Congatec conga-TS170 User manual

COM Express™ conga-TS170
6th Generation Intel® Core™ i7, i5, i3 Celeron/Xeon processor with either QM170, HM170, or CM236 Chipset
User’s Guide
Revision 1.1

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Revision History
Revision Date (yyyy.mm.dd) Author Changes
0.1 2016.03.22 AEM •Preliminary release
0.2 2016.07.14 BEU •Updated available product variants in section 1 “Introduction” and section 2 “Specifications”
•Added section 10 “System Resources”
•Added section 11 “BIOS Setup Description”
•Added section 12 “Additional BIOS Features”
1.0 2017.01.10 AEM •Updated section 2.1 “Feature List”
•Updated section 2.5 “Power Consumption”
•Updated the note in section 2.6.1 “CMOS Battery Power Consumption”
•Updated the caution note in section 4.3 “Heatspreader”
•Corrected the description of pins D63 and D64 in table 31 “Connector C-D Pinout”
•Corrected typographical error in section 6.1.7 “PCIe Express”
•Updated section 6.1.10 “LVDS/eDP”
•Deleted all references of SDIO/SD card because the chipset does not support SD card
1.1 2018.05.07 AEM •Added VGA to table 2 “conga-TS170 Variants”
•Updated section 3 “Block Diagram”
•Updated table 5 “Power Consumption Values”
•Corrected the maximum HDMI resolution value in table 7 “Maximum Supported Resolutions”
•Indicated in table 15 “LPC Signal Description” and 26 “Connector A-B Pinout “ that the LPC_DRQ signal is not supported
•Deleted the note in section 11.4.15 “Serial Port Console Redirection Submenu”
•Corrected the pin numbers of USB ports 0 and 1 in table 16 “USB SignalDescriptions”
•Updated section 11 “BIOS Setup Description” and section 12 “Additional BIOS Features”

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Preface
This user’s guide provides information about the components, features, connectors and BIOS Setup menus available on the conga-TS170. It is
one of three documents that should be referred to when designing a COM Express™ application. The other reference documents that should
be used include the following:
COM Express™Design Guide
COM Express™Specification
The links to these documents can be found on the congatec AG website at www.congatec.com
Disclaimer
The information contained within this user’s guide, including but not limited to any product specification, is subject to change without notice.
congatec AG provides no warranty with regard to this user’s guide or any other information contained herein and hereby expressly disclaims
any implied warranties of merchantability or fitness for any particular purpose with regard to any of the foregoing. congatec AG assumes
no liability for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for
discrepancies between the product and the user’s guide. In no event shall congatec AG be liable for any incidental, consequential, special, or
exemplary damages, whether based on tort, contract or otherwise, arising out of or in connection with this user’s guide or any other information
contained herein or the use thereof.
Intended Audience
This user’s guide is intended for technically qualified personnel. It is not intended for general audiences.
Lead-Free Designs (RoHS)
All congatec AG designs are created from lead-free components and are completely RoHS compliant.

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Electrostatic Sensitive Device
All congatec AG products are electrostatic sensitive devices. They are enclosed in static shielding bags, and shipped enclosed in secondary
packaging (protective packaging). The secondary packaging does not provide electrostatic protection.
Do not remove the device from the static shielding bag or handle it, except at an electrostatic-free workstation. Also, do not ship or store
electronic devices near strong electrostatic, electromagnetic, magnetic, or radioactive fields unless the device is contained within its original
packaging. Be aware that failure to comply with these guidelines will void the congatec AG Limited Warranty.
Symbols
The following symbols are used in this user’s guide:
Warning
Warnings indicate conditions that, if not observed, can cause personal injury.
Caution
Cautions warn the user about how to prevent damage to hardware or loss of data.
Note
Notes call attention to important information that should be observed.
Trademarks
Product names, logos, brands, and other trademarks featured or referred to within this user’s guide, or the congatec website, are the property
of their respective trademark holders. These trademark holders are not affiliated with congatec AG, our products, or our website.

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Copyright Notice
Copyright © 2016, congatec AG. All rights reserved. All text, pictures and graphics are protected by copyrights. No copying is permitted
without written permission from congatec AG.
congatec AG has made every attempt to ensure that the information in this document is accurate yet the information contained within is
supplied “as-is”.
Warranty
congatec AG makes no representation, warranty or guaranty, express or implied regarding the products except its standard form of limited
warranty (“Limited Warranty”) per the terms and conditions of the congatec entity, which the product is delivered from. These terms and
conditions can be downloaded from www.congatec.com. congatec AG may in its sole discretion modify its Limited Warranty at any time and
from time to time.
The products may include software. Use of the software is subject to the terms and conditions set out in the respective owner’s license
agreements, which are available at www.congatec.com and/or upon request.
Beginning on the date of shipment to its direct customer and continuing for the published warranty period, congatec AG represents that the
products are new and warrants that each product failing to function properly under normal use, due to a defect in materials or workmanship or
due to non conformance to the agreed upon specifications, will be repaired or exchanged, at congatec’s option and expense.
Customer will obtain a Return Material Authorization (“RMA”) number from congatec AG prior to returning the non conforming product freight
prepaid. congatec AG will pay for transporting the repaired or exchanged product to the customer.
Repaired, replaced or exchanged product will be warranted for the repair warranty period in effect as of the date the repaired, exchanged
or replaced product is shipped by congatec, or the remainder of the original warranty, whichever is longer. This Limited Warranty extends to
congatec’s direct customer only and is not assignable or transferable.
Except as set forth in writing in the Limited Warranty, congatec makes no performance representations, warranties, or guarantees, either
express or implied, oral or written, with respect to the products, including without limitation any implied warranty (a) of merchantability, (b) of
fitness for a particular purpose, or (c) arising from course of performance, course of dealing, or usage of trade.
congatec AG shall in no event be liable to the end user for collateral or consequential damages of any kind. congatec shall not otherwise be
liable for loss, damage or expense directly or indirectly arising from the use of the product or from any other cause. The sole and exclusive
remedy against congatec, whether a claim sound in contract, warranty, tort or any other legal theory, shall be repair or replacement of the
product only.

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Certification
congatec AG is certified to DIN EN ISO 9001 standard.
Technical Support
congatec AG technicians and engineers are committed to providing the best possible technical support for our customers so that our products
can be easily used and implemented. We request that you first visit our website at www.congatec.com for the latest documentation, utilities
and drivers, which have been made available to assist you. If you still require assistance after visiting our website then contact our technical
support department by email at [email protected]
Terminology
Term Description
GB Gigabyte
GHz Gigahertz
kB Kilobyte
MB Megabyte
Mbit Megabit
kHz Kilohertz
MHz Megahertz
TDP Thermal Design Power
PCIe PCI Express
SATA Serial ATA
PEG PCI Express Graphics
PCH Platform Controller Hub
eDP Embedded DisplayPort
HDA High Definition Audio
N.C. Not connected
N.A. Not available
TBD To be determined
C
E
R
T
I
F
I
C
A
T
I
O
N
I
S
O
9
0
0
1
TM

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Contents
1 Introduction ............................................................................. 11
2 Specifications........................................................................... 14
2.1 Feature List .............................................................................. 14
2.2 Supported Operating Systems ................................................ 15
2.3 Mechanical Dimensions ........................................................... 15
2.4 Supply Voltage Standard Power .............................................. 16
2.4.1 Electrical Characteristics .......................................................... 16
2.4.2 Rise Time ................................................................................. 16
2.5 Power Consumption ................................................................ 17
2.6 Supply Voltage Battery Power ................................................. 18
2.7 Environmental Specifications................................................... 19
3 Block Diagram.......................................................................... 20
4 Cooling Solutions..................................................................... 21
4.1 CSA Dimensions ...................................................................... 21
4.2 CSP Dimensions....................................................................... 22
4.3 Heatspreader ........................................................................... 23
4.4 Heatspreader Thermal Imagery ............................................... 25
5 Onboard Temperature Sensors................................................ 26
6 Connector Rows....................................................................... 28
6.1 Primary Connector Rows A and B............................................ 28
6.1.1 Serial ATA™ (SATA).................................................................. 28
6.1.2 USB 2.0 .................................................................................... 28
6.1.3 High Definition Audio (HDA) Interface .................................... 28
6.1.4 Gigabit Ethernet ..................................................................... 29
6.1.5 LPC Bus.................................................................................... 29
6.1.6 I²C Bus Fast Mode ................................................................... 29
6.1.7 PCI Express™........................................................................... 29
6.1.8 ExpressCard™ ......................................................................... 30
6.1.9 VGA.......................................................................................... 30
6.1.10 LVDS/eDP................................................................................. 30
6.1.11 General Purpose Serial Interface ............................................. 31
6.1.12 GPIOs....................................................................................... 31
6.1.13 Power Control .......................................................................... 31
6.1.14 Power Management................................................................. 35
6.2 Secondary Connector Rows C and D....................................... 36
6.2.1 PCI Express™........................................................................... 36
6.2.2 PCI Express Graphics (PEG) ..................................................... 36
6.2.3 Digital Display Interface........................................................... 37
6.2.3.1 HDMI........................................................................................ 38
6.2.3.2 DVI ........................................................................................... 38
6.2.3.3 DisplayPort (DP) ....................................................................... 38
6.2.4 USB 3.0 .................................................................................... 39
7 Additional Features.................................................................. 40
7.1 congatec Board Controller (cBC) ............................................. 40
7.2 Board Information.................................................................... 40
7.3 Watchdog ................................................................................ 40
7.4 I2C Bus...................................................................................... 40
7.5 Power Loss Control.................................................................. 40
7.6 OEM BIOS Customization........................................................ 41
7.6.1 OEM Default Settings .............................................................. 41
7.6.2 OEM Boot Logo....................................................................... 41
7.6.3 OEM POST Logo ..................................................................... 41
7.6.4 OEM BIOS Code/Data............................................................. 41
7.6.5 OEM DXE Driver...................................................................... 42
7.7 congatec Battery Management Interface ................................ 42
7.8 API Support (CGOS) ................................................................ 42
7.9 Security Features...................................................................... 43
7.10 Suspend to Ram....................................................................... 43
8 conga Tech Notes .................................................................... 44
8.1 Intel®PCH Features ................................................................. 44
8.1.1 Intel®Rapid Storage Technology ............................................ 44
8.1.1.1 AHCI ........................................................................................ 44
8.1.1.2 RAID......................................................................................... 44

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8.1.1.3 Intel®Smart Response Technology ......................................... 44
8.2 Intel®Processor Features ......................................................... 45
8.2.1 Intel®Turbo Boost Technology ................................................ 45
8.2.2 Adaptive Thermal Monitor and Catastrophic Thermal Protection
45
8.2.3 Processor Performance Control ............................................... 46
8.2.4 Intel®64 Architecture............................................................... 47
8.2.5 Intel®Virtualization Technology ............................................... 47
8.2.6 Thermal Management ............................................................. 48
8.3 ACPI Suspend Modes and Resume Events.............................. 49
8.4 DDR4 Memory ......................................................................... 49
9 Signal Descriptions and Pinout Tables..................................... 50
9.1 A-B Connector Signal Descriptions ......................................... 51
9.2 A-B Connector Pinout.............................................................. 60
9.3 C-D Connector Signal Descriptions......................................... 62
9.4 C-D Connector Pinout ............................................................. 71
9.5 Boot Strap Signals ................................................................... 73
10 System Resources .................................................................... 74
10.1 I/O Address Assignment.......................................................... 74
10.1.1 LPC Bus.................................................................................... 74
10.2 PCI Configuration Space Map ................................................. 75
10.3 I2C............................................................................................ 76
10.4 SM Bus..................................................................................... 76
11 BIOS Setup Description........................................................... 77
11.1 Entering the BIOS Setup Program........................................... 77
11.1.1 Boot Selection Popup.............................................................. 77
11.2 Setup Menu and Navigation.................................................... 77
11.3 Main Setup Screen................................................................... 78
11.3.1 Platform Information Submenu................................................ 79
11.4 Advanced Setup ...................................................................... 80
11.4.1 Graphics Submenu................................................................... 81
11.4.1.1 Display Interface Signal Integrity Settings Submenu............... 85
11.4.2 Watchdog Submenu ................................................................ 86
11.4.3 Module Serial Ports Submenu ................................................. 88
11.4.4 Hardware Health Monitoring Submenu ................................... 89
11.4.5 Intel®Ethernet Connection (H) I219-LM Submenu .................. 90
11.4.5.1 NIC Configuration Submenu ................................................... 90
11.4.6 Driver Health Submenu............................................................ 90
11.4.7 Trusted Computing Submenu.................................................. 91
11.4.8 RTC Wake Settings Submenu .................................................. 91
11.4.9 ACPI Submenu......................................................................... 91
11.4.10 Intel®ICC Submenu ................................................................. 92
11.4.11 AMT Configuration Submenu.................................................. 93
11.4.12 PCH-FW Configuration Submenu............................................ 94
11.4.13 SMART Settings Submenu....................................................... 94
11.4.14 Super IO Submenu .................................................................. 95
11.4.15 Serial Port Console Redirection Submenu............................... 95
11.4.15.1 Console Redirection Settings Submenu .................................. 96
11.4.16 CPU Submenu.......................................................................... 97
11.4.17 Secure Erase Submenu .......................................................... 101
11.4.18 SATA Submenu ...................................................................... 101
11.4.18.1 Software Feature Mask Configuration ................................... 103
11.4.19 Acoustic Management Submenu........................................... 104
11.4.20 PCI Express Configuration Submenu..................................... 104
11.4.20.1 BIOS Hot Plug Settings Submenu ......................................... 105
11.4.21 PCI Express Configuration Submenu..................................... 106
11.4.21.1 PCI Express Gen3 Eq Lanes Submenu................................... 107
11.4.21.2 PCI Express Settings Submenu.............................................. 107
11.4.21.3 PCI Express GEN2 Settings Submenu ................................... 108
11.4.21.4 PCI Express Port 0 - 7 Submenu ............................................ 109
11.4.21.5 PCI Express Graphics (PEG) Port Submenu ........................... 111
11.4.22 UEFI Network Stack Submenu............................................... 113
11.4.23 CSM & Option ROM Control Submenu................................. 114
11.4.24 NVMe Configuration Submenu ............................................. 115
11.4.25 SDIO Configuration Submenu ............................................... 115
11.4.26 USB Submenu........................................................................ 115
11.4.27 Diagnostics Settings Submenu .............................................. 116
11.4.28 PC Speaker Submenu ............................................................ 117
11.5 Chipset Setup ........................................................................ 118
11.5.1 Processor (Integrated Components) Submenu...................... 118
11.5.1.1 DMI/OPI Configuration Submenu.......................................... 119
11.5.1.2 Memory Configuration Submenu .......................................... 120
11.5.2 Platform Controller Hub (PCH) Submenu .............................. 122
11.5.3 Platform Thermal Configuration Submenu............................ 123
11.6 Security Setup........................................................................ 124

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11.6.1 Security Settings .................................................................... 124
11.6.1.1 BIOS Security Features .......................................................... 124
11.6.1.2 Hard Disk Security Features................................................... 127
11.7 Boot Setup............................................................................. 128
11.7.1 Boot Settings Configuration .................................................. 128
11.8 Save & Exit Menu................................................................... 130
12 Additional BIOS Features ...................................................... 131
12.1 Supported Flash Devices ....................................................... 131
12.2 Updating the BIOS................................................................. 131
13 Industry Specifications ........................................................... 132

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List of Tables
Table 1 COM Express™ 2.1 Pinout Types ............................................ 11
Table 2 conga-TS170 Variants .............................................................. 12
Table 3 Feature Summary..................................................................... 14
Table 4 Measurement Description........................................................ 17
Table 5 Power Consumption Values ..................................................... 18
Table 6 CMOS Battery Power Consumption ........................................ 18
Table 7 Maximum Supported Resolutions............................................ 37
Table 8 Wake Events............................................................................. 49
Table 9 Signal Tables Terminology Descriptions .................................. 50
Table 10 Intel®High Definition Audio Link Signals Descriptions............ 51
Table 11 Gigabit Ethernet Signal Descriptions....................................... 51
Table 12 Serial ATA Signal Descriptions ................................................. 52
Table 13 PCI Express Signal Descriptions (general purpose) ................. 53
Table 14 ExpressCard Support Pins Signal Descriptions........................ 53
Table 15 LPC Signal Descriptions........................................................... 54
Table 16 USB Signal Descriptions........................................................... 54
Table 17 CRT Signal Descriptions........................................................... 55
Table 18 LVDS Signal Descriptions......................................................... 55
Table 19 Embedded DisplayPort Signal Descriptions............................ 56
Table 20 SPI BIOS Flash Interface Signal Descriptions........................... 56
Table 21 Miscellaneous Signal Descriptions........................................... 57
Table 22 General Purpose I/O Signal Descriptions ................................ 57
Table 23 Power and System Management Signal Descriptions ............. 58
Table 24 General Purpose Serial Interface Signal Descriptions.............. 59
Table 25 Power and GND Signal Descriptions....................................... 59
Table 26 Connector A-B Pinout.............................................................. 60
Table 27 PCI Express Signal Descriptions (general purpose) ................. 62
Table 28 USB 3.0 Signal Descriptions..................................................... 62
Table 29 PCI Express Signal Descriptions (x16 Graphics)....................... 63
Table 30 DDI Signal Description............................................................. 65
Table 31 HDMI Signal Descriptions........................................................ 67
Table 32 DisplayPort (DP) Signal Descriptions ....................................... 68
Table 33 Module Type Definition Signal Description ............................. 70
Table 34 Power and GND Signal Descriptions....................................... 70
Table 35 Connector C-D Pinout ............................................................. 71
Table 36 Boot Strap Signal Descriptions ................................................ 73
Table 37 PCI Configuration Space Map ................................................. 75

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1 Introduction
COM Express™ Concept
COM Express™ is an open industry standard defined specifically for COMs (computer on modules). Its creation makes it possible to smoothly
transition from legacy interfaces to the newest technologies available today. COM Express™ modules are available in following form factors:
•Mini 84mm x 55mm
•Compact 95mm x 95mm
•Basic 125mm x 95mm
•Extended 155mm x110mm
Table 1 COM Express™ 2.1 Pinout Types
Types Connector Rows PCIe Lanes PCI IDE SATA Ports LAN ports USB 2.0/ USB 3.0 Display Interfaces
Type 1 A-B Up to 6 - 4 1 8 / 0 VGA, LVDS
Type 2 A-B C-D Up to 22 32 bit 1 4 1 8 / 0 VGA, LVDS, PEG/SDVO
Type 3 A-B C-D Up to 22 32 bit - 4 3 8 / 0 VGA,LVDS, PEG/SDVO
Type 4 A-B C-D Up to 32 1 4 1 8 / 0 VGA,LVDS, PEG/SDVO
Type 5 A-B C-D Up to 32 - 4 3 8 / 0 VGA,LVDS, PEG/SDVO
Type 6 A-B C-D Up to 24 - 4 1 8 / 4 1. VGA,LVDS/eDP, PEG, 3x DDI
Type 10 A-B Up to 4 - 2 1 8 / 0 LVDS/eDP, 1xDDI
1. The SuperSpeed USB ports (USB 3.0) are not in addition to the USB 2.0 ports. Up to 4 of the USB 2.0 ports can support SuperSpeed USB.
The conga-TS170 modules use the Type 6 pinout definition and comply with COM Express 2.1 specification. They are equipped with two high
performance connectors that ensure stable data throughput.
The COM (computer on module) integrates all the core components and is mounted onto an application specific carrier board. COM modules
are legacy-free design (no Super I/O, PS/2 keyboard and mouse) and provide most of the functional requirements for any application. These
functions include, but are not limited to a rich complement of contemporary high bandwidth serial interfaces such as PCI Express, Serial
ATA, USB 3.0, and Gigabit Ethernet. The Type 6 pinout provides the ability to offer PCI Express, Serial ATA, USB 3.0 and LPC options thereby
expanding the range of potential peripherals. The robust thermal and mechanical concept, combined with extended power-management
capabilities, is perfectly suited for all applications.
Carrier board designers can use as little or as many of the I/O interfaces as deemed necessary. The carrier board can therefore provide all
the interface connectors required to attach the system to the application specific peripherals. This versatility allows the designer to create a
dense and optimized package, which results in a more reliable product while simplifying system integration. Most importantly, COM Express™

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modules are scalable, which means once an application has been created there is the ability to diversify the product range through the use
of different performance class or form factor size modules. Simply unplug one module and replace it with another; no redesign is necessary.
conga-TS170 Options Information
The conga-TS170 is currently available in thirteen variants. The table below shows the different configurations available. Check for the part
number that applies to your product. This will tell you what options described in this user’s guide are available on your particular module.
Table 2 conga-TS170 Variants
Part-No. 045900 045901 045902 045903
Processor Intel®Core™ i7-6820EQ
2.8 GHz Quad Core™
Intel®Core™ i7-6822EQ
2.0 GHz Quad Core™
Intel®Core™ i5-6440EQ
2.7 GHz Quad core
Intel®Core™ i5-6442EQ
1.9 GHz Quad Core™
Max. Turbo Frequency 3.5 GHz 2.8 GHz 3.4 GHz 2.7 GHz
Chipset Intel® QM170 Intel® QM170 Intel® QM170 Intel® QM170
Intel®Smart Cache 8 MB 8 MB 6 MB 6 MB
Processor Graphics Intel®HD Graphics 530 (GT2) Intel®HD Graphics 530 (GT2) Intel®HD Graphics 530 (GT2) Intel®HD Graphics 530 (GT2)
GFX Base/Max. Dynamic Freq. 350 MHz / 1 GHz 350 MHz / 1 GHz 350 MHz / 1 GHz 350 MHz / 1 GHz
Memory (DDR4) 2133 MT/s dual channel 2133 MT/s dual channel 2133 MT/s dual channel 2133 MT/s dual channel
LVDS Yes Yes Yes Yes
DisplayPort (DP) Yes Yes Yes Yes
HDMI Yes Yes Yes Yes
VGA Yes Yes Yes Yes
Processor TDP (cTDP) 45 W (N.A) 25 W (N.A) 45 W (N.A) 25 W (N.A)
Part-No. 045904 045905 045906 (ECC) 045907 (ECC)
Processor Intel®Core™ i3-6100E
2.7 GHz Dual Core™
Intel®Core™ i3-6102E
1.9 GHz, Dual Core™
Intel®Xeon®E3-1505M v5
2.8 GHz Quad Core™
Intel®Xeon®E3-1505L v5
2.0 GHz Quad Core™
Max. Turbo Frequency N.A N.A 3.7 GHz 2.8 GHz
Chipset Intel® HM170 Intel® HM170 Intel® CM236 Intel® CM236
Intel®Smart Cache 3 MB 3 MB 8 MB 8 MB
Processor Graphics Intel®HD Graphics 530 (GT2) Intel®HD Graphics 530 (GT2) Intel®HD Graphics P530 (GT2) Intel®HD Graphics P530 (GT2)
GFX Base/Max. Dynamic Freq. 350 MHz / 950 MHz 350 MHz / 950 MHz 350 MHz / 1.05 GHz 350 MHz / 1 GHz
Memory (DDR4) 2133 MT/s dual channel 2133 MT/s dual channel 2133 MT/s dual channel ECC 2133 MT/s dual channel ECC
LVDS Yes Yes Yes Yes
DisplayPort (DP) Yes Yes Yes Yes
HDMI Yes Yes Yes Yes
VGA Yes Yes Yes Yes
Processor TDP (cTDP) 35 W (N.A) 25 W (N.A) 45 W (35W) 25 W (N.A)

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Part-No. 045908 (ECC) 045909 (ECC) 045910 045911
Processor Intel®Core™ i3-6100E
2.7 GHz Dual Core™
Intel®Core™ i3-6102E
1.9 GHz Dual Core™
Intel®Celeron®G3900E
2.4 GHz Dual Core™
Intel®Celeron®G3902E
1.6 GHz Dual Core™
Max. Turbo Frequency N.A N.A N.A N.A
Chipset Intel® CM236 Intel®CM236 Intel®HM170 Intel®HM170
Intel®Smart Cache 3 MB 3 MB 2 MB 2 MB
Processor Graphics Intel®HD Graphics 530 (GT2) Intel®HD Graphics 530 (GT2) Intel®HD Graphics 510 (GT1) Intel®HD Graphics 510 (GT1)
GFX Base/Max. Dynamic Freq. 350 MHz / 950 MHz 350 MHz / 950 MHz 350 MHz / 950 MHz 350 MHz / 950 MHz
Memory (DDR4) 2133 MT/s dual channel ECC 2133 MT/s dual channel ECC 2133 MT/s dual channel 2133 MT/s dual channel
LVDS Yes Yes Yes Yes
DisplayPort (DP) Yes Yes Yes Yes
HDMI Yes Yes Yes Yes
VGA Yes Yes Yes Yes
Processor TDP (cTDP) 35 W (N.A) 25 W (N.A) 35 W (N.A) 25 W (N.A)
Part-No. 045912 (ECC) 045913 (ECC) 045914 (ECC)
Processor Intel®Xeon®E3-1515M v5
2.8 GHz Quad Core™
Intel®Xeon®E3-1578L v5
2.0 GHz Quad CoreTM
Intel®Xeon®E3-1558L v5
1.9 GHz Quad CoreTM
Max. Turbo Frequency 3.7 GHz 3.4 GHz 3.3 GHz
Chipset Intel®CM236 Intel®CM236 Intel®CM236
Intel®Smart Cache 8 MB 8 MB 8 MB
Processor Graphics Intel®Iris™ Pro P580 (GT4) Intel®Iris™ Pro Graphics P580 (GT4) Intel®Iris Pro Graphics P555 (GT3)
GFX Base/Max. Dynamic Freq. 350 MHz / 1 GHz 700 MHz / 1 GHz 650 MHz / 1 GHz
Memory (DDR4) 2133 MT/s dual channel ECC 2133 MT/s dual channel ECC 2133 MT/s dual channel ECC
LVDS Yes Yes Yes
DisplayPort (DP) Yes Yes Yes
HDMI Yes Yes Yes
VGA Yes Yes Yes
Processor TDP (cTDP) 45 W (35W) 45 W (N.A) 45 W (N.A)

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2 Specifications
2.1 Feature List
Table 3 Feature Summary
Form Factor Based on COM Express™ standard pinout Type 6 Rev. 2.1 (Basic size 95 x 125 mm)
Processor Intel®6th Generation Core i7,i5,i3 Celeron and Xeon mobile processors.
Memory Two memory sockets (located on the top and bottom side of the conga-TS170). Supports
-SO-DIMM DDR4 (voltage @ 1.2V) modules
-Data rates up to 2133 MT/s
-Maximum 32 GB capacity (2x16 GB)
NOTE: Variants that feature the Intel CM236 chipset support ECC memory
Chipset Mobile Intel®100 Series Chipset QM170, HM170 and CM236 PCH
Audio High definition audio interface with support for multiple codecs
Ethernet Gigabit Ethernet support via the onboard Intel®i219-LM GbE LAN controller (with AMT 11 support).
Graphics Options Gen9 HD Graphics engine. Supports full hardware accelerated video decoding/encoding for AVC, MPEG2, HEVC (8 bit), VP8, JPEG, hardware
accelerated video processing/transcoding, DirectX 12, Direct3D 12, OpenGL 4.4, OpenCL 2.1 APIs and up to 3 independent displays.
NOTE: Variants equipped with Intel®Xeon®E3-1515MV5 feature the Intel® Iris Pro Graphics.
1x LVDS
1x Optional eDP 1.3 interface (assembly option).
3x DDIs (Digital Display Interfaces). Supports:
-3x DisplayPort 1.2 with support for Multi-Stream Transport (MST)
-3x HDMI 1.4 (requires external level shifter)
-3x DVI port (requires external level shifter)
-Resolutions up to 4K and support for Hot Plug Detect
1x VGA support
1x PEG Gen 3 port (x16 lanes)
NOTE:
-To support HDMI/DVI, an external level shifter should be
implemented on the user’s carrier board.
-To support HDMI 2.0 via the DDI, a Level Shifter Protocol
Converter (LSPCON) is required on the carrier board.
Peripheral Interfaces USB Interfaces:
-Up to 8x USB 2.0
-Up to 4x USB 3.0
4x Serial ATA®6Gb/s with RAID support 0/1/5/10
8x PCI Express®Gen. 3 lanes
2x UART
I²C bus (fast mode, 400 kHz, multi-master)
LPC bus (no DMA)
SM Bus
SPI
GPIOs
BIOS AMI Aptio®UEFI 5.x firmware, 8/16 MByte serial SPI with congatec Embedded BIOS features
Power Management ACPI 5.0 compliant with battery support. Also supports DeepSx and Suspend to RAM (S3).
congatec Board
Controller
Multi-stage watchdog, non-volatile user data storage, manufacturing and board information, board statistics, hardware monitoring, fan control, I²C
bus, power loss control.
Security Optional discrete Trusted Platform Module “TPM 1.2/2.0”; AES Instructions.

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Note
Some of the features mentioned in the above feature summary are optional. Check the article number of your module and compare it to the
option information list on page 11 of this user’s guide to determine what options are available on your particular module.
2.2 Supported Operating Systems
The conga-TS170 supports the following operating systems.
•Microsoft®Windows® 10
•Microsoft®Windows® 8.1
•Microsoft®Windows® 7
•Microsoft®Windows®Embedded Standard
•Linux
2.3 Mechanical Dimensions
•95.0 mm x 125.0 mm
•Height approximately 18 or 21mm (including heatspreader) depending on the carrier board connector that is used. If the 5mm (height)
carrier board connector is used, then approximate overall height is 18mm. If the 8mm (height) carrier board connector is used, then
approximate overall height is 21mm.

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2.4 Supply Voltage Standard Power
•12V DC ± 5%
The dynamic range shall not exceed the static range.
2.4.1 Electrical Characteristics
Power supply pins on the module’s connectors limit the amount of input power. The following table provides an overview of the limitations for
pinout Type 6 (dual connector, 440 pins).
Power Rail Module Pin
Current Capability
(Amps)
Nominal
Input
(Volts)
Input
Range
(Volts)
Derated
Input
(Volts)
Max. Input Ripple
(10Hz to 20MHz)
(mV)
Max. Module Input
Power (w. derated input)
(Watts)
Assumed
Conversion
Efficiency
Max. Load
Power
(Watts)
VCC_12V 12 12 11.4-12.6 11.4 +/- 100 137 85% 116
VCC_5V-SBY 2 5 4.75-5.25 4.75 +/- 50 9
VCC_RTC 0.5 3 2.0-3.3 +/- 20
2.4.2 Rise Time
The input voltages shall rise from 10% of nominal to 90% of nominal at a minimum slope of 250V/s. The smooth turn-on requires that, during
the 10% to 90% portion of the rise time, the slope of the turn-on waveform must be positive.
Nominal Static Range
Dynamic Range
Absolute Minimum
Absolute Maximum12.60V
11.40V
12V
12.10V
11.90V

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2.5 Power Consumption
The power consumption values were measured with the following setup:
•conga-TS170 COM
•modified congatec carrier board
•conga-TS170 cooling solution
•Microsoft Windows 7 (64 bit)
Note
The CPU was stressed to its maximum workload with the Intel®Thermal Analysis Tool
Table 4 Measurement Description
The power consumption values were recorded during the following system states:
System State Description Comment
S0: Minimum value Lowest frequency mode (LFM) with minimum core voltage during
desktop idle.
The CPU was stressed to its maximum frequency.
S0: Maximum value Highest frequency mode (HFM/Turbo Boost). The CPU was stressed to its maximum frequency.
S0: Peak value Highest current spike during the measurement of “S0: Maximum
value”. This state shows the peak value during runtime
Consider this value when designing the system’s power supply to
ensure that sufficient power is supplied during worst case scenarios.
S3 COM is powered by VCC_5V_SBY.
S5 COM is powered by VCC_5V_SBY.
Note
1. The fan and SATA drives were powered externally.
2. All other peripherals except the LCD monitor were disconnected before measurement.

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Table 5 Power Consumption Values
The tables below provide additional information about the power consumption data for each of the conga-TS170 variants offered. The values
are recorded at various operating mode.
Part
No.
Memory
Size
H.W
Rev.
BIOS
Rev.
OS
(64 bit)
CPU Current (Amp.)
Variant Cores Freq/Turbo
(GHz)
S0:
Min
S0:
Max
S0:
Peak
S3 S5
045900 4 GB A.0 BQSLR005 Windows 7 Intel®Core™ i7-6820EQ 4 2.8/3.5 0.65 5.23
(5.27)
5.45 0.10 0.06
045901 4 GB A.0 BQSLR005 Windows 7 Intel®Core™ i7-6822EQ 4 2.0/2.8 0.66 3.35 3.45 0.10 0.07
045902 4 GB X.0 BQSLR005 Windows 7 Intel®Core™ i5-6440EQ 4 2.7/3.4 0.66 5.32 5.69 0.09 0.06
045903 4 GB A.0 BQSLR005 Windows 7 Intel®Core™ i5-6442EQ 4 1.9/2.7 0.66 3.15 3.24 0.10 0.06
045904 4 GB X.0 BQSLR005 Windows 7 Intel®Core™ i3-6100E 2 2.7/N.A 0.66 3.09 3.54 0.09 0.06
045905 4 GB A.0 BQSLR005 Windows 7 Intel®Core™ i3-6102E 2 1.9/N.A 0.62 2.51 2.74 0.10 0.06
045906 (ECC) 4 GB A.0 BQSLR005 Windows 7 Intel®Xeon®E3-1505M v5 4 2.8/3.7 0.72 5.73 5.95 0.10 0.06
045907 (ECC) 4 GB A.0 BQSLR005 Windows 7 Intel®Xeon®E3-1505L v5 4 2.0/2.8 0.65 3.06 3.16 0.10 0.07
045908 (ECC) 4 GB A.2 BQSLR112 Windows 7 Intel®Core™ i3-6100E 2 2.7/N.A 0.67 3.87 4.08 0.07 0.06
045909 (ECC) 4 GB A.2 BQSLR112 Windows 7 Intel®Core™ i3-6102E 2 1.9/N.A 0.62 2.73 2.86 0.07 0.06
045910 (ECC) 4 GB A.1 BQSLR112 Windows 7 Intel®Celeron®G3900E 2 2.4/N.A 0.62 2.29 2.33 0.07 0.07
045911 (ECC) 4 GB A.1 BQSLR112 Windows 7 Intel®Celeron®G3902E 2 1.6/N.A 0.58 1.66 1.73 0.08 0.06
045912 (ECC) 4 GB A.0 BQSLR005 Windows 7 Intel®Xeon®E3-1515M v5 4 2.8/3.7 TBD TBD TBD TBD TBD
045913 (ECC) 4 GB A.0 BQSLR005 Windows 7 Intel®Xeon®E3-1578L v5 4 2.0/3.4 TBD TBD TBD TBD TBD
045914 (ECC) 4 GB A.0 BQSLR005 Windows 7 Intel®Xeon®E3-1558L v5 4 1.9/3.3 TBD TBD TBD TBD TBD
Note
With fast input voltage rise time, the inrush current may exceed the measured peak current.
2.6 Supply Voltage Battery Power
Table 6 CMOS Battery Power Consumption
RTC @ Voltage Current
-10oC 3V DC 1.18 µA
20oC 3V DC 1.33 µA
70oC 3V DC 1.99 µA

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Note
1. Do not use the CMOS battery power consumption values listed above to calculate CMOS battery lifetime.
2. Measure the CMOS battery power consumption in your customer specific application in worst case conditions (for example, during high
temperature and high battery voltage).
3. Consider also the self-discharge of the battery when calculating the lifetime of the CMOS battery. For more information, refer to application
note AN9_RTC_Battery_Lifetime.pdf on congatec AG website at www.congatec.com/support/application-notes.
4. We recommend to always have a CMOS battery present when operating the conga-TS170.
2.7 Environmental Specifications
Temperature Operation: 0° to 60°C Storage: -20° to +80°C
Humidity Operation: 10% to 90% Storage: 5% to 95%
Caution
The above operating temperatures must be strictly adhered to at all times. When using a congatec heatspreader, the maximum operating
temperature refers to any measurable spot on the heatspreader’s surface.
Humidity specifications are for non-condensing conditions.

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3 Block Diagram
6th Gen. Intel® Core™ processor
CPU Platform
VT
HT Technology AMT 11.0
Turbo Boost 2.0 Technology TXT
AES-NI
AVX2 SSE 4.2 TSX
Hardware Graphics Accelerators
Video Codecs APIs
Vector Graphics
DXVA2
3D
2D
MPEG-2
H.265
WMV9
OpenCL 2.1
OpenGL 4.4
DirectX 12
Integrated Intel HD Graphics
SATA USB 2.0
LPC BusPCIe
USB 3.0
HDA
Multimedia Features
ASRC
I/O Interfaces
HDMI and DP
Display Interface
up to 4K resolution
Mobile Intel ® 100 Series PCH-H
MGMNT
PECI
PCIe Gen. 3
Aux Channel
DDI port D supports only HDMI if VGA is enabled.
*
*
PCIe Gen. 3
PECI
SM Bus
Dual Channel DDR4
eDP
PCIe Gen. 3
eDP to LVDS
Bridge
2x SO-DIMM (X1/X2)
SPI Flash 0
LVDS/eDP
TPM
XDP
LPC
SATA 6G
USB 2.0
HDA
DMI Gen3
UART0/1
DP to VGA
congatec System
Management
Controller
Ethernet 10/100/1000
Intel i219LM
Ethernet
VGA
LVDS/eDP
COM Express
Type 6
A-B Connector
LPC Bus
SM Bus
HDA I/F
I2C Bus
USB Port 0..7
SATA Port 0 - 3
SER0/1
GPIOs
SPI
SPI
LID#/SLEEP#
FAN control
PCIe lane 0 - 5
USB 3.0 Port 0 - 3
PCIe lane 6 - 7
(TX BC)
congatec custom
COM Express
Type 6
C-D Connector
DP/HDMI Port D
DP/HDMI Port C
DP/HDMI Port B
PEG x16