ADLINK Technology arm AMPERE COM-HPC-ALT User manual

Express-ID7 User’s Guide PICMG COM.0 R3.1
Page 1 Copyright © 2023 ADLINK Technology, Inc.
COM-HPC-ALT
Revision: Rev. 0.1
Date: 2023-01-10
Part Number: 50M-00115-1000
User’s Guide

COM-HPC-ALT User’s Guide PICMG COM-HPC R1.0
Page 2 Copyright © 2023 ADLINK Technology, Inc.
Revision History
Revision
Description
Date
Author
0.1
Preliminary release
2023-01-10
CC

COM-HPC-ALT User’s Guide PICMG COM-HPC R1.0
Page 3 Copyright © 2023 ADLINK Technology, Inc.
Preface
Disclaimer
Information in this document is provided in connection with ADLINK products. No license, express or implied, by estoppel or otherwise, to any
intellectual property rights is granted by this document. Except as provided in ADLINK´s Terms and Conditions of Sale for such products, ADLINK
assumes no liability whatsoever, and ADLINK disclaims any express or implied warranty, relating to sale and/or use of ADLINK products including
liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property
right. If you intend to use ADLINK products in or as medical devices, you are solely responsible for all required regulatory compliance, including, without
limitation, Title 21 of the CFR (US), Directive 2007/47/EC (EU), and ISO 13485 & 14971, if any. ADLINK may make changes to specifications and product
descriptions at any time, without notice.
Environmental Responsibility
ADLINK is committed to fulfil its social responsibility to global environmental preservation through compliance with the European Union's Restriction of
Hazardous Substances (RoHS) directive and Waste Electrical and Electronic Equipment (WEEE) directive. Environmental protection is a top priority for
ADLINK. We have enforced measures to ensure that our products, manufacturing processes, components, and raw materials have as little impact on the
environment as possible. When products are at their end of life, our customers are encouraged to dispose of them in accordance with the product
disposal and/or recovery programs prescribed by their nation or company.
California Proposition 65 Warning: This product can expose you to chemicals including acrylamide, arsenic, benzene, cadmium, Tris(1,3-
dichloro-2-propyl)phosphate (TDCPP), 1,4-Dioxane, formaldehyde, lead, DEHP, styrene, DINP, BBP, PVC, and vinyl materials, which are known
to the State of California to cause cancer, and acrylamide, benzene, cadmium, lead, mercury, phthalates, toluene, DEHP, DIDP, DnHP, DBP,
BBP, PVC, and vinyl materials, which are known to the State of California to cause birth defects or other reproductive harm. For more
information go to www.P65Warnings.ca.gov.
Trademarks
Product names mentioned herein are used for identification purposes only and may be trademarks / registered trademarks of respective companies.
Copyright © 2023 ADLINK Technology Incorporated
This document contains proprietary information protected by copyright. All rights are reserved. No part of this manual may be reproduced by any
mechanical, electronic, or other means in any form without prior written permission of the manufacturer.

COM-HPC-ALT User’s Guide PICMG COM-HPC R1.0
Page 4 Copyright © 2023 ADLINK Technology, Inc.
Safety Instructions
For user safety, please read and follow all Instructions, WARNINGs, CAUTIONs, and NOTEs marked in this manual and on the associated equipment
before handling/operating the equipment.
Read these safety instructions carefully.
•Keep this manual for future reference.
•Read the specifications section of this manual for detailed information on the operating environment of this equipment.
•Turn off power and unplug any power cords/cables when installing/mounting or un-installing/removing equipment.
•To avoid electrical shock and/or damage to equipment:
•Keep equipment away from water or liquid sources;
•Keep equipment away from high heat or high humidity;
•Keep equipment properly ventilated (do not block or cover ventilation openings);
•Make sure to use recommended voltage and power source settings;
•Always install and operate equipment near an easily accessible electrical socket outlet;
•Secure the power cord (do not place any object on/over the power cord);
•Only install/attach and operate equipment on stable surfaces and/or recommended mountings;
•If the equipment will not be used for long periods of time, turn off the power source and unplug the equipment.

COM-HPC-ALT User’s Guide PICMG COM-HPC R1.0
Page 5 Copyright © 2023 ADLINK Technology, Inc.
Conventions
The following conventions may be used throughout this manual, denoting special levels of information
Note: This information adds clarity or specifics to text and illustrations.
Caution: This information indicates the possibility of minor physical injury, component damage, data loss, and/or program corruption.
Warning: This information warns of possible serious physical injury, component damage, data loss, and/or program corruption.

COM-HPC-ALT User’s Guide PICMG COM-HPC R1.0
Page 6 Copyright © 2023 ADLINK Technology, Inc.
Getting Service
Ask an Expert: http://askanexpert.adlinktech.com
ADLINK Technology, Inc.
No. 66, Huaya 1st Rd., Guishan District, Taoyuan City 333411, Taiwan
Tel: [phone]
Fax: [phone]
Email: [e-mail]
Ampro ADLINK Technology, Inc.
6450 Via Del Oro, San Jose, CA 95119-1208, USA
Tel: [phone]
Toll Free: [phone] (USA only)
Fax: [phone]
Email: [e-mail]
ADLINK Technology (China) Co., Ltd.
300 Fang Chun Rd., Zhangjiang Hi-Tech Park, Pudong New Area, Shanghai, 201203, China
Tel: [phone]
Fax: [phone]
Email: [e-mail]
ADLINK Technology GmbH
Hans-Thoma-Strasse 11, D-68163 Mannheim, Germany
Tel: [phone]
Fax: [phone]
Email: [email protected]
Please visit the Contact page at www.adlinktech.com for information on how to contact the ADLINK regional office nearest you.

COM-HPC-ALT User’s Guide PICMG COM-HPC R1.0
Page 0 Copyright © 2023 ADLINK Technology, Inc.
Table of Contents
Revision History ................................................................................................................................................................................................................................................................................................................ 2
Preface .................................................................................................................................................................................................................................................................................................................................. 3
1. Introduction ................................................................................................................................................................................................................................................................................................................. 3
2. Specifications...............................................................................................................................................................................................................................................................................................................4
2.1 Core System..................................................................................................................................................................................................................................................................................................................................... 4
2.2 Expansion Busses ........................................................................................................................................................................................................................................................................................................................... 5
2.3 Ethernet ............................................................................................................................................................................................................................................................................................................................................. 8
2.4 Multi I/O and Storage .................................................................................................................................................................................................................................................................................................................. 9
2.5 Others...............................................................................................................................................................................................................................................................................................................................................10
2.6 Security ............................................................................................................................................................................................................................................................................................................................................10
2.7 Module Management Controller (MMC) ............................................................................................................................................................................................................................................................................11
2.8 Debug...............................................................................................................................................................................................................................................................................................................................................17
2.9 Power................................................................................................................................................................................................................................................................................................................................................17
2.10 Mechanical and Environmental...............................................................................................................................................................................................................................................................................................18
3. Block Diagram...........................................................................................................................................................................................................................................................................................................20
4. Pinout and Signal Descriptions ..........................................................................................................................................................................................................................................................................21
4.1 Pin Summary..................................................................................................................................................................................................................................................................................................................................21
4.2 Signal Terminology Descriptions ............................................................................................................................................................................................................................................................................................. 7
4.3 Signal Descriptions on J1/J2 Connectors .............................................................................................................................................................................................................................................................................. 8
4.3.1 Ethernet KR/KX ................................................................................................................................................................................................................................................................................................................... 8
4.3.2 NBASE-T Ethernet.............................................................................................................................................................................................................................................................................................................. 9
4.3.3 PCI Express .........................................................................................................................................................................................................................................................................................................................11
4.3.4 USB........................................................................................................................................................................................................................................................................................................................................18
4.3.5 Asynchronous Serial Port..............................................................................................................................................................................................................................................................................................20
4.3.6 I2C .........................................................................................................................................................................................................................................................................................................................................21
4.3.7 Port 80 Support on USB_PD I2C Bus ........................................................................................................................................................................................................................................................................22
4.3.8 IPMB .....................................................................................................................................................................................................................................................................................................................................22
4.3.9 General Purpose SPI .......................................................................................................................................................................................................................................................................................................23
4.3.10 Power & System Management ...................................................................................................................................................................................................................................................................................24
4.3.11 Thermal Protection..........................................................................................................................................................................................................................................................................................................25

COM-HPC-ALT User’s Guide PICMG COM-HPC R1.0
Page 1 Copyright © 2023 ADLINK Technology, Inc.
4.3.12 SMBus ..................................................................................................................................................................................................................................................................................................................................26
4.3.13 General Purpose Input Outputs..................................................................................................................................................................................................................................................................................26
4.3.14 Module Type Definition.................................................................................................................................................................................................................................................................................................27
4.3.15 Miscellaneous Signals ....................................................................................................................................................................................................................................................................................................28
4.3.16 Power and Ground ..........................................................................................................................................................................................................................................................................................................30
5. Additional Features .................................................................................................................................................................................................................................................................................................31
5.1 Debug Connector (40-pin connector)..................................................................................................................................................................................................................................................................................32
5.2 Status LEDs.....................................................................................................................................................................................................................................................................................................................................33
5.3 Fan Connector...............................................................................................................................................................................................................................................................................................................................34
5.4 BIOS Default Reset ......................................................................................................................................................................................................................................................................................................................35
5.5 BIOS Boot Select ..........................................................................................................................................................................................................................................................................................................................36
6. BIOS Checkpoints, Beep Codes ........................................................................................................................................................................................................................................................................37
6.1 Status Code Ranges ....................................................................................................................................................................................................................................................................................................................38
7. Mechanical and Thermal.......................................................................................................................................................................................................................................................................................39
7.1 Module Dimensions....................................................................................................................................................................................................................................................................................................................39
7.2 Thermal Solutions........................................................................................................................................................................................................................................................................................................................40
7.2.1 Heatsink : THS-ALT-BL ...................................................................................................................................................................................................................................................................................................40
7.2.2 Low profile active cooler: THSF-ALT-BL-S ..............................................................................................................................................................................................................................................................41
7.2.3 High profile passive heatsink: THSH-ALT-VC ........................................................................................................................................................................................................................................................42
7.2.4 Active Cooling: THSF-ALT-BL ......................................................................................................................................................................................................................................................................................43

COM-HPC-ALT User’s Guide PICMG COM-HPC R1.0
Page 2 Copyright © 2023 ADLINK Technology, Inc.
List of Figures
Figure 1 – Module Function Block Diagram ........................................................................................................................................................................................................................................................20
Figure 2 – Module Rear Side Row............................................................................................................................................................................................................................................................................21
Figure 4 – Heatsink THS-ALT-BL...............................................................................................................................................................................................................................................................................40
Figure 5 – THSF-ALT-BL-S...........................................................................................................................................................................................................................................................................................41
Figure 6 – High profile passive heatsink THSH-ALT-VC..................................................................................................................................................................................................................................42
Figure 7 – Cooler THSF-ALT-BL.................................................................................................................................................................................................................................................................................43

COM-HPC-ALT User’s Guide PICMG COM-HPC R1.0
Page 3 Copyright © 2023 ADLINK Technology, Inc.
1. Introduction
Caution: This is an EA (early available) engineering manual. The contents may not accurately reflect the actual or final version of this product.
ADLINK COM-HPC-ALT is a COM-HPC® Server Type Size E compliance module featuring Ampere® Altra® Series SoC. It supports up to 128 cores and
boosts up to 2.6GHz based on 190W TDP while providing up to 384GB of RDIMM, UDIMM, LRDIMM DDR4 six-channel memory at up to 3200 MT/s in 6
DIMM sockets. These combined features make the COM-HPC-ALT well suited to customers who need uncompromising system performance and
responsiveness embedded solutions with extended product life.
The COM-HPC-ALT features 4x 110G SFP+ interfaces by Broadcom BCM57502 (PCIex8 input, 4x 10G-KR output) and a single on-board Gigabit Ethernet
port by Intel i210/i211 series. It features 64x PCIe Gen4 physical lanes, 4x USB 3.x upgrade signals, and 4x USB 2.0 ports
The COM-HPC-ALT features 1x GPP_SPI and 1x Boot_SPI, 1x SMBus, 2x I2C, 2x UART and 12x GPIO. No eSPI offered
The COM-HPC-ALT based discrete circuit and MMC (ATMEGA128), instead of CLPD, are supported by the module for power sequence control
The COM-HPC-ALT supports IPMB, which supports an MMC (module management controller, ATMEGA) and its firmware on the module. Combined
with a dedicate 1x PCIe lane (it is called PCIe_BMC), IPMB can enable Carrier BMC (for example, AST2500 or equivalent) and access necessary message
(for example, voltage information and CPU temperature on module) between MMC and Carrier BMC. In addition, an EEPROM is located on I2C_0 bus as
a traditional COMe EEPROM usage and also as a FRU for Carrier BMC
One security chip is supported on the module. The traditional TPM 2.0, SPI based (same as Ampere Altra reference design) (it is on GP_SPI bus)
The module is equipped with EDK2 (bootloader, open source) BIOS with CMOS backup, supporting embedded features such as remote console,
hardware monitor, and watchdog timer.
No EC on this product.

COM-HPC-ALT User’s Guide PICMG COM-HPC R1.0
Page 4 Copyright © 2023 ADLINK Technology, Inc.
2. Specifications
2.1 Core System
SoC
Ampere Computing, Ampere® Altra® Series Processors
•M128-26 128 cores, 2.6GHz, 190W TDP
•Q80-26 80 cores, 2.6GHz, 150W TDP
•Q64-22 64 cores, 2.2GHz, 95W TDP
•Q32-17 32 cores, 1,7GHz, 65W TDP

COM-HPC-ALT User’s Guide PICMG COM-HPC R1.0
Page 5 Copyright © 2023 ADLINK Technology, Inc.
Memory
Up to 384GB 3200 MT/s DDR4 in 6 DIMM sockets, Maximum 64GB per socket
Supports RDIMM, UDIMM and LRDIMM and 3DS
3 DIMM on the right side, the other 3 DIMMs on the left side
Cache
1 MB L2 cache per core
32 MB system level cache
Embedded BIOS
EDK2 UEFI with CMOS backup in 32 (or 16, TBC) MB SPI BIOS
2.2 Expansion Busses
PCI Express
64x PCIe lanes with 5x PCIe_REFCLK / 5x PCIe_CLKREQ
-Up to Gen4 speed
-PCIe 0-7 1 x4 or 2 x2 config at 0-3, 1 x4 or 2 x2 config at 4-7, 1 x8 config at 0-7 (from Root Complex B)
-PCIe 8-15 1 x4 or 2 x2 config at 8-11, 1 x4 or 2 x2 config at 12-15, 1 x8 config at 8-15 (from Root Complex B)
-PCIe 16-31 1 x16 or 2 x8 or 4 x4 config at 16-31, (from Root Complex A)
-PCIe 32-47 1 x16 or 2 x8 or 4 x4 config at 32-47, (from Root Complex A)
-PCIe 48-63 1 x16 or 2 x8 or 4 x4 config at 48-63, (from Root Complex A)

COM-HPC-ALT User’s Guide PICMG COM-HPC R1.0
Page 6 Copyright © 2023 ADLINK Technology, Inc.
-Lane polarity inversion
-5x PCIe_REFCLK/PCIe_CLKREQ
PCIe_REFCLK0_LO & PCIe_CLKREQ0_LO# : for PCIe lanes [0:7] and PCIe_BMC
PCIe_REFCLK0_HI & PCIe_CLKREQ0_HI# : for PCIe lanes [8:15]
PCIe_REFCLK1 & PCIe_CLKREQ1# : for PCIe lanes [16:31]
PCIe_REFCLK2 & PCIe_CLKREQ2# : for PCIe lanes [32:47]
PCIe_REFCLK3 & PCIe_CLKREQ3# : for PCIe lanes [48:63]
Note: Due to SoC orientation, the trace of PCIe 48-63 lanes over the PICMG specification marginally and may require re-driver on carrier.
PCI Express Dedicated for Carrier BMC
1x PCIe lane (called PCIe_BMC)
They can be used to connect the Carrier BMC (located on carrier) and combined with MMC (Module Management Controller, build option feature), such
as voltage monitoring, power on/off, in the server applications.
Boot SPI
1x Boot_SPI, 2x Boot_SPI_CS dedicated for boot BIOS flash usage
SPI clock is either 20 MHz, 25 MHz, 33 MHz (Ampere Altra SOC only support up to 30MHz)
Support 3.3V of VCC_BOOT_SPI pin, if SPI flash on carrier is implemented, it shall be powered by VCC_BOOT_SPI pin
BIOS Boot Selection
BIOS flash can be boot up at SPI bus, can be located at module or carrier or combined

COM-HPC-ALT User’s Guide PICMG COM-HPC R1.0
Page 7 Copyright © 2023 ADLINK Technology, Inc.
I2C
2x I2C, I2C 0 and I2C 1
I2C 0 additional offer ALERT# input and 3.3V power rail (source from Ampere Altra SoC)
I2C 1 is 1.8V power rail (source from Ampere Altra SoC)
Supports software programmable clock of 100 KHz (standard mode) and 400 KHz operation (fast mode)
Supports multi-master, allowing carrier to read the module’s EEPROM before powering up the module
Support 7-bit and 10-bit address mode
An EEPROM is located on I2C 0, which can be used as Module EEPROM and IPMI FRU, combined together
USB_PD_I2C
COM-HPC Module should support exporting Port 80 information over the USB_PD I2C bus (signals USB_OD_I2C_DAT and USB_PD_I2C_CLK) to Carrier
hardware that implements a pair of 7-segment displays to show the codes
The USB_PD_I2C comes from MMC ATMEGA128 and USB_PD_I2C, MMC and SOC connect to the same bus
IPMB
1x IPMB comes from MMC. Please refer to section 2.9 Module Management Controller for further details
IPMB is used with a Carrier BMC.
MMC is ATMEGA solution that communicate with Ampere Altra SOC through UART
Several monitored voltage (for example, memory voltage, CPU voltage) and temperature (for example, CPU temperature) can be communicated
between MMC and Carrier BMC through IPMB.
A dedicated PCIe x1 lane is also available on the Carrier BMC, allowing the Carrier BMC to generate a VGA or other format video output, for
management functions.

COM-HPC-ALT User’s Guide PICMG COM-HPC R1.0
Page 8 Copyright © 2023 ADLINK Technology, Inc.
General Purpose SPI
1x GP_SPI, 2x GP_SPI_CS
A TPM is located on GP_SPI bus
SM Bus
1x SMBus comes from SoC I2C_9 bus
2.3 Ethernet
NBASE-T Ethernet
Intel® Ethernet Controller i210/i211, connected to the SoC through PCIe lane
Supports 10/100/1000 Mbps data transfer rates, both full-duplex and half-duplex
Supports NBASET_SDP, Software-Defined Pin. Can also be used for IEEE 1588 support such as 1pps signal
Supports Wake on LAN at S3/S4/S5
Supports PXE boot
Ethernet KR/KX Interfaces
Broadcom® Ethernet Controller BCM57502, connected to the SoC through PCIex8 lane
4x 10GBASE-KR and its sideband signals
Supports both full-duplex and half-duplex

COM-HPC-ALT User’s Guide PICMG COM-HPC R1.0
Page 9 Copyright © 2023 ADLINK Technology, Inc.
2.4 Multi I/O and Storage
USB
Up to 4x USB 3.2 Gen1/2.0 (USB 0,1,2,3; via PCIe to USB IC) (the IC is Renesas uPD720201)
SuperSpeedPlus, SuperSpeed, High-Speed, Full-Speed and Low-Speed USB signalling
Asynchronous Serial Port
Two UART interfaces UART0 and UART1. UART0 supports TX RX RTS CTS. UART1 supports TX/RX
Console Redirection UART0 or UART1 selectable in BIOS
Up to 2 serial ports are supported in standard BIOS including Super I/O on the carrier
COM Port Description IRQ Address Console Redirection Support
COM 1 Supported by module (SER0, A98/A99), via SOC 4 0x3F8 Yes
COM 2 Supported by module (SER1, A101/A102), via SOC 3 0x2F8 Yes
Note: UART0, 1 both source from SOC. UART0 offers TX, RX, RTS#, CTS#. UART1 only offers TX and RX; its RTS#, CTS# are simulated by 2 GPIO
from SOC.
GPIO
12x GPIO
Supports GPI with interrupt

COM-HPC-ALT User’s Guide PICMG COM-HPC R1.0
Page 10 Copyright © 2023 ADLINK Technology, Inc.
2.5 Others
FAN Control
Control source is from MMC
FAN control is offered
Health Monitoring
CPU temperature (through I2C3 of SOC) and board temperature are monitored by MMC.
8-10 voltage are monitored by EC, customer can get voltage information on BIOS menu and also shown in SEMA GUI and access it through SEMA API
2.6 Security
This module offers one security-related chip on the module.

COM-HPC-ALT User’s Guide PICMG COM-HPC R1.0
Page 11 Copyright © 2023 ADLINK Technology, Inc.
Trusted Platform Module (TPM)
Chipset: Infineon solution
Type: TPM 2.0 (SPI bus based) (located on GP_SPI)
2.7 Module Management Controller (MMC)
A Module Management Controller (MMC) is supported by default, which offers power sequence management and IPMB that can be connected to
Carrier BMC for voltage, current, temperature, and other system information through IPMI protocol
The selected MMC is ATMEGA128A-MU (Microchip) (-40 to 85°C) solution.
MMC connects to SOC through UART interface
MMC connects to a HW monitor through I2C bus to monitor module’s voltage, current and temperature
MMC only offers two I2C, one is used for USB_PD_I2C, the other used for IPMB.
Overview
COM-HPC Module and Carrier boards may support out-of-band (OOB) management features. These features may be implemented on COM-HPC
Server or Client systems. Traditionally OOB management is more of a server class feature, but the option is there for both COM-HPC Clients and Servers.
There is a separate PICMG document that describes COM-HPC OOB management features in details —PICMG COM-HPC Platform Management
Interface Specification. The management architecture is divided into BMC (Board Management Controller) and MMC (Module Management
Controller), which are explained in the following sections.
BMC (Board Management Controller) (Located on Carrier board if deployed)
This is a microcontroller subsystem, usually based on the Carrier, that performs system out-of-band management functions such as firmware updates,
power and reset control, performance monitoring and more. For COM-HPC module, which are hosted on the carrier, it may be a full subsystem with
CPU / SOC, DRAM memory, an internal display controller and more. It may be ARM based. It may run a Linux or other OS. A popular vendor for this
sort of BMC part is Aspeed, and in particular the Aspeed AST2510 and successor parts. Many other vendors and parts are possible.

COM-HPC-ALT User’s Guide PICMG COM-HPC R1.0
Page 12 Copyright © 2023 ADLINK Technology, Inc.
It is anticipated that in most situations the BMC, if deployed, will be on the Carrier. Implementation of OOB management and a BMC on the Carrier is
entirely optional. A Carrier based BMC is intended to work in conjunction with a Module based microcontroller referred to as the MMC (described
below).
A Carrier BMC, if deployed, shall implement an IPMB interface to the COM-HPC Module. This is the channel for IPMI support. The Carrier BMC may also
make use of the COM-HPC I2C0, USB, eSPI, NBASET0, UARTx and / or the PCIe_BMC interfaces, as well as controlling the module power signals like
PWRBTN, ...).
Any COM-HPC USB host port may be used to interface to a Carrier BMC USB client port. The Module USB port is usually a Module chipset or SOC host
port, and not a MMC USB port. Designers should avoid using COM-HPC USB0, as it has special privileges allowing it to be used as a host or client.
Designers may want to avoid using COM-HPC USB0, 1, 2, 3 as they are defined to allow USB SuperSpeed capability and BMC devices to not typically
have USB SuperSpeed capability. USB4, 5, 6 or 7 should be used for the BMC interface if available.
Of the two COM-HPC UART interfaces that may be used to interface to a Carrier BMC, UART1 should be selected as UART0 is often used for functions
such as Console Redirect.
MMC (Module Management Controller) (Located on COM-HPC Module, optional)
The MMC is a Module based microcontroller that may work in conjunction with a Carrier based BMC. If there is no Carrier BMC, then the MMC shall fall
back to a mode that does not depend on the Carrier BMC, allowing the Module to function without external OOB management. The MMC shall
powered by the VCC_5V_SBY supply to allow for OOB functionality even when the main supply is not available, however, it should also use the main
VCC rail, if available.
In most implementations, the MMC will be a relatively small low cost and low power device, in order to keep Module costs down for customers that do
not require OOB management features. It may serve as a sensor aggregator. It may serve as host for nonvolatile Module parameter storage.
The MMC, if implemented, shall include an IPMB slave interface. It may additionally interface to the Carrier BMC over any of several other COM-HPC
interfaces, including the I2C0 and or UART0 ports.