Congatec COM Express conga-TR3 User manual

Copyright © 2016 congatec AG TR33m10 1/105
COM Express™ conga-TR3
3rd Generation AMD Embedded R-Series SoC
User’s Guide
Revision 1.0

Copyright © 2016 congatec AG TR33m10 2/105
Revision History
Revision Date (yyyy.mm.dd) Author Changes
0.1 2016.02.02 AEM •Preliminary release
0.2 2016.03.22 AEM •Updated the whole document.
1.0 2016.07.26 BEU •Updated form factors in section 1 “Introduction”
•Updated section 2.5 “Power Consumption”, 2.7 “Environmental Specifications” and 4 “Cooling Solutions”
•Added section 10 “System Resources”, 11 “BIOS Setup Description” and 12 “Additional BIOS Features”
•Final release

Copyright © 2016 congatec AG TR33m10 3/105
Preface
This user’s guide provides information about the components, features, connectors and BIOS Setup menus available on the conga-TR3. It is
one of three documents that should be referred to when designing a COM Express™ application. The other reference documents that should
be used include the following:
COM Express™ Design Guide
COM Express™ Specification
The links to these documents can be found on the congatec AG website at www.congatec.com
Disclaimer
The information contained within this user’s guide, including but not limited to any product specification, is subject to change without notice.
congatec AG provides no warranty with regard to this user’s guide or any other information contained herein and hereby expressly disclaims
any implied warranties of merchantability or fitness for any particular purpose with regard to any of the foregoing. congatec AG assumes
no liability for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for
discrepancies between the product and the user’s guide. In no event shall congatec AG be liable for any incidental, consequential, special, or
exemplary damages, whether based on tort, contract or otherwise, arising out of or in connection with this user’s guide or any other information
contained herein or the use thereof.
Intended Audience
This user’s guide is intended for technically qualified personnel. It is not intended for general audiences.
Lead-Free Designs (RoHS)
All congatec AG designs are created from lead-free components and are completely RoHS compliant.
Electrostatic Sensitive Device
All congatec AG products are electrostatic sensitive devices and are packaged accordingly. Do not open or handle a congatec AG product
except at an electrostatic-free workstation. Additionally, do not ship or store congatec AG products near strong electrostatic, electromagnetic,
magnetic, or radioactive fields unless the device is contained within its original manufacturer’s packaging. Be aware that failure to comply with
these guidelines will void the congatec AG Limited Warranty.

Copyright © 2016 congatec AG TR33m10 4/105
Symbols
The following symbols are used in this user’s guide:
Warning
Warnings indicate conditions that, if not observed, can cause personal injury.
Caution
Cautions warn the user about how to prevent damage to hardware or loss of data.
Note
Notes call attention to important information that should be observed.
Copyright Notice
Copyright © 2016, congatec AG. All rights reserved. All text, pictures and graphics are protected by copyrights. No copying is permitted
without written permission from congatec AG.
congatec AG has made every attempt to ensure that the information in this document is accurate yet the information contained within is
supplied “as-is”.
Trademarks
Product names, logos, brands, and other trademarks featured or referred to within this user’s guide, or the congatec website, are the property
of their respective trademark holders. These trademark holders are not affiliated with congatec AG, our products, or our website.

Copyright © 2016 congatec AG TR33m10 5/105
Warranty
congatec AG makes no representation, warranty or guaranty, express or implied regarding the products except its standard form of limited
warranty (“Limited Warranty”) per the terms and conditions of the congatec entity, which the product is delivered from. These terms and
conditions can be downloaded from www.congatec.com. congatec AG may in its sole discretion modify its Limited Warranty at any time and
from time to time.
The products may include software. Use of the software is subject to the terms and conditions set out in the respective owner’s license
agreements, which are available at www.congatec.com and/or upon request.
Beginning on the date of shipment to its direct customer and continuing for the published warranty period, congatec AG represents that the
products are new and warrants that each product failing to function properly under normal use, due to a defect in materials or workmanship or
due to non conformance to the agreed upon specifications, will be repaired or exchanged, at congatec’s option and expense.
Customer will obtain a Return Material Authorization (“RMA”) number from congatec AG prior to returning the non conforming product freight
prepaid. congatec AG will pay for transporting the repaired or exchanged product to the customer.
Repaired, replaced or exchanged product will be warranted for the repair warranty period in effect as of the date the repaired, exchanged
or replaced product is shipped by congatec, or the remainder of the original warranty, whichever is longer. This Limited Warranty extends to
congatec’s direct customer only and is not assignable or transferable.
Except as set forth in writing in the Limited Warranty, congatec makes no performance representations, warranties, or guarantees, either
express or implied, oral or written, with respect to the products, including without limitation any implied warranty (a) of merchantability, (b) of
fitness for a particular purpose, or (c) arising from course of performance, course of dealing, or usage of trade.
congatec AG shall in no event be liable to the end user for collateral or consequential damages of any kind. congatec shall not otherwise be
liable for loss, damage or expense directly or indirectly arising from the use of the product or from any other cause. The sole and exclusive
remedy against congatec, whether a claim sound in contract, warranty, tort or any other legal theory, shall be repair or replacement of the
product only.
Certification
congatec AG is certified to DIN EN ISO 9001 standard.
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Copyright © 2016 congatec AG TR33m10 6/105
Technical Support
congatec AG technicians and engineers are committed to providing the best possible technical support for our customers so that our products
can be easily used and implemented. We request that you first visit our website at www.congatec.com for the latest documentation, utilities
and drivers, which have been made available to assist you. If you still require assistance after visiting our website then contact our technical
support department by email at [email protected]
Terminology
Term Description
GB Gigabyte (1,073,741,824 bytes)
GHz Gigahertz (one billion hertz)
kB Kilobyte (1024 bytes)
MB Megabyte (1,048,576 bytes)
Mbit Megabit (1,048,576 bits)
kHz Kilohertz (one thousand hertz)
MHz Megahertz (one million hertz)
TDP Thermal Design Power
PCIe PCI Express
SATA Serial ATA
PEG PCI Express Graphics
T.O.M. Top of memory = max. DRAM installed
HDA High Definition Audio
I/F Interface
N.C. Not connected
N.A. Not available
cBC congatec Board Controller
TBD To be determined

Copyright © 2016 congatec AG TR33m10 7/105
Contents
1 Introduction ............................................................................. 10
2 Specifications........................................................................... 12
2.1 Feature List .............................................................................. 12
2.2 Supported Operating Systems ................................................ 13
2.3 Mechanical Dimensions ........................................................... 13
2.4 Supply Voltage Standard Power .............................................. 14
2.4.1 Electrical Characteristics .......................................................... 14
2.4.2 Rise Time ................................................................................. 14
2.5 Power Consumption ................................................................ 15
2.5.1 conga-TR3 AMD Embedded RX-421BD 2.1/3.4 GHz Quad Core
2MB L2 Cache.......................................................................... 16
2.5.2 conga-TR3 AMD Embedded RX-418GD 1.8/3.2 GHz Quad Core
2MB L2 Cache.......................................................................... 16
2.5.3 conga-TR3 AMD Embedded RX-216GD 1.6/3.0 GHz Dual Core
1MB L2 Cache.......................................................................... 17
2.6 Supply Voltage Battery Power ................................................. 17
2.6.1 CMOS Battery Power Consumption ........................................ 17
2.7 Environmental Specifications................................................... 18
3 Block Diagram.......................................................................... 19
4 Cooling Solutions..................................................................... 20
4.1 CSA Dimensions ...................................................................... 20
4.2 CSP Dimensions....................................................................... 21
4.3 Heatspreader Dimensions........................................................ 22
5 Onboard Temperature Sensor ................................................. 24
6 Connector Subsystems Rows A, B, C, D.................................. 25
6.1 Primary Connector Rows A and B............................................ 26
6.1.1 Serial ATA™ (SATA).................................................................. 26
6.1.2 USB 2.0 .................................................................................... 26
6.1.3 High Definition Audio (HDA) Interface .................................... 26
6.1.4 Gigabit Ethernet ..................................................................... 27
6.1.5 LPC Bus.................................................................................... 27
6.1.6 I²C Bus Fast Mode ................................................................... 27
6.1.7 PCI Express™........................................................................... 28
6.1.8 ExpressCard™ ......................................................................... 28
6.1.9 VGA.......................................................................................... 28
6.1.10 LVDS......................................................................................... 28
6.1.11 General Purpose Input/Output................................................ 29
6.1.12 Serial Ports/UART Interfaces .................................................... 29
6.1.13 Power Control .......................................................................... 29
6.1.14 Power Management................................................................. 31
6.2 Secondary Connector Rows C and D....................................... 32
6.2.1 PCI Express™........................................................................... 32
6.2.2 PCI Express Graphics (PEG) ..................................................... 32
6.2.3 Digital Display Interface........................................................... 32
6.2.3.1 DisplayPort (DP) ....................................................................... 33
6.2.3.2 HDMI........................................................................................ 33
6.2.3.3 DVI ........................................................................................... 33
6.2.4 USB 3.0 .................................................................................... 33
7 Additional Features.................................................................. 34
7.1 congatec Board Controller (cBC) ............................................. 34
7.1.1 Board Information.................................................................... 34
7.1.2 Fan Control .............................................................................. 34
7.1.3 Power Loss Control.................................................................. 34
7.1.4 Watchdog ................................................................................ 35
7.2 OEM BIOS Customization........................................................ 35
7.2.1 OEM Default Settings .............................................................. 35
7.2.2 OEM Boot Logo....................................................................... 35
7.2.3 OEM POST Logo ..................................................................... 36
7.2.4 OEM BIOS Code/Data............................................................. 36
7.2.5 OEM DXE Driver...................................................................... 36
7.3 congatec Battery Management Interface ................................ 36
7.4 API Support (CGOS) ................................................................ 37
7.5 Security Features...................................................................... 37
7.6 Suspend to Ram....................................................................... 37
8 conga Tech Notes .................................................................... 38

Copyright © 2016 congatec AG TR33m10 8/105
8.1 AHCI ........................................................................................ 38
8.2 AMD Processor Features ......................................................... 38
8.2.1 AMD64 Technology ................................................................. 38
8.2.2 Power Management................................................................. 39
8.2.3 AMD Virtualization™Technology ............................................. 39
8.3 Thermal Management ............................................................. 40
8.4 ACPI Suspend Modes and Resume Events.............................. 41
8.5 USB Host Controller................................................................. 42
9 Signal Descriptions and Pinout Tables..................................... 43
9.1 A-B Connector Signal Descriptions ......................................... 44
9.2 A-B Connector Pinout.............................................................. 53
9.3 C-D Connector Signal Descriptions......................................... 55
9.4 C-D Connector Pinout ............................................................. 64
10 System Resources .................................................................... 66
10.1 I/O Address Assignment.......................................................... 66
10.1.1 LPC Bus.................................................................................... 66
10.2 PCI Configuration Space Map ................................................. 67
10.3 PCI Interrupt Routing Map....................................................... 69
10.4 I2C............................................................................................ 70
10.5 SM Bus..................................................................................... 70
11 BIOS Setup Description........................................................... 71
11.1 Entering the BIOS Setup Program........................................... 71
11.1.1 Boot Selection Popup.............................................................. 71
11.2 Setup Menu and Navigation.................................................... 71
11.3 Main Setup Screen................................................................... 72
11.3.1 Advanced Setup ...................................................................... 73
11.3.2 Graphics Submenu................................................................... 74
11.3.3 Hardware Monitoring Submenu............................................... 76
11.3.4 Watchdog Submenu ................................................................ 77
11.3.5 Module Serial Ports.................................................................. 79
11.3.6 Trusted Platform Module 1.2 Submenu ................................... 80
11.3.7 Trusted Platform Module 2.0 Submenu ................................... 81
11.3.8 RTC Wake Submenu................................................................ 81
11.3.9 Memory Submenu ................................................................... 82
11.3.10 Chipset Submenu .................................................................... 82
11.3.11 SATA Submenu ........................................................................ 83
11.3.12 ACPI Submenu......................................................................... 83
11.3.13 Super I/O Submenu ................................................................. 84
11.3.14 Serial Port Console Redirection Submenu............................... 85
11.3.14.1 Console Redirection Settings Submenu .................................. 85
11.3.15 CPU Submenu.......................................................................... 86
11.3.16 PCI Express Submenu.............................................................. 87
11.3.16.1 PCI Express Settings Submenu................................................ 88
11.3.16.2 PCI Express Port Control Submenu ......................................... 89
11.3.16.3 PIRQ Routing & IRQ Reservation Submenu............................. 91
11.3.17 UEFI Network Stack Submenu................................................. 92
11.3.18 CSM and Option ROM Submenu ............................................ 92
11.3.19 Info Report Submenu............................................................... 93
11.3.20 NVMe Submenu....................................................................... 94
11.3.21 SDIO Submenu ........................................................................ 94
11.3.22 USB Submenu.......................................................................... 94
11.3.22.1 USB Controllers and Ports Submenu ....................................... 95
11.3.23 Diagnostic Settings Submenu.................................................. 96
11.3.24 PC Speaker Configuration Submenu ....................................... 97
11.3.25 Intel®I211 Gigabit Network Connection Submenu................. 97
11.3.25.1 NIC Configuration Submenu ................................................... 98
11.4 Security Setup.......................................................................... 98
11.4.1 Security Settings ...................................................................... 98
11.4.1.1 BIOS Security Features ............................................................ 99
11.4.1.2 Hard Disk Security Features................................................... 100
11.4.2 Boot Settings Configuration .................................................. 101
11.5 Save & Exit Menu................................................................... 102
11.5.1 Save & Exit Configuration...................................................... 103
12 Additional BIOS Features ...................................................... 104
12.1 Supported Flash Devices ....................................................... 104
12.2 Updating the BIOS................................................................. 104
13 Industry Specifications ........................................................... 105

Copyright © 2016 congatec AG TR33m10 9/105
List of Tables
Table 1 COM Express™ 2.0 pinout types ............................................ 10
Table 2 conga-TR3 Options.................................................................. 11
Table 3 Feature Summary..................................................................... 12
Table 4 System State Description......................................................... 15
Table 5 Part No. 041300....................................................................... 16
Table 6 Part No. 041301....................................................................... 16
Table 7 Part No. 041302....................................................................... 17
Table 8 CMOS Battery Power Consumption ........................................ 17
Table 9 Digital Display Interface........................................................... 32
Table 10 Wake Events............................................................................. 41
Table 11 Signal Tables Terminology Descriptions .................................. 43
Table 12 High Definition Audio Link Signals Descriptions ..................... 44
Table 13 Testing...................................................................................... 44
Table 14 Gigabit Ethernet Signal Descriptions....................................... 44
Table 15 Serial ATA Signal Descriptions ................................................. 46
Table 16 PCI Express Signal Descriptions (general purpose) ................. 47
Table 17 ExpressCard Support Pins Descriptions................................... 47
Table 18 LPC Signal Descriptions........................................................... 48
Table 19 USB 2.0 Signal Descriptions..................................................... 48
Table 20 LVDS Signal Descriptions......................................................... 49
Table 21 SPI BIOS Flash Interface Signal Descriptions........................... 50
Table 22 Miscellaneous Signal Descriptions........................................... 50
Table 23 General Purpose I/O Signal Descriptions ................................ 51
Table 24 Power and System Management Signal Descriptions ............. 51
Table 25 Serial/UART Interface Signal Descriptions ............................... 52
Table 26 Power and GND Signal Descriptions....................................... 52
Table 27 Connector A-B Pinout.............................................................. 53
Table 28 PCI Express Signal Descriptions (general purpose) ................. 55
Table 29 USB 3.0 Signal Descriptions..................................................... 55
Table 30 PCI Express Signal Descriptions (x16 Graphics)....................... 56
Table 31 DDI Signal Description............................................................. 58
Table 32 HDMI/DVI Signal Descriptions................................................. 60
Table 33 DisplayPort (DP) Signal Descriptions ....................................... 61
Table 34 Module Type Definition Signal Description ............................. 62
Table 35 Power and GND Signal Descriptions....................................... 63
Table 36 Connector C-D Pinout ............................................................. 64
Table 37 I/O address ranges to LPC Bus................................................ 66
Table 38 PCI Configuration Space Map ................................................. 67
Table 39 PCI Interrupt Routing Map #1.................................................. 69
Table 40 PCI Interrupt Routing Map #2.................................................. 69

Copyright © 2016 congatec AG TR33m10 10/105
1 Introduction
COM Express™ Concept
COM Express™ is an open industry standard defined specifically for COMs (computer on modules). Its creation makes it possible to smoothly
transition from legacy interfaces to the newest technologies available today. COM Express™ modules are available in following form factors:
•Mini 84mm x 55mm
•Compact 95mm x 95mm
•Basic 125mm x 95mm
•Extended 155mm x110mm
Table 1 COM Express™ 2.0 pinout types
Types Connector Rows PCI Express Lanes PCI IDE Channels LAN ports
Type 1 A-B Up to 6 1
Type 2 A-B C-D Up to 22 32 bit 1 1
Type 3 A-B C-D Up to 22 32 bit 3
Type 4 A-B C-D Up to 32 1 1
Type 5 A-B C-D Up to 32 3
Type 6 A-B C-D Up to 24 1
Type 10 A-B Up to 4 1
conga-TR3 modules utilize the Type 6 pinout definition and are COM Express 2.1 Compliant. They are equipped with two high performance
connectors that ensure stable data throughput.
The COM (computer on module) integrates all the core components and is mounted onto an application specific carrier board. COM modules
are a legacy-free design (no Super I/O, PS/2 keyboard and mouse) and provide most of the functional requirements for any application. These
functions include, but are not limited to, a rich complement of contemporary high bandwidth serial interfaces such as PCI Express, Serial ATA,
USB 2.0, and Gigabit Ethernet. The Type 6 pinout provides the ability to offer PCI Express, Serial ATA, and LPC options thereby expanding
the range of potential peripherals. The robust thermal and mechanical concept, combined with extended power-management capabilities, is
perfectly suited for all applications.
Carrier board designers can utilize as little or as many of the I/O interfaces as deemed necessary. The carrier board can therefore provide all
the interface connectors required to attach the system to the application specific peripherals. This versatility allows the designer to create a
dense and optimized package, which results in a more reliable product while simplifying system integration. Most importantly, COM Express™
modules are scalable, which means once an application has been created there is the ability to diversify the product range through the use
of different performance class or form factor size modules. Simply unplug one module and replace it with another, no redesign is necessary.

Copyright © 2016 congatec AG TR33m10 11/105
conga-TR3 Options Information
The conga-TR3 is available in three variants. This user’s guide describes these variants. The table below shows the different configurations
available. Check the Part No. that applies to your product. This will tell you what options described in this user’s guide are available on your
particular module.
Table 2 conga-TR3 Options
Part-No. 041300 041301 041302
SoC AMD Embedded RX-421BD AMD Embedded RX-418GD AMD Embedded RX-216GD
CPU Freq. 2.1/3.4 GHz Quad Core 1.8/3.2 GHz Quad Core 1.6/3.0 GHz Dual Core
L2 Shared Cache 2 MB 2 MB 1 MB
Memory (DDR4) 2133 MT/s dual channel 2133 MT/s dual channel 1600 MT/s dual channel
GPU Freq / Compute Unit 800 MHz / 8 CU 800 MHz / 6 CU 800 MHz / 4 CU
Graphics Engine AMD RadeonTM R7 Graphics AMD RadeonTM R6 Graphics AMD RadeonTM R5 Graphics
PCIe 3 PCIe Gen 3 ports 3 PCIe Gen 3 ports 3 PCIe Gen 3 ports
PEG 1 PEG Gen 3 port (x8 lanes) 1 PEG Gen 3 port (x8 lanes) 1 PEG Gen 3 port (x8 lanes)
USB 3.0 Up to 4 ports Up to 4 ports Up to 4 ports
DDI Dual-mode DP 1.2 Dual-mode DP 1.2 Dual-mode DP 1.2
LVDS/eDP LVDS LVDS LVDS
SoC TDP/cTDP 15 / 12-35 W 15 / 12-35 W 15 / 12-15 W

Copyright © 2016 congatec AG TR33m10 12/105
2 Specifications
2.1 Feature List
Table 3 Feature Summary
Form Factor Based on COM Express™ standard pinout Type 6 (Basic size 95 x 125mm). Compliant with COM Express 2.1 specification.
SoC 3rd Generation AMD Embedded R-Series (FP4) SoC, with TDP ranging from 12-35W
Memory SO-DIMM DDR4 up to 2133 MT/s. Supports up to 32GB with 2x 16GB SO-DIMM modules (ECC and non-ECC). Sockets located top and bottom side
of module.
Chipset Integrated in the SoC
Audio High Definition Audio (HDA) interface
Ethernet 1 Gigabit Ethernet support via the onboard Intel®Ethernet Controller i211.
Graphics Options AMD Radeon 3rd Generation GCN, Unified Video Decoder 6 (4K H.265 and H.264), Video Compression Engine 3.1 (4K H.264 encode), OpenGL 4.4,
OpenCL®2.0, DirectX®12, full HSA support, up to three independent displays.
LVDS (Integrated flat panel interface with 25-112MHz single/dual-channel
Transmitter). Supports:
-Single-channel LVDS interface: 1 x 18 bpp or 1 x 24 bpp.
-Dual-channel LVDS interface : 2 x 18 bpp or 2 x 24 bpp.
-VESA standard or JEIDA data mapping
-Automatic Panel Detection via Embedded Panel Interface based on VESA
EDID™ 1.3.
-Resolution up to 1920x1200 in dual channel LVDS mode.
Optional eDP interface (assembly option)
NOTE: Either eDP or LVDS signals supported. Both not supported.
1 PEG Gen 3 port (x8 lanes) for external graphics.
2 dedicated DDIs (Digital Display Interfaces) with support for
-2 DisplayPort 1.2 (resolution up to 4k @ 60Hz).
-2 HDMI 2.0 port (requires external level shifter)
-2 DVI port (requires external level shifter).
1 Optional DDI (assembly option)
NOTE: To support HDMI/DVI, an external level shifter (e.g PTN
3360D) needs to be implemented on the user’s carrier board.
Peripheral
Interfaces
2 Serial ATA®(6 Gb/s)
3 PCI Express®3.0 ports (8 GT/s).
4 USB 2.0
4 USB 3.0/2.0
2 UART
2 ExpressCard
LPC Bus
SDIO interface (shared with GPIOs
I²C Bus, Fast Mode, multimaster
SM Bus
SPI
BIOS AMI Aptio®UEFI 5.x firmware; 8 MByte serial SPI with congatec Embedded BIOS features
Security Optional TPM 1.2/2.0
Power
Management
ACPI 5.0 compliant with battery support. Also supports Suspend to RAM (S3).
cBC Multi-stage watchdog, manufacturing and board information, board statistics, I2C bus, Power loss control.
Note
Some of the features mentioned in the above Feature Summary are optional. Check the article number of your module and compare it to the
option information list on page 11 of this user’s guide to determine what options are available on your particular module.

Copyright © 2016 congatec AG TR33m10 13/105
2.2 Supported Operating Systems
The conga-TR3 supports the following operating systems.
•Microsoft®Windows®10
•Microsoft®Windows®10 IOT enterprise
•Microsoft®Windows®8.1
•Microsoft®Windows®8.1 Embedded Standard
•Microsoft®Windows®7
•Microsoft®Windows®7 Embedded Standard
•Linux
Note
To improve the graphic performance of conga-TR3 after installing Microsoft®Windows®Operating System, congatec AG recommends the
installation of AMD catalyst driver.
2.3 Mechanical Dimensions
•95.0 mm x 125.0 mm (3.74” x 4.92”)
•Height approximately 18 or 21mm (including heatspreader) depending on the carrier board connector that is used. If the 5mm (height)
carrier board connector is used then approximate overall height is 18mm. If the 8mm (height) carrier board connector is used then approximate
overall height is 21mm.

Copyright © 2016 congatec AG TR33m10 14/105
2.4 Supply Voltage Standard Power
•12V DC ± 5%
The dynamic range shall not exceed the static range.
2.4.1 Electrical Characteristics
Power supply pins on the module’s connectors limit the amount of input power. The following table provides an overview of the limitations for
pinout Type 6 (dual connector, 440 pins).
Power Rail Module Pin
Current Capability
(Amps)
Nominal
Input (Volts)
Input
Range
(Volts)
Derated
Input (Volts)
Max. Input Ripple
(10Hz to 20MHz)
(mV)
Max. Module Input
Power (w. derated input)
(Watts)
Assumed
Conversion
Efficiency
Max. Load
Power
(Watts)
VCC_12V 12 12 11.4-12.6 11.4 +/- 100 137 85% 116
VCC_5V-SBY 2 5 4.75-5.25 4.75 +/- 50 9
VCC_RTC 0.5 3 2.0-3.3 +/- 20
2.4.2 Rise Time
The input voltages shall rise from 10% of nominal to 90% of nominal at a minimum slope of 250V/s. The smooth turn-on requires that during
the 10% to 90% portion of the rise time, the slope of the turn-on waveform must be positive.
Nominal Static Range
Dynamic Range
Absolute Minimum
Absolute Maximum12.60V
11.40V
12V
12.10V
11.90V

Copyright © 2016 congatec AG TR33m10 15/105
2.5 Power Consumption
The power consumption values were measured using the following test setup:
•conga-TR3 COM
•modified carrier board to measure the power consumption of the COM
•product specific cooling solution with the highest cooling capacity
•running Windows OS
Note
All peripherals were powered externally and therefore did not influence the measured values.
The power consumption values were recorded during the following S-states:
Table 4 System State Description
System State Description
S0: Minimum value COM set to lowest frequency mode (LFM) with minimum core voltage during
desktop idle. The CPU was stressed to its maximum frequency in this S-state.
S0: Maximum value COM set to highest frequency mode (HFM/Turbo Boost). The CPU was
stressed to its maximum frequency in this S-state.
S0: Peak value The worst case power consumption value shows the peak value over a
short period of time. Highest power spike during the measurement of
“S0: Maximum value”. This value should be taken into consideration when
designing the system’s power supply to ensure that the power supply is
sufficient during worst case scenarios
S3 COM is powered by VCC_5V_SBY.
S5 COM is powered by VCC_5V_SBY.

Copyright © 2016 congatec AG TR33m10 16/105
Processor Information
The tables below provide additional information about the power consumption data for each of the conga-TR3 variants offered. The values are
recorded at various operating mode.
2.5.1 conga-TR3 AMD Embedded RX-421BD 2.1/3.4 GHz Quad Core 2MB L2 Cache
Table 5 Part No. 041300
Part No. 041300 (R7 Graphics) AMD Embedded RX-421BD 2.1GHz Quad Core 2MB L2 Cache (28nm) Hardware revision A.0 /BIOS revision TR3R016
Max Turbo Frequency 3.2GHz
Memory Size 2x 4GB
Operating System Windows 7 (64 bit)
Power State S0: Min S0: Max S0: Peak S3 S5
Power consumption 0.24 A /2.85 W 4.33 A /51.93 W 8.6 A /103.2 W 0.08 A /0.41 W 0.07 A /0.35 W
2.5.2 conga-TR3 AMD Embedded RX-418GD 1.8/3.2 GHz Quad Core 2MB L2 Cache
Table 6 Part No. 041301
Part No. 041301 (R6 Graphics) AMD Embedded RX-418GD 1.8GHz Quad Core 2MB L2 Cache (28nm) Hardware revision A.0 /BIOS revision TR3R016
Max Turbo Frequency 3.2GHz
Memory Size 2x 4GB
Operating System Windows 7 (64 bit)
Power State S0: Min S0: Max S0: Peak S3 S5
Power consumption 0.25 A /3 W 4.33 A /52.01 W 7.76 A /93.06 W 0.08 A /0.41 W 0.07 A /0.35 W

Copyright © 2016 congatec AG TR33m10 17/105
2.5.3 conga-TR3 AMD Embedded RX-216GD 1.6/3.0 GHz Dual Core 1MB L2 Cache
Table 7 Part No. 041302
Part No. 041302 (R5 Graphics) AMD Embedded RX-216GD 1.6GHz Dual Core 1MB L2 Cache (28nm) Hardware revision A.0 /BIOS revision TR3R016
Max Turbo Frequency 3.0GHz
Memory Size 2x 4GB
Operating System Windows 7 (64 bit)
Power State S0: Min S0: Max S0: Peak S3 S5
Power consumption 0.4 A /4.78 W 3.72 A /44.63 W 5.27 A /63.21 W 0.08 A /0.41 W 0.06 A /0.32 W
Note
All recorded power consumption values are approximate and only valid for the controlled environment described earlier. 100% workload
refers to the CPU workload and not the maximum workload of the complete module. Supply power for S3 mode is 5V while all other measured
modes are supplied with 12V power. Power consumption results will vary depending on the workload of other components such as graphics
engine, memory, etc.
2.6 Supply Voltage Battery Power
•2.3V - 3.5V DC
•Typical 3V DC
2.6.1 CMOS Battery Power Consumption
Table 8 CMOS Battery Power Consumption
RTC: measured with conga-TR3/421BD Voltage Current
-10°C 3V DC 2,19 µA
20°C 3V DC 2,84 µA
70°C 3V DC 4,77 µA
The CMOS battery power consumption value listed above should not be used to calculate CMOS battery lifetime. You should measure the
CMOS battery power consumption in your customer specific application in worst case conditions, for example during high temperature and
high battery voltage. The self-discharge of the battery must also be considered when determining CMOS battery lifetime. For more information
about calculating CMOS battery lifetime refer to application note AN9_RTC_Battery_Lifetime.pdf, which can be found on the congatec AG
website at www.congatec.com.

Copyright © 2016 congatec AG TR33m10 18/105
2.7 Environmental Specifications
Temperature Operation: 0° to 60°C Storage: -20° to +80°C
Humidity Operation: 10% to 90% Storage: 5% to 95%
Caution
The above operating temperatures must be strictly adhered to at all times. When using a congatec heatspreader, the maximum operating
temperature refers to any measurable spot on the heatspreader’s surface.
Humidity specifications are for non-condensing conditions.

Copyright © 2016 congatec AG TR33m10 19/105
3 Block Diagram
*
*
*
*
Note:
Not supported by default. Only available as assembly option.
AMD Embedded R-Series SOC
(3rd Generation)
Integrated SoC
Compute Unit
Core #1 Core #2
Core #3 Core #4
SSE4.2 AVX
Memory
high performance ECC low power
2MB Shared L2
Graphics Unit
OpenGL 4.4 OpenCL 2.0 DirectX 12
Interfaces
DisplayPort HDMI/DVI
SATA USB 2.0
LPC BusPCIe
Integrated I/O Interfaces
GPIOs
USB 3.0
MPEG-4 WMV-9 VC-1 MPEG-2
MVCH.265 H.264
Multimedia Features
MJPEG
Platform Security
AES
RSA SHA TRNG
PCIe Port 6 - 7
Connector
220 pos
Ethernet
COM Express AB
PCIe-GBE
congatec
Board
Controller
MUX
Optional
TPM
Intel i210
NXP PTN3460
RES
LVDS/eDP
Connector
220 pos
COM Express CD
LPC Bus
HDA I/F
USB Port 0 - 7
SATA Port 0 - 1
SATA Port 2 - 3
GPIOs / SDIO
I2C Bus
SM Bus
Serial Port 1-0
FAN control
CRT
PCIe Port 3
PCIe Port 0 - 2
PCIe Port 4 - 5
PEG Lane 8 - 15
PEG Lane 0 - 7
DDI 1
DDI 2
DDI 3
4x USB SS
PEG x8
DP0
DP0 DP2
DP1
LPC
8x USB2.0
GBE
PCIE 3x1
PE x1
2x SATA
SD / SDIO
GPIOs
eDP (Assembly Option)
USB SS Port 0 - 3
Dual Channel DDR4
Up to 2x 16 GB SODIMM
eDP to LVDS
Bridge

Copyright © 2016 congatec AG TR33m10 20/105
4 Cooling Solutions
congatec AG offers three cooling solutions for the conga-TR3:
•Active cooling solution (CSA)
•Passive cooling solution (CSP)
•Heatspreader
The dimensions of the cooling solutions are shown below and all measurements are in millimeters. The maximum torque specification for
heatspreader screws is 0.3 Nm. Mechanical system assembly mounting shall follow the valid DIN/ISO specifications..
4.1 CSA Dimensions