ASROCK PRO Series User manual

Version 1.0
Published November 2021
Copyright©2021 ASRock INC. All rights reserved.
Copyright Notice:
No part of this documentation may be reproduced, transcribed, transmitted, or
translated in any language, in any form or by any means, except duplication of
documentation by the purchaser for backup purpose, without written consent of
ASRock Inc.
Products and corporate names appearing in this documentation may or may not
be registered trademarks or copyrights of their respective companies, and are used
only for identication or explanation and to the owners’ benet, without intent to
infringe.
Disclaimer:
Specications and information contained in this documentation are furnished for
informational use only and subject to change without notice, and should not be
constructed as a commitment by ASRock. ASRock assumes no responsibility for
any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock does not provide
warranty of any kind, either expressed or implied, including but not limited to
the implied warranties or conditions of merchantability or tness for a particular
purpose.
In no event shall ASRock, its directors, ocers, employees, or agents be liable for
any indirect, special, incidental, or consequential damages (including damages for
loss of prots, loss of business, loss of data, interruption of business and the like),
even if ASRock has been advised of the possibility of such damages arising from any
defect or error in the documentation or product.
is device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.
CALIFORNIA, USA ONLY
e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
“Perchlorate Material-special handling may apply, see www.dtsc.ca.gov/hazardouswaste/
perchlorate”
ASRock Website: http://www.asrock.com

AUSTRALIA ONLY
Our goods come with guarantees that cannot be excluded under the Australian Consumer
Law. You are entitled to a replacement or refund for a major failure and compensation for
any other reasonably foreseeable loss or damage caused by our goods. You are also entitled
to have the goods repaired or replaced if the goods fail to be of acceptable quality and the
failure does not amount to a major failure. If you require assistance please call ASRock Tel
: [phone] ext.123 (Standard International call charges apply)
e terms HDMI®and HDMI High-Denition Multimedia Interface, and the HDMI
logo are trademarks or registered trademarks of HDMI Licensing LLC in the United
States and other countries.
INTEL END USER SOFTWARE LICENSE AGREEMENT
IMPORTANT - READ BEFORE COPYING, INSTALLING OR USING.
LICENSE. Licensee has a license under Intel’s copyrights to reproduce Intel’s Soware
only in its unmodied and binary form, (with the accompanying documentation, the
“Soware”) for Licensee’s personal use only, and not commercial use, in connection with
Intel-based products for which the Soware has been provided, subject to the following
conditions:
(a) Licensee may not disclose, distribute or transfer any part of the Soware, and You agree
to prevent unauthorized copying of the Soware.
(b) Licensee may not reverse engineer, decompile, or disassemble the Soware.
(c) Licensee may not sublicense the Soware.
(d) e Soware may contain the soware and other intellectual property of third party
suppliers, some of which may be identied in, and licensed in accordance with, an enclosed
license.txt le or other text or le.
(e) Intel has no obligation to provide any support, technical assistance or updates for the
Soware.
OWNERSHIP OF SOFTWARE AND COPYRIGHTS. Title to all copies of the Soware
remains with Intel or its licensors or suppliers. e Soware is copyrighted and protected
by the laws of the United States and other countries, and international treaty provisions.
Licensee may not remove any copyright notices from the Soware. Except as otherwise
expressly provided above, Intel grants no express or implied right under Intel patents,
copyrights, trademarks, or other intellectual property rights. Transfer of the license termi-
nates Licensee’s right to use the Soware.
DISCLAIMER OF WARRANTY. e Soware is provided “AS IS” without warranty of
any kind, EITHER EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION,
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PUR-
POSE.
LIMITATION OF LIABILITY. NEITHER INTEL NOR ITS LICENSORS OR SUPPLIERS
WILL BE LIABLE FOR ANY LOSS OF PROFITS, LOSS OF USE, INTERRUPTION OF
BUSINESS, OR INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAG

ES OF ANY KIND WHETHER UNDER THIS AGREEMENT OR OTHERWISE, EVEN
IF INTEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
LICENSE TO USE COMMENTS AND SUGGESTIONS. is Agreement does NOT
obligate Licensee to provide Intel with comments or suggestions regarding the Soware.
However, if Licensee provides Intel with comments or suggestions for the modication,
correction, improvement or enhancement of (a) the Soware or (b) Intel products or
processes that work with the Soware, Licensee grants to Intel a non-exclusive, worldwide,
perpetual, irrevocable, transferable, royalty-free license, with the right to sublicense, under
Licensee’s intellectual property rights, to incorporate or otherwise utilize those comments
and suggestions.
TERMINATION OF THIS LICENSE. Intel or the sublicensor may terminate this license
at any time if Licensee is in breach of any of its terms or conditions. Upon termination,
Licensee will immediately destroy or return to Intel all copies of the Soware.
THIRD PARTY BENEFICIARY. Intel is an intended beneciary of the End User License
Agreement and has the right to enforce all of its terms.
U.S. GOVERNMENT RESTRICTED RIGHTS. e Soware is a commercial item (as
dened in 48 C.F.R. 2.101) consisting of commercial computer soware and commercial
computer soware documentation (as those terms are used in 48 C.F.R. 12.212), consistent
with 48 C.F.R. 12.212 and 48 C.F.R 227.7202-1 through 227.7202-4. You will not provide
the Soware to the U.S. Government. Contractor or Manufacturer is Intel Corporation,
2200 Mission College Blvd., Santa Clara, CA 95054.
EXPORT LAWS. Licensee agrees that neither Licensee nor Licensee’s subsidiaries will
export/re-export the Soware, directly or indirectly, to any country for which the U.S.
Department of Commerce or any other agency or department of the U.S. Government
or the foreign government from where it is shipping requires an export license, or other
governmental approval, without rst obtaining any such required license or approval. In
the event the Soware is exported from the U.S.A. or re-exported from a foreign destina-
tion by Licensee, Licensee will ensure that the distribution and export/re-export or import
of the Soware complies with all laws, regulations, orders, or other restrictions of the U.S.
Export Administration Regulations and the appropriate foreign government.
APPLICABLE LAWS. is Agreement and any dispute arising out of or relating to it will
be governed by the laws of the U.S.A. and Delaware, without regard to conict of laws
principles. e Parties to this Agreement exclude the application of the United Nations
Convention on Contracts for the International Sale of Goods (1980). e state and federal
courts sitting in Delaware, U.S.A. will have exclusive jurisdiction over any dispute arising
out of or relating to this Agreement. e Parties consent to personal jurisdiction and venue
in those courts. A Party that obtains a judgment against the other Party in the courts iden-
tied in this section may enforce that judgment in any court that has jurisdiction over the
Parties.
Licensee’s specic rights may vary from country to country.

Contents
Chapter 1 Introduction 1
1.1 Package Contents 1
1.2 Specications 2
1.3 Motherboard Layout 6
1.4 I/O Panel 8
Chapter 2 Installation 9
2.1 Installing the CPU 10
2.2 Installing the CPU Fan and Heatsink 13
2.3 Installing Memory Modules (DIMM) 14
2.4 Expansion Slots (PCIe Slots) 16
2.5 Jumpers Setup 17
2.6 Onboard Headers and Connectors 18
2.7 Post Status Checker 24
2.8 CrossFireXTM and Quad CrossFireXTM Operation Guide 25
2.8.1 Installing Two CrossFireXTM-Ready Graphics Cards 25
2.8.2 Driver Installation and Setup 27
2.9 M.2 WiFi/BT PCIe WiFi Module Installation Guide 28
2.10 M.2_SSD (NGFF) Module Installation Guide (M2_1) 30
2.11 M.2_SSD (NGFF) Module Installation Guide (M2_2) 33
Chapter 3 Software and Utilities Operation 37
3.1 Installing Drivers 37
3.2 ASRock Motherboard Utility (A-Tuning) 38

3.2.1 Installing ASRock Motherboard Utility (A-Tuning) 38
3.2.2 Using ASRock Motherboard Utility (A-Tuning) 38
3.3 ASRock Live Update & APP Shop 41
3.3.1 UI Overview 41
3.3.2 Apps 42
3.3.3 BIOS & Drivers 45
3.3.4 Setting 46
3.4 Nahimic Audio 47
3.5 ASRock Polychrome SYNC 48
Chapter 4 UEFI SETUP UTILITY 51
4.1 Introduction 51
4.2 EZ Mode 52
4.3 Advanced Mode 53
4.3.1 UEFI Menu Bar 53
4.3.2 Navigation Keys 54
4.4 Main Screen 55
4.5 OC Tweaker Screen 56
4.6 Advanced Screen 71
4.6.1 CPU Conguration 72
4.6.2 Chipset Conguration 75
4.6.3 Storage Conguration 78
4.6.4 Intel(R) Thunderbolt 79
4.6.5 ACPI Conguration 80
4.6.6 USB Conguration 81

4.6.7 Trusted Computing 82
4.7 Tools 84
4.8 Hardware Health Event Monitoring Screen 86
4.9 Security Screen 90
4.10 Boot Screen 91
4.11 Exit Screen 94

Chapter 1 Introduction
ank you for purchasing ASRock H670M Pro RS motherboard, a reliable
motherboard produced under ASRock’s consistently stringent quality control.
It delivers excellent performance with robust design conforming to ASRock’s
commitment to quality and endurance.
In this documentation, Chapter 1 and 2 contains the introduction of the
motherboard and step-by-step installation guides. Chapter 3 contains the operation
guide of the soware and utilities. Chapter 4 contains the conguration guide of
the BIOS setup.
1.1 Package Contents
• ASRock H670M Pro RS Motherboard (Micro ATX Form Factor)
• ASRock H670M Pro RS Quick Installation Guide
• ASRock H670M Pro RS Support CD
• 2 x Serial ATA (SATA) Data Cables (Optional)
• 3 x Screws for M.2 Sockets (Optional)
• 1 x Stando for M.2 Socket (Optional)
• 1 x I/O Panel Shield

1
English
H670M Pro RS
Chapter 1 Introduction
ank you for purchasing ASRock H670M Pro RS motherboard, a reliable
motherboard produced under ASRock’s consistently stringent quality control.
It delivers excellent performance with robust design conforming to ASRock’s
commitment to quality and endurance.
In this documentation, Chapter 1 and 2 contains the introduction of the
motherboard and step-by-step installation guides. Chapter 3 contains the operation
guide of the soware and utilities. Chapter 4 contains the conguration guide of
the BIOS setup.
1.1 Package Contents
• ASRock H670M Pro RS Motherboard (Micro ATX Form Factor)
• ASRock H670M Pro RS Quick Installation Guide
• ASRock H670M Pro RS Support CD
• 2 x Serial ATA (SATA) Data Cables (Optional)
• 3 x Screws for M.2 Sockets (Optional)
• 1 x Stando for M.2 Socket (Optional)
• 1 x I/O Panel Shield
Because the motherboard specications and the BIOS soware might be updated, the
content of this documentation will be subject to change without notice. In case any
modications of this documentation occur, the updated version will be available on
ASRock’s website without further notice. If you require technical support related to
this motherboard, please visit our website for specic information about the model
you are using. You may nd the latest VGA cards and CPU support list on ASRock’s
website as well. ASRock website http://www.asrock.com.

2
English
1.2 Specications
Platform • Micro ATX Form Factor
• Solid Capacitor design
CPU • Supports 12th Gen Intel® CoreTM Processors (LGA1700)
• Digi Power design
• 7 Power Phase design
• Supports Intel® Hybrid Technology
• Supports Intel® Turbo Boost Max 3.0 Technology
Chipset • Intel® H670
Memory • Dual Channel DDR4 Memory Technology
• 4 x DDR4 DIMM Slots
• Supports DDR4 non-ECC, un-buered memory up to
4800+(OC)*
* Supports DDR4 3200 natively.
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
• Supports ECC UDIMM memory modules (operate in non-
ECC mode)
• Max. capacity of system memory: 128GB
• Supports Intel® Extreme Memory Prole (XMP) 2.0
Expansion
Slot
• 2 x PCIe x16 Slots (PCIE1/PCIE3: single at Gen4x16 (PCIE1);
dual at Gen4x16 (PCIE1) / Gen3x4 (PCIE3))*
* Supports NVMe SSD as boot disks
• 1 x PCIe Gen3x1 Slot
• Supports AMD Quad CrossFireXTM and CrossFireXTM
• 1 x M.2 Socket (Key E), supports type 2230 WiFi/BT PCIe
WiFi module
Graphics • Intel® UHD Graphics Built-in Visuals and the VGA outputs
can be supported only with processors which are GPU
integrated.
• Intel® XeGraphics Architecture (Gen 12)
• Dual graphics output: support HDMI and DisplayPort 1.4
ports by independent display controllers