Congatec conga-TEVAL/COMe 3.0 User manual

Copyright © 2018 congatec AG TEVA2m11 1/56
conga-TEVAL/COMe 3.0
Detailed description of the congatec COM Express™ Type 6 revision 3.0 evaluation carrier board
User’s Guide
Revision 1.1

Copyright © 2018 congatec AG TEVA2m11 2/56
Revision History
Revision Date (yyyy-mm-dd) Author Changes
1.0 2018-08-16 AEM •Official release
1.1 2019-09-23 AEM •Updated the title page image
•Added section 1.3 “Order Number”
•Corrected the storage temperature in section 4.3 “Environmental Specifications”
•Changed conga-TEVAL2 to conga-TEVAL/COMe 3.0
•Corrected LED D68 color description in table 9 “Power LEDs Status”
•Changed the warning icons in sections 4.9.1 “Disk Drive Power Connector” and 4.15 “LPC/eSPI” to caution icon

Copyright © 2018 congatec AG TEVA2m11 3/56
Preface
This user’s guide provides information about the components, features and connectors available on the congatec COM Express™ Type6,
revision 3.0 evaluation carrier board.
Disclaimer
The information contained within this user’s guide, including but not limited to any product specification, is subject to change without notice.
congatec AG provides no warranty with regard to this user’s guide or any other information contained herein and hereby expressly disclaims
any implied warranties of merchantability or fitness for any particular purpose with regard to any of the foregoing. congatec AG assumes
no liability for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for
discrepancies between the product and the user’s guide. In no event shall congatec AG be liable for any incidental, consequential, special, or
exemplary damages, whether based on tort, contract or otherwise, arising out of or in connection with this user’s guide or any other information
contained herein or the use thereof.
Intended Audience
This user’s guide is intended for technically qualified personnel. It is not intended for general audiences.
Lead-Free Designs (RoHS)
All congatec AG designs are created from lead-free components and are completely RoHS compliant.
Electrostatic Sensitive Device
All congatec AG products are electrostatic sensitive devices. They are enclosed in static shielding bags, and shipped enclosed in secondary
packaging (protective packaging). The secondary packaging does not provide electrostatic protection.
Do not remove the device from the static shielding bag or handle it, except at an electrostatic-free workstation. Also, do not ship or store
electronic devices near strong electrostatic, electromagnetic, magnetic, or radioactive fields unless the device is contained within its original
packaging. Be aware that failure to comply with these guidelines will void the congatec AG Limited Warranty

Copyright © 2018 congatec AG TEVA2m11 4/56
Symbols
The following symbols are used in this user’s guide:
Warning
Warnings indicate conditions that, if not observed, can cause personal injury.
Caution
Cautions warn the user about how to prevent damage to hardware or loss of data.
Note
Notes call attention to important information that should be observed.
Connector Type
Describes the connector that must be used with the congatec COM Express™ evaluation carrier board, not the connector found on the
congatec COM Express™ evaluation carrier board.
Link to connector layout diagram
This link icon is located in the top left corner of each page. It provides a direct link to the connector layout diagram on page 8 of this document.
Copyright Notice
Copyright © 2018, congatec AG. All rights reserved. All text, pictures and graphics are protected by copyrights. No copying is permitted
without written permission from congatec AG.
congatec AG has made every attempt to ensure that the information in this document is accurate yet the information contained within is
supplied “as-is”.

Copyright © 2018 congatec AG TEVA2m11 5/56
Trademarks
Product names, logos, brands, and other trademarks featured or referred to within this user’s guide, or the congatec website, are the property
of their respective trademark holders. These trademark holders are not affiliated with congatec AG, our products, or our website.
Warranty
congatec AG makes no representation, warranty or guaranty, express or implied regarding the products except its standard form of limited
warranty (“Limited Warranty”) per the terms and conditions of the congatec entity, which the product is delivered from. These terms and
conditions can be downloaded from www.congatec.com. congatec AG may in its sole discretion modify its Limited Warranty at any time and
from time to time.
The products may include software. Use of the software is subject to the terms and conditions set out in the respective owner’s license
agreements, which are available at www.congatec.com and/or upon request.
Beginning on the date of shipment to its direct customer and continuing for the published warranty period, congatec AG represents that the
products are new and warrants that each product failing to function properly under normal use, due to a defect in materials or workmanship or
due to non conformance to the agreed upon specifications, will be repaired or exchanged, at congatec’s option and expense.
Customer will obtain a Return Material Authorization (“RMA”) number from congatec AG prior to returning the non conforming product freight
prepaid. congatec AG will pay for transporting the repaired or exchanged product to the customer.
Repaired, replaced or exchanged product will be warranted for the repair warranty period in effect as of the date the repaired, exchanged
or replaced product is shipped by congatec, or the remainder of the original warranty, whichever is longer. This Limited Warranty extends to
congatec’s direct customer only and is not assignable or transferable.
Except as set forth in writing in the Limited Warranty, congatec makes no performance representations, warranties, or guarantees, either
express or implied, oral or written, with respect to the products, including without limitation any implied warranty (a) of merchantability, (b) of
fitness for a particular purpose, or (c) arising from course of performance, course of dealing, or usage of trade.
congatec AG shall in no event be liable to the end user for collateral or consequential damages of any kind. congatec shall not otherwise be
liable for loss, damage or expense directly or indirectly arising from the use of the product or from any other cause. The sole and exclusive
remedy against congatec, whether a claim sound in contract, warranty, tort or any other legal theory, shall be repair or replacement of the
product only.
Certification
congatec AG is certified to DIN EN ISO 9001 standard.
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Copyright © 2018 congatec AG TEVA2m11 6/56
Technical Support
congatec AG technicians and engineers are committed to providing the best possible technical support for our customers so that our products
can be easily used and implemented. We request that you first visit our website at www.congatec.com for the latest documentation, utilities
and drivers, which have been made available to assist you. If you still require assistance after visiting our website then contact our technical
support department by email at [email protected]
Terminology
Term Description
PCIe Peripheral Component Interface Express (PCI Express)
SDIO Secure Digital Input Output
USB Universal Serial Bus
SATA Serial AT Attachment. A serial-interface standard for hard disks
HDA High Definition Audio
I²C Bus Inter-Integrated Circuit Bus
SM Bus System Management Bus
GbE Gigabit Ethernet
LVDS Low Voltage Differential Signaling
HBR3 High Bit Rate 3
DDC Display Data Channel
GPIO General Purpose Input/Output
eDP Embedded DisplayPort
LVDS Low Voltage Differential Signaling
N.C Not connected
N.A Not available
T.B.D To be determined

Copyright © 2018 congatec AG TEVA2m11 7/56
Contents
1 Introduction ............................................................................. 10
1.1 COM Express™ Concept......................................................... 10
1.2 conga-TEVAL/COMe 3.0 ........................................................ 10
1.3 Order Number ......................................................................... 11
2 Connector Layout .................................................................... 12
3 Specifications........................................................................... 13
3.1 Feature List .............................................................................. 13
3.2 Mechanical Dimensions ........................................................... 14
3.3 Environmental Specifications................................................... 14
4 Connectors and Features......................................................... 15
4.1 COM Express A - B Connector ................................................ 15
4.2 COM Express C - D Connector................................................ 17
4.3 Power Supply Connector ......................................................... 18
4.3.1 ATX Power Connector.............................................................. 19
4.3.2 DC Banana Jack....................................................................... 20
4.3.3 Status LEDs D68-D72, D84-D86 .............................................. 21
4.3.4 PWR_OK Signal........................................................................ 21
4.3.5 Power-Up Control .................................................................... 22
4.3.6 Power Consumption Header ................................................... 22
4.3.7 Module Type Detection ........................................................... 22
4.4 CMOS Battery Holder ............................................................. 23
4.5 PCIe Connectors...................................................................... 24
4.5.1 PEG x16 Slot ............................................................................ 25
4.5.2 PCIe x4 Slot.............................................................................. 25
4.5.3 PCIe x1 Slot.............................................................................. 26
4.5.4 Mini PCIe Socket...................................................................... 26
4.5.5 M.2........................................................................................... 27
4.6 SD Card Slot ............................................................................ 28
4.7 Display Interfaces..................................................................... 29
4.7.1 VGA.......................................................................................... 29
4.7.2 DP++ ....................................................................................... 29
4.7.3 LVDS/eDP................................................................................. 29
4.7.3.1 eDP .......................................................................................... 30
4.7.3.2 LVDS ........................................................................................ 31
4.7.3.3 LVDS Panel and Backlight Power Supply ................................. 32
4.7.3.4 Flat Panel and Backlight Voltage Selection ............................. 32
4.7.3.5 Flat Panel and Backlight Power Supply Connection................ 33
4.7.3.6 Flat Panel Configuration Data.................................................. 34
4.8 Universal Serial Bus (USB) ........................................................ 34
4.8.1 Dual Stacked USB 3.1 Type-A ................................................. 35
4.8.2 USB Type-B (Client Mode) ....................................................... 36
4.8.3 Dual Stacked USB 2.0 Type-A.................................................. 36
4.9 SATA/SATADOM...................................................................... 37
4.9.1 Disk Drive Power Connector.................................................... 37
4.9.2 SATA Power ............................................................................. 38
4.10 Gigabit Ethernet (GbE) ............................................................ 38
4.11 Audio Interfaces....................................................................... 39
4.11.1 MIC-In ...................................................................................... 40
4.11.2 Line-Out................................................................................... 40
4.11.3 Optical S/PDIF-Out.................................................................. 40
4.11.4 HDA Adapter/Debug Header.................................................. 41
4.12 SM Bus..................................................................................... 41
4.13 I2C Bus...................................................................................... 42
4.14 SPI Bus ..................................................................................... 42
4.15 LPC/eSPI .................................................................................. 43
4.16 LPC/TPM Header ..................................................................... 44
4.17 Serial Ports (COM Ports) .......................................................... 45
4.17.1 COM Port 0 Header................................................................. 45
4.17.2 COM Port 1 Header................................................................. 46
4.17.3 Module Serial Port 0 ................................................................ 46
4.17.4 Module Serial Port 1/CAN Bus ................................................ 47
4.18 System Fan Header.................................................................. 47
4.19 CPU Fan Header ...................................................................... 49
4.20 Smart Battery Management Header........................................ 49
4.21 Debug Pin Header ................................................................... 50
4.22 Internal Use Only ..................................................................... 50
4.23 Feature Connector................................................................... 51
5 Additional Features.................................................................. 52

Copyright © 2018 congatec AG TEVA2m11 8/56
5.1 Buttons..................................................................................... 52
5.1.1 Power....................................................................................... 52
5.1.2 Reset ........................................................................................ 52
5.1.3 LID............................................................................................ 52
5.1.4 Sleep........................................................................................ 53
5.2 Beeper ..................................................................................... 53
5.3 Ground Test Points................................................................... 53
5.4 Debug Display ......................................................................... 54
6 Mechanical Dimensions ........................................................... 55
7 Industry Specifications ............................................................. 56

Copyright © 2018 congatec AG TEVA2m11 9/56
List of Tables
Table 1 Order Description .................................................................... 11
Table 2 Feature Summary..................................................................... 13
Table 3 Module Type 6 Connector Pinout—Rows A and B .................. 15
Table 4 Module Type 6 Connector Pinout—Rows C and D.................. 17
Table 5 X63 - ATX Power...................................................................... 19
Table 6 SW21.1 - ATX PSU Control Description................................... 19
Table 7 JP11 - ATX 5V Standby Connection ........................................ 20
Table 8 X41/X42 - DC Banana Jack...................................................... 20
Table 9 SW21.2 - 12 V Voltage Regulator Control (Only via DC Banana
Jack)......................................................................................... 20
Table 10 Power LEDs Status ................................................................... 21
Table 11 JP9 - Module PWR_OK Selection ............................................ 21
Table 12 X3/X4 - Power Consumption Measurement ............................ 22
Table 13 Module Type Detection Pinout Description............................. 22
Table 14 JP8 - RTC Battery Connection ................................................ 23
Table 15 SW1 - PCIe x4 Slot Configuration............................................ 25
Table 16 PCIe x1 Lane Routing............................................................... 26
Table 17 D6-D8 - mini PCIe LEDs Description ....................................... 26
Table 18 SW2.1 - PCIe Lane 5 Configuration ......................................... 27
Table 19 SW3 - M.2 Configuration ......................................................... 27
Table 20 SW4 - M.2/mini PCIe Configuration ........................................ 27
Table 21 SW 5.2 - GPIO/SDIO Connection ............................................ 28
Table 22 SW8.1 - eDP/LVDS Selection ................................................... 29
Table 23 X39 - eDP Pinout Description .................................................. 30
Table 24 X38 - LVDS Pinout Description................................................. 31
Table 25 X40 - LVDS Power Pinout Description...................................... 32
Table 26 JP3 - Flat Panel Voltage Selection ........................................... 32
Table 27 JP4 - Backlight Voltage Selection ............................................ 32
Table 28 SW8.2 - Backlight Enable Signal Configuration....................... 33
Table 29 SW5.1 - USB Port 0 Configuration ........................................... 35
Table 30 JP1 - SATA/SATADOM Configuration ..................................... 37
Table 31 X26 - External SATA Activity LED............................................. 37
Table 32 X24 - SATA Power Pinout Description ..................................... 38
Table 33 GbE (X32) Status LEDs............................................................. 38
Table 34 JP2 - Ethernet LEDs Power Configuration ............................... 38
Table 35 X33 - Ethernet SDP ................................................................. 39
Table 36 MIC-In (X47) Pinout Description ............................................. 40
Table 37 Line-Out (X47) Pinout Description ........................................... 40
Table 38 SW9.2 - HDA Codec Configuration ......................................... 41
Table 39 X49 - HDA Adapter Pinout Description ................................... 41
Table 40 SW14 - BIOS Boot Device Selection........................................ 42
Table 41 SW10.1 - Super I/O Control..................................................... 43
Table 42 SW10.2 - LPC/eSPI Mode Control ........................................... 43
Table 43 SW11 - Super IO Configuration ............................................... 44
Table 44 X51 - LPC/TPM Pinout Description.......................................... 44
Table 45 X53 - COM 0 Pinout Description ............................................. 45
Table 46 SW12 - COM Port 0 Transceiver Configuration ....................... 45
Table 47 SW13 - COM Port 0 Slew Rate/Termination ............................ 46
Table 48 X52 - COM 1 Pinout Description ............................................. 46
Table 49 SW2.2 - SER1/CAN Selection .................................................. 47
Table 50 JP7 - CAN Bus Termination/Filter ........................................... 47
Table 51 X55 - SYS Fan Pinout .............................................................. 48
Table 52 JP5 - Fan Voltage Selection ..................................................... 48
Table 53 JP6 - Fan Speed Control.......................................................... 48
Table 54 X60 - CPU Fan.......................................................................... 49
Table 55 JP10 - CPU Fan Voltage Selection ........................................... 49
Table 56 X61 - SBM Pinout..................................................................... 49
Table 57 X57 - Debug Pin Header.......................................................... 50
Table 58 X56 - Feature Connector Pinout Description.......................... 51
Table 59 SW9.1 - Beeper Control........................................................... 53
Table 60 SW22 - POST Code Decoder .................................................. 54
Table 61 SW22 - POST Code LPC/I2C Address Decoder ...................... 54
Table 62 References ............................................................................... 56

Copyright © 2018 congatec AG TEVA2m11 10/56
1 Introduction
1.1 COM Express™ Concept
COM Express™ is an open industry standard defined specifically for COMs (computer on modules). Its creation makes it possible to smoothly
transition from legacy interfaces to the newest technologies available today.
A Computer On Module integrates all the core components and standard I/O interfaces of a common PC onto an application specific carrier
board. The key advantage of the COM in the embedded computer industries is that all the highly integrated, high speed components such as
CPU, chipsets and memory are combined on a small module form factor for easy adaptation into different applications across multiple market
segments.
COM Express™ modules have standardized form factors and specified pinouts on the two system connectors that remain the same regardless
of the vendor. The COM Express™ module reflects the functional requirements for a wide range of embedded applications. These functions
include, but are not limited to, PCI Express, PCI, Graphics, High Definition Audio, parallel ATA, serial ATA, Gigabit Ethernet and USB ports.
Two ruggedized, shielded connectors provide the carrier board interface and carry all the I/O signals to and from the COM Express™ module.
Carrier board designers can use as little or as many of the I/O interfaces as deemed necessary. The carrier board can therefore provide all
the interface connectors required to attach the system to the application specific peripherals. This versatility allows the designer to create a
dense and optimized package, which results in a more reliable product while simplifying system integration. Most importantly, COM Express™
modules are scalable, which means once an application has been created there is the ability to diversify the product range through the use
of different performance class or form factor size modules. Simply unplug one module and replace it with another; no redesign is necessary.
1.2 conga-TEVAL/COMe 3.0
The conga-TEVAL/COMe 3.0 carrier board is designed based on the Type 6 pinout definition and it complies with COM Express Specification
3.0. The conga-TEVAL/COMe 3.0 provides most of the functional requirements for any embedded PC application. These functions include, but
are not limited to a rich complement of contemporary high bandwidth serial interfaces such as PCI Express, Serial ATA, USB 2.0, and Gigabit
Ethernet. To ensure stable data throughput, the carrier board is equipped with two high performance connectors in accordance with the COM
Express specification.
By combining the scalability of COM Express modules, the conga-TEVAL/COMe 3.0 carrier board provides manufacturers and developers
with a platform to jump-start the development of systems and applications based on COM Express specification. This helps to reduce product
design cycle and encourages rapid innovation in system design, to meet the ever-changing needs of the market.
The various features and capabilities offered by the conga-TEVAL/COMe 3.0 makes it ideal for the integration of Compact and Basic form
factor CPU modules.