Congatec conga-PA7 Pico-ITX User manual

conga-PA7 Pico-ITX SBC
Based on Intel® Atom® x6000E/RE Series and Intel® Pentium® and Celeron® J Series processors
User's Guide
Revision 0.1 (Preliminary)

Copyright © 2021 congatec GmbH PA70m01 2/45
Revision History
Revision Date (yyyy.mm.dd) Author Changes
0.1 2021.04.15 BEU •Preliminary release

Copyright © 2021 congatec GmbH PA70m01 3/45
Preface
This user's guide provides information about the components, features and connectors available on the conga-PA7 Pico-ITX SBC.
Disclaimer
The information contained within this user’s guide, including but not limited to any product specification, is subject to change without notice.
congatec GmbH provides no warranty with regard to this user’s guide or any other information contained herein and hereby expressly disclaims
any implied warranties of merchantability or fitness for any particular purpose with regard to any of the foregoing. congatec GmbH assumes
no liability for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for
discrepancies between the product and the user’s guide. In no event shall congatec GmbH be liable for any incidental, consequential, special,
or exemplary damages, whether based on tort, contract or otherwise, arising out of or in connection with this user’s guide or any other
information contained herein or the use thereof.
Intended Audience
This user's guide is intended for technically qualified personnel. It is not intended for general audiences.
Lead-Free Designs (RoHS)
All congatec GmbH products are created from lead-free components and are completely RoHS compliant.
Electrostatic Sensitive Device
All congatec GmbH products are electrostatic sensitive devices. They are enclosed in static shielding bags, and shipped enclosed in secondary
packaging (protective packaging). The secondary packaging does not provide electrostatic protection.
Do not remove the device from the static shielding bag or handle it, except at an electrostatic-free workstation. Also, do not ship or store
electronic devices near strong electrostatic, electromagnetic, magnetic, or radioactive fields unless the device is contained within its original
packaging. Be aware that failure to comply with these guidelines will void the congatec GmbH Limited Warranty.

Copyright © 2021 congatec GmbH PA70m01 4/45
Symbols
The following symbols are used in this user's guide:
Warning
Warnings indicate conditions that, if not observed, can cause personal injury.
Caution
Cautions warn the user about how to prevent damage to hardware or loss of data.
Note
Notes call attention to important information that should be observed.
Connector Type
Describes the connector used on the Single Board Computer and a possible mating connector.
Copyright Notice
Copyright © 2021, congatec GmbH. All rights reserved. All text, pictures and graphics are protected by copyrights. No copying is permitted
without written permission from congatec GmbH.
congatec GmbH has made every attempt to ensure that the information in this document is accurate yet the information contained within is
supplied “as-is”.

Copyright © 2021 congatec GmbH PA70m01 5/45
Trademarks
Product names, logos, brands, and other trademarks featured or referred to within this user’s guide, or the congatec website, are the property
of their respective trademark holders. These trademark holders are not affiliated with congatec GmbH, our products, or our website.
Warranty
congatec GmbH makes no representation, warranty or guaranty, express or implied regarding the products except its standard form of limited
warranty (“Limited Warranty”) per the terms and conditions of the congatec entity, which the product is delivered from. These terms and
conditions can be downloaded from www.congatec.com. congatec GmbH may in its sole discretion modify its Limited Warranty at any time
and from time to time.
The products may include software. Use of the software is subject to the terms and conditions set out in the respective owner’s license
agreements, which are available at www.congatec.com and/or upon request.
Beginning on the date of shipment to its direct customer and continuing for the published warranty period, congatec GmbH represents that
the products are new and warrants that each product failing to function properly under normal use, due to a defect in materials or workmanship
or due to non conformance to the agreed upon specifications, will be repaired or exchanged, at congatec’s option and expense.
Customer will obtain a Return Material Authorization (“RMA”) number from congatec GmbH prior to returning the non conforming product
freight prepaid. congatec GmbH will pay for transporting the repaired or exchanged product to the customer.
Repaired, replaced or exchanged product will be warranted for the repair warranty period in effect as of the date the repaired, exchanged
or replaced product is shipped by congatec, or the remainder of the original warranty, whichever is longer. This Limited Warranty extends to
congatec’s direct customer only and is not assignable or transferable.
Except as set forth in writing in the Limited Warranty, congatec makes no performance representations, warranties, or guarantees, either
express or implied, oral or written, with respect to the products, including without limitation any implied warranty (a) of merchantability, (b) of
fitness for a particular purpose, or (c) arising from course of performance, course of dealing, or usage of trade.
congatec GmbH shall in no event be liable to the end user for collateral or consequential damages of any kind. congatec shall not otherwise
be liable for loss, damage or expense directly or indirectly arising from the use of the product or from any other cause. The sole and exclusive
remedy against congatec, whether a claim sound in contract, warranty, tort or any other legal theory, shall be repair or replacement of the
product only.

Copyright © 2021 congatec GmbH PA70m01 6/45
Certification
congatec GmbH is certified to DIN EN ISO 9001 standard.
Technical Support
congatec GmbH technicians and engineers are committed to providing the best possible technical support for our customers so that our
products can be easily used and implemented. We request that you first visit our website at www.congatec.com for the latest documentation,
utilities and drivers, which have been made available to assist you. If you still require assistance after visiting our website then contact our
technical support department by email at [email protected]
Terminology
Term Description
PCIe Peripheral Component Interface Express
cBC congatec Board Controller
SDIO Secure Digital Input Output
USB Universal Serial Bus
SATA Serial AT Attachment: serial-interface standard for hard disks
HDA High Definition Audio
S/PDIF Sony/Philips Digital Interconnect Format
TMDS Transition Minimized Differential Signaling
LPC Low Pin-Count
I²C Bus Inter-Integrated Circuit Bus
SBC Single Board Computer
SM Bus System Management Bus
SPI Serial Peripheral Interface
GbE Gigabit Ethernet
LVDS Low-Voltage Differential Signaling
DDC Display Data Channel is an I²C bus interface between a display and a graphics adapter.
PN Part Number - the part number for placing orders.
N.C Not connected
N.A Not available
TBD To be determined
C
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A
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Copyright © 2021 congatec GmbH PA70m01 7/45
Contents
1 Introduction ............................................................................. 10
1.1 Pico-ITX Concept..................................................................... 10
1.2 conga-PA7................................................................................ 10
1.2.1 Options Information................................................................. 11
1.2.2 Optional Accessories ............................................................... 12
2 Specification ............................................................................ 13
2.1 Feature List .............................................................................. 13
2.2 Supported Operating Systems ................................................ 14
2.3 Mechanical Dimensions ........................................................... 14
2.4 Power Supply Voltage.............................................................. 14
2.5 Power Consumption ................................................................ 14
2.6 Supply Voltage Battery Power ................................................. 16
2.7 Environmental Specifications................................................... 16
3 Block Diagram.......................................................................... 17
4 Cooling Solutions..................................................................... 18
4.1 CSP Dimensions ...................................................................... 19
4.2 HSP Dimensions....................................................................... 21
5 Connector Description............................................................. 23
5.1 Power Supply Connectors........................................................ 23
5.1.1 DC Power Jack......................................................................... 23
5.1.2 2-Pin Power Connector............................................................ 23
5.1.3 USB Type-C®Port..................................................................... 24
5.2 Cell Battery Header ................................................................. 24
5.3 System State LED..................................................................... 25
5.4 Audio Header .......................................................................... 25
5.5 USB Interfaces.......................................................................... 26
5.5.1 USB Type-A Ports..................................................................... 26
5.5.2 USB Type-C®Port..................................................................... 26
5.5.3 USB 2.0 Header ....................................................................... 27
5.6 Ethernet Ports .......................................................................... 27
5.7 Display Interfaces..................................................................... 28
5.7.1 Dual-Mode DisplayPort (DP++) ............................................... 28
5.7.2 USB Type-C®Port..................................................................... 28
5.7.3 LVDS Header............................................................................ 29
5.7.3.1 Backlight Power Header .......................................................... 30
5.7.3.2 Panel Power Jumper ................................................................ 30
5.8 COM Ports ............................................................................... 31
5.9 CAN Ports ................................................................................ 32
5.10 M.2 Key-B ................................................................................ 33
5.11 M.2 Key-E ................................................................................ 34
5.12 CPU Fan Header ...................................................................... 36
5.13 BIOS Flash Header................................................................... 36
6 Additional Features.................................................................. 37
6.1 Feature Connectors ................................................................. 37
6.1.1 Buttons and LEDs .................................................................... 37
6.1.2 I2C and Watchdog................................................................... 38
6.1.3 GPIOs and Real-Time Trigger Signals...................................... 39
6.2 DRAM....................................................................................... 39
6.3 Flash Storage ........................................................................... 39
6.4 congatec Board Controller (cBC) ............................................. 40
6.4.1 Fan Control .............................................................................. 40
6.4.2 Power Loss Control.................................................................. 40
6.4.3 Board Information.................................................................... 40
6.5 OEM BIOS Customization........................................................ 40
6.5.1 OEM Default Settings .............................................................. 40
6.5.2 OEM Boot Logo....................................................................... 41
6.5.3 OEM POST Logo ..................................................................... 41
6.5.4 OEM BIOS Code/Data............................................................. 41
6.5.5 OEM DXE Driver...................................................................... 41
6.6 congatec Battery Management Interface ................................ 41
6.7 API Support (CGOS) ................................................................ 42
6.8 Thermal/Voltage Monitoring.................................................... 42
6.9 External System Wake Event ................................................... 42
6.10 Security Features...................................................................... 42

Copyright © 2021 congatec GmbH PA70m01 8/45
7 Mechanical Drawing ................................................................ 43
8 BIOS Setup Description........................................................... 44
8.1 Navigating the BIOS Setup Menu ........................................... 44
8.2 BIOS Versions........................................................................... 44
8.3 Updating the BIOS................................................................... 45
8.4 Supported Flash Device........................................................... 45

Copyright © 2021 congatec GmbH PA70m01 9/45
List of Tables
Table 1 conga-PA7 Commercial Variants.............................................. 11
Table 2 conga-PA7 Industrial Variants .................................................. 11
Table 3 Cooling Solutions..................................................................... 12
Table 4 Cables...................................................................................... 12
Table 5 Power Supplies ........................................................................ 12
Table 6 Feature Summary..................................................................... 13
Table 7 Measurement Description........................................................ 15
Table 8 Power Consumption Values ..................................................... 15
Table 9 CMOS Battery Power Consumption ........................................ 16
Table 10 X21 Pinout ............................................................................... 23
Table 11 X22 Pinout ............................................................................... 23
Table 12 X23 Pinout ............................................................................... 24
Table 13 D20 Description....................................................................... 25
Table 14 X6 Pinout ................................................................................. 25
Table 15 X8 Pinout ................................................................................. 27
Table 16 X12, X13 Description ............................................................... 27
Table 17 X3 Pinout ................................................................................. 29
Table 18 X4 Pinout ................................................................................. 30
Table 19 X24 Settings............................................................................. 30
Table 20 X15, X16 Pinout ....................................................................... 31
Table 21 X1, X2 Pinout ........................................................................... 32
Table 22 X10 Pinout ............................................................................... 33
Table 23 X11 Pinout ............................................................................... 34
Table 24 X17 Pinout ............................................................................... 36
Table 25 X14 Pinout ............................................................................... 36
Table 26 X18 Pinout ............................................................................... 37
Table 27 X19 Pinout ............................................................................... 38
Table 28 X20 Pinout ............................................................................... 39

Copyright © 2021 congatec GmbH PA70m01 10/45
1 Introduction
1.1 Pico-ITX Concept
The Pico-ITX form factor provides system designers and manufacturers with a standardized ultra compact platform for development. With a
footprint of 100 mm x 72 mm, this scalable platform promotes the design of highly integrated, energy efficient systems. Due to its small size,
the Pico-ITX form factor enables PC appliance designers not only to design attractive low cost devices but also allows them to explore a huge
variety of product development options - from compact space-saving designs to fully functional Information Station and Value PC systems.
This helps to reduce product design cycle and encourages rapid innovation in system design to meet the ever-changing needs of the market.
Additionally, the boards can be passively cooled, presenting opportunities for fanless designs. The Pico-ITX boards are equipped with various
interfaces such as PCI Express, USB, Ethernet, Displays and Audio.
1.2 conga-PA7
The conga-PA7 is a Single Board Computer (SBC) design based on the Pico-ITX specification. The conga-PA7 SBC features the Intel®Atom®
x6000E/RE Series and Intel®Pentium®and Celeron®J Series processors (formerly Elkhart Lake). With maximum 12 W TDP processors, the SBC
offers Ultra Low Power boards with high computing performance and outstanding graphics. Additionally, the SBC offers onboard LPDDR4x
memory, eMMC storage, multiple I/O interfaces, up to three independent display interfaces, and various congatec embedded features.
With small board size and low height keep-out zones, the conga-PA7 provides manufacturers and system designers with the opportunity to
design compact systems for space restricted areas.
The various features and capabilities offered by the conga-PA7 makes it ideal for the design of compact, energy efficient, performance-
oriented embedded systems.

Copyright © 2021 congatec GmbH PA70m01 11/45
1.2.1 Options Information
The conga-PA7 is currently available in eight variants. This user’s guide describes all of these variants. The tables below show the different
configurations available. Check for the PN that applies to your product. This will tell you what options described in this user’s guide are
available on your particular module.
Table 1 conga-PA7 Commercial Variants
PN 048900 048901 048902 048920 048921
Intel®Processor Atom®x6425E
Quad Core 2.0 GHz
Atom®x6413E
Quad Core 1.5 GHz
Atom®x6211E
Dual Core 1.3 GHz
Pentium®J6425
Quad Core 1.8 GHz
Celeron®J6413
Quad Core 1.8 GHz
Burst Frequency 2.7 GHz 2.7 GHz 3.0 GHz 2.7 GHz 2.7 GHz
Onboard Memory 8 GB 3733 MT/s 4 GB 3200 MT/s 4 GB 3200 MT/s 8 GB 3733 MT/s 4 GB 3733 MT/s
eMMC 64 GB 32 GB 32 GB 64 GB 32 GB
Processor Graphics Intel®UHD Graphics Intel®UHD Graphics Intel®UHD Graphics Intel®UHD Graphics Intel®UHD Graphics
Execution Units 32 16 16 32 16
Graphics Base / Burst 500 MHz / 750 MHz 500 MHz / 750 MHz 350 MHz / 750 MHz 400 MHz / 850 MHz 400 MHz / 800 MHz
Processor TDP (Max) 12 W 9 W 6 W 10 W 10 W
Table 2 conga-PA7 Industrial Variants
PN 048910 048911 048912
Intel®Processor Atom®x6425RE
Quad Core 1.9 GHz
Atom®x6414RE
Quad Core 1.5 GHz
Atom®x6212RE
Dual Core 1.2 GHz
Burst Frequency N/A N/A N/A
Onboard Memory 8 GB 4267 MT/s 4 GB 3200 MT/s 4 GB 3200 MT/s
eMMC 64 GB 32 GB 32 GB
Processor Graphics Intel®UHD Graphics Intel®UHD Graphics Intel®UHD Graphics
Execution Units 32 16 16
Graphics Base / Burst 400 MHz / N/A 400 MHz / N/A 350 MHz / N/A
Processor TDP (Max) 12 W 9 W 6 W

Copyright © 2021 congatec GmbH PA70m01 12/45
1.2.2 Optional Accessories
Table 3 Cooling Solutions
Article PN Description
conga-PA7/HSP-T 048950 Heatspreader solution for conga-PA7 based on open silicon Intel Pentium and Celeron J and N processors. All standoffs are M2.5 thread.
conga-PA7/i-HSP-T 048951 Heatspreader solution for conga-PA7 based on lidded silicon Intel Atom x6000E processors. All standoffs are M2.5 thread.
conga-PA7/CSP-T 048952 Passive cooling solution for conga-PA7 based on open silicon Pentium and Celeron J and N processors. All standoffs are M2.5 thread.
conga-PA7/i-CSP-T 048953 Passive cooling solution for conga-PA7 based on lidded silicon Atom X6000E processors. All standoffs are M2.5 thread.
conga-PA7/HSP-B 048954 Heatspreader solution for conga-PA7 based on open silicon Intel Pentium and Celeron J and N processors. All standoffs are with 2.7mm borehole.
conga-PA7/i-HSP-B 048955 Heatspreader solution for conga-PA7 based on lidded silicon Intel Atom x6000E processors. All standoffs are with 2.7mm borehole.
Table 4 Cables
Article PN Description Fits to Connector
cab-Pico-ITX-Audio Cable Adapter 14000146 Audio cable adapter, 15cm X6
cab-Pico-ITX-Buttons-LED 14000147 Buttons and LEDs adapter, 15cm X18
cab-Pico-ITX-Buttons-LED, 100cm 14000148 Buttons and LEDs adapter, 100cm X18
cab-Pico-ITX-GPIO 14000151 GPIO cable, 15cm, wires with open ends X20
cab-Pico-ITX-RS232 14000152 RS232 cable adapter, 15cm (Molex Picoblade to DSUB 9) X15, X16
cab-Pico-ITX-RS422 14000153 RS422 cable adapter, embedded termination,15cm (Molex Picoblade to DSUB 9) X15, X16
cab-Pico-ITX-RS485 14000154 RS485 cable adapter, embedded termination, 15cm (Molex Picoblade to DSUB 9) X15, X16
cab-Pico-ITX-External-Power 14000157 Power cable with DC jack and 4mm banana plugs, 100cm X21
cab-Pico-ITX-Feature 14000161 Feature cable, 15cm, wires with open ends X19
cab-Pico-ITX-Power 14000172 Power cable adapter from DC jack to Molex MicroFit (int. power connector) X22
cab-Pico-ITX-Backlight 14000206 LCD backlight cable for AUO G170EG01 V1 X4
cab-Pico-ITX-USB20-Twin 14000210 USB 2.0 cable adapter, 2mm pin header, 20 / 25 cm X8
cab-Pico-ITX-LVDS 14000211 LCD data cable for AUO G170EG01 V1 (LVDS) X3
Table 5 Power Supplies
Article PN Description
Power Supply 60W TBD PSU, 60W, 12V / 5A, Plug 5.5x2.5mm / 10mm length

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2 Specification
2.1 Feature List
Table 6 Feature Summary
Form Factor Pico-ITX Single Board Computer; 100 x 72 mm
CPU Intel®Atom®x6000E/RE Series and Intel®Pentium®and Celeron®J Series processors (formerly Elkhart Lake)
DRAM up to 4 Channels onboard LPDDR4x with up to 4,267 MT/s; max. system capacity 16 GB
Chipset Integrated in SoC
Ethernet 2x LAN Gbit / 100 Mbit / 10 Mbit with TSN support and Out-Of-Band Management
2x real-time trigger
Mass Storage eMMC 5.1 onboard flash up to 64 GB (optional up to 128 GB)
Sound Intel®HDA via codec CS4207
Graphics Intel®UHD Graphics (Gen11)
Internal
Connectors
2x USB 2.0
1x LVDS 18/24bit
1x Backlight power connector (5V, 12V)
1x Audio Connector (HP/Line Out, MIC In, S/PDIF Out)
1x Power In (+12V)
2x COM (RS232/422/485)
1x Fan Connector with PWM
3x Feature Connector
1x M.2 key ID B type 2280 (2 PCIe lanes/SATA, USB 2.0) or type 2242 (opt.)
1x M.2 key ID E type 2230 (1 PCIe lane, USB 2.0)
2x CAN (opt.)
1x 2-pin Header for RTC Power Backup
External
Connectors
1x DP++
2x LAN RJ45
1x USB 3.1 Gen2 Type C (with Power Delivery and DP Alt Mode)
2x USB 3.1 Gen2 Type A
1x DC-In
congatec Board
controller
Multistage watchdog; non-volatile user data storage; manufacturing and board Information; board statistics; fast mode and multi-master I²C bus;
power loss control
Embedded BIOS
Feature
AMI Aptio®UEFI firmware; 32 Mbyte serial SPI with congatec Embedded BIOS features; OEM Logo; OEM CMOS Defaults; LCD Control; Display
Auto Detection; Backlight Control; Flash Update
Security TPM 2.0
Power Management ACPI 5 .0 compliant; Smart Battery Management
Operating Systems Microsoft®Windows 10; Microsoft®Windows 10 IoT Enterprise; Microsoft®Windows IoT 10 Core; Linux; Android; RTS Hypervisor
Temperature Range Commercial: Operating Temperature: 0 to +60°C Storage Temperature: -20 to +70°C
Industrial: Operating Temperature: -40 to +85°C Storage Temperature: -40 to +85°C
Humidity Operating: 10 to 90% r. H. non cond.
Storage: 5 to 95% r. H. non cond.
Size 100 x 72 mm (approx. 3.9 x 2.8”)

Copyright © 2021 congatec GmbH PA70m01 14/45
2.2 Supported Operating Systems
The conga-PA7 supports the following operating systems.
2.3 Mechanical Dimensions
•100 mm x 72 mm
•Top side max. 18.3 mm
•Bottom (CPU) side max. 3.4 mm
2.4 Power Supply Voltage
•12 V DC ± 10%
Caution
The maximum operating input voltage is 13.5 volts. Do not exceed this rating for a prolonged time. Otherwise, the system may be damaged
or may have reliability issues.
2.5 Power Consumption
The power consumption values were measured with the following setup:
•conga-PA7
•conga-PA7 cooling solution
•Microsoft®Windows® 10
Note
The CPU was stressed to its maximum workload with the Intel®Power Thermal Utility (PTU).
•Microsoft®Windows 10
•Microsoft®Windows 10 IoT Enterprise
•Microsoft®Windows IoT 10 Core
•Linux®(Yocto, Ubuntu, Wind River)
•Android®
•RTS Hypervisor

Copyright © 2021 congatec GmbH PA70m01 15/45
The power consumption values were recorded during the following system states:
Table 7 Measurement Description
System State Description Comment
S0: Minimum value Lowest frequency mode (LFM) with minimum core voltage during
desktop idle.
S0: Maximum value Highest frequency mode (HFM/Turbo Boost). The CPU was stressed to its maximum frequency.
S0: Peak value Highest power spike during the measurement of “S0: Maximum value”.
This state shows the peak value over a short period of time (worst case
power consumption value).
Consider this value when designing the system’s power supply to
ensure that sufficient power is supplied during worst case scenarios.
S3 Suspend to RAM state.
S5 Soft-Off state.
S5e Enhanced Soft-Off state.
Note
1. The fan was powered externally.
2. All other peripherals except the LCD monitor were disconnected before measurement.
The tables below provide additional information about the power consumption data for each of the conga-PA7 variants offered. The values are
recorded at various operating modes.
Table 8 Power Consumption Values
PN Memory
Size
HW
Rev.
BIOS
Rev.
OS
(64-bit)
CPU Current (A) @ 12 V
Variant Cores Base / Burst
Freq. (GHz)
S0: Min S0: Max S0: Peak S3 S5 S5e
048900 TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD
048901 TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD
048902 TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD
048920 TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD
048921 TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD
048911 TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD
048912 TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD
048112 TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD
Note
With fast input voltage rise time, the inrush current may exceed the measured peak current.

Copyright © 2021 congatec GmbH PA70m01 16/45
2.6 Supply Voltage Battery Power
Table 9 CMOS Battery Power Consumption
RTC @ Voltage Current
-10oC 3 V DC TBD µA
20oC 3 V DC TBD µA
70oC 3 V DC TBD µA
Note
1. Do not use the CMOS battery power consumption values listed above to calculate CMOS battery lifetime.
2. Measure the CMOS battery power consumption in your customer specific application in worst case conditions (for example, during high
temperature and high battery voltage).
3. Consider also the self-discharge of the battery when calculating the lifetime of the CMOS battery. For more information, refer to application
note AN9_RTC_Battery_Lifetime.pdf on congatec GmbH website at www.congatec.com/support/application-notes.
4. We recommend to always have a CMOS battery present when operating the conga-PA7.
2.7 Environmental Specifications
Temperature (commercial variants) Operation: 0° to 60°C Storage: -20° to +70°C
Temperature (industrial variants) Operation: -40° to 85°C Storage: -40° to +85°C
Humidity Operation: 10% to 90% Storage: 5% to 95%
Caution
The above operating temperatures must be strictly adhered to at all times. Humidity specifications are for non-condensing conditions.

Copyright © 2021 congatec GmbH PA70m01 17/45
3 Block Diagram
Gigabit Phy
AUDIO CODEC
DP/USB
MUX
USB PD
RTC ry
hadrDC-In 12v
GPIO 0-7
Front
Panl
I2C,
Watchdog
FAN
4-Pin
Gigabit Phy
Oponal
Intrnal I/O
Extrnal I/O
USB-C
DP++
DC-Jack
GbE GbE
2x USB 3.1 Type A
TPM
USB 3.1
DP1
DP0
RGMII 0
RGMII 1
HDA
2x USB 2.0
LPDDR4
USB 2.0
SATA/PCIe x2
PCIe
USB 2.0
eDP to LVDS
congatc
Board
Controllr
5th Gnr
eSPI
Legend
y
Onboard
LPDDR4x
memory
eMMC 5.1
Dual Can
Transceiver
CAN0
CAN1
Mul�protocol
Transceiver
UART 0
UART 1
eDP
FSPI
2x USB 3.1
M.2 2230
Ky-E
2x USB 2.0
M.2 2280
Ky-B
LVDS
Backlight
CAN0
CAN1
COM1
COM0
HP out/
Mic In/
S/PDIF Out
Intel Atom® x6000E
and
Intel® Pentium® and
Celeron® N and J
Series processors
(“Elkhart Lake”)
Note: * Assembly optionson request only

Copyright © 2021 congatec GmbH PA70m01 18/45
4 Cooling Solutions
congatec GmbH offers the cooling solutions listed in Table 3 for conga-PA7. The dimensions of the cooling solutions are shown in the
sub-sections. All measurements are in millimeters.
Note
1. We recommend a maximum torque of 0.3 Nm for the mounting screws.
2. The gap pad material used on congatec heatspreaders may contain silicon oil that can seep out over time depending on the environmental
conditions it is subjected to. For more information about this subject, contact your local congatec sales representative and request the gap
pad material manufacturer’s specification.
Caution
1. The congatec heatspreaders/cooling solutions are tested only within the commercial temperature range of 0° to 60°C. Therefore, if your application
that features a congatec heatspreader/cooling solution operates outside this temperature range, ensure the correct operating temperature of
the module is maintained at all times. This may require additional cooling components for your final application’s thermal solution.
2. For adequate heat dissipation, use the mounting holes on the cooling solution to attach it to the module. Apply thread-locking fluid on
the screws if the cooling solution is used in a high shock and/or vibration environment. To prevent the standoff from stripping or cross-
threading, use non-threaded carrier board standoffs to mount threaded cooling solutions.
3. For applications that require vertically-mounted cooling solution, use only coolers that secure the thermal stacks with fixing post. Without
the fixing post feature, the thermal stacks may move.

Copyright © 2021 congatec GmbH PA70m01 19/45
4.1 CSP Dimensions
PN: 048952
25

Copyright © 2021 congatec GmbH PA70m01 20/45
PN: 048953
25