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  9. Congatec conga-TEVAL/COMe 3.0 User manual

Congatec conga-TEVAL/COMe 3.0 User manual

Copyright © 2018 congatec AG TEVA2m11 1/56
conga-TEVAL/COMe 3.0
Detailed description of the congatec COM Express™ Type 6 revision 3.0 evaluation carrier board
User’s Guide
Revision 1.1
Copyright © 2018 congatec AG TEVA2m11 2/56
Revision History
Revision Date (yyyy-mm-dd) Author Changes
1.0 2018-08-16 AEM •Official release
1.1 2019-09-23 AEM •Updated the title page image
•Added section 1.3 “Order Number”
•Corrected the storage temperature in section 4.3 “Environmental Specifications”
•Changed conga-TEVAL2 to conga-TEVAL/COMe 3.0
•Corrected LED D68 color description in table 9 “Power LEDs Status”
•Changed the warning icons in sections 4.9.1 “Disk Drive Power Connector” and 4.15 “LPC/eSPI” to caution icon
Copyright © 2018 congatec AG TEVA2m11 3/56
Preface
This user’s guide provides information about the components, features and connectors available on the congatec COM Express™ Type6,
revision 3.0 evaluation carrier board.
Disclaimer
The information contained within this user’s guide, including but not limited to any product specification, is subject to change without notice.
congatec AG provides no warranty with regard to this user’s guide or any other information contained herein and hereby expressly disclaims
any implied warranties of merchantability or fitness for any particular purpose with regard to any of the foregoing. congatec AG assumes
no liability for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for
discrepancies between the product and the user’s guide. In no event shall congatec AG be liable for any incidental, consequential, special, or
exemplary damages, whether based on tort, contract or otherwise, arising out of or in connection with this user’s guide or any other information
contained herein or the use thereof.
Intended Audience
This user’s guide is intended for technically qualified personnel. It is not intended for general audiences.
Lead-Free Designs (RoHS)
All congatec AG designs are created from lead-free components and are completely RoHS compliant.
Electrostatic Sensitive Device
All congatec AG products are electrostatic sensitive devices. They are enclosed in static shielding bags, and shipped enclosed in secondary
packaging (protective packaging). The secondary packaging does not provide electrostatic protection.
Do not remove the device from the static shielding bag or handle it, except at an electrostatic-free workstation. Also, do not ship or store
electronic devices near strong electrostatic, electromagnetic, magnetic, or radioactive fields unless the device is contained within its original
packaging. Be aware that failure to comply with these guidelines will void the congatec AG Limited Warranty
Copyright © 2018 congatec AG TEVA2m11 4/56
Symbols
The following symbols are used in this user’s guide:
Warning
Warnings indicate conditions that, if not observed, can cause personal injury.
Caution
Cautions warn the user about how to prevent damage to hardware or loss of data.
Note
Notes call attention to important information that should be observed.
Connector Type
Describes the connector that must be used with the congatec COM Express™ evaluation carrier board, not the connector found on the
congatec COM Express™ evaluation carrier board.
Link to connector layout diagram
This link icon is located in the top left corner of each page. It provides a direct link to the connector layout diagram on page 8 of this document.
Copyright Notice
Copyright © 2018, congatec AG. All rights reserved. All text, pictures and graphics are protected by copyrights. No copying is permitted
without written permission from congatec AG.
congatec AG has made every attempt to ensure that the information in this document is accurate yet the information contained within is
supplied “as-is”.
Copyright © 2018 congatec AG TEVA2m11 5/56
Trademarks
Product names, logos, brands, and other trademarks featured or referred to within this user’s guide, or the congatec website, are the property
of their respective trademark holders. These trademark holders are not affiliated with congatec AG, our products, or our website.
Warranty
congatec AG makes no representation, warranty or guaranty, express or implied regarding the products except its standard form of limited
warranty (“Limited Warranty”) per the terms and conditions of the congatec entity, which the product is delivered from. These terms and
conditions can be downloaded from www.congatec.com. congatec AG may in its sole discretion modify its Limited Warranty at any time and
from time to time.
The products may include software. Use of the software is subject to the terms and conditions set out in the respective owner’s license
agreements, which are available at www.congatec.com and/or upon request.
Beginning on the date of shipment to its direct customer and continuing for the published warranty period, congatec AG represents that the
products are new and warrants that each product failing to function properly under normal use, due to a defect in materials or workmanship or
due to non conformance to the agreed upon specifications, will be repaired or exchanged, at congatec’s option and expense.
Customer will obtain a Return Material Authorization (“RMA”) number from congatec AG prior to returning the non conforming product freight
prepaid. congatec AG will pay for transporting the repaired or exchanged product to the customer.
Repaired, replaced or exchanged product will be warranted for the repair warranty period in effect as of the date the repaired, exchanged
or replaced product is shipped by congatec, or the remainder of the original warranty, whichever is longer. This Limited Warranty extends to
congatec’s direct customer only and is not assignable or transferable.
Except as set forth in writing in the Limited Warranty, congatec makes no performance representations, warranties, or guarantees, either
express or implied, oral or written, with respect to the products, including without limitation any implied warranty (a) of merchantability, (b) of
fitness for a particular purpose, or (c) arising from course of performance, course of dealing, or usage of trade.
congatec AG shall in no event be liable to the end user for collateral or consequential damages of any kind. congatec shall not otherwise be
liable for loss, damage or expense directly or indirectly arising from the use of the product or from any other cause. The sole and exclusive
remedy against congatec, whether a claim sound in contract, warranty, tort or any other legal theory, shall be repair or replacement of the
product only.
Certification
congatec AG is certified to DIN EN ISO 9001 standard.
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Copyright © 2018 congatec AG TEVA2m11 6/56
Technical Support
congatec AG technicians and engineers are committed to providing the best possible technical support for our customers so that our products
can be easily used and implemented. We request that you first visit our website at www.congatec.com for the latest documentation, utilities
and drivers, which have been made available to assist you. If you still require assistance after visiting our website then contact our technical
support department by email at [email protected]
Terminology
Term Description
PCIe Peripheral Component Interface Express (PCI Express)
SDIO Secure Digital Input Output
USB Universal Serial Bus
SATA Serial AT Attachment. A serial-interface standard for hard disks
HDA High Definition Audio
I²C Bus Inter-Integrated Circuit Bus
SM Bus System Management Bus
GbE Gigabit Ethernet
LVDS Low Voltage Differential Signaling
HBR3 High Bit Rate 3
DDC Display Data Channel
GPIO General Purpose Input/Output
eDP Embedded DisplayPort
LVDS Low Voltage Differential Signaling
N.C Not connected
N.A Not available
T.B.D To be determined
Copyright © 2018 congatec AG TEVA2m11 7/56
Contents
1 Introduction ............................................................................. 10
1.1 COM Express™ Concept......................................................... 10
1.2 conga-TEVAL/COMe 3.0 ........................................................ 10
1.3 Order Number ......................................................................... 11
2 Connector Layout .................................................................... 12
3 Specifications........................................................................... 13
3.1 Feature List .............................................................................. 13
3.2 Mechanical Dimensions ........................................................... 14
3.3 Environmental Specifications................................................... 14
4 Connectors and Features......................................................... 15
4.1 COM Express A - B Connector ................................................ 15
4.2 COM Express C - D Connector................................................ 17
4.3 Power Supply Connector ......................................................... 18
4.3.1 ATX Power Connector.............................................................. 19
4.3.2 DC Banana Jack....................................................................... 20
4.3.3 Status LEDs D68-D72, D84-D86 .............................................. 21
4.3.4 PWR_OK Signal........................................................................ 21
4.3.5 Power-Up Control .................................................................... 22
4.3.6 Power Consumption Header ................................................... 22
4.3.7 Module Type Detection ........................................................... 22
4.4 CMOS Battery Holder ............................................................. 23
4.5 PCIe Connectors...................................................................... 24
4.5.1 PEG x16 Slot ............................................................................ 25
4.5.2 PCIe x4 Slot.............................................................................. 25
4.5.3 PCIe x1 Slot.............................................................................. 26
4.5.4 Mini PCIe Socket...................................................................... 26
4.5.5 M.2........................................................................................... 27
4.6 SD Card Slot ............................................................................ 28
4.7 Display Interfaces..................................................................... 29
4.7.1 VGA.......................................................................................... 29
4.7.2 DP++ ....................................................................................... 29
4.7.3 LVDS/eDP................................................................................. 29
4.7.3.1 eDP .......................................................................................... 30
4.7.3.2 LVDS ........................................................................................ 31
4.7.3.3 LVDS Panel and Backlight Power Supply ................................. 32
4.7.3.4 Flat Panel and Backlight Voltage Selection ............................. 32
4.7.3.5 Flat Panel and Backlight Power Supply Connection................ 33
4.7.3.6 Flat Panel Configuration Data.................................................. 34
4.8 Universal Serial Bus (USB) ........................................................ 34
4.8.1 Dual Stacked USB 3.1 Type-A ................................................. 35
4.8.2 USB Type-B (Client Mode) ....................................................... 36
4.8.3 Dual Stacked USB 2.0 Type-A.................................................. 36
4.9 SATA/SATADOM...................................................................... 37
4.9.1 Disk Drive Power Connector.................................................... 37
4.9.2 SATA Power ............................................................................. 38
4.10 Gigabit Ethernet (GbE) ............................................................ 38
4.11 Audio Interfaces....................................................................... 39
4.11.1 MIC-In ...................................................................................... 40
4.11.2 Line-Out................................................................................... 40
4.11.3 Optical S/PDIF-Out.................................................................. 40
4.11.4 HDA Adapter/Debug Header.................................................. 41
4.12 SM Bus..................................................................................... 41
4.13 I2C Bus...................................................................................... 42
4.14 SPI Bus ..................................................................................... 42
4.15 LPC/eSPI .................................................................................. 43
4.16 LPC/TPM Header ..................................................................... 44
4.17 Serial Ports (COM Ports) .......................................................... 45
4.17.1 COM Port 0 Header................................................................. 45
4.17.2 COM Port 1 Header................................................................. 46
4.17.3 Module Serial Port 0 ................................................................ 46
4.17.4 Module Serial Port 1/CAN Bus ................................................ 47
4.18 System Fan Header.................................................................. 47
4.19 CPU Fan Header ...................................................................... 49
4.20 Smart Battery Management Header........................................ 49
4.21 Debug Pin Header ................................................................... 50
4.22 Internal Use Only ..................................................................... 50
4.23 Feature Connector................................................................... 51
5 Additional Features.................................................................. 52
Copyright © 2018 congatec AG TEVA2m11 8/56
5.1 Buttons..................................................................................... 52
5.1.1 Power....................................................................................... 52
5.1.2 Reset ........................................................................................ 52
5.1.3 LID............................................................................................ 52
5.1.4 Sleep........................................................................................ 53
5.2 Beeper ..................................................................................... 53
5.3 Ground Test Points................................................................... 53
5.4 Debug Display ......................................................................... 54
6 Mechanical Dimensions ........................................................... 55
7 Industry Specifications ............................................................. 56
Copyright © 2018 congatec AG TEVA2m11 9/56
List of Tables
Table 1 Order Description .................................................................... 11
Table 2 Feature Summary..................................................................... 13
Table 3 Module Type 6 Connector Pinout—Rows A and B .................. 15
Table 4 Module Type 6 Connector Pinout—Rows C and D.................. 17
Table 5 X63 - ATX Power...................................................................... 19
Table 6 SW21.1 - ATX PSU Control Description................................... 19
Table 7 JP11 - ATX 5V Standby Connection ........................................ 20
Table 8 X41/X42 - DC Banana Jack...................................................... 20
Table 9 SW21.2 - 12 V Voltage Regulator Control (Only via DC Banana
Jack)......................................................................................... 20
Table 10 Power LEDs Status ................................................................... 21
Table 11 JP9 - Module PWR_OK Selection ............................................ 21
Table 12 X3/X4 - Power Consumption Measurement ............................ 22
Table 13 Module Type Detection Pinout Description............................. 22
Table 14 JP8 - RTC Battery Connection ................................................ 23
Table 15 SW1 - PCIe x4 Slot Configuration............................................ 25
Table 16 PCIe x1 Lane Routing............................................................... 26
Table 17 D6-D8 - mini PCIe LEDs Description ....................................... 26
Table 18 SW2.1 - PCIe Lane 5 Configuration ......................................... 27
Table 19 SW3 - M.2 Configuration ......................................................... 27
Table 20 SW4 - M.2/mini PCIe Configuration ........................................ 27
Table 21 SW 5.2 - GPIO/SDIO Connection ............................................ 28
Table 22 SW8.1 - eDP/LVDS Selection ................................................... 29
Table 23 X39 - eDP Pinout Description .................................................. 30
Table 24 X38 - LVDS Pinout Description................................................. 31
Table 25 X40 - LVDS Power Pinout Description...................................... 32
Table 26 JP3 - Flat Panel Voltage Selection ........................................... 32
Table 27 JP4 - Backlight Voltage Selection ............................................ 32
Table 28 SW8.2 - Backlight Enable Signal Configuration....................... 33
Table 29 SW5.1 - USB Port 0 Configuration ........................................... 35
Table 30 JP1 - SATA/SATADOM Configuration ..................................... 37
Table 31 X26 - External SATA Activity LED............................................. 37
Table 32 X24 - SATA Power Pinout Description ..................................... 38
Table 33 GbE (X32) Status LEDs............................................................. 38
Table 34 JP2 - Ethernet LEDs Power Configuration ............................... 38
Table 35 X33 - Ethernet SDP ................................................................. 39
Table 36 MIC-In (X47) Pinout Description ............................................. 40
Table 37 Line-Out (X47) Pinout Description ........................................... 40
Table 38 SW9.2 - HDA Codec Configuration ......................................... 41
Table 39 X49 - HDA Adapter Pinout Description ................................... 41
Table 40 SW14 - BIOS Boot Device Selection........................................ 42
Table 41 SW10.1 - Super I/O Control..................................................... 43
Table 42 SW10.2 - LPC/eSPI Mode Control ........................................... 43
Table 43 SW11 - Super IO Configuration ............................................... 44
Table 44 X51 - LPC/TPM Pinout Description.......................................... 44
Table 45 X53 - COM 0 Pinout Description ............................................. 45
Table 46 SW12 - COM Port 0 Transceiver Configuration ....................... 45
Table 47 SW13 - COM Port 0 Slew Rate/Termination ............................ 46
Table 48 X52 - COM 1 Pinout Description ............................................. 46
Table 49 SW2.2 - SER1/CAN Selection .................................................. 47
Table 50 JP7 - CAN Bus Termination/Filter ........................................... 47
Table 51 X55 - SYS Fan Pinout .............................................................. 48
Table 52 JP5 - Fan Voltage Selection ..................................................... 48
Table 53 JP6 - Fan Speed Control.......................................................... 48
Table 54 X60 - CPU Fan.......................................................................... 49
Table 55 JP10 - CPU Fan Voltage Selection ........................................... 49
Table 56 X61 - SBM Pinout..................................................................... 49
Table 57 X57 - Debug Pin Header.......................................................... 50
Table 58 X56 - Feature Connector Pinout Description.......................... 51
Table 59 SW9.1 - Beeper Control........................................................... 53
Table 60 SW22 - POST Code Decoder .................................................. 54
Table 61 SW22 - POST Code LPC/I2C Address Decoder ...................... 54
Table 62 References ............................................................................... 56
Copyright © 2018 congatec AG TEVA2m11 10/56
1 Introduction
1.1 COM Express™ Concept
COM Express™ is an open industry standard defined specifically for COMs (computer on modules). Its creation makes it possible to smoothly
transition from legacy interfaces to the newest technologies available today.
A Computer On Module integrates all the core components and standard I/O interfaces of a common PC onto an application specific carrier
board. The key advantage of the COM in the embedded computer industries is that all the highly integrated, high speed components such as
CPU, chipsets and memory are combined on a small module form factor for easy adaptation into different applications across multiple market
segments.
COM Express™ modules have standardized form factors and specified pinouts on the two system connectors that remain the same regardless
of the vendor. The COM Express™ module reflects the functional requirements for a wide range of embedded applications. These functions
include, but are not limited to, PCI Express, PCI, Graphics, High Definition Audio, parallel ATA, serial ATA, Gigabit Ethernet and USB ports.
Two ruggedized, shielded connectors provide the carrier board interface and carry all the I/O signals to and from the COM Express™ module.
Carrier board designers can use as little or as many of the I/O interfaces as deemed necessary. The carrier board can therefore provide all
the interface connectors required to attach the system to the application specific peripherals. This versatility allows the designer to create a
dense and optimized package, which results in a more reliable product while simplifying system integration. Most importantly, COM Express™
modules are scalable, which means once an application has been created there is the ability to diversify the product range through the use
of different performance class or form factor size modules. Simply unplug one module and replace it with another; no redesign is necessary.
1.2 conga-TEVAL/COMe 3.0
The conga-TEVAL/COMe 3.0 carrier board is designed based on the Type 6 pinout definition and it complies with COM Express Specification
3.0. The conga-TEVAL/COMe 3.0 provides most of the functional requirements for any embedded PC application. These functions include, but
are not limited to a rich complement of contemporary high bandwidth serial interfaces such as PCI Express, Serial ATA, USB 2.0, and Gigabit
Ethernet. To ensure stable data throughput, the carrier board is equipped with two high performance connectors in accordance with the COM
Express specification.
By combining the scalability of COM Express modules, the conga-TEVAL/COMe 3.0 carrier board provides manufacturers and developers
with a platform to jump-start the development of systems and applications based on COM Express specification. This helps to reduce product
design cycle and encourages rapid innovation in system design, to meet the ever-changing needs of the market.
The various features and capabilities offered by the conga-TEVAL/COMe 3.0 makes it ideal for the integration of Compact and Basic form
factor CPU modules.
Copyright © 2018 congatec AG TEVA2m11 11/56
1.3 Order Number
Table 1 Order Description
Part Number Product Name Description
065810 conga-TEVAL2 (conga-TEVAL/COMe 3.0) Evaluation carrier board for COM Express Type 6 rev 3.0 modules
Copyright © 2018 congatec AG TEVA2m11 12/56
2 Connector Layout
The connector layout
picture below shows
each connector and its
name designator. Select
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Tool’ and zoom in on a
given component to see
its designator. Hover
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change indicating there
is a link. Click on the link
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component is described.
Use the mouse icon in the
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Copyright © 2018 congatec AG TEVA2m11 13/56
3 Specifications
3.1 Feature List
Table 2 Feature Summary
Form Factor Based on COM Express standard pinout Type 6, rev. 3.0
Supported Modules COM Express™ Type 6 compact and basic form factor
Power 1 x standard 24-pin ATX connector
1 x DC power input (4 mm banana connectors)
1 x CR2032 CMOS/RTC battery
Back Panel I/O
Connectors
1 x Gigabit Ethernet RJ45 port
1 x Microphone jack
1 x Line-OUT jack
1 x Optical S/PDIF-Out port
3 x DP++ ports
4 x USB 3.1 host ports
2 x USB 2.0 host ports
Onboard I/O
Connectors
1 x USB client port
1 x PEG x16 slot
1 x PCIe x4 slot
5 x PCIe x1 slot
1 x VGA port
1 x M.2 Key B socket
1 x mini PCIe socket
2 x micro-SIM card socket
1 x SD card socket (full-size)
1 x LVDS connector
1 x eDP connector
1 x Panel and Backlight header
1 x EPI EEPROM Socket
4 x SATA connectors (one connector supports SATADOM)
1 x SATA power connector
1 x Disk drive 4-pin connector
1 x HDA adapter/debug header
1 x I2C EEPROM socket
1 x SPI flash socket
1 x LPC/TPM header
2 x COM port headers
1 x CAN connector
2 x Fan headers
1 x SBM header
1 x Feature connector
Optional Onboard
Interfaces
1 x Power consumption header
Other Features 1 x Beeper
4 x Buttons (power, reset, sleep, lid)
4 x Ground test points
Four 14-segment displays for post code information
Multi-channel low power HD audio codec (Cirrus CS4207)
Super I/O (Nuvoton NCT6112D)
Note
The module must also support the features for them to function. Refer to the module’s user’s guide for information about supported features.
Copyright © 2018 congatec AG TEVA2m11 14/56
3.2 Mechanical Dimensions
•294.0 mm x 244.0 mm
•Height approximately 43.0 mm (top side)
3.3 Environmental Specifications
Temperature Operation: -40°C to 85°C Storage: -40°C to +85°C
Humidity Operation: 10% to 90% Storage: 5% to 95%
Note
The above operating temperatures must be strictly adhered to at all times. The maximum operating temperature refers to any measurable
spot on the modules surface.
Humidity specifications are for non-condensing conditions.
Copyright © 2018 congatec AG TEVA2m11 15/56
4 Connectors and Features
4.1 COM Express A - B Connector
Table 3 Module Type 6 Connector Pinout—Rows A and B
Pin Row A Pin Row B Pin Row A Pin Row B
A1 GND (FIXED) B1 GND (FIXED) A56 PCIE_TX4- B56 PCIE_RX4-
A2 GBE0_MDI3- B2 GBE0_ACT# A57 GND B57 GPO2
A3 GBE0_MDI3+ B3 LPC_FRAME#/ESPI_CS0# A58 PCIE_TX3+ B58 PCIE_RX3+
A4 GBE0_LINK100# B4 LPC_AD0/ESPI_IO_0 A59 PCIE_TX3- B59 PCIE_RX3-
A5 GBE0_LINK1000# B5 LPC_AD1/ESPI_IO_1 A60 GND (FIXED) B60 GND (FIXED)
A6 GBE0_MDI2- B6 LPC_AD2/ESPI_IO_2 A61 PCIE_TX2+ B61 PCIE_RX2+
A7 GBE0_MDI2+ B7 LPC_AD3/ESPI_IO_3 A62 PCIE_TX2- B62 PCIE_RX2-
A8 GBE0_LINK# B8 LPC_DRQ0#/ESPI_ALERT0# A63 GPI1 B63 GPO3
A9 GBE0_MDI1- B9 LPC_DRQ1#/ESPI_ALERT1# A64 PCIE_TX1+ B64 PCIE_RX1+
A10 GBE0_MDI1+ B10 LPC_CLK/ESPI_CK A65 PCIE_TX1- B65 PCIE_RX1-
A11 GND (FIXED) B11 GND (FIXED) A66 GND B66 WAKE0#
A12 GBE0_MDI0- B12 PWRBTN# A67 GPI2 B67 WAKE1#
A13 GBE0_MDI0+ B13 SMB_CK A68 PCIE_TX0+ B68 PCIE_RX0+
A14 GBE0_CTREF B14 SMB_DAT A69 PCIE_TX0- B69 PCIE_RX0-
A15 SUS_S3# B15 SMB_ALERT# A70 GND (FIXED) B70 GND (FIXED)
A16 SATA0_TX+ B16 SATA1_TX+ A71 eDP_TX2+/LVDS_A0+ B71 LVDS_B0+
A17 SATA0_TX- B17 SATA1_TX- A72 eDP_TX2-/LVDS_A0- B72 LVDS_B0-
A18 SUS_S4# B18 SUS_STAT#/ESPI_RESET# A73 eDP_TX1+/LVDS_A1+ B73 LVDS_B1+
A19 SATA0_RX+ B19 SATA1_RX+ A74 eDP_TX1-/LVDS_A1- B74 LVDS_B1-
A20 SATA0_RX- B20 SATA1_RX- A75 eDP_TX0+/LVDS_A2+ B75 LVDS_B2+
A21 GND (FIXED) B21 GND (FIXED) A76 eDP_TX0-/LVDS_A2- B76 LVDS_B2-
A22 SATA2_TX+ B22 SATA3_TX+ A77 eDP_VDD_EN/LVDS_VDD_EN B77 LVDS_B3+
A23 SATA2_TX- B23 SATA3_TX- A78 LVDS_A3+ B78 LVDS_B3-
A24 SUS_S5# B24 PWR_OK A79 LVDS_A3- B79 eDP_BKLT_EN/LVDS_BKLT_EN
A25 SATA2_RX+ B25 SATA3_RX+ A80 GND (FIXED) B80 GND (FIXED)
A26 SATA2_RX- B26 SATA3_RX- A81 eDP_TX3+/LVDS_A_CK+ B81 LVDS_B_CK+
A27 BATLOW# B27 WDT A82 eDP_TX3-/LVDS_A_CK- B82 LVDS_B_CK-
A28 (S)ATA_ACT# B28 HDA_SDIN2 A83 eDP_AUX+/LVDS_I2C_CK B83 eDP/LVDS_BKLT_CTRL
A29 HDA_SYNC B29 HDA_SDIN1 A84 eDP_AUX-/LVDS_I2C_DAT B84 VCC_5V_SBY
A30 HDA_RST# B30 HDA_SDIN0 A85 GPI3 B85 VCC_5V_SBY
A31 GND (FIXED) B31 GND (FIXED) A86 RSVD B86 VCC_5V_SBY
A32 HDA_BITCLK B32 SPKR A87 eDP_HPD B87 VCC_5V_SBY
Copyright © 2018 congatec AG TEVA2m11 16/56
Pin Row A Pin Row B Pin Row A Pin Row B
A33 HDA_SDOUT B33 I2C_CK A88 PCIE_CLK_REF+ B88 BIOS_DIS1#
A34 BIOS_DIS0#/ESPI_SAFS B34 I2C_DAT A89 PCIE_CLK_REF- B89 VGA_RED
A35 THRMTRIP# B35 THRM# A90 GND (FIXED) B90 GND (FIXED)
A36 USB6- B36 USB7- A91 SPI_POWER B91 VGA_GRN
A37 USB6+ B37 USB7+ A92 SPI_MISO B92 VGA_BLU
A38 USB_6_7_OC# B38 USB_4_5_OC# A93 GPO0 B93 VGA_HSYNC
A39 USB4- B39 USB5- A94 SPI_CLK B94 VGA_VSYNC
A40 USB4+ B40 USB5+ A95 SPI_MOSI B95 VGA_I2C_CK
A41 GND (FIXED) B41 GND (FIXED) A96 TPM_PP B96 VGA_I2C_DAT
A42 USB2- B42 USB3- A97 TYPE10# B97 SPI_CS#
A43 USB2+ B43 USB3+ A98 SER0_TX B98 RSVD
A44 USB_2_3_OC# B44 USB_0_1_OC# A99 SER0_RX B99 RSVD
A45 USB0- B45 USB1- A100 GND (FIXED) B100 GND (FIXED)
A46 USB0+ B46 USB1+ A101 SER1_TX B101 FAN_PWMOUT
A47 VCC_RTC B47 ESPI_EN# A102 SER1_RX B102 FAN_TACHIN
A48 RSVD B48 USB0_HOST_PRSNT A103 LID# B103 SLEEP#
A49 GBE0_SDP B49 SYS_RESET# A104 VCC_12V B104 VCC_12V
A50 LPC_SERIRQ/ESPI_CS1# B50 CB_RESET# A105 VCC_12V B105 VCC_12V
A51 GND (FIXED) B51 GND (FIXED) A106 VCC_12V B106 VCC_12V
A52 PCIE_TX5+ B52 PCIE_RX5+ A107 VCC_12V B107 VCC_12V
A53 PCIE_TX5- B53 PCIE_RX5- A108 VCC_12V B108 VCC_12V
A54 GPI0 B54 GPO1 A109 VCC_12V B109 VCC_12V
A55 PCIE_TX4+ B55 PCIE_RX4+ A110 GND (FIXED) B110 GND (FIXED)
Copyright © 2018 congatec AG TEVA2m11 17/56
4.2 COM Express C - D Connector
Table 4 Module Type 6 Connector Pinout—Rows C and D
Pin Row C Pin Row D Pin Row C Pin Row D
C1 GND (FIXED) D1 GND (FIXED) C56 PEG_RX1- D56 PEG_TX1-
C2 GND D2 GND C57 TYPE1# D57 TYPE2#
C3 USB_SSRX0- D3 USB_SSTX0- C58 PEG_RX2+ D58 PEG_TX2+
C4 USB_SSRX0+ D4 USB_SSTX0+ C59 PEG_RX2- D59 PEG_TX2-
C5 GND D5 GND C60 GND (FIXED) D60 GND (FIXED)
C6 USB_SSRX1- D6 USB_SSTX1- C61 PEG_RX3+ D61 PEG_TX3+
C7 USB_SSRX1+ D7 USB_SSTX1+ C62 PEG_RX3- D62 PEG_TX3-
C8 GND D8 GND C63 RSVD D63 RSVD
C9 USB_SSRX2- D9 USB_SSTX2- C64 RSVD D64 RSVD
C10 USB_SSRX2+ D10 USB_SSTX2+ C65 PEG_RX4+ D65 PEG_TX4+
C11 GND (FIXED) D11 GND (FIXED) C66 PEG_RX4- D66 PEG_TX4-
C12 USB_SSRX3- D12 USB_SSTX3- C67 RAPID_SHUTDOWN D67 GND
C13 USB_SSRX3+ D13 USB_SSTX3+ C68 PEG_RX5+ D68 PEG_TX5+
C14 GND D14 GND C69 PEG_RX5- D69 PEG_TX5-
C15 DDI1_PAIR6+ D15 DDI1_CTRLCLK_AUX+ C70 GND (FIXED) D70 GND (FIXED)
C16 DDI1_PAIR6- D16 DDI1_CTRLDATA_AUX- C71 PEG_RX6+ D71 PEG_TX6+
C17 RSVD D17 RSVD C72 PEG_RX6- D72 PEG_TX6-
C18 RSVD D18 RSVD C73 GND D73 GND
C19 PCIE_RX6+ D19 PCIE_TX6+ C74 PEG_RX7+ D74 PEG_TX7+
C20 PCIE_RX6- D20 PCIE_TX6- C75 PEG_RX7- D75 PEG_TX7-
C21 GND (FIXED) D21 GND (FIXED) C76 GND D76 GND
C22 PCIE_RX7+ D22 PCIE_TX7+ C77 RSVD D77 RSVD
C23 PCIE_RX7- D23 PCIE_TX7- C78 PEG_RX8+ D78 PEG_TX8+
C24 DDI1_HPD D24 RSVD C79 PEG_RX8- D79 PEG_TX8-
C25 DDI1_PAIR4+ D25 RSVD C80 GND (FIXED) D80 GND (FIXED)
C26 DDI1_PAIR4- D26 DDI1_PAIR0+ C81 PEG_RX9+ D81 PEG_TX9+
C27 RSVD D27 DDI1_PAIR0- C82 PEG_RX9- D82 PEG_TX9-
C28 RSVD D28 RSVD C83 RSVD D83 RSVD
C29 DDI1_PAIR5+ D29 DDI1_PAIR1+ C84 GND D84 GND
C30 DDI1_PAIR5- D30 DDI1_PAIR1- C85 PEG_RX10+ D85 PEG_TX10+
C31 GND (FIXED) D31 GND (FIXED) C86 PEG_RX10- D86 PEG_TX10-
C32 DDI2_CTRLCLK_AUX+ D32 DDI1_PAIR2+ C87 GND D87 GND
C33 DDI2_CTRLDATA_AUX- D33 DDI1_PAIR2- C88 PEG_RX11+ D88 PEG_TX11+
C34 DDI2_DDC_AUX_SEL D34 DDI1_DDC_AUX_SEL C89 PEG_RX11- D89 PEG_TX11-
C35 RSVD D35 RSVD C90 GND (FIXED) D90 GND (FIXED)
Copyright © 2018 congatec AG TEVA2m11 18/56
Pin Row C Pin Row D Pin Row C Pin Row D
C36 DDI3_CTRLCLK_AUX+ D36 DDI1_PAIR3+ C91 PEG_RX12+ D91 PEG_TX12+
C37 DDI3_CTRLDATA_AUX- D37 DDI1_PAIR3- C92 PEG_RX12- D92 PEG_TX12-
C38 DDI3_DDC_AUX_SEL D38 RSVD C93 GND D93 GND
C39 DDI3_PAIR0+ D39 DDI2_PAIR0+ C94 PEG_RX13+ D94 PEG_TX13+
C40 DDI3_PAIR0- D40 DDI2_PAIR0- C95 PEG_RX13- D95 PEG_TX13-
C41 GND (FIXED) D41 GND (FIXED) C96 GND D96 GND
C42 DDI3_PAIR1+ D42 DDI2_PAIR1+ C97 RVSD D97 RSVD
C43 DDI3_PAIR1- D43 DDI2_PAIR1- C98 PEG_RX14+ D98 PEG_TX14+
C44 DDI3_HPD D44 DDI2_HPD C99 PEG_RX14- D99 PEG_TX14-
C45 RSVD D45 RSVD C100 GND (FIXED) D100 GND (FIXED)
C46 DDI3_PAIR2+ D46 DDI2_PAIR2+ C101 PEG_RX15+ D101 PEG_TX15+
C47 DDI3_PAIR2- D47 DDI2_PAIR2- C102 PEG_RX15- D102 PEG_TX15-
C48 RSVD D48 RSVD C103 GND D103 GND
C49 DDI3_PAIR3+ D49 DDI2_PAIR3+ C104 VCC_12V D104 VCC_12V
C50 DDI3_PAIR3- D50 DDI2_PAIR3- C105 VCC_12V D105 VCC_12V
C51 GND (FIXED) D51 GND (FIXED) C106 VCC_12V D106 VCC_12V
C52 PEG_RX0+ D52 PEG_TX0+ C107 VCC_12V D107 VCC_12V
C53 PEG_RX0- D53 PEG_TX0- C108 VCC_12V D108 VCC_12V
C54 TYPE0# D54 PEG_LANE_RV# C109 VCC_12V D109 VCC_12V
C55 PEG_RX1+ D55 PEG_TX1+ C110 GND (FIXED) D110 GND (FIXED)
4.3 Power Supply Connector
The conga-TEVAL/COMe 3.0 provides the following connectors for power supply:
•standard 24-pin ATX connector (X63)
•12 V DC banana jack (X41 and X42)
Note
1. In ATX mode, the +3.3 V, +5 V and +12 V are derived from the ATX power supply. If you supply 12 V DC power via the DC banana jack,
the onboard DC/DC regulators will generate the 3.3 V, 5 V and 12 V.
2. Do not supply power to both the DC banana jack and the ATX connector at the same time.
Copyright © 2018 congatec AG TEVA2m11 19/56
4.3.1 ATX Power Connector
The conga-TEVAL/COMe 3.0 provides a standard 24-pin connector X63 for ATX power supply. With ATX power supply, the COM Express™
module starts after you press the power-on button SW16 (ATX mode). To configure the power supply to operate in AT mode, set DIP SW21.1
to ON. In this mode, the module starts after the power switch on the power supply is turned on.
Use jumper JP11 to disconnect the 5 V standby voltage from the whole system.
Table 5 X63 - ATX Power
Pin Signal Description Pin Signal Description
1 +3.3V Power supply +3.3 VDC 13 +3.3V Power supply +3.3 VDC
2 +3.3V Power supply +3.3 VDC 14 -12V Power supply -12 VDC
3 GND Power ground 15 GND Power ground
4 +5V Power supply +5 VDC 16 PS_ON# Power Supply On (active low). Short this
pin to GND to switch power supply ON;
disconnect from GND to switch OFF.
5 GND Power ground 17 GND Power ground
6 +5V Power supply +5 VDC 18 GND Power ground
7 GND Power ground 19 GND Power ground
8 PWR_OK Power Ok 20 N.C
9 5V_SB Standby power supply +5 VDC 21 +5V Power supply +5 VDC
10 +12V Power supply +12 VDC 22 +5V Power supply +5 VDC
11 +12V Power supply +12 VDC 23 +5V Power supply +5 VDC
12 +3.3V Power supply +3.3 VDC 24 GND Power ground
Note
1. The -5V power output of the ATX power supply is not used.
2. The carrier board supports only 24-pin ATX power supply.
Table 6 SW21.1 - ATX PSU Control Description
Setting Configuration
OFF ATX mode (default)
ON AT mode
X63
12
0N
SW21
SW16
Copyright © 2018 congatec AG TEVA2m11 20/56
Table 7 JP11 - ATX 5V Standby Connection
Pin Description
1-2 5V standby connected (default)
2-3 5V standby disconnected
Connector Type
X63: Standard 24-pin ATX connector
4.3.2 DC Banana Jack
The conga-TEVAL/COMe 3.0 provides banana jacks X41 and X42 for DC power supply. This power supply supplies power to both the module
and the voltage regulators on the carrier board. Although the carrier board is designed for input voltage range of 6 -21 V, the input voltage
range is defined by the module (usually 12 V).
Caution
Do not exceed the voltage rating of the COM Express module. Doing so, will damage the module.
Table 8 X41/X42 - DC Banana Jack
Connector Description
X41 Input voltage for module and carrier board (usually +12 V)
X42 Ground
Table 9 SW21.2 - 12 V Voltage Regulator Control (Only via DC Banana Jack)
Setting Description
OFF Enable (default)
ON Disable
Connector Type
X41, X42: 4 mm diameter plug
2 31
JP11
X41 X42
12
0N
SW21

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