting Methods ..........................................................................................86
Figure 7: COM Express Standoff Types................................................................................................ 87

viii Preface
List of Tables
Table 1: nanoX-AL Type 10 COM.0 Rev. 3.0 Pin Definitions ............................................................... 11
Table 2: 40-pin Debug Connector Pin Definition ................................................................................... 27
Table 3: nanoX-AL LED Descriptions.................................................................................................... 28
Table 4: MIPI60 Debug Header Pin Definition ...................................................................................... 29
Table 5: BIOS Select and Mode Configuration Switch Settings............................................................ 30
Table 6: SEMA Onboard Voltage Monitor ............................................................................................. 32
Table 7: SEMA BMC Status .................................................................................................................. 32
Table 8: SEMA Exception Codes .......................................................................................................... 33
Table 9: SEMA BMC Flags.................................................................................................................... 33

nanoX-AL
Introduction 1
1. Introduction
The nanoX-AL is a COM Express® COM.0 R3.0 Type 10 module supporting Intel Atom® processor E3900 series
system-on-chip (SoC). The nanoX-AL is specifically designed for customers who need optmized processing and
graphics performance with low power consumption in a long product life solution.
The nanoX-AL features the dual/quad core Intel Atom® processor E3900 series supporting non-ECC type DDR3L
single-channel or dual-channel memory at 1600/1867 MHz to provide excellent overall performance. Integrated
Intel® Gen9 LP Graphics includes features such as OpenGL 4.3, DirectX 12, OpenCL 2.0 and support for
H.265/HEVC, H.264, MPEG2, VC1, VP9, MVC, JPEG/MJPEG hardware decode. Graphics outputs include DDI
ports supporting HDMI/DVI/DisplayPort and single-channel 18/24-bit LVDS (eDP by build option). The nanoX-AL is
specifically designed for customers with balanced performance and power consumption requirements who want to
outsource the custom core logic of their systems for reduced development time.
The nanoX-AL has 2GB of soldered type non-ECC DDR3L memory (4GB and 8GB optional). In addition, onboard
eMMC memory (8GB/16GB/32GB) and SD signals are available as build options.
The nanoX-AL features a single onboard Gigabit Ethernet port, multiple PCIe lanes, USB 3.0 ports and USB 2.0
ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI
BIOS (dual BIOS by build option), supporting embedded features such as remote console, CMOS backup,
hardware monitor, and watchdog timer.

2 Introduction
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