ADLINK Technology nanoX-AL User manual

Leading EDGE COMPUTING
nanoX-AL
User’s Manual
COM Express Mini Size Type 10 Module with
Intel Atom®, Pentium®, Celeron® SoC
Manual Rev.: 1.3
Revision Date: July 16, 2020
Part Number: 50-1J088-1030

ii Preface
Preface
Copyright
Copyright © 2018-2020 ADLINK Technology, Inc. This document contains proprietary information protected by
copyright. All rights are reserved. No part of this manual may be reproduced by any mechanical, electronic, or other
means in any form without prior written permission of the manufacturer.
Disclaimer
The information in this document is subject to change without prior notice in order to improve reliability, design, and
function and does not represent a commitment on the part of the manufacturer. In no event will the manufacturer
be liable for direct, indirect, special, incidental, or consequential damages arising out of the use or inability to use
the product or documentation, even if advised of the possibility of such damages.
Environmental Responsibility
ADLINK is committed to fulfill its social responsibility to global environmental preservation
through compliance with the European Union's Restriction of Hazardous Substances (RoHS)
directive and Waste Electrical and Electronic Equipment (WEEE) directive. Environmental
protection is a top priority for ADLINK. We have enforced measures to ensure that our products,
manufacturing processes, components, and raw materials have as little impact on the
environment as possible. When products are at their end of life, our customers are encouraged
to dispose of them in accordance with the product disposal and/or recovery programs
prescribed by their nation or company.
Battery Labels (for products with battery)
廢電池請回收
California Proposition 65 Warning
WARNING: This product can expose you to chemicals including acrylamide, arsenic, benzene,
cadmium, Tris(1,3-dichloro-2-propyl)phosphate (TDCPP), 1,4-Dioxane, formaldehyde, lead, DEHP,
styrene, DINP, BBP, PVC, and vinyl materials, which are known to the State of California to cause
cancer, and acrylamide, benzene, cadmium, lead, mercury, phthalates, toluene, DEHP, DIDP, DnHP,
DBP, BBP, PVC, and vinyl materials, which are known to the State of California to cause birth defects or other
reproductive harm. For more information go to www.P65Warnings.ca.gov.
Trademarks
Product names mentioned herein are used for identification purposes only and may be trademarks and/or
registered trademarks of their respective companies.
Revision History
Revision Description Date By
1.0 Initial release 2018-04-02 JC
1.1 Correct LVDS specification 2019-11-18 JC
1.2 Update dual BIOS to “build option”; update Ethernet controller temperature support 2019-12-06 JC
1.3 Correct GBE0_MDI0- pin number 2020-07-16 JC

nanoX-AL
Preface iii
Table of Contents
Preface................................................................................................................................ii
List of Figures ..................................................................................................................vii
List of Tables...................................................................................................................viii
1. Introduction................................................................................................................1
2. Specifications............................................................................................................3
2.1. Core System ...............................................................................................................3
2.2. Expansion Busses ......................................................................................................3
2.3. Video...........................................................................................................................4
2.4. Audio...........................................................................................................................4
2.5. LAN.............................................................................................................................4
2.6. Multi I/O and Storage..................................................................................................4
2.7. Serial I/O on Module ...................................................................................................5
2.8. Trusted Platform Module (TPM) .................................................................................5
2.9. SEMA Board Controller ..............................................................................................5
2.10. Debug......................................................................................................................6
2.11. Power Specifications ...............................................................................................6
2.12. Power Consumption ................................................................................................6
2.13. Operating Temperatures .........................................................................................6
2.14. Environmental .........................................................................................................6
2.15. Specification Compliance ........................................................................................6
2.16. Operating Systems..................................................................................................7
2.17. Functional Diagram .................................................................................................8
2.18. Mechanical Drawing ................................................................................................9
3. Pinouts and Signal Descriptions............................................................................11
3.1. AB/CD Pin Definitions...............................................................................................11
3.2. Signal Description Terminology ................................................................................14
3.3. AB Signal Descriptions .............................................................................................15
3.3.1. Audio Signals ..................................................................................................................... 15
3.3.2. LVDS/eDP.......................................................................................................................... 15
3.3.3. DDI0 Channel ....................................................................................................................16
3.3.4. Gigabit Ethernet ................................................................................................................. 16
3.3.5. SATA.................................................................................................................................. 17
3.3.6. PCI Express ....................................................................................................................... 17
3.3.7. Express Card (Not supported) ........................................................................................... 18
3.3.8. LPC Bus ............................................................................................................................. 18

iv Preface
3.3.9. USB 1.1/2.0........................................................................................................................ 18
3.3.10. USB 3.0 Extension........................................................................................................... 19
3.3.11. USB Root Segmentation.................................................................................................. 20
3.3.12. SPI (BIOS only) ................................................................................................................ 21
3.3.13. Miscellaneous .................................................................................................................. 21
3.3.14. SMBus.............................................................................................................................. 22
3.3.15. I2C Bus ............................................................................................................................ 22
3.3.16. General Purpose I/O (GPIO)............................................................................................ 22
3.3.17. Serial Interface Signals .................................................................................................... 23
3.3.18. Power And System Managemen t .................................................................................... 23
3.3.19. Power and Ground........................................................................................................... 24
4. Module Interfaces....................................................................................................25
4.1. Connector, Switch and LED Locations .....................................................................25
4.2. 40-pin Debug Connector...........................................................................................26
4.3. Status LEDs..............................................................................................................28
4.4. MIPI60 Debug Header (build option) ........................................................................29
4.5. Switch Settings .........................................................................................................30
5. Smart Embedded Management Agent (SEMA) .....................................................31
5.1. Board Specific SEMA Functions...............................................................................32
5.1.1. Voltages ............................................................................................................................. 32
5.1.2. Main Current ...................................................................................................................... 32
5.1.3. BMC Status........................................................................................................................ 32
5.1.4. Exception Codes................................................................................................................ 33
5.1.5. BMC Flags ......................................................................................................................... 33
6. System Resources ..................................................................................................35
6.1. System Memory Map................................................................................................35
6.2. I/O Map .....................................................................................................................35
6.3. Interrupt Request (IRQ) Lines...................................................................................37
6.4. PCI Configuration Space Map ..................................................................................40
6.5. PCI Interrupt Routing Map ........................................................................................41
6.6. SMBus Address Table ..............................................................................................42
7. BIOS Setup...............................................................................................................43
7.1. Menu Structure .........................................................................................................43
7.2. Main ..........................................................................................................................44
7.2.1. Main > BIOS Information ................................................................................................... 44
7.2.2. Main > System Information ................................................................................................ 44
7.2.3. Main > Board Information .................................................................................................. 45
7.2.4. Main >System Date/Time .................................................................................................. 45

nanoX-AL
Preface v
7.2.5. Main >Access Level........................................................................................................... 45
7.3. Advanced..................................................................................................................46
7.3.1. Advanced > CPU Configuration......................................................................................... 46
7.3.2. Advanced > Graphics Configuration .................................................................................. 48
7.3.3. Advanced > Power Management....................................................................................... 49
7.3.4. Advanced > System Management..................................................................................... 50
7.3.5. Advanced > Thermal Management.................................................................................... 50
7.3.6. Advanced > Watchdog Timer ............................................................................................ 51
7.3.7. Advanced > CSM Configuration ........................................................................................ 51
7.3.8. Advanced > Super IO Configuration.................................................................................. 51
7.3.9. Advanced > Serial Console Redirection ............................................................................ 53
7.3.10. Advanced > USB.............................................................................................................. 55
7.3.11. Advanced > Network........................................................................................................ 56
7.3.12. Advanced > Miscellaneous .............................................................................................. 56
7.3.13. Advanced > Driver Health................................................................................................ 56
7.3.14. Advanced > Trusted Computing ...................................................................................... 56
7.3.15. Advanced > Trusted Computing ...................................................................................... 57
7.4. Chipset......................................................................................................................58
7.4.1. Chipset > North Bridge ...................................................................................................... 58
7.4.2. Chipset > South Bridge...................................................................................................... 58
7.4.3. Chipset > Uncore Configuration......................................................................................... 58
7.4.4. Chipset > South Cluster Configuration .............................................................................. 60
7.5. Security.....................................................................................................................69
7.5.1. Security > Password Description ....................................................................................... 69
7.6. Boot ..........................................................................................................................70
7.6.1. Boot > Boot Configuration.................................................................................................. 70
7.6.2. Boot > FIXED BOOT ORDER Priorities............................................................................. 70
7.7. Save & Exit ...............................................................................................................71
8. BIOS Checkpoints, Beep Codes.............................................................................73
8.1. Status Code Ranges.................................................................................................74
8.2. Standard Status Codes.............................................................................................74
8.2.1. SEC Phase......................................................................................................................... 74
8.2.2. SEC Beep Codes............................................................................................................... 75
8.2.3. PEI Phase .......................................................................................................................... 75
8.2.4. PEI Beep Codes ................................................................................................................ 77
8.2.5. DXE Status Codes ............................................................................................................. 78
8.2.6. DXE Beep Codes............................................................................................................... 80
8.2.7. ACPI/ASL Checkpoint........................................................................................................ 80
8.3. OEM-Reserved Checkpoint Ranges......................................................................... 81

vi Preface
9. Mechanical Information...........................................................................................83
9.1. Board-to-Board Connectors......................................................................................83
9.2. Thermal Solution.......................................................................................................84
9.2.1. Heat Spreaders..................................................................................................................84
9.2.2. Heat Sinks.......................................................................................................................... 84
9.2.3. Installation.......................................................................................................................... 84
9.3. Mounting Methods ....................................................................................................86
9.4. Standoff Types..........................................................................................................87
Safety Instructions...........................................................................................................88
Getting Service.................................................................................................................89

nanoX-AL
Preface vii
List of Figures
Figure 1: nanoX-AL Functional Block Diagram ........................................................................................8
Figure 2: nanoX-AL Mechanical Drawing.................................................................................................9
Figure 3: nanoX-AL Connector, Switch and LED Locations ................................................................. 25
Figure 4: nanoX-AL and the DB40 Debug Module................................................................................ 25
Figure 5: cExpress Switch Locations .................................................................................................... 30
Figure 6: COM Express Mounting Methods ..........................................................................................86
Figure 7: COM Express Standoff Types................................................................................................ 87

viii Preface
List of Tables
Table 1: nanoX-AL Type 10 COM.0 Rev. 3.0 Pin Definitions ............................................................... 11
Table 2: 40-pin Debug Connector Pin Definition ................................................................................... 27
Table 3: nanoX-AL LED Descriptions.................................................................................................... 28
Table 4: MIPI60 Debug Header Pin Definition ...................................................................................... 29
Table 5: BIOS Select and Mode Configuration Switch Settings............................................................ 30
Table 6: SEMA Onboard Voltage Monitor ............................................................................................. 32
Table 7: SEMA BMC Status .................................................................................................................. 32
Table 8: SEMA Exception Codes .......................................................................................................... 33
Table 9: SEMA BMC Flags.................................................................................................................... 33

nanoX-AL
Introduction 1
1. Introduction
The nanoX-AL is a COM Express® COM.0 R3.0 Type 10 module supporting Intel Atom® processor E3900 series
system-on-chip (SoC). The nanoX-AL is specifically designed for customers who need optmized processing and
graphics performance with low power consumption in a long product life solution.
The nanoX-AL features the dual/quad core Intel Atom® processor E3900 series supporting non-ECC type DDR3L
single-channel or dual-channel memory at 1600/1867 MHz to provide excellent overall performance. Integrated
Intel® Gen9 LP Graphics includes features such as OpenGL 4.3, DirectX 12, OpenCL 2.0 and support for
H.265/HEVC, H.264, MPEG2, VC1, VP9, MVC, JPEG/MJPEG hardware decode. Graphics outputs include DDI
ports supporting HDMI/DVI/DisplayPort and single-channel 18/24-bit LVDS (eDP by build option). The nanoX-AL is
specifically designed for customers with balanced performance and power consumption requirements who want to
outsource the custom core logic of their systems for reduced development time.
The nanoX-AL has 2GB of soldered type non-ECC DDR3L memory (4GB and 8GB optional). In addition, onboard
eMMC memory (8GB/16GB/32GB) and SD signals are available as build options.
The nanoX-AL features a single onboard Gigabit Ethernet port, multiple PCIe lanes, USB 3.0 ports and USB 2.0
ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI
BIOS (dual BIOS by build option), supporting embedded features such as remote console, CMOS backup,
hardware monitor, and watchdog timer.

2 Introduction
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nanoX-AL
Specifications 3
2. Specifications
2.1. Core System
CPU Dual or quad-core Intel Atom® processor E3900 SoC
•Intel Atom® E3950 1.6/2.0GHz (Burst), 400-650MHz (Graphics) 12W (4C/1866)
•Intel Atom® E3940 1.6/1.8GHz (Burst), 400-600MHz (Graphics) 9W (4C/1866)
•Intel Atom® E3930 1.3/1.8GHz (Burst), 400-550MHz (Graphics) 6W (2C/1866)
•Pentium® N4200 1.1/2.5GHz (Turbo), 200-750MHz (graphics), 6W (4C/1866)
•Celeron® N3350 1.1/2.4GHz (Turbo), 200-650MHz (graphics), 6W (2C/1866)
Supports dual or quad Out-of-Order Execution (OOE) processor cores, Intel® VT-x, Intel®
VT-d, Intel® SSE4.1 and SSE4.2, Intel® 64 architecture, Intel® Turbo Boost Technology
2.0, Intel AES-NI, Intel® TXT, PCLMULQDQ instruction DRNG
Notes: Availability of features may vary between processor SKUs and operating systems;
N4200/M3350 by project basis.
L3 Cache 2MB for all SKUs
Memory Single channel or dual channel non-ECC 1600/1866 MHz soldered DDR3L memory up to
8GB (4GB and 8GB supported by build option)
Notes: 2GB and 4GB are 1866MHz and 8GB is 1600MHz (or 1866MHz, by project basis).
Availability of features may vary between processor SKUs.
2GB is single channel and 4GB/8GB are dual channel.
BIOS AMI EFI with CMOS backup in 16MB SPI BIOS
2.2. Expansion Busses
PCI Express Multiple PCI Express x1 Gen2 (AB):
Lanes 0/1/2/4, configurable to 3 x1 (default); 2 x1+1 x2 or 1 x4 (by request)
Recommend up to three devices only.
Other •LPC bus
•SMBus (system)
•I2C (user)

4 Specifications
2.3. Video
Integrated on SoC Intel® Generation 9 Low Power Graphics core architecture with up to 18 execution units
supporting two independent displays
GPU Feature Support •3D graphics hardware acceleration
•Support for DirectX12/11.3/10/9.3, OCL 2.0, OGL ES 3.0, OGL 4.3
•Video decode hardware acceleration including support for H.265 (HEVC), H.264, MVC,
MPEG-2, VC-1, WMV9, VP8/VP9, JPEG/MJPEG formats
•Video encode hardware acceleration including support for H.265 (HEVC), H.264,
VP8/VP9, JPEG/MJPEG formats
•Supports content protection using PAVP 2.0 and HDCP 1.4/2.0
Note: Availability of features may vary between operating systems.
Display Types •Single channel 18/24-bit LVDS: supports DE mode and H/V-Sync mode display,
resolution up to 1920x1200 with single channel LVDS.
•eDP x4 lanes (eDP 1.3, by build option in place of LVDS)
•DDI0: Supports DisplayPort, HDMI, DVI
2.4. Audio
Integrated Intel® HD Audio integrated on SoC
Codec Located on carrier miniBASE-10R (ALC262 standard support)
2.5. LAN
Intel MAC/PHY Intel® Ethernet Controller I210 (Extreme Rugged operating temperature range)
Intel® Ethernet Controller I211 (standard operating temperature range)
Supports GbE0_SDP, IEEE 1588 for real-time applications
Interface 10/100/1000 Mbit/s connection
2.6. Multi I/O and Storage
I/O Hub Integrated on SoC
USB 2x USB. 3.0/2.0/1.1 (USB 0/1)
6x USB. 2.0/1.1 (USB 2/3/4/5/6/7)
Note: USB port 7 supports USB 2.0 OTG on Yocto Linux OS, detection pin is B96. Does
not comply with PICMG R3.0 USB OTG support order (port 0, then port 7) due to design
prior to finalization of specification.
SATA 2x ports SATA 6Gb/s (SATA0, SATA1)
eMMC 5.0 (build option) 8/16/32 GB (boot device support may vary between operating systems)*
SD (build option) SD 3.0 signal is muxed with GPIO, switching through BOM option (boot device support
may vary between operating systems)
Note: Supports 3.30V SD cards only.
GPIO 4 GPO and 4 GPI
Note: GPI with interruput supported on Linux.
*Note: See table below for detailed boot device support information.

nanoX-AL
Specifications 5
Boot Device Support
Windows 10
Enterprise Linux (Yocto)
eMMC 5.0 Yes Yes Storage only
SD Yes Yes
eMMC 5.0 Yes Yes OS Installation
SD No No
Note: eMMC and SD functionality as an OS installation device may change dependent on Intel updates. Please
contact your local sales representative for more information.
2.7. Serial I/O on Module
zPorts: 2x UART ports COM 1/2, baud rate up to 115.2k bps
zConsole Redirection: selectable in BIOS, supported during BIOS POST
COM Port Description IRQ Address Console Redirection Support
COM 1 Supported by module (SER0, A98/A99), via NCT5104D 10 0x240 Yes
COM 2 Supported by module (SER1, A101/A102), via NCT5104D 11 0x248 Yes
COM 3 Supported by Super I/O (W83627DHG) on carrier board 4 0x3F8 Yes
COM 4 Supported by Super I/O (W83627DHG) on carrier board 3 0x2F8 Yes
2.8. Trusted Platform Module (TPM)
zChipset: Infineon
zType: TPM 2.0
Note: TPM supported by build option.
2.9. SEMA Board Controller
zType: ADLINK Smart Embedded Management Agent (SEMA)
zFunctions:
•Voltage/Current monitoring
•Power sequence debug support
•AT/ATX mode control
•Logistics and forensic information
•Flat panel control
•General purpose I2C
•Failsafe BIOS (dual BIOS by build option)
•Watchdog timer and fan control

6 Specifications
2.10. Debug
z40-pin flat cable connector to be used with DB-40 debug module
Supports: BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs
zMIPI60 60-pin header for debug of SoC (build option)
2.11. Power Specifications
Power Modes AT and ATX mode (AT mode startup controlled by SEMA Board Controller)
Standard Voltage Input ATX: 12V ±5% / 5Vsb ±5% or AT = 12V ±5%
Wide Voltage Input ATX: 4.75-20V, 5Vsb ±5%; AT: 4.75-20V
Power Management ACPI 5.0 compliant, Smart Battery support
Power States Supports C0, C1, C1E, C6L, C6, S0, S3, S4, S5, S5 ECO mode (Wake-on-USB S3/S4,
WoL S3/S4/S5)
ECO Mode Supports deep S5 for 5Vsb power saving
2.12. Power Consumption
Please contact your ADLINK representative for the document “COM Express Module Power Consumption”.
2.13. Operating Temperatures
Standard Operating
Temperature 0°C to +60°C (wide voltage input)
Storage: -20°C to +70°C
Extreme Rugged Operating
Temperature (optional) -40°C to +85°C (standard voltage input only, build option, Intel Atom® SKUs only)
Storage: -40°C to +85°C
2.14. Environmental
Humidity Operating: 5-90% RH, non-condensing
Storage: 5-95% RH (and operating with conformal coating)
Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I,
Condition D
HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
2.15. Specification Compliance
zPICMG COM.0: Rev 3.0 Type 10, Mini size 84 x 55 mm

nanoX-AL
Specifications 7
2.16. Operating Systems
Standard Support •Windows 10 (64-bit)
•Linux (64-bit)
•VxWorks (64-bit)
Extended Support (BSP) •Linux (64-bit)
•VxWorks (64-bit)

8 Specifications
2.17. Functional Diagram
SEMA
BMC
On break-out board
by build option
AB
GbE
i210
Intel Atom®
Processor E3900
Soldered
2/4/8 GB DDR3L
non-ECC
DDI0
4 lanes
4x PCIe x1 Gen2 (port 0-3)
Supports x1, x2, x4 (3 devices only)
HD Audio
2x SATA 6Gb/s
(port 0/1)
8x USB 2.0/1.1 (port 0-7)
(port 7 supports host and client mode)
MIPI60
60-pin
PCIe x1 Gen2
eMMC 5.0
8/16/32GB
(build option)
LM73
4x GP0, 4x GPI (SDIO)
GP I2C
LPC Bus
SPI
SPI0
BIOS
DDC I2C
SPI_CS#
2 UART (Tx/Rx)
eDP x4 lanes
(build option)
LVDS
eDP to LVDS eDP
SMBus
GPIO
PCA9535
SD
Single channel
18/24-bit
2x USB 3.0 (port 0-1)
I2C
HSUART
TPM 2.0
(build option)
Super I/O
LPC to UART
SPI1
BIOS
GBE0_SDP
Figure 1: nanoX-AL Functional Block Diagram

nanoX-AL
Specifications 9
2.18. Mechanical Drawing
6
2.7
0
4
51
55
49
0 4
9.8
67.5
80 84
2
Top View
Side View
All are dimensions shown in millimeters.
Tolerances should be ± 0.25mm, unless otherwise noted. The tolerances of the
module connector locating peg holes (dimensions [9.8, 49]) should be ±0.10mm.
Figure 2: nanoX-AL Mechanical Drawing

10 Specifications
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nanoX-AL
Pinouts and Signal Descriptions 11
3. Pinouts and Signal Descriptions
3.1. AB/CD Pin Definitions
The nanoX-AL is a Type 10 module supporting USB 3.0 and DDI channel on the AB connector. All standard pins of
the COM Express specification are described in the table below, including those not supported on the nanoX-AL.
Note: Signals not supported on the nanoX-AL module are crossed out.
Table 1: nanoX-AL Type 10 COM.0 Rev. 3.0 Pin Definitions
Row A Row B
Pin Name Pin Name
1 GND(FIXED) 1 GND(FIXED)
2 GBE0_MDI3- 2 GBE0_ACT#
3 GBE0_MDI3+ 3 LPC_FRAME# / ESPI_CS0#
4 GBE0_LINK100# 4 LPC_AD0 / ESPI_IO_0
5 GBE0_LINK1000# 5 LPC_AD1 / ESPI_IO_1
6 GBE0_MDI2- 6 LPC_AD2 / ESPI_IO_2
7 GBE0_MDI2+ 7 LPC_AD3 / ESPI_IO_3
8 GBE0_LINK# 8 LPC_DRQ0# / ESPI_ALERT0#
9 GBE0_MDI1- 9 LPC_DRQ1# / ESPI_ALERT_1#
10 GBE0_MDI1+ 10 LPC_CLK / ESPI_CK
11 GND(FIXED) 11 GND(FIXED)
12 GBE0_MDI0- 12 PWRBTN#
13 GBE0_MDI0+ 13 SMB_CK
14 GBE0_CTREF 14 SMB_DAT
15 SUS_S3# 15 SMB_ALERT#
16 SATA0_TX+ 16 SATA1_TX+
17 SATA0_TX- 17 SATA1_TX-
18 SUS_S4# 18 SUS_STAT# / ESPI_RESET#
19 SATA0_RX+ 19 SATA1_RX+
20 SATA0_RX- 20 SATA1_RX-
21 GND(FIXED) 21 GND(FIXED)
22 USB_SSRX0- 22 USB_SSTX0-
23 USB_SSRX0+ 23 USB_SSTX0+
24 SUS_S5# 24 PWR_OK
25 USB_SSRX1- 25 USB_SSTX1-
26 USB_SSRX1+ 26 USB_SSTX1+
27 BATLOW# 27 WDT
28 (S)ATA_ACT# 28 HDA_SDIN2
29 HDA_SYNC 29 HDA_SDIN1
30 HDA_RST# 30 HDA_SDIN0
31 GND(FIXED) 31 GND(FIXED)
32 HDA_BITCLK 32 SPKR
33 HDA_SDOUT 33 I2C_CK
34 BIOS_DIS0# / ESPI_SAFS 34 I2C_DAT
35 THRMTRIP# 35 THRM#

12 Pinouts and Signal Descriptions
Row A Row B
Pin Name Pin Name
36 USB6- 36 USB7-
37 USB6+ 37 USB7+
38 USB_6_7_OC# 38 USB_4_5_OC#
39 USB4- 39 USB5-
40 USB4+ 40 USB5+
41 GND(FIXED) 41 GND(FIXED)
42 USB2- 42 USB3-
43 USB2+ 43 USB3+
44 USB_2_3_OC# 44 USB_0_1_OC#
45 USB0- 45 USB1-
46 USB0+ 46 USB1+
47 VCC_RTC 47 ESPI_EN
48 RSVD 48 USB0_HOST_PRSNT
49 GBE0_SDP 49 SYS_RESET#
50 LPC_SERIRQ / ESPI_CS1# 50 CB_RESET#
51 GND(FIXED) 51 GND(FIXED)
52 RSVD 52 RSVD
53 RSVD 53 RSVD
54 GPI0 54 GPO1
55 RSVD 55 RSVD
56 RSVD 56 RSVD
57 GND 57 GPO2
58 PCIE_TX3+ 58 PCIE_RX3+
59 PCIE_TX3- 59 PCIE_RX3-
60 GND(FIXED) 60 GND(FIXED)
61 PCIE_TX2+ 61 PCIE_RX2+
62 PCIE_TX2- 62 PCIE_RX2-
63 GPI1 63 GPO3
64 PCIE_TX1+ 64 PCIE_RX1+
65 PCIE_TX1- 65 PCIE_RX1-
66 GND 66 WAKE0#
67 GPI2 67 WAKE1#
68 PCIE_TX0+ 68 PCIE_RX0+
69 PCIE_TX0- 69 PCIE_RX0-
70 GND(FIXED) 70 GND(FIXED)
71 LVDS_A0+ / eDP_TX2+ 71 DDI0_PAIR0+
72 LVDS_A0- / eDP_TX2- 72 DDI0_PAIR0-
73 LVDS_A1+ / eDP_TX1+ 73 DDI0_PAIR1+
74 LVDS_A1- / eDP_TX1- 74 DDI0_PAIR1-
75 LVDS_A2+ / eDP_TX0+ 75 DDI0_PAIR2+
76 LVDS_A2- / eDP_TX0- 76 DDI0_PAIR2-
77 LVDS_/eDP_VDD_EN 77 DDI0_PAIR4+
78 LVDS_A3+ 78 DDI0_PAIR4-
79 LVDS_A3- 79 LVDS_/eDP_BKLT_EN
80 GND(FIXED) 80 GND(FIXED)