Congatec conga-IC170 Thin Mini-ITX SBC User manual

conga-IC170 Thin Mini-ITX SBC
Detailed Description Of The congatec Thin Mini-ITX Based On Intel 6th Generation U-Series SoC
User's Guide
Revision 1.3

Copyright © 2016 congatec AG ICSLm13.indd 2/95
Revision History
Revision Date (yyyy.mm.dd) Author Changes
0.1 2016.08.19 AEM •Preliminary release
1.0 2017.02.07 AEM •Updated the document to reflect the changes in hardware revision B.x
•Updated section 1.2.2 “Optional Accessories”
•Official release
1.1 2017.12.05 AEM •Added note that hardware revision B.1 and older do not support the “TDP Up” Configurable TDP Boot Mode option in
section 8.4.15 “CPU Submenu”
•Updated section 9 “Additional BIOS Features”. Changed the feature number for the initial production BIOS to “1”. Also
deleted section 9.1 “Supported Flash Devices”
•Updated table 9 “Measurement Description”
•Updated table 43 “Feature Connector X38 Pinout Description”
1.2 2018.05.11 AEM •Updated section 9.1 “BIOS Versions”
•Deleted references to MIPI interface because the conga-IC175 does not support it
1.3 2018.08.01 AEM •Added note about Wake on LAN from S5 mode in section 5.7 “Ethernet”

Copyright © 2016 congatec AG ICSLm13.indd 3/95
Preface
This user's guide provides information about the components, features and connectors available on the conga-IC170 Thin Mini-ITX single
board.
Disclaimer
The information contained within this user’s guide, including but not limited to any product specification, is subject to change without notice.
congatec AG provides no warranty with regard to this user’s guide or any other information contained herein and hereby expressly disclaims
any implied warranties of merchantability or fitness for any particular purpose with regard to any of the foregoing. congatec AG assumes
no liability for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for
discrepancies between the product and the user’s guide. In no event shall congatec AG be liable for any incidental, consequential, special, or
exemplary damages, whether based on tort, contract or otherwise, arising out of or in connection with this user’s guide or any other information
contained herein or the use thereof.
Intended Audience
This user's guide is intended for technically qualified personnel. It is not intended for general audiences.
Lead-Free Designs (RoHS)
All congatec AG products are created from lead-free components and are completely RoHS compliant.
Electrostatic Sensitive Device
All electronic parts described in this user’s guide are electrostatic sensitive devices and are packaged accordingly. Do not open or handle a
carrier board or module except at an electrostatic-free workstation. Additionally, do not ship or store electronic devices near strong electrostatic,
electromagnetic, magnetic, or radioactive fields unless the device is contained within its original manufacturer’s packaging.

Copyright © 2016 congatec AG ICSLm13.indd 4/95
Symbols
The following symbols are used in this user's guide:
Warning
Warnings indicate conditions that, if not observed, can cause personal injury.
Caution
Cautions warn the user about how to prevent damage to hardware or loss of data.
Note
Notes call attention to important information that should be observed.
Connector Type
Describes the connector used on the Single Board Computer.
Copyright Notice
Copyright © 2016, congatec AG. All rights reserved. All text, pictures and graphics are protected by copyrights. No copying is permitted
without written permission from congatec AG.
congatec AG has made every attempt to ensure that the information in this document is accurate yet the information contained within is
supplied “as-is”.

Copyright © 2016 congatec AG ICSLm13.indd 5/95
Trademarks
Product names, logos, brands, and other trademarks featured or referred to within this user’s guide, or the congatec website, are the property
of their respective trademark holders. These trademark holders are not affiliated with congatec AG, our products, or our website.
Warranty
congatec AG makes no representation, warranty or guaranty, express or implied regarding the products except its standard form of limited
warranty (“Limited Warranty”) per the terms and conditions of the congatec entity, which the product is delivered from. These terms and
conditions can be downloaded from www.congatec.com. congatec AG may in its sole discretion modify its Limited Warranty at any time and
from time to time.
The products may include software. Use of the software is subject to the terms and conditions set out in the respective owner’s license
agreements, which are available at www.congatec.com and/or upon request.
Beginning on the date of shipment to its direct customer and continuing for the published warranty period, congatec AG represents that the
products are new and warrants that each product failing to function properly under normal use, due to a defect in materials or workmanship or
due to non conformance to the agreed upon specifications, will be repaired or exchanged, at congatec’s option and expense.
Customer will obtain a Return Material Authorization (“RMA”) number from congatec AG prior to returning the non conforming product freight
prepaid. congatec AG will pay for transporting the repaired or exchanged product to the customer.
Repaired, replaced or exchanged product will be warranted for the repair warranty period in effect as of the date the repaired, exchanged
or replaced product is shipped by congatec, or the remainder of the original warranty, whichever is longer. This Limited Warranty extends to
congatec’s direct customer only and is not assignable or transferable.
Except as set forth in writing in the Limited Warranty, congatec makes no performance representations, warranties, or guarantees, either
express or implied, oral or written, with respect to the products, including without limitation any implied warranty (a) of merchantability, (b) of
fitness for a particular purpose, or (c) arising from course of performance, course of dealing, or usage of trade.
congatec AG shall in no event be liable to the end user for collateral or consequential damages of any kind. congatec shall not otherwise be
liable for loss, damage or expense directly or indirectly arising from the use of the product or from any other cause. The sole and exclusive
remedy against congatec, whether a claim sound in contract, warranty, tort or any other legal theory, shall be repair or replacement of the
product only.
Certification
congatec AG is certified to DIN EN ISO 9001 standard.
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Copyright © 2016 congatec AG ICSLm13.indd 6/95
Technical Support
congatec AG technicians and engineers are committed to providing the best possible technical support for our customers so that our products
can be easily used and implemented. We request that you first visit our website at www.congatec.com for the latest documentation, utilities
and drivers, which have been made available to assist you. If you still require assistance after visiting our website then contact our technical
support department by email at [email protected]
Terminology
Term Description
PCIe Peripheral Component Interface Express
cBC congatec Board Controller
SDIO Secure Digital Input Output
USB Universal Serial Bus
SATA Serial AT Attachment: serial-interface standard for hard disks
HDA High Definition Audio
S/PDIF Sony/Philips Digital Interconnect Format
HDMI High Definition Multimedia Interface
TMDS Transition Minimized Differential Signaling
DVI Digital Visual Interface
LPC Low Pin-Count
I²C Bus Inter-Integrated Circuit Bus
SM Bus System Management Bus
SPI Serial Peripheral Interface
GbE Gigabit Ethernet
LVDS Low-Voltage Differential Signaling
DDC Display Data Channel
PN Part Number - the part number for placing orders.
N.C Not connected
N.A Not available
T.B.D To be determined

Copyright © 2016 congatec AG ICSLm13.indd 7/95
Contents
1 Introduction ............................................................................. 10
1.1 Mini-ITX Concept..................................................................... 10
1.2 conga-IC170 ............................................................................ 10
1.2.1 Options Information................................................................. 11
1.2.2 Optional Accessories ............................................................... 11
2 Specification ............................................................................ 14
2.1 Feature List .............................................................................. 14
2.2 Supported Operating Systems ................................................ 15
2.3 Mechanical Dimensions ........................................................... 15
2.4 Supply Voltage Power.............................................................. 16
2.5 Power Consumption ................................................................ 16
2.5.1 Supply Voltage Battery Power ................................................. 17
2.6 Environmental Specifications................................................... 18
3 Block Diagram.......................................................................... 19
4 Cooling Solution ...................................................................... 20
4.1 Cooling Installation.................................................................. 21
4.2 Active Cooling Dimensions...................................................... 22
5 Connector Description............................................................. 23
5.1 Power Supply ........................................................................... 23
5.1.1 DC Power Jack (Rear I/O) ........................................................ 23
5.1.2 Power Supply (Internal Connector) .......................................... 24
5.1.3 Optional SBM3Power Connector (Internal Connector) ........... 24
5.1.3.1 Optional SBM3 Signal Connector............................................ 25
5.1.4 Power Status LEDs ................................................................... 25
5.2 CMOS Battery/RTC.................................................................. 26
5.3 PCI Express ............................................................................. 27
5.3.1 PCIe x4 Slot.............................................................................. 27
5.3.2 Full/half-size Mini PCIe ............................................................ 28
5.3.3 PCI Express Routing................................................................. 30
5.4 Display Interfaces..................................................................... 31
5.4.1 Display Port Interface DP++ .................................................... 31
5.4.2 LVDS......................................................................................... 31
5.4.3 Embedded Display Port (eDP) ................................................. 33
5.4.3.1 Backlight Power Connector ..................................................... 34
5.4.3.2 Backlight/Panel Power Selection ............................................. 35
5.4.3.3 Monitor OFF connector ........................................................... 35
5.5 Universal Serial Bus (USB) ........................................................ 36
5.5.1 Rear USB Connectors............................................................... 36
5.5.2 Internal USB Connectors.......................................................... 36
5.6 SATA Interfaces........................................................................ 38
5.6.1 Standard SATA Ports ................................................................ 38
5.6.2 SATA Power ............................................................................. 39
5.6.3 M.2 Slot.................................................................................... 39
5.7 Ethernet 10/100/1000.............................................................. 41
5.8 Audio Interface ........................................................................ 42
5.8.1 Rear Audio Connectors............................................................ 42
5.8.2 Internal Audio Connectors....................................................... 43
5.8.2.1 Stereo Speaker Header............................................................ 43
5.8.2.2 Digital Microphone/SPDIF ....................................................... 43
5.8.2.3 Front Panel (HD Audio/AC97).................................................. 44
5.8.2.4 Surround header ...................................................................... 45
5.9 SMBus...................................................................................... 45
5.10 SPI Bus ..................................................................................... 45
5.11 I²C Bus .................................................................................... 46
5.12 LPC Super I/O Device.............................................................. 46
5.12.1 GPIOs....................................................................................... 46
5.12.2 Serial Ports (COM) ................................................................... 46
5.12.3 CPU/System Fan Connector & Power Configuration............... 47
6 Additional Features.................................................................. 48
6.1 Front Panel Connector............................................................. 48
6.2 Micro-SIM Card........................................................................ 48
6.3 Micro-SD Card ......................................................................... 49
6.4 Integrated Sensor Hub............................................................. 50
6.5 Case Open Intrusion Connector .............................................. 51
6.6 Trusted Platform Module – TPM (Optional) ............................. 51

Copyright © 2016 congatec AG ICSLm13.indd 8/95
6.7 congatec Board Controller (cBC) ............................................. 51
6.7.1 Fan Control .............................................................................. 51
6.7.2 Power Loss Control.................................................................. 52
6.7.3 Board Information.................................................................... 52
6.8 Embedded BIOS...................................................................... 52
6.8.1 OEM Default Settings and OEM BIOS Logo ........................... 52
6.8.2 OEM BIOS Code...................................................................... 52
6.8.3 congatec Battery Management Interface ................................ 53
6.8.4 API Support (CGOS) ................................................................ 53
6.9 Thermal/Voltage Monitoring.................................................... 53
6.10 Beeper ..................................................................................... 53
6.11 External System Wake Event ................................................... 54
6.12 Feature Connector................................................................... 54
7 conga-IC170 Mechanical Drawing........................................... 56
8 BIOS Setup Description........................................................... 57
8.1 Entering the BIOS Setup Program........................................... 57
8.1.1 Boot Selection Popup.............................................................. 57
8.2 Setup Menu and Navigation.................................................... 57
8.3 Main Setup Screen................................................................... 58
8.3.1 Platform Information Submenu................................................ 59
8.4 Advanced Setup ...................................................................... 60
8.4.1 Graphics Submenu................................................................... 61
8.4.2 Watchdog Submenu ................................................................ 64
8.4.3 Module Serial Ports Submenu ................................................. 66
8.4.4 Intel®Ethernet Connection (H) I219-LM Submenu .................. 67
8.4.4.1 NIC Configuration Submenu ................................................... 68
8.4.5 Driver Health Submenu............................................................ 68
8.4.6 Trusted Computing Submenu.................................................. 68
8.4.7 RTC Wake Settings Submenu .................................................. 68
8.4.8 ACPI Submenu......................................................................... 69
8.4.9 Intel®ICC Submenu ................................................................. 70
8.4.10 OverClocking Performance Submenu ..................................... 70
8.4.11 PCH-FW Configuration Submenu............................................ 70
8.4.12 SMART Settings Submenu....................................................... 71
8.4.13 Super IO Submenu .................................................................. 71
8.4.14 Serial Port Console Redirection Submenu............................... 72
8.4.14.1 Console Redirection Settings Submenu .................................. 72
8.4.15 CPU Submenu.......................................................................... 74
8.4.15.1 CPU Information ...................................................................... 77
8.4.16 Platform Misc Configuration Submenu.................................... 78
8.4.17 SATA Submenu ........................................................................ 79
8.4.17.1 Software Feature Mask Configuration ..................................... 80
8.4.18 Thermal Configuration Submenu............................................. 81
8.4.19 Acoustic Management Submenu............................................. 82
8.4.20 PCI & PCI Express Submenu.................................................... 82
8.4.20.1 PCI Hot Plug Settings Submenu .............................................. 83
8.4.21 UEFI Network Stack Submenu................................................. 84
8.4.22 CSM & Option ROM Control Submenu................................... 85
8.4.23 NVMe Configuration Submenu ............................................... 85
8.4.24 SDIO Configuration Submenu ................................................. 86
8.4.25 Diagnostics Settings Submenu ................................................ 86
8.4.26 USB Submenu.......................................................................... 87
8.4.27 PC Speaker Submenu .............................................................. 88
8.5 Chipset Setup .......................................................................... 88
8.6 Security Setup.......................................................................... 88
8.6.1 Security Settings ...................................................................... 88
8.6.1.1 BIOS Security Features ............................................................ 89
8.6.1.2 Hard Disk Security Features..................................................... 90
8.7 Boot Setup............................................................................... 91
8.7.1 Boot Settings Configuration .................................................... 91
8.8 Save & Exit Menu..................................................................... 93
9 Additional BIOS Features ........................................................ 94
9.1 BIOS Versions........................................................................... 94
9.2 Updating the BIOS................................................................... 94
10 Industry Specifications ............................................................. 95

Copyright © 2016 congatec AG ICSLm13.indd 9/95
List of Tables
Table 1 conga-IC170 Variants............................................................... 11
Table 2 Cooling/IO Shield .................................................................... 11
Table 3 Memory Modules..................................................................... 11
Table 4 Cables...................................................................................... 12
Table 5 Adapters .................................................................................. 12
Table 6 Power Supply ........................................................................... 12
Table 7 2.5-inch SSDs........................................................................... 13
Table 8 Feature Summary..................................................................... 14
Table 9 Measurement Description........................................................ 16
Table 10 Power Consumption Values ..................................................... 17
Table 11 CMOS Battery Power Consumption ........................................ 17
Table 12 Connector X48 Pinout Description .......................................... 23
Table 13 Connector X49 Pinout Description .......................................... 24
Table 14 Connector X47 Pinout Description .......................................... 24
Table 15 Connector X46 Pinout Description .......................................... 25
Table 16 LED States................................................................................ 25
Table 17 PCIe x4 Slot (Connector X7) Pinout Description...................... 27
Table 18 mPCIe (Connector X8) Pinout Description............................... 28
Table 19 Connector X25 Pinout Description ......................................... 32
Table 20 Connector X20 Pinout Description .......................................... 33
Table 21 Connector X22 Pinout Description .......................................... 34
Table 22 Connector X23 Pinout Description .......................................... 35
Table 23 Connector X24 Pinout Description .......................................... 35
Table 24 Connector X21 Pinout Description .......................................... 35
Table 25 Connector X16 Pinout Description .......................................... 36
Table 26 Connector X15 Pinout Description .......................................... 37
Table 27 Connector X12 Pinout Description. ......................................... 39
Table 28 Connector X10 Pinout Description (Revision B.x and later)..... 39
Table 29 LED Description ....................................................................... 41
Table 30 MIC-IN (Connector X29) Pinout Description............................ 42
Table 31 Line-OUT (Connector X31) Pinout Description........................ 42
Table 32 Stereo Speaker (Connector X30) Pinout Description............... 43
Table 33 HDA/AC97 Front Panel (Connector X27) Pinout Description.. 44
Table 34 Surround (Connector X26) Pinout Description......................... 45
Table 35 Serial Ports (Connectors X34/X37) Pinout Description ............ 46
Table 36 CPU/SYS Fan Pinout ................................................................ 47
Table 37 Front Panel (Connector X39) Pinout Description..................... 48
Table 38 Connector X11 Pinout Description .......................................... 48
Table 39 Connector X60 Pinout Description .......................................... 49
Table 40 ISH (Connector X61) Pinout Description.................................. 50
Table 41 Case Open Intrusion (Connector X2) Pinout Description ........ 51
Table 42 Feature Connector X38 Pinout Description............................. 54

Copyright © 2016 congatec AG ICSLm13.indd 10/95
1 Introduction
1.1 Mini-ITX Concept
The Mini-ITX form factor provides enthusiasts and manufacturers with a standardized ultra compact platform for development. With a footprint
of 170 mm x170 mm, this scalable platform promotes the design of highly integrated, energy efficient systems. Due to its small size, the Mini-
ITX form factor enables PC appliance designers not only to design attractive low cost devices but also allows them to explore a huge variety of
product development options - from compact space-saving designs to fully functional Information Station and Value PC systems. This helps to
reduce product design cycle and encourages rapid innovation in system design, to meet the ever-changing needs of the market.
Additionally, the boards can also be passively cooled, presenting opportunities for fanless designs. The Mini-ITX boards are equipped with
various interfaces such as PCI Express, SATA, USB 2.0/3.0, Ethernet, Displays and Audio.
1.2 conga-IC170
The conga-IC170 is a Single Board Computer designed based on the Thin Mini-ITX specification. The conga-IC170 SBC features the 6th
Generation Intel Core U-Series processors. With 15W base TDP, the SBC offers Ultra Low Power boards with high computing performance and
outstanding graphics. Additionally, the SBC supports dual channel DDR4 up to 2133 MT/s for a maximum system memory capacity of 32 GB,
multiple I/O interfaces, up to three independent displays and various congatec embedded features.
With smaller board size and lower height keep-out zones, the conga-IC170 SBC provides manufacturers and system designers with the
opportunity to design compact systems for space restricted areas. With appropriate I/O shield, the same conga-IC170 SBC can be used in
either a Thin Mini-ITX or a Mini-ITX design.
The various features and capabilities offered by the conga-IC170 makes it ideal for the design of compact, energy efficient, performance-
oriented embedded systems.

Copyright © 2016 congatec AG ICSLm13.indd 11/95
1.2.1 Options Information
The conga-IC170 is currently available in four variants. This user’s guide describes all of these variants. The table below show the different
configurations available. Check for the part number that applies to your product. This will tell you what options described in this user’s guide
are available on your particular module
Table 1 conga-IC170 Variants
Part-No. 052700 052701 052702 052703
Processor Intel®Core™ i5-6300U 2.4 GHz
Dual Core™
Intel®Core™ i3-6100U 2.3 GHz
Dual Core™
Intel®Celeron™ 3955U 2.0 GHz
Dual Core™
Intel®Core™ i7-6600U 2.6 GHz
Dual Core™
Intel®Smart Cache 3 MByte 3 MByte 2 MByte 4 MByte
Max. Turbo Frequency 3.0 GHz N.A N.A 3.4 GHz
Processor Graphics Intel®HD Graphics 520 (GT2) Intel®HD Graphics 520 (GT2) Intel®HD graphics 510 (GT1) Intel®HD Graphics 520 (GT2)
Graphics Max. Dynamic Freq 1.0 GHz 1.0 GHz 900 MHz 1.0 GHz
Memory (DDR4) 2133 MT/s dual channel 2133 MT/s dual channel 2133 MT/s dual channel 2133 MT/s dual channel
LVDS Yes Yes Yes Yes
DisplayPort (DP) Yes Yes Yes Yes
HDMI Via DP to HDMI cable adapter Via DP to HDMI cable adapter Via DP to HDMI cable adapter Via DP to HDMI cable adapter
Processor TDP (cTDP down) 15 (7.5) W 15 (7.5) W 15 (10) W 15 (7.5) W
1.2.2 Optional Accessories
Table 2 Cooling/IO Shield
Accessories Part No. Description
conga-IC97/CSA 052252 12V active cooling solution with Thin Mini-ITX height (compatible with conga-IC170)
conga-IC97/Retention Frame 052254 Retention frame for conga-IC97/CSA (compatible with conga-IC170)
conga-IC97/CSP 052260 Passive cooling solution with Thin Mini-ITX height (compatible with conga-IC170)
conga-IC170 IO Shield - Standard Size 052751 IO shield for conga-IC170 Mini-ITX height
conga-IC170 IO Shield - Thin Size 052752 IO shield for conga-IC170 with Thin Mini-ITX height
Table 3 Memory Modules
Memory Modules Part No. Description
DDR4-SODIMM-2400 (4GB) 068790 Certified 4 GB DDR4 SODIMM memory module with 2400 MT/s
DDR4-SODIMM-2400 (8GB) 068791 Certified 8 GB DDR4 SODIMM memory module with 2400 MT/s
DDR4-SODIMM-2400 (16GB) 068792 Certified 16 GB DDR4 SODIMM memory module with 2400 MT/s

Copyright © 2016 congatec AG ICSLm13.indd 12/95
Table 4 Cables
Cables Part No. Description
cab-ThinMini-ITX-SATA-Power 14000120 Power cable for SATA and micro-SATA devices.
cab-ThinMini-ITX-UART 14000121 UART cable with 2x5-pin female housing and D-Sub male connector.
cab-ThinMini-ITX-USB2.0-Single 14000122 USB 2.0 cable with 1x5-pin female housing and USB 2.0 Type A female connector.
cab-ThinMini-ITX-USB2.0-Twin 14000123 USB 2.0 cable with twin USB 2.0 Type A female connector and 2x5-pin housing.
cab-ThinMini-ITX-LVDS-Open End 14000125 ACES 40 pin-LVDS cable with open end.
cab-ThinMini-ITX-BKLT 14000127 CHYAO SHIUNN 8-pin backlight cable with open end.
cab-DP to HDMI Passive 14000128 DisplayPort to HDMI connector
cab-ThinMini-ITX-LVDS 14000129 ACES 50204-40 LVDS cable for Thin Mini-ITX.
cab-ThinMini-ITX-SATA-Power (50cm lenght) 14000135 50cm SATA power cable with 2x15-pin female connectors.
cab-ThinMini-ITX-SATA-Power (30cm length) 14000136 30cm SATA power cable with 2x15-pin female connectors.
SATA III cable (straight/straight) 48000029 30cm SATA III data cable with straight connectors at both ends
SATA III cable (straight/right-angled) 48000030 30cm SATA III data cable with straight/right-angled connectors
Table 5 Adapters
Adapters Part No. Description
conga-Thin MITX/eDP to DP adapter 052231 eDP to standard DP evaluation adapter
conga-Thin MITX/eDP to HDMI adapter 052232 eDP to standard HDMI evalutiona adapter
conga-Thin MITX/LVDS Adapter 052233 LVDS pin header evaluation adapter for congatec Thin Mini-ITX boards
conga-Thin MITX/Debug Card 047858 Evaluation debug card with post code display, buttons, status LED's and other useful IO's
conga-DP2VGA 011132 DP/eDP to VGA adapter
Table 6 Power Supply
PSUs Part No. Description
NB Power Supply (65W, [email protected]) 10000145 FSP065-REBN2, Plug 7.4x5.1x12.5mm
NB Power Supply (90W, [email protected]) 10000146 FSP090-DIEBN2, Plug 7.4x5.1x12.5mm

Copyright © 2016 congatec AG ICSLm13.indd 13/95
Table 7 2.5-inch SSDs
2.5-inch SSDs Part No. Description
2.5" SSD, 120 GB SATA III – Intel®SSD Pro 5400s series 10000201 SATA III (6 Gbps), 16 nm, TLC, 0°C to 70°C
2.5" SSD, 180 GB SATA III – Intel®SSD Pro 5400s series 10000202 SATA III (6 Gbps), 16 nm, TLC, 0°C to 70°C
2.5" SSD, 240 GB SATA III – Intel®SSD Pro 5400s series 10000203 SATA III (6 Gbps), 16 nm, TLC, 0°C to 70°C
2.5" SSD, 360 GB SATA III – Intel®SSD Pro 5400s series 10000204 SATA III (6 Gbps), 16 nm, TLC, 0°C to 70°C
2.5" SSD, 128 GB SATA III – Innodisk 3ME3 series 10000205 SATA III (6 Gbps), 15 nm, MLC, 0°C to 70°C
2.5" SSD, 256 GB SATA III – Innodisk 3ME3 series 10000206 SATA III (6 Gbps), 15 nm, MLC, 0°C to 70°C

Copyright © 2016 congatec AG ICSLm13.indd 14/95
2 Specification
2.1 Feature List
Table 8 Feature Summary
Form Factor Based on Thin Mini-ITX form factor (170 x 170 mm).
Processor 6th Generation Intel®Core™ i7,i5, i3 and Celeron Single Chip Ultra Low TDP Processors.
Memory Two memory sockets (located on the top side). Supports
-SO-DIMM non-ECC DDR4 modules
-Data rates up to 2133 MT/s
-Maximum 32 GB capacity (16 GB each)
cBC Multi-stage watchdog, non-volatile user data storage, manufacturing and board information, board statistics, hardware monitoring, fan control, I2C bus,
Power loss control.
Chipset Intel®100 Series PCH-LP integrated in the Multi-Chip Package.
Audio Realtek ALC888S-VD 7.1 channel High Definition Audio codec
Ethernet 2x Gigabit Ethernet support via the onboard Intel®l219LM GbE PHY (with AMT 11 support) and Intel®I211 GbE controller.
Graphic Interfaces Next Generation Intel® HD (510/520). Supports:
-API (DirectX 12, OpenGL 4.4, OpenCL 2.1)
-Intel®QuickSync & Clear Video Technology HD (hardware accelerated video decode/encode/processing/transcode)
-Hybrid graphics
-Up to 3 independent displays (must be two DDI’s (DP, HDMI/DVI) and one eDP/LVDS)
2x DP++
1x LVDS/eDP
Back Panel I/O
Connectors
2x DisplayPort++ (DP, HDMI,DVI)
1x Mic IN
1x Line OUT
2x Gigabit Ethernet (only connector X5 supports AMT)
4x USB 3.0 (supports also USB 2.0 devices)
1x DC-IN
Onboard I/O
Connectors
4x USB 2.0
SATA Interfaces:
-2x Standard SATA 3.0
-1x M.2 SATA SSD slot
-1x SATA power header connector (3.3V, 5V or 12V)
PCI Express Interfaces:
-1x PCIe x4 slot (gen. 3)
-1x M.2 slot (type 3042/2242, key B)
-1x Full/half size mini PCIe (x1 lane)
1x LVDS (top side)
1x Backlight
1x Monitor OFF
1x eDP interface (bottom side)
1x Micro-SIM card slot
1x Micro-SD card slot (bottom side)
1x Integrated Sensor Hub (ISH) header
1x Internal power connector (12-24V)
1x Surround
1x Front Panel HD Audio
1x SPDIF out or Digital MIC
1x Stereo speaker
Super IO
-2x COM ports (COM 2 can be used optionally as ccTALK)
-1x CPU fan with selectable voltage
-1x System fan with selectable voltage
-GPOs on feature connector
Feature Connector (GPIOs, SPI, SMB, LPC, LID/SLEEP etc)
1x Front panel header (power button, reset, LEDs)
1x Intrusion detection header (case open)

Copyright © 2016 congatec AG ICSLm13.indd 15/95
Optional Onboard
Interfaces
1x SBM3support header
1x SBM3power
1x CEC header
1x ccTalk
Other Features Thermal and voltage monitoring
CMOS Battery
Beeper
congatec standard BIOS (to boot from an external BIOS, trigger the BIOS_DISABLE# signal on the feature connector)
BIOS AMI Aptio®UEFI 5.x firmware, 8/16 MByte serial SPI with congatec Embedded BIOS features.
Power
Management
ACPI 4.0 compliant with battery support. Also supports Suspend to RAM (S3) and Intel AMT 9.5/10.
Configurable TDP
Ultra low standby power consumption, deep sleep.
Security Optional discrete TPM 2.0; new AES Instructions for faster and better encryption.
Note
Some of the features mentioned in the above feature summary are optional. Check the article number of your SBC and compare it to the
option information list on page 11 to determine what options are available on your particular SBC.
2.2 Supported Operating Systems
The conga-IC170 supports the following operating systems.
•Microsoft®Windows® 10
•Microsoft®Windows® 8.1
•Microsoft®Windows®7
•Microsoft®Windows®Embedded Standard 7/8
•Linux 3.x/4.x
Note
For Windows installation, we recommend a minimum storage capacity of 20 GB. congatec will not offer installation support for systems with
less than 20 GB storage space.
2.3 Mechanical Dimensions
•170 mm x 170 mm
•Height approximately 20 mm

Copyright © 2016 congatec AG ICSLm13.indd 16/95
2.4 Supply Voltage Power
•12-24V DC ± 5%
2.5 Power Consumption
The power consumption values were measured using the following test setup:
•Input voltage +12V
•conga-IC170 SBC
•conga-IC170 cooling solution
•Microsoft Windows 7 (64 bit)
Note
The CPU was stressed to its maximum workload with the Intel®Thermal Analysis Tool.
The power consumption values were recorded during the following system states:
Table 9 Measurement Description
System State Description Comment
S0: Minimum value Lowest frequency mode (LFM) with minimum core voltage during
desktop idle.
S0: Maximum value Highest frequency mode (HFM/Turbo Boost). The CPU was stressed to its maximum frequency.
S0: Peak current Highest current spike during the measurement of “S0: Maximum
value”. This state shows the peak value during runtime
Consider this value when designing the system’s power supply, to
ensure sufficient power is supplied during worst case scenarios.
S3 SBC is powered by 12V.
S5 SBC is powered by 12V.
Note
1. The fan and SATA drives were powered externally.
2. All other peripherals except the LCD monitor were disconnected before measurement.

Copyright © 2016 congatec AG ICSLm13.indd 17/95
Table 10 Power Consumption Values
The tables below provide additional information about the power consumption data for each of the conga-IC170 variants offered. The values
are recorded at various operating mode.
Part
No.
Memory
Size
H.W
Rev.
BIOS
Rev.
OS (64 bit) CPU Current (Amp.)
Variant Cores Freq. /Max. Turbo S0: Min S0: Max S0: Peak S3 S5
052700 2x4 GB A.0 R610 Windows 7 Intel®Core™ i5-6300U 2 2.6 /3.0 GHz 0.45 2.57 3.26 0.11 0.09
052701 2x4 GB A.0 R610 Windows 7 Intel®Core™ i3-6100U 2 2.3 GHz/N.A 0.47 2.44 2.96 0.10 0.09
052702 2x4 GB A.0 R610 Windows 7 Intel®Celeron®3955U 2 2.0 Ghz /N.A 0.49 1.44 1.44 0.11 0.09
052703 2x4 GB A.0 R610 Windows 7 Intel®Core™ i7-6600U 2 2.6 /3.4 GHz 0.48 2.39 3.29 0.12 0.10
Note
With a fast input voltage rise time, the inrush current may exceed the measured peak current.
2.5.1 Supply Voltage Battery Power
Table 11 CMOS Battery Power Consumption
RTC @ Voltage Current
-10oC 3V DC 1.51μA
20oC 3V DC 1.66 μA
70oC 3V DC 2.29 μA
Note
1. Do not use the CMOS battery power consumption values listed above to calculate CMOS battery lifetime.
2. Measure the CMOS battery power consumption in your customer specific application in worst case conditions (for example, during high
temperature and high battery voltage).
3. Consider also the self-discharge of the battery when calculating the lifetime of the CMOS battery. For more information, refer to application
note AN9_RTC_Battery_Lifetime.pdf on congatec AG website at www.congatec.com/support/application-notes.

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2.6 Environmental Specifications
Temperature Operation: 0° to 60°C Storage: -20° to +70°C
Humidity Operation: 10% to 90% Storage: 5% to 95%
Note
The above operating temperatures must be strictly adhered to at all times. Humidity specifications are for non-condensing conditions.

Copyright © 2016 congatec AG ICSLm13.indd 19/95
3 Block Diagram
*
1 )
Optional feature (available with a customized variant)
*
2 )
Connected either to a standard SATA connector or to an
M.2 slot.
*
3 )
Supports GPIOs, SPI, SMBus, LPC, UART, I2C, Sleep,
LID, Watchdog
2x SO-DIMM DDR4
LPC
HDA
Speaker
Audio
ALC888S
Super IO
Feature *
3
FAN 1
2x Dual USB 2.0
Front Panel
HD Audio
FAN 2
COM 1
COM 2
ccTALK *
1
congatec
Board Controller
TPM
(optional)
External I/O
Power IN
Internal I/O
microSD card
Flash
SATA 0
SATA 1
SATA 2 *
1
*
2
DP++
DP++
PCIe x4
M.2 Slot
(WWAN or SSD)
PCIe Mini Card
(Full / Half Lenght)
PCIe 1 - PCIe 4
PCIe 9
USB 2.0
PCIe 11
PCIe 12 / SATA 2
*
2
USB 2.0
PCIe 6
PCIe 5
i219
i211-AT
eDP to LVDS
Ethernet
Ethernet
Line OUT
Mic IN
Buzzer
Internal speaker
Surround
S/PDIF or DMIC
USB2.0/USB3.0
SPI
optional
eDP
LVDS
eDP
2x24 bit
LVDS
4x USB3.0
Front Panel
Sensor Hub
micro-SIM card
SATA Power
Power IN SBM
3
Batery
Mgmt *
1
Backlight
Intel®ULT SOC (CPU + PCH)
Integrated Intel HD Graphics
Vector Graphics3D
Turbo Boost 2.0 Technology
HT Technology
TXT AES-NI TSX VTSSE4.2 AVX2
64 Architecture
2D DXVA
MPEG-2
Video Codecs APIs
Hardware Graphics Accelerators
DisplayPort 1.2 HDMI 2.0 (3D, 4k)
Digital Display Interfaces
7th Generation Intel®Core™Processor
WMV9
H.265
OpenCL 2.0
DirectX 12
OpenGL 5.0
Intel®100 Series PCH-LP
High Definition Audio
ASRC
SATA USB 2.0
LPC BusPCIe
I/O Interfaces
GPIOs
USB 3.0
AMT 11
Low Power Interconnect

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4 Cooling Solution
The conga-IC170 SBC offers Ultra Low Power boards with high computing performance and outstanding graphics. Due to its low power
consumption, the SBC generates less heat and therefore requires less active cooling, allowing the use of quieter, lower profile coolers that are
better suited to small form factor systems.
Nonetheless, all electronics contain semiconductor devices which have operating temperature ranges that should be adhered to. For this reason,
it is imperative to provide sufficient air flow to each of the components, to ensure the specified operating temperature of the conga-IC170 is
maintained.
congatec AG offers two cooling possibilities for the conga-IC170:
•A customized active cooling solution (fan attached with heatsink) in combination with the conga-IC170 retention frame. This cooling solution
is adapted to the Thin Mini-ITX height specification and features a Hi-Flow 225UT pressure sensitive, phase change thermal interface. The
retention frame acts as a mounting backplate and also as board reinforcement to prevent PCB deformation. Refer to section 4.2 “Active
Cooling Dimensions” for the dimensions of the active cooling solution.
•The use of a custom cooling solution in combination with the conga-IC170 retention frame.
Note
When a passive cooling is used, the end user must ensure that adequate air flow is maintained.
See section 1.2.2 “Optional Accessories/Cables” for the part numbers of the cooling accessories.
Retention Frame Active Cooling Solution