Congatec Qseven conga-QA5 User manual

Qseven®conga-QA5
Qseven module based on the Intel® Atom™, Pentium® and Celeron® Apollo Lake SoC
User’s Guide
Revision 1.0

Copyright © 2017 congatec AG QA50m10 2/61
Revision History
Revision Date (yyyy.mm.dd) Author Changes
0.1 2017.03.06 BEU •Preliminary release
1.0 2017.09.14 BEU •Minor improvements throughout the document
•Updated peripheral interfaces in section 2.1 "Feature List", supported OS in section 2.2 "Supported Operating Systems"
and supported features in section 6.3.4 "OEM BIOS Code/Data"
•Added power consumption values in section 2.5 "Power Consumption" and 2.6 "Supply Voltage Battery Power"
•Updated table 16 "USB Signal Descriptions", table 17 "SDIO Signal Descriptions", table 21 " HDMI/DVI Signal
Descriptions", table 22 "LPC Signal Descriptions", and table 28 "Miscellaneous Signal Descriptions"
•Added inrush current in section 5.12 "Power Control"
•Added section 5.15 "MIPI CSI-2"
•Added information to section 9 "System Resources"
•Added information to section 10 "BIOS Setup Description"

Copyright © 2017 congatec AG QA50m10 3/61
Preface
This user’s guide provides information about the components, features, connector and BIOS Setup menus available on the conga-QA5. It is
one of three documents that should be referred to when designing a Qseven®application. The other reference documents that should be used
include the following:
Qseven®Design Guide
Qseven®Specification
The links to these documents can be found on the congatec AG website at www.congatec.com
Disclaimer
The information contained within this user’s guide, including but not limited to any product specification, is subject to change without notice.
congatec AG provides no warranty with regard to this user’s guide or any other information contained herein and hereby expressly disclaims
any implied warranties of merchantability or fitness for any particular purpose with regard to any of the foregoing. congatec AG assumes
no liability for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for
discrepancies between the product and the user’s guide. In no event shall congatec AG be liable for any incidental, consequential, special, or
exemplary damages, whether based on tort, contract or otherwise, arising out of or in connection with this user’s guide or any other information
contained herein or the use thereof.
Intended Audience
This user’s guide is intended for technically qualified personnel. It is not intended for general audiences.
Lead-Free Designs (RoHS)
All congatec AG designs are created from lead-free components and are completely RoHS compliant.
Electrostatic Sensitive Device
All congatec AG products are electrostatic sensitive devices and are packaged accordingly. Do not open or handle a congatec AG product
except at an electrostatic-free workstation. Additionally, do not ship or store congatec AG products near strong electrostatic, electromagnetic,
magnetic, or radioactive fields unless the device is contained within its original manufacturer’s packaging. Be aware that failure to comply with
these guidelines will void the congatec AG Limited Warranty.

Copyright © 2017 congatec AG QA50m10 4/61
Symbols
The following symbols are used in this user’s guide:
Warning
Warnings indicate conditions that, if not observed, can cause personal injury.
Caution
Cautions warn the user about how to prevent damage to hardware or loss of data.
Note
Notes call attention to important information that should be observed.
Copyright Notice
Copyright © 2017, congatec AG. All rights reserved. All text, pictures and graphics are protected by copyrights. No copying is permitted
without written permission from congatec AG.
congatec AG has made every attempt to ensure that the information in this document is accurate yet the information contained within is
supplied “as-is”.
Trademarks
Product names, logos, brands, and other trademarks featured or referred to within this user’s guide, or the congatec website, are the property
of their respective trademark holders. These trademark holders are not affiliated with congatec AG, our products, or our website.

Copyright © 2017 congatec AG QA50m10 5/61
Warranty
congatec AG makes no representation, warranty or guaranty, express or implied regarding the products except its standard form of limited warranty
(“Limited Warranty”) per the terms and conditions of the congatec entity, which the product is delivered from. These terms and conditions can
be downloaded from www.congatec.com. congatec AG may in its sole discretion modify its Limited Warranty at any time and from time to time.
The products may include software. Use of the software is subject to the terms and conditions set out in the respective owner’s license agreements,
which are available at www.congatec.com and/or upon request.
Beginning on the date of shipment to its direct customer and continuing for the published warranty period, congatec AG represents that the
products are new and warrants that each product failing to function properly under normal use, due to a defect in materials or workmanship or
due to non conformance to the agreed upon specifications, will be repaired or exchanged, at congatec’s option and expense.
Customer will obtain a Return Material Authorization (“RMA”) number from congatec AG prior to returning the non conforming product freight
prepaid. congatec AG will pay for transporting the repaired or exchanged product to the customer.
Repaired, replaced or exchanged product will be warranted for the repair warranty period in effect as of the date the repaired, exchanged
or replaced product is shipped by congatec, or the remainder of the original warranty, whichever is longer. This Limited Warranty extends to
congatec’s direct customer only and is not assignable or transferable.
Except as set forth in writing in the Limited Warranty, congatec makes no performance representations, warranties, or guarantees, either express
or implied, oral or written, with respect to the products, including without limitation any implied warranty (a) of merchantability, (b) of fitness for a
particular purpose, or (c) arising from course of performance, course of dealing, or usage of trade.
congatec AG shall in no event be liable to the end user for collateral or consequential damages of any kind. congatec shall not otherwise be liable
for loss, damage or expense directly or indirectly arising from the use of the product or from any other cause. The sole and exclusive remedy
against congatec, whether a claim sound in contract, warranty, tort or any other legal theory, shall be repair or replacement of the product only.
Certification
congatec AG is certified to DIN EN ISO standard.
Technical Support
congatec AG technicians and engineers are committed to providing the best possible technical support for our customers so that our products
can be easily used and implemented. We request that you first visit our website at www.congatec.com for the latest documentation, utilities and
drivers, which have been made available to assist you. If you still require assistance after visiting our website then contact our technical support
department by email at [email protected]
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Terminology
Term Description
PCIe Peripheral Component Interface Express – next-generation high speed Serialized I/O bus
PCI Express Lane One PCI Express Lane is a set of 4 signals that contains two differential lines for
Transmitter and two differential lines for Receiver. Clocking information is embedded into the data stream.
x1, x2, x4, x8, x16 x1 refers to one PCI Express Lane of basic bandwidth; x2 to a collection of two PCI Express Lanes; etc.. Also referred to as x1, x2, x4,
x8, or x16 link.
eMMC Embedded MultiMediaCard
SD card Secure Digital card is a non-volatile memory card format developed for use in portable devices.
USB Universal Serial Bus
SATA Serial AT Attachment: serial-interface standard for hard disks
HDA High Definition Audio
DDI Digital Display Interface. DDI can operate as DisplayPort, HDMI or DVI.
DP DisplayPort is a VESA open digital communications interface.
HDMI High Definition Multimedia Interface. HDMI supports standard, enhanced, or high-definition video, plus multi-channel digital audio
on a single cable.
TMDS Transition Minimized Differential Signaling. TMDS is a signaling interface defined by Silicon Image that is used for DVI and HDMI.
DVI Digital Visual Interface is a video interface standard developed by the Digital Display Working Group (DDWG).
LPC Low Pin-Count is a low speed interface used for peripheral circuits such as Super I/O controllers, which typically combine legacy
device support into a single IC.
I²C Bus Inter-Integrated Circuit Bus is a simple two-wire bus with a software-defined protocol that was developed to provide the
communications link between integrated circuits in a system.
SM Bus System Management Bus is a popular derivative of the I²C-bus.
SPI Bus Serial Peripheral Interface is a synchronous serial data link standard that operates in full duplex mode.
GbE Gigabit Ethernet
LVDS Low-Voltage Differential Signaling
DDC Display Data Channel is an I²C bus interface between a display and a graphics adapter.
N.C. Not connected
N.A. Not available
T.B.D. To be determined

Copyright © 2017 congatec AG QA50m10 7/61
Contents
1 Introduction ............................................................................. 10
1.1 Qseven®Concept .................................................................... 10
1.2 conga-QA5 Options Information ............................................. 11
2 Specifications........................................................................... 13
2.1 Feature List .............................................................................. 13
2.2 Supported Operating Systems ................................................ 14
2.3 Mechanical Dimensions ........................................................... 14
2.4 Supply Voltage Standard Power .............................................. 15
2.4.1 Electrical Characteristics .......................................................... 15
2.4.2 Rise Time ................................................................................. 15
2.5 Power Consumption ................................................................ 16
2.6 Supply Voltage Battery Power ................................................. 18
2.7 Environmental Specifications................................................... 18
3 Block Diagram.......................................................................... 19
4 Cooling Solutions..................................................................... 20
4.1 CSP Dimensions....................................................................... 21
4.2 Heatspreader Dimensions........................................................ 23
5 Connector Subsystems ............................................................ 25
5.1 PCI Express™........................................................................... 25
5.2 Gigabit Ethernet ...................................................................... 25
5.3 SATA ....................................................................................... 26
5.4 USB .......................................................................................... 26
5.5 UART........................................................................................ 26
5.6 SD Card.................................................................................... 26
5.7 High Definition Audio (HDA) ................................................... 26
5.8 Display Interfaces..................................................................... 27
5.8.1 DisplayPort............................................................................... 27
5.8.2 HDMI........................................................................................ 27
5.8.3 DVI ........................................................................................... 28
5.8.4 LVDS / eDP............................................................................... 28
5.9 LPC........................................................................................... 28
5.10 SPI............................................................................................ 29
5.11 I²C Bus ..................................................................................... 29
5.12 Power Control .......................................................................... 29
5.13 Power Management................................................................. 30
5.14 SMBus...................................................................................... 30
5.15 MIPI CSI-2 ............................................................................... 31
6 Additional Features.................................................................. 32
6.1 eMMC 5.0 ................................................................................ 32
6.2 congatec Board Controller (cBC) ............................................. 32
6.2.1 Board Information.................................................................... 32
6.2.2 Fan Control .............................................................................. 32
6.2.3 Power Loss Control.................................................................. 32
6.2.4 Watchdog ................................................................................ 33
6.3 OEM BIOS Customization........................................................ 33
6.3.1 OEM Default Settings .............................................................. 33
6.3.2 OEM Boot Logo....................................................................... 33
6.3.3 OEM POST Logo ..................................................................... 33
6.3.4 OEM BIOS Code/Data............................................................. 34
6.3.5 OEM DXE Driver...................................................................... 34
6.4 congatec Battery Management Interface ................................ 34
6.5 API Support (CGOS) ................................................................ 35
6.6 Security Features...................................................................... 35
6.7 Suspend to RAM...................................................................... 35
7 conga Tech Notes .................................................................... 36
7.1 Intel Apollo Lake SoC Features................................................ 36
7.1.1 Processor Core......................................................................... 36
7.1.1.1 Intel Virtualization Technology................................................. 36
7.1.1.2 AHCI ........................................................................................ 37
7.1.1.3 Thermal Management ............................................................. 37
7.2 ACPI Suspend Modes and Resume Events.............................. 38
8 Signal Descriptions and Pinout Tables..................................... 39
9 System Resources .................................................................... 55

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9.1 I/O Address Assignment.......................................................... 55
9.1.1 LPC Bus.................................................................................... 55
9.2 PCI Configuration Space Map ................................................. 56
9.3 I²C Bus ..................................................................................... 57
9.4 SM Bus..................................................................................... 57
9.5 congatec System Sensors ........................................................ 58
10 BIOS Setup Description........................................................... 59
10.1 Navigating the BIOS Setup Menu ........................................... 59
10.2 BIOS Versions........................................................................... 59
10.3 Updating the BIOS................................................................... 59
10.4 Supported Flash Devices ......................................................... 60
11 Industry Specifications ............................................................. 61

Copyright © 2017 congatec AG QA50m10 9/61
List of Tables
Table 1 conga-QA5 (Commercial Variants)........................................... 11
Table 2 conga-QA5 (Industrial Variants) ............................................... 12
Table 3 Feature Summary..................................................................... 13
Table 4 Measurement Description........................................................ 16
Table 5 Power Consumption Values ..................................................... 17
Table 6 CMOS Battery Power Consumption ........................................ 18
Table 7 PCI Express™ Options............................................................. 25
Table 8 USB Options ............................................................................ 26
Table 9 Display Combination ............................................................... 27
Table 10 Signal Tables Terminology Descriptions .................................. 39
Table 11 Edge Finger Pinout.................................................................. 40
Table 12 PCI Express Signal Descriptions .............................................. 44
Table 13 UART Signal Descriptions ........................................................ 44
Table 14 Ethernet Signal Descriptions.................................................... 45
Table 15 SATA Signal Descriptions......................................................... 45
Table 16 USB Signal Descriptions........................................................... 46
Table 17 SDIO Signal Descriptions......................................................... 47
Table 18 HDA Signal Descriptions.......................................................... 48
Table 19 LVDS Signal Descriptions......................................................... 48
Table 20 DisplayPort Signal Descriptions............................................... 50
Table 21 HDMI/DVI Signal Descriptions................................................. 50
Table 22 LPC Signal Descriptions........................................................... 51
Table 23 SPI Interface Signal Descriptions ............................................. 51
Table 24 CAN Bus Signal Descriptions................................................... 52
Table 25 Power and GND Signal Descriptions....................................... 52
Table 26 Power Control Signal Descriptions .......................................... 52
Table 27 Power Management Signal Descriptions................................. 53
Table 28 Miscellaneous Signal Descriptions........................................... 53
Table 29 Manufacturing Signal Descriptions .......................................... 54
Table 30 Thermal Management Signal Descriptions.............................. 54
Table 31 Fan Control Signal Descriptions .............................................. 54
Table 32 I/O Address Assignment.......................................................... 55
Table 33 PCI Configuration Space Map ................................................. 56

Copyright © 2017 congatec AG QA50m10 10/61
1 Introduction
1.1 Qseven®Concept
The Qseven®concept is an off-the-shelf, multi vendor, Single-Board-Computer that integrates all the core components of a common PC and is
mounted onto an application specific carrier board. Qseven®modules have a standardized form factor of 70mm x 70mm and a specified pinout
based on the high speed MXM system connector. The pinout remains the same regardless of the vendor. The Qseven®module provides the
functional requirements for an embedded application. These functions include, but are not limited to, graphics, sound, mass storage, network
interface and multiple USB ports.
A single ruggedized MXM connector provides the carrier board interface to carry all the I/O signals to and from the Qseven®module. This
MXM connector is a well known and proven high speed signal interface connector that is commonly used for high speed PCI Express graphics
cards in notebooks.
Carrier board designers can use as little or as many of the I/O interfaces as deemed necessary. The carrier board can therefore provide all the
interface connectors required to attach the system to the application specific peripherals. This versatility allows the designer to create a dense
and optimized package, which results in a more reliable product while simplifying system integration.
The Qseven®evaluation carrier board provides carrier board designers with a reference design platform and the opportunity to test all the
Qseven®I/O interfaces available and then choose what are suitable for their application. Qseven®applications are scalable, which means once
a carrier board has been created there is the ability to diversify the product range through the use of different performance class Qseven®
modules. Simply unplug one module and replace it with another, no need to redesign the carrier board.
This document describes the features available on the Qseven®evaluation carrier board. Additionally, the schematics for the Qseven®evaluation
carrier board can be found on the congatec website.

Copyright © 2017 congatec AG QA50m10 11/61
1.2 conga-QA5 Options Information
The conga-QA5 is available in nine variants. This user’s guide describes all of these variants and the table below shows the different configurations
available. Check for the Part No. that applies to your product. This will tell you what options described in this user’s guide are available on your
particular module.
Table 1 conga-QA5 (Commercial Variants)
Part-No 015500 015501 015502 015503 015522 015523
Processor Intel® Atom™ E3950
1.6 GHz Quad Core
Intel® Atom™ E3940
1.6 GHz Quad Core
Intel® Atom™ E3930
1.3 GHz Dual Core
Intel® Atom™ E3950
1.6 GHz Quad Core
Intel® Celeron®N3350
1.1 GHz Dual Core
Intel® Pentium®N4200
1.1 GHz Quad Core
CPU Burst Freq. 2.0 GHz 1.8 GHz 1.8 GHz 2.0 GHz 2.4 GHz 2.5 GHz
L2 Cache 2 MB 2 MB 2 MB 2MB 2 MB 2 MB
Onboard Memory 8 GB 1866 MT/s DDR3L 4 GB 1866 MT/s DDR3L 2 GB 1866 MT/s DDR3L 4 GB 1866 MT/s DDR3L 4 GB 1866 MT/s DDR3L 8 GB 1866 MT/s DDR3L
Graphics Intel®HD Graphics 505 Intel®HD Graphics 500 Intel®HD Graphics 500 Intel®HD Graphics 505 Intel®HD Graphics 500 Intel®HD Graphics 505
GFX Normal/Burst 500 / 650 MHz 400 / 600 MHz 400 / 550 MHz 500 / 650 MHz 200 / 650 MHz 200 / 750 MHz
LVDS/eDP LVDS LVDS LVDS LVDS LVDS LVDS
Default USB
Configuration
1x USB3.0 / 2.0
5x USB2.0
1x USB3.0 / 2.0
5x USB2.0
1x USB3.0 / 2.0
5x USB2.0
1x USB3.0 / 2.0
5x USB2.0
1x USB3.0 / 2.0
5x USB2.0
1x USB3.0 / 2.0
5x USB2.0
DDI Dual-mode DP 1.2 /
HDMI 1.4b / DVI
Dual-mode DP 1.2 /
HDMI 1.4b / DVI
Dual-mode DP 1.2 /
HDMI 1.4b / DVI
Dual-mode DP 1.2 /
HDMI 1.4b / DVI
Dual-mode DP 1.2 /
HDMI 1.4b / DVI
Dual-mode DP 1.2 /
HDMI 1.4b / DVI
eMMC 32 GB 16 GB 8 GB 16 GB 16 GB 32 GB
Ethernet Controller Intel® I211 Intel® I211 Intel® I211 Intel® I211 Intel® I211 Intel® I211
SOC TDP 12 W 9.5 W 6.5 W 12 W 6 W 6 W

Copyright © 2017 congatec AG QA50m10 12/61
Table 2 conga-QA5 (Industrial Variants)
Part-No 015510 015511 015512
Intel Processor Intel® Atom™ E3950
1.6 GHz Quad Core
Intel® Atom™ E3940
1.6 GHz Quad Core
Intel® Atom™ E3930
1.3 GHz Dual Core
CPU Burst Freq. 2.0 GHz 1.8 GHz 1.8 GHz
L2 Cache 2 MB 2 MB 2 MB
Onboard Memory 8 GB 1866 MT/s DDR3L 4 GB 1866 MT/s DDR3L 2 GB 1866 MT/s DDR3L
Graphics Intel®HD Graphics 505 Intel®HD Graphics 500 Intel®HD Graphics 500
GFX Normal/Burst 500 / 650 MHz 400 / 600 MHz 400 / 550 MHz
LVDS/eDP 1.3 LVDS LVDS LVDS
Default USB
Configuration
1x USB3.0/2.0
5x USB2.0
1x USB3.0/2.0
5x USB2.0
1x USB3.0/2.0
5x USB2.0
DDI Dual-mode DP 1.2 /
HDMI 1.4b / DVI
Dual-mode DP 1.2 /
HDMI 1.4b / DVI
Dual-mode DP 1.2 /
HDMI 1.4b / DVI
eMMC 32 GB 16 GB 8 GB
Ethernet Controller Intel® I210 Intel® I210 Intel® I210
SOC TDP 12 W 9.5 W 6.5 W

Copyright © 2017 congatec AG QA50m10 13/61
2 Specifications
2.1 Feature List
Table 3 Feature Summary
Form Factor Based on Qseven®form factor specification revision 2.0
Processor Based on full industrial Intel®Atom™ and commercial Pentium™/Celeron™ Apollo Lake Architecture
Memory Single or dual channel non-ECC DDR3L onboard memory interface with up to 8 GB system memory and data rates up to 1866 MT/s
Chipset Integrated in the SoC
Onboard Storage eMMC 5.0 onboard flash up to 64 GB
Audio Intel® High Definition Audio and Integrated Audio DSP with Intel® Smart Sound Technology
Ethernet Onboard Intel®Ethernet Controller I211 (Commercial Variants) or I210 (Industrial Variants) connected via one PCI Express®x1 link by default
Graphics
Interfaces
Intel®HD Graphics Gen9-LP supporting DirectX12, OpenGL 4.3, OpenGL ES 3.0, OpenCL 1.2, full HW acceleration for HEVC(H2.65), H.264, MVC,
VP8, VP9, MPEG2, VC-1, WMV9 and JPEG/MJPEG
1x LVDS (default) or eDP interface (assembly option)*1
1x Dedicated DDI and
1x Optional DDI (assembly option)*2 with support for:
-1x Dual-mode DisplayPort 1.2
-1x HDMI 1.4b*3
-1x DVI*3
NOTE:
*1 Either eDP or LVDS signals supported. Both signals are not supported.
*2 Variants equipped with the optional DDI interface do not support LVDS.
*3 Requires an external level shifter on the carrier board.
Peripheral
Interfaces
2x SATA 6Gb/s
Up to 4x PCI Express®Gen2 x1 links without LAN (requires
custom BIOS)
USB Interfaces:
-1x USB 3.0/2.0 + 5x USB 2.0 (default) or
-2x USB 3.0/2.0 + 2x USB 2.0 or
-8x USB 2.0
SD (MMC not supported)
UART
SPI Bus
LPC Bus
I²C Bus
BIOS Features AMI Aptio®UEFI 5.x firmware; 8 MByte serial SPI with congatec Embedded BIOS features (OEM Logo, OEM CMOS Defaults, LCD Control, Display
Auto Detection, Backlight Control, Flash Update)
Power Mgmt ACPI 5.0 compliant with battery support. Also supports Suspend to RAM (S3).
congatec Board
Controller
Multi Stage Watchdog, non-volatile User Data Storage, Manufacturing and Board Information, Board Statistics, BIOS Setup Data Backup, I²C bus (fast
mode, 400 kHz, multi-master), Power Loss Control
Security Optional discrete Trusted Platform Module “TPM 1.2/2.0”; new AES Instructions for faster and better encryption.
Note
Some of the features mentioned in the above Feature Summary are optional. Check the article number of your module and compare it to the
option information list on page 11 of this user’s guide to determine what options are available on your particular module.

Copyright © 2017 congatec AG QA50m10 14/61
2.2 Supported Operating Systems
The conga-QA5 supports the following operating systems:
• Microsoft®Windows®10 Enterprise (64-bit)
• Microsoft®Windows®10 IoT Core (32/64-bit)
• Linux 3.x/4.x
• Android 6.x
• Yocto 2.x
Note
For the installation of Microsoft®Windows®10 (64-bit), congatec AG recommends a minimum storage capacity of 20 GB. congatec will not
offer technical support for systems with less than 20 GB storage space.
2.3 Mechanical Dimensions
•70.0 mm x 70.0 mm
•The Qseven™ module, including the heatspreader plate, PCB thickness and bottom components, is up to approximately 12mm thick.
Heatspeader
Qseven Module PCB
Carrier Board PCB
Dimension is dependent
on connector height used
Dimension is dependent
on connector height used
All measurements are in millimeters
All dimensions without tolerance ±0.2mm
Rear View of Qseven Module
2.00
1.20 ±0.1
6.00 8.00

Copyright © 2017 congatec AG QA50m10 15/61
2.4 Supply Voltage Standard Power
•5V DC ± 5%
The dynamic range shall not exceed the static range.
2.4.1 Electrical Characteristics
Characteristics Min. Typ. Max. Units Comment
5V Voltage ± 5% 4.75 5.00 5.25 Vdc
Ripple - - ± 50 mVPP 0-20MHz
Current
5V_SB Voltage ± 5% 4.75 5.00 5.25 Vdc
Ripple ± 50 mVPP
2.4.2 Rise Time
The input voltages shall rise from 10% of nominal to 90% of nominal at a minimum slope of 250V/s. The smooth turn-on requires that, during
the 10% to 90% portion of the rise time, the slope of the turn-on waveform must be positive.
Note
For information about the input power sequencing of the Qseven®module, refer to the Qseven®specification.
Nominal Static Range
Dynamic Range
Absolute Minimum
Absolute Maximum5.25V
4.75V
5V
5.05V
4.95V

Copyright © 2017 congatec AG QA50m10 16/61
2.5 Power Consumption
The power consumption values were measured with the following setup:
•conga-QA5 COM
•modified congatec carrier board
•conga-QA5 cooling solution
•Microsoft Windows®10 (64-bit)
Note
The CPU was stressed to its maximum workload with the Intel®Thermal Analysis Tool.
Table 4 Measurement Description
The power consumption values were recorded during the following system states:
System State Description Comment
S0: Minimum value Lowest frequency mode (LFM) with minimum core voltage during
desktop idle.
S0: Maximum value Highest frequency mode (HFM/Turbo Boost). The CPU was stressed to its maximum frequency.
S0: Peak value Highest current spike during the measurement of “S0: Maximum
value”. This state shows the peak value during runtime.
Consider this value when designing the system’s power supply to
ensure that sufficient power is supplied during worst case scenarios.
S3 COM is powered by VCC_5V_SBY.
S5 COM is powered by VCC_5V_SBY.
Note
1. The fan and SATA drives were powered externally.
2. All other peripherals except the LCD monitor were disconnected before measurement.

Copyright © 2017 congatec AG QA50m10 17/61
Table 5 Power Consumption Values
The tables below provide additional information about the power consumption data for each of the conga-QA5 variants offered. The values
are recorded at various operating mode.
Part
No.
Memory
Size
H.W
Rev.
BIOS
Rev.
OS
(64-bit)
CPU Current (Amp.)
Variant Cores Freq/Turbo
(GHz)
S0:
Min
S0:
Max
S0:
Peak
S3 S5
015500 8 GB A.1 QA50R015 Windows 10 Atom™ E3950 4 1.6 GHz/2.0 GHz 0.11 1.82 1.99 0.08 0.04
015501 4 GB A.1 QA50R015 Windows 10 Atom™ E3940 4 1.6 GHz/1.8 GHz 0.09 1.22 1.29 0.06 0.04
015502 2 GB A.1 QA50R015 Windows 10 Atom™ E3930 2 1.3 GHz/1.8 GHz 0.09 0.88 0.94 0.06 0.04
015503* 4 GB A.1 QA50R015 Windows 10 Atom™ E3950 4 1.6 GHz/2.0 GHz 0.11 1.82 1.99 0.08 0.04
015522 4 GB A.1 QA50R015 Windows 10 Celeron®N3350 2 1.1 GHz/2.4 GHz 0.10 1.02 1.48 0.06 0.04
015523 8 GB A.1 QA50R015 Windows 10 Pentium®N4200 4 1.1 GHz/2.5 GHz 0.11 1.13 1.83 0.10 0.06
015510* 8 GB A.1 QA50R015 Windows 10 Atom™ E3950 4 1.6 GHz/2.0 GHz 0.11 1.82 1.99 0.08 0.04
015511* 4 GB A.1 QA50R015 Windows 10 Atom™ E3940 4 1.6 GHz/1.8 GHz 0.09 1.22 1.29 0.06 0.04
015512* 2 GB A.1 QA50R015 Windows 10 Atom™ E3930 2 1.3 GHz/1.8 GHz 0.09 0.88 0.94 0.06 0.04
Note
With fast input voltage rise time, the inrush current may exceed the measured peak current.
Because the power consumption of module variants with the same CPU are similar (maxmimum ± 5%), we measured only one variant. The
power consumption values for the other variants (marked with asterisk) were copied.

Copyright © 2017 congatec AG QA50m10 18/61
2.6 Supply Voltage Battery Power
Table 6 CMOS Battery Power Consumption
RTC @ Voltage Current
-10oC 3V DC 1.89 µA
20oC 3V DC 2.06 µA
70oC 3V DC 2.98 µA
Note
1. Do not use the CMOS battery power consumption values listed above to calculate CMOS battery lifetime.
2. Measure the CMOS battery power consumption in your customer specific application in worst case conditions (for example, during high
temperature and high battery voltage).
3. Consider also the self-discharge of the battery when calculating the lifetime of the CMOS battery. For more information, refer to application
note AN9_RTC_Battery_Lifetime.pdf on congatec AG website at www.congatec.com/support/application-notes.
4. We recommend to always have a CMOS battery present when operating the conga-QA5.
2.7 Environmental Specifications
Temperature (commercial variants) Operation: 0° to 60°C Storage: -20° to +80°C
Temperature (industrial variants) Operation: -40° to 85°C Storage: -45° to +85°C
Humidity Operation: 10% to 90% Storage: 5% to 95%
Caution
The above operating temperatures must be strictly adhered to at all times. When using a congatec heatspreader, the maximum operating
temperature refers to any measurable spot on the heatspreader’s surface.
Humidity specifications are for non-condensing conditions.

Copyright © 2017 congatec AG QA50m10 19/61
3 Block Diagram
Intel Apollo Lake
VP9
OpenCL 2.0
Interfaces
SATA
UNCORE UNIT
USB 3.0/2.0
COMPUTE UNIT
Core #1 Core #2
Core #4
Tri-gate 3-D 14nm Quad core SoC
1MB L2 cache shared by 2 cores
PROCESSOR CORE
Core #3
AESSSE4.2
Multimedia Features
Intel®Gen9 LP
HEVC
H.264
DirectX 12.0
VP8 MPEG2 WMV9
M/JPEG
DISPLAY & GRAPHICS @MEDIA
OpenGL 4.3
OpenGL ES 3.0
LPC BusPCIe GPIOs
eMMC/SDHD Audio UART
SPI
Integrated I/O Interfaces
INTEGRATED I/O
DisplayPort HDMI/DVI eDP
VC-1
eDP
DDI1
DDI0
optional*
1
optional
Notes:
*
1
: PCIe 3 is available only for config x4 or no GbE
2x SATA 6Gb/s
4 bit SD v3
1x USB 3.0/2.0 SuperSpeed
1x USB 2.0 DualRole USB 2.0
USB 2.0
4x USB 2.0
FSPI
Channel 1
DDR3L-1866
Channel 2
DDR3L-1866
eMMC 5.0
LPC
Onboard
DDR3L Memory
Onboard
DDR3L Memory
SSD
MIPI CSI2
PCIe to GBE
Intel I210/l211
eDP to LVDS
NXP PTN3460
BIOS
congatec
Board Controller
opt. 1x USB 3.0 + 1x USB 2.0 DualRole + 4x USB2.0
1x USB 2.0 DualRole USB 2.0
USB 2.0
7x USB 2.0
opt. 1x USB 2.0 DualRole + 7x USB2.0
1x USB 3.0 SuperSpeed
1x USB 3.0 DualRole SuperSpeed
USB 2.0
2x USB 2.0
opt. 1x USB 3.0 + 1x USB 3.0 DualRole + 2x USB2.0
TPM
0R0
0R0
Ethernet
LVDS_A / eDP0
LVDS_B / eDP1
Qseven 2.0
Connector
230 Edge Finger
LPC Bus
CAN Bus
SPI Bus
HDA I/F
USB 3.0 Port
USB 2.0 Port
USB 2.0 Port
USB 2.0 Port
USB 2.0 Port
USB 3.0 Port
USB 3.0 Port
USB 2.0 Port
SATA Port 1-0
SD/SDIO
PWR Control
I2C Bus
SM Bus
UART
Fan Control
PCIe Port 2
PCIe Port 3
PCIe Port 1
PCIe Port 0
DDI
MIPI CSI x4
MIPI-CSI x2 MIPI CSI2

Copyright © 2017 congatec AG QA50m10 20/61
4 Cooling Solutions
congatec AG offers cooling solutions for the lidded and open die conga-QA5 variants:
•Passive cooling solutions (CSP)
•Heatspreader
The dimensions of the cooling solutions are shown below. All measurements are in millimeters. The maximum recommended torque for
heatspreader screws is 0.3 Nm. Mechanical system assembly mounting shall follow the valid DIN/ISO specifications.
The heatspreader acts as a thermal coupling device to the module and is thermally coupled to the CPU via a thermal gap filler. On some
modules, it may also be thermally coupled to other heat generating components with the use of additional thermal gap fillers.
Although the heatspreader is the thermal interface where most of the heat generated by the module is dissipated, it is not to be considered
as a heatsink. It has been designed as a thermal interface between the module and the application specific thermal solution. The application
specific thermal solution may use heatsinks with fans, and/or heat pipes, which can be attached to the heatspreader. Some thermal solutions
may also require that the heatspreader is attached directly to the systems chassis thereby using the whole chassis as a heat dissipater.
Note
The gap pad material used on all heatspreaders contains silicon oil that can seep out over time depending on the environmental conditions
it is subjected to. For more information about this subject, contact your local congatec sales representative and request the gap pad material
manufacturer’s specification.
Caution
The congatec heatspreaders/cooling solutions are tested only within the commercial temperature range of 0° to 60°C. Therefore, if your
application that features a congatec heatspreader/cooling solution operates outside this temperature range, ensure the correct operating
temperature of the module is maintained at all times. This may require additional cooling components for your final application’s thermal
solution.
For adequate heat dissipation, use the mounting holes on the cooling solution to attach it to the module. Apply thread-locking fluid on the
screws if the cooling solution is used in a high shock and/or vibration environment. To prevent the standoff from stripping or cross-threading,
use non-threaded carrier board standoffs to mount threaded cooling solutions.
For applications that require vertically-mounted cooling solution, use only coolers that secure the thermal stacks with fixing post. Without the
fixing post feature, the thermal stacks may move.
Also, do not exceed the maximum torque specified for the screws. Doing so may damage the module or/and the carrier board.