Asus M930 User manual

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ASUS M930 Level 3 4 Trouble
shooting Guide
Ver 1.0

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CONTENT
1. OVER VIEW............................................................................................... 5
1.1 S YSTEM BLOCK DIAGRAM ............................................................................ 5
1.2 P OWER D OMAIN B LOCK .............................................................................. 6
1.3 P LACEMENT TOP V IEW ............................................................................... 7
1.4 P LACEMENT B OTTOM V IEW ......................................................................... 8
1.5 S PECIFICATION ............................................................................................. 9
2. SYSTEM CAN’T BOOT ......................................................................... 10
3.1 P OWER - ON SEQUENCE ................................................................................ 10
1.2 O THERS ...................................................................................................... 11
3. MMI TEST ITEM .................................................................................... 13
4.1 M ICRO SD T EST ......................................................................................... 13
4.2 SIM T EST .................................................................................................. 13
4.3 D ISPLAY T EST ............................................................................................ 14
4.4 V IBRATOR T EST ......................................................................................... 15
4.5 LED T EST .................................................................................................. 15
2.5.1 RGB Led fail ..................................................................................... 15
2.5.2 Keypad LED fail ................................................................................ 15
4.6 2M C AMERA & VGA C AMERA T EST ......................................................... 16
4.7 SDRAM & F LASH T EST ............................................................................ 17
4.8 A UDIO T EST ............................................................................................... 18
4.8.1 Headset fail........................................................................................ 18
4.8.2 Speaker .............................................................................................. 19
4.8.3 On-Board Microphone can’t record ................................................. 20
4.8.4 Receiver ............................................................................................. 20
4.9 K EYPAD T EST ............................................................................................ 21
4.9.1 Board level test:................................................................................. 21
4.9.2 External Keypad ................................................................................ 21
4.9.3 Internal Qwerty Keypad .................................................................... 22
4.10 BT T EST .................................................................................................. 22
4.11 W I F I T EST ............................................................................................... 23

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5. PHONE OFF ................................................................................................. 25
5.1 M ODEM P OWER ......................................................................................... 25
5.2 M ODEM TO S YSTEM INTERFACE ................................................................. 26
6. POWER CONSUMPTION ......................................................................... 28
6.1 P OWER O FF M ODE ..................................................................................... 28
6.2 S LEEP M ODE .............................................................................................. 28
7. RF REPAIR REQUIREMENT................................................................... 29
7.1 S OFTWARE REQUIREMENTS ：.................................................................... 29
7.2 H ARDWARE REQUIREMENTS ：.................................................................. 29
7.3 E QUIPMENT ............................................................................................... 29
8. BLOCK DIAGRAM..................................................................................... 30
8.1 RF B LOCK D IAGRAM OF VEGA2 .............................................................. 30
8.3 WCDMA B LOCK D IAGRAM ...................................................................... 33
9. GSM & WCDMA RF TX/RX PATH ......................................................... 34
9.1 B ACKSIDE A NTENNA A REA ....................................................................... 34
9.2 EGG T
X
/R
X
P ATH ...................................................................................... 35
9.3 WCDMA T
X
/R
X
P ATH .............................................................................. 36
10. TEST & REPAIR FLOW CHART .......................................................... 37
10.1 C ONDUCTIVE & A NTENNA T EST P ROCEDURE .......................................... 37
10.2 GSM/GPRS/EDGE T EST & R EPAIR P ROCEDURE ................................... 38
10.3 EGG TX P ATH ......................................................................................... 41
10.3.1 Probe ............................................................................................... 42
10.3.2 Placement on the PCB..................................................................... 42
10.3.3 Measurement Result ........................................................................ 43
10.4 EGG RX.................................................................................................. 45
10.5 GSM/GPRS/EDGE R EPAIR P ROCEDURE ................................................ 46
10.6 WCDMA T EST & R EPAIR P ROCEDURE ................................................... 47
10.7 WCDMA TX .......................................................................................... 48
10.8 WCDMA RX .......................................................................................... 53
10.9 WCDMA T EST & R EPAIR P ROCEDURE ................................................... 54
APPENDIX........................................................................................................ 55

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A PPENDIX A .................................................................................................... 55
A PPENDIX B..................................................................................................... 55
A PPENDIX C..................................................................................................... 56
1. Introduction............................................................................................ 56
2. Set Slot ID............................................................................................... 56
3. Switch to TP Mode.................................................................................. 58
4. Operating Method .................................................................................. 61

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Forward
The purpose of the troubleshooting guide just implement for the failure
on the MMI Testing. We will show several cases to discuss the repair
reference procedure.
1. Over view
1.1
1.1 1.1
1.1 System block diagram
System block diagramSystem block diagram
System block diagram
i. Figure 1. System Block Diagram

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1.2
1.21.2
1.2 Power Domain
Power Domain Power Domain
Power Domain Block
BlockBlock
Block
Figure 2. Power Block Diagram

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1.3 Placement TOP View
1.3 Placement TOP View1.3 Placement TOP View
1.3 Placement TOP View

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1.4 Placem
1.4 Placem1.4 Placem
1.4 Placement Bottom View
ent Bottom Viewent Bottom View
ent Bottom View

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1.5 S ecification
1.5 S ecification1.5 S ecification
1.5 S ecification

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2. SYSTEM Can’t Boot
The main of the reason always focus on the component short and
incorrect Power-on Sequence. In personal opinion, the power consumption
of M930 can be check before the Power on Sequence. Please check the
Power consumption of the M930 via power supply in R&D comment. It
always judges SMT component defective issue: short, open. In general,
power range will below 1mA in the deep sleep mode (Not touch the Power
key of the device).
Please check the put low signal after we push the power key on the U32
pin 4.
3
33
3.1 P
.1 P.1 P
.1 Power
owerower
ower-
--
-on sequence
on sequenceon sequence
on sequence
A. The signal VBAT = power supply voltage
The VBAT can make sure the system power effective. Please check
the voltage on the CON23 pin1.
B. V_CORE = 1.3~1.45, V_IO = 1.8,
The signal V_CORE and V_IO can make sure cpu power domain
from PMU. Please check the voltage and try to eliminate component
soldering issue (cold soldering, float mounting) on the below item:
R77、R19 / R202、R76、R72
C. V_PLL = 1.3，
Please check the voltage and try to eliminate component soldering
issue (cold soldering, float mounting) on the below item:
R20.

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Figure 3. Power On Sequence
1.2 Others
1.2 Others1.2 Others
1.2 Others
1.If all of the signal have checked and still not improve the status. Please
check the below signal.
C110.Pin1 32.768KHz
R151.Pin1&2 26MHz
2. Please check the insulation tape is well between VGA Camera and FPC
side. Please avoid the short issue.
3. If still can’t not improve the status, you should check the CPU and
Memory status by X-ray machine. We can try to replace the CPU and
memory which has updated the firmware with m930w reference
version.

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4.
Figure 4. PMU-01
Figure 5. PMU-02

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3. MMI Test item
4
44
4.1
.1 .1
.1 Micro
MicroMicro
Micro SD Test
SD Test SD Test
SD Test
The MMI test tool will be auto-executed by itself after we insert the
MMI Micro SD card. If the phone can’t get the data on the storage
device, we should check the pathway on below process.
A. V_MMC 3.0V, CON27 Pin4
B. SD_DET# 0V, R54 Pin1.
C.
If item A fail, try to check open or short issue on the PMU.
If item B fail, try to check the CON27 Pin13 & Pin1 .In the general; it
will short when we put in the card. Please change the CON27 if the
Pin13 and Pin 1 not short.
Figure 6. MicroSD + SIM Circuit
4
44
4.2
.2 .2
.2 SIM Test
SIM TestSIM Test
SIM Test
If SIM test fail, please check below items.
A. SIM_VCC 2.85V
If not please check the open or short on U39.
B. Please check the connector 27 on touch issue.

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4
44
4.3
.3 .3
.3 Dis lay Test
Dis lay TestDis lay Test
Dis lay Test
The test item will focus LCM interface and backlight. If result is fail
please check below item.
A. VIO_LCD 1.8V,
R143 both side.
B. LCD_VSYNC
LCD_HSYNC
LCD_PCLK video clock,
C238Pin1、C239Pin1、R111 both side on soldering issue.
C. If the main screen backlight wasn’t executed, we can check below
items on the LCD_PCB auxiliary board.
(LED_V+) 12.1V
MAIN_BL_EN 1.8V
If something wrong with the result which we found, please check U1
peripheral components and circuit.
D. If the secondary screen backlight wasn’t executed, we can check
below items on the LCD_PCB auxiliary board.
LED_V+ 6.2V
SUB_BL_EN 1.8V
If something wrong with the result which we found, please check U1
peripheral components and circuit.
Figure 7. Backlight Driver Circuit ( On LCD_PCB board)

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4
44
4.4
.4 .4
.4 Vibrator Test
Vibrator TestVibrator Test
Vibrator Test
If the vibrator can not working, please refer to below items try to
eliminate the error.
U17 Pin1 3.0V
PMU ( U31 ) open / short
Figure 8. Vibrator Circuit
4
44
4.5
.5 .5
.5 LED Test
LED TestLED Test
LED Test
We can check the RGB LED function and keypad LED via this test
item. The indication LED will show: Red-> Green->Blue->kpd White
LED->Red…….etc.
2.5.1 RGB Led fail
1. Please check R1, R2, R3 on soldering status.
2. Check the Pin9 and Pin 10 on the U5.
3. If the answer is no, please check the open/short on the CPU.
4. Replace the LED1.
2.5.2 Keypad LED fail
If the keypad LED will not executed. We can check below items on
the LCD_PCB auxiliary board.
LED_V+ 6.2V
SUB_BL_EN 1.8V (Figure 4 )

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Figure 9. Indication LED Circuit -01
Figure 10. Indication LED Circuit -02
4
44
4.6
.6 .6
.6 2M Camera & VGA Camera Test
2M Camera & VGA Camera Test2M Camera & VGA Camera Test
2M Camera & VGA Camera Test
We also test the item after assembly process. The main reason of the
defective will focus on camera. Ex. Camera FPC fail 、 lens of the
camera dirty 、can’t focus. If the pre-view image also shacking
on the screen. Please check the defective or damage on the
Coaxial Cable and follow procedure.
i. VCAM_2V8 2.8V, C69 Pin1.If not please check the PMU.

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ii. V_IO 1.8V, CON2 Pin6
iii. 2M camera and VGA common signal bus
KEY_I2C_SCL、KEY_I2C_SDA、CAM_D0~D7
iv. 2M Camera ON
CAM_2M_MCLK and CAM_XCLK Clock
2M_CLK_SHDN Low
VGA_CLK_SHDN High
v. VGA Camera ON
CAM_VGA_MCLK and CAM_XCLK Clock
2M_CLK_SHDN High
VGA_CLK_SHDN Low
Figure 11. Camera control signal
4.7
4.7 4.7
4.7 SDRAM & Flash Test
SDRAM & Flash Test SDRAM & Flash Test
SDRAM & Flash Test
Due to POP procedure, there will not test point be explored.
R72 1.8V
If you can get 1.8V then check the open/short of the memory by X-ray
machine. Try to replace the chip.

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4.8
4.8 4.8
4.8 Audio Te
Audio TeAudio Te
Audio Test
stst
st
4.8.1 Headset fail
Visual inspection earphone connector depends on soldering issue.
a. If headset signal can’t be detected by phone. Please check the ，
JACK_DET_1 and JACK_DET_2 1.8V. Please check
the below components:R36、R93、C56、C240.
b. Audio no effect on R/L pathway
Please check the related circuit on U12, , ex:C40、C41、R37、
R38 both side to avoid soldering issue. Check the R30 Pin2 是
High ( 1.8V )
c. Can’t record
Please check the signal from HSMICP and HSMICN, Please
check the related component on soldering issue. ex. C51、C52、
R35.
Figure 12. Headset Circuit - 01

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Figure 13. Headset Circuit - 02
4.8.2 Speaker
Most defective always related to the Speaker itself during the
assembly period. Please check the below item.
Speaker NO Sound
R31、R32 Audio signal (oscillate scope)
C46、C49 Audio signal (oscillate scope)
If the C46、C49 can be check signal but SPK_P、SPK_N no be
measured, please replace the U13 ( Class-D Amp).
Figure 14. Class D Amp for speaker

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4.8.3 On-Board Microphone can’t record
If recording quality is poor U15 NG.
If recording function is fail, please check R39、R44、C55、C60.
Figure 15. Microphone circuit
4.8.4 Receiver
If Receiver no voice, please check the C1、C2 on the LCD_FPC.
If still can’t find any signal , please check Soldering issue( open /
short) on the PMU.
Please replace the Receiver in the final step.