Congatec COM Express conga-MA5 User manual

COM Express™ conga-MA5
COM Express Type 10 Mini module based on the Intel® Atom®, Pentium® and Celeron® Apollo Lake SoC
User's Guide
Revision 1.7

Copyright © 2017 congatec AG MA50m17 2/60
Revision History
Revision Date (yyyy.mm.dd) Author Changes
0.1 2017.04.07 BEU •Preliminary release
1.0 2017.09.21 BEU •Minor improvements throughout the document
•Updated section 2.2 "Supported Operating Systems", 2.4 "Supply Voltage Standard Power", 2.4.1 Electrical
Characteristics", 3 "Block Diagram", 5.7.3 "DVI-D", 5.8 "SD Card", 6.1.1 "eMMC 5.0", and 6.7 "Security Features"
•Added inrush and maximum currents peaks paragraph to section 5.14 "Power Control"
•Added section 5.16 "MIPI CSI-2"
•Updated tables 7 "Power Consumption Values", 8 "CMOS Battery Power Consumption", 13 "COM Express Connector
Pinouts", 16 "Serial ATA Signal Descriptions", 18 "ExpressCard Support Pins Signal Descriptions", 19 "USB Signal
Descriptions", 20 "LVDS Signal Descriptions", 23 "DDI Signal Descriptions", 24 "DisplayPort (DP) Signal Descriptions",
25 "HDMI/DVI Signal Descriptions", 28 "Miscellaneous Signal Descriptions", 29 "Power and System Management Signal
Descriptions"
•Added fully legacy UART 16550 compliant LPC controller as assembly option
•Added content to section 9 "System Resources"and 10 "BIOS Setup Description"
1.1 2018.06.25 BEU •Added errata as a document to read in the preface section
•Updated "Electrostatic Sensitive Device" information on page 3
•Updated security features in table 4 "Feature Summary"
•Removed Android from supported OS in section 2.2 "Supported Operating Systems"
•Added EFT caution to section 5.4.1 "USB 2.0"
•Updated section 5.9 "General Purpose Serial Interface (UART)"
1.2 2018.08.21 BEU •Minor improvements throughout the document
1.3 2018.10.16 BEU •Corrected commercial operating temperature in section 2.7 "Environmental Specifications"
•Corrected pin A83 and A84 description in table 20 "LVDS Signal Descriptions"
•Added voltages and BIOS revision information to table 7 "Power Consumption Values"
1.4 2019.01.18 BEU •Corrected image in section 2.3 "Mechanical Dimensions"
1.5 2019.04.16 BEU •Corrected image in section 2.3 "Mechanical Dimensions"
1.6 2020.01.07 BEU •Removed support for IoT 32-bit OS in section 2.2 " Supported Operating Systems"
•Updated section 4 "Cooling Solutions"
•Updated reference to power supply design guide in section 5.14 "Power Control"
•Updated section 10.3 "Updating the BIOS"
•Updated section 10.4 "Supported Flash Devices"
•Added note about pulse width to several signals in table 29
•Added reference to BIOS Setup Description application note in section 10 "BIOS Setup Description"
•Updated section 11 "Industry Specifications"
1.7 2021.02.19 BEU •Corrected the storage temperature for industrial variants in section 2.7 “Environmental Specifications”

Copyright © 2017 congatec AG MA50m17 3/60
Preface
This user’s guide provides information about the components, features, connectors and BIOS Setup menus available on the conga-MA5.
It is one of four documents that should be referred to when designing a COM Express™ application. This user's guide should be read in
conjunction with the document "Errata_congatec_xA5_designs". Click on the document name to download it.
The other reference documents that should be used include the following:
COM Express™ Design Guide
COM Express™ Specification
The links to these documents can be found on the congatec AG website at www.congatec.com.
Disclaimer
The information contained within this user's guide, including but not limited to any product specification, is subject to change without notice.
congatec AG provides no warranty with regard to this user's guide or any other information contained herein and hereby expressly disclaims any
implied warranties of merchantability or fitness for any particular purpose with regard to any of the foregoing. congatec AG assumes no liability
for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for discrepancies
between the product and the user's guide. In no event shall congatec AG be liable for any incidental, consequential, special, or exemplary
damages, whether based on tort, contract or otherwise, arising out of or in connection with this user's guide or any other information contained
herein or the use thereof.
Intended Audience
This user's guide is intended for technically qualified personnel. It is not intended for general audiences.
Electrostatic Sensitive Device
All congatec AG products are electrostatic sensitive devices. They are enclosed in static shielding bags, and shipped enclosed in secondary
packaging (protective packaging). The secondary packaging does not provide electrostatic protection.
Do not remove the device from the static shielding bag or handle it, except at an electrostatic-free workstation. Also, do not ship or store
electronic devices near strong electrostatic, electromagnetic, magnetic, or radioactive fields unless the device is contained within its original
packaging. Be aware that failure to comply with these guidelines will void the congatec AG Limited Warranty.

Copyright © 2017 congatec AG MA50m17 4/60
Lead-Free Designs (RoHS)
All congatec AG designs are created from lead-free components and are completely RoHS compliant.
Symbols
The following symbols are used in this user's guide:
Warning
Warnings indicate conditions that, if not observed, can cause personal injury.
Caution
Cautions warn the user about how to prevent damage to hardware or loss of data.
Note
Notes call attention to important information that should be observed.
Copyright Notice
Copyright © 2017, congatec AG. All rights reserved. All text, pictures and graphics are protected by copyrights. No copying is permitted
without written permission from congatec AG.
congatec AG has made every attempt to ensure that the information in this document is accurate yet the information contained within is
supplied “as-is”.
Trademarks
Product names, logos, brands, and other trademarks featured or referred to within this user's guide, or the congatec website, are the property
of their respective trademark holders. These trademark holders are not affiliated with congatec AG, our products, or our website.

Copyright © 2017 congatec AG MA50m17 5/60
Warranty
congatec AG makes no representation, warranty or guaranty, express or implied regarding the products except its standard form of limited
warranty (“Limited Warranty”) per the terms and conditions of the congatec entity, which the product is delivered from. These terms and
conditions can be downloaded from www.congatec.com. congatec AG may in its sole discretion modify its Limited Warranty at any time and
from time to time.
The products may include software. Use of the software is subject to the terms and conditions set out in the respective owner's license
agreements, which are available at www.congatec.com and/or upon request.
Beginning on the date of shipment to its direct customer and continuing for the published warranty period, congatec AG represents that the
products are new and warrants that each product failing to function properly under normal use, due to a defect in materials or workmanship or
due to non conformance to the agreed upon specifications, will be repaired or exchanged, at congatec's option and expense.
Customer will obtain a Return Material Authorization (“RMA”) number from congatec AG prior to returning the non conforming product freight
prepaid. congatec AG will pay for transporting the repaired or exchanged product to the customer.
Repaired, replaced or exchanged product will be warranted for the repair warranty period in effect as of the date the repaired, exchanged
or replaced product is shipped by congatec, or the remainder of the original warranty, whichever is longer. This Limited Warranty extends to
congatec's direct customer only and is not assignable or transferable.
Except as set forth in writing in the Limited Warranty, congatec makes no performance representations, warranties, or guarantees, either
express or implied, oral or written, with respect to the products, including without limitation any implied warranty (a) of merchantability, (b) of
fitness for a particular purpose, or (c) arising from course of performance, course of dealing, or usage of trade.
congatec AG shall in no event be liable to the end user for collateral or consequential damages of any kind. congatec shall not otherwise be
liable for loss, damage or expense directly or indirectly arising from the use of the product or from any other cause. The sole and exclusive
remedy against congatec, whether a claim sound in contract, warranty, tort or any other legal theory, shall be repair or replacement of the
product only.
Certification
congatec AG is certified to DIN EN ISO 9001 standard.
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Copyright © 2017 congatec AG MA50m17 6/60
Technical Support
congatec AG technicians and engineers are committed to providing the best possible technical support for our customers so that our products
can be easily used and implemented. We request that you first visit our website at www.congatec.com for the latest documentation, utilities
and drivers, which have been made available to assist you. If you still require assistance after visiting our website then contact our technical
support department by email at [email protected].
Terminology
Term Description
GB Gigabyte
GHz Gigahertz
kB Kilobyte
MB Megabyte
Mbit Megabit
kHz Kilohertz
MHz Megahertz
TDP Thermal Design Power
PCIe PCI Express
SATA Serial ATA
DDC Display Data Channel
SoC System On Chip
LVDS Low-Voltage Differential Signaling
GbE Gigabit Ethernet
eMMC Embedded MultiMedia Card
MLC Multi-level Cell
SLC Single-level Cell
HDA High Definition Audio
cBC congatec Board Controller
I/F Interface
N.C. Not connected
N.A. Not available
TBD To be determined

Copyright © 2017 congatec AG MA50m17 7/60
Contents
1 Introduction ............................................................................. 10
2 Specifications........................................................................... 12
2.1 Feature List .............................................................................. 12
2.2 Supported Operating Systems ................................................ 13
2.3 Mechanical Dimensions ........................................................... 13
2.4 Supply Voltage Standard Power .............................................. 14
2.4.1 Electrical Characteristics .......................................................... 14
2.4.2 Rise Time ................................................................................. 14
2.5 Power Consumption ................................................................ 15
2.6 Supply Voltage Battery Power ................................................. 16
2.7 Environmental Specifications................................................... 17
3 Block Diagram.......................................................................... 18
4 Cooling Solutions..................................................................... 19
4.1 CSP Dimensions ...................................................................... 20
4.2 Heatpsreader Dimensions........................................................ 22
5 Connector Subsystems Rows A, B ........................................... 24
5.1 PCI Express™........................................................................... 24
5.2 Gigabit Ethernet ...................................................................... 24
5.3 SATA ........................................................................................ 25
5.4 Universal Serial Bus.................................................................. 25
5.4.1 USB 2.0 .................................................................................... 25
5.4.2 USB 3.0 .................................................................................... 26
5.5 ExpressCard™ ......................................................................... 26
5.6 High Definition Audio (HDA) Interface .................................... 26
5.7 Digital Display Interface........................................................... 26
5.7.1 DisplayPort (DP) ....................................................................... 27
5.7.2 HDMI........................................................................................ 27
5.7.3 DVI-D ....................................................................................... 27
5.7.4 LVDS/eDP................................................................................. 28
5.8 SD Card ................................................................................... 28
5.9 General Purpose Serial Interface (UART) ................................. 28
5.10 LPC Bus.................................................................................... 29
5.11 SPI Bus ..................................................................................... 29
5.12 I²C Bus ..................................................................................... 29
5.13 SMBus...................................................................................... 29
5.14 Power Control .......................................................................... 29
5.15 Power Management................................................................. 31
5.16 MIPI CSI-2 ............................................................................... 32
6 Additional Features.................................................................. 33
6.1 Onboard Interfaces.................................................................. 33
6.1.1 eMMC 5.0 ................................................................................ 33
6.2 congatec Board Controller (cBC) ............................................. 33
6.2.1 Board Information.................................................................... 33
6.2.2 Fan Control .............................................................................. 33
6.2.3 Power Loss Control.................................................................. 34
6.2.4 Watchdog ................................................................................ 34
6.2.5 General Purpose Input/Output................................................ 34
6.3 OEM BIOS Customization........................................................ 34
6.3.1 OEM Default Settings .............................................................. 34
6.3.2 OEM Boot Logo....................................................................... 35
6.3.3 OEM POST Logo ..................................................................... 35
6.3.4 OEM BIOS Code/Data............................................................. 35
6.3.5 OEM DXE Driver...................................................................... 35
6.4 congatec Battery Management Interface ................................ 35
6.5 API Support (CGOS) ................................................................ 36
6.6 Suspend to Ram....................................................................... 36
6.7 Security Features...................................................................... 36
7 conga Tech Notes .................................................................... 37
7.1 Intel®Apollo Lake Features......................................................37
7.1.1 Processor Core......................................................................... 37
7.1.1.1 Intel Virtualization Technology................................................. 37
7.1.1.2 AHCI ........................................................................................ 38
7.1.1.3 Thermal Management ............................................................. 38
7.2 ACPI Suspend Modes and Resume Events.............................. 39

Copyright © 2017 congatec AG MA50m17 8/60
8 Signal Descriptions and Pinout Tables..................................... 40
8.1 COM Express Connector Pinout.............................................. 41
8.2 COM Express Connector Signal Descriptions ......................... 43
9 System Resources .................................................................... 54
9.1 I/O Address Assignment.......................................................... 54
9.1.1 LPC Bus.................................................................................... 54
9.2 PCI Configuration Space Map ................................................. 55
9.3 I²C Bus ..................................................................................... 56
9.4 SM Bus..................................................................................... 56
9.5 congatec System Sensors ........................................................ 57
10 BIOS Setup Description........................................................... 58
10.1 Navigating the BIOS Setup Menu ........................................... 58
10.2 BIOS Versions........................................................................... 58
10.3 Updating the BIOS................................................................... 59
10.4 Supported Flash Devices ......................................................... 59
11 Industry Specifications ............................................................. 60

Copyright © 2017 congatec AG MA50m17 9/60
List of Tables
Table 1 Types of COM Express™ Pinouts/Features ............................. 10
Table 2 conga-MA5 Commercial Variants ............................................ 11
Table 3 conga-MA5 Industrial Variants ................................................. 11
Table 4 Feature Summary..................................................................... 12
Table 5 Power Limits on Type 10 Connector ........................................ 14
Table 6 Measurement Description........................................................ 15
Table 7 Power Consumption Values ..................................................... 16
Table 8 CMOS Battery Power Consumption ........................................ 16
Table 9 Cooling Solution Variants......................................................... 19
Table 10 PCI Express™ Options............................................................. 24
Table 11 Display Combination ............................................................... 26
Table 12 Wake Events resuming system from S3 ................................... 39
Table 13 Signal Tables Terminology Descriptions .................................. 40
Table 14 COM Express Connector Pinouts ............................................ 41
Table 15 High Definition Audio Link Signals Descriptions ..................... 43
Table 16 Gigabit Ethernet Signal Descriptions....................................... 43
Table 17 Serial ATA Signal Descriptions................................................. 44
Table 18 PCI Express Signal Descriptions (general purpose) ................. 44
Table 19 ExpressCard Support Pins Signal Descriptions........................ 45
Table 20 USB Signal Descriptions........................................................... 45
Table 21 LVDS Signal Descriptions......................................................... 46
Table 22 LPC Signal Descriptions........................................................... 47
Table 23 SPI Interface Signal Descriptions ............................................. 47
Table 24 DDI Signal Descriptions ........................................................... 48
Table 25 DisplayPort (DP) Signal Descriptions ....................................... 48
Table 26 HDMI/DVI Signal Descriptions................................................. 49
Table 27 General Purpose Serial Interface Signal Descriptions.............. 49
Table 28 I2C Interface Signal Descriptions............................................. 49
Table 29 Miscellaneous Signal Descriptions........................................... 50
Table 30 Power and System Management Signal Descriptions ............. 50
Table 31 Thermal Protection Interface Signal Descriptions.................... 51
Table 32 SM Bus Signal Descriptions ..................................................... 51
Table 33 General Purpose I/O Signal Descriptions ................................ 51
Table 34 SDIO Signal Descriptions......................................................... 52
Table 35 Module Type Definition Signal Description ............................. 52
Table 36 Power and GND Signal Descriptions....................................... 52
Table 37 CAN Bus Signal Descriptions................................................... 53
Table 38 I/O Address Assignment.......................................................... 54
Table 39 PCI Configuration Space Map ................................................. 55
Table 40 Industry Specifications ............................................................. 60

Copyright © 2017 congatec AG MA50m17 10/60
1 Introduction
COM Express™ Concept
COM Express™ is an open industry standard defined specifically for COMs (computer on modules). Its creation makes it possible to smoothly
transition from legacy interfaces to the newest technologies available today. COM Express™ modules are available in following form factors:
•Mini 84 mm x 55 mm
•Compact 95 mm x 95 mm
•Basic 125 mm x 95 mm
•Extended 155 mm x110 mm
The COM Express Specification Rev 2.1 currently defines seven different pinout types. These are shown in the table below.
Table 1 Types of COM Express™ Pinouts/Features
Types Connector Rows PCI Express Lanes PCI IDE Channels LAN ports
Type 1 A-B Up to 6 1
Type 2 A-B C-D Up to 22 32-bit 1 1
Type 3 A-B C-D Up to 22 32-bit 3
Type 4 A-B C-D Up to 32 1 1
Type 5 A-B C-D Up to 32 3
Type 6 A-B C-D Up to 24 1
Type 10 A-B Up to 4 1
conga-MA5 modules use the Type 10 pinout definition. They are equipped with single 220-pin high performance connector that ensure stable
data throughput.
The COM (computer on module) integrates all the core components and is mounted onto an application specific carrier board. COM modules
are legacy-free design (no Super I/O, PS/2 keyboard and mouse) and provide most of the functional requirements for any application. These
functions include, but are not limited to, a rich complement of contemporary high bandwidth serial interfaces such as PCI Express, Serial ATA,
USB 3.0, and Gigabit Ethernet. The Type 10 pinout provides the ability to offer PCI Express, Serial ATA, and LPC options thereby expanding
the range of potential peripherals. The robust thermal and mechanical concept, combined with extended power-management capabilities, is
perfectly suited for all applications.
Carrier board designers can use as little or as many of the I/O interfaces as deemed necessary. The carrier board can therefore provide all
the interface connectors required to attach the system to the application specific peripherals. This versatility allows the designer to create a
dense and optimized package, which results in a more reliable product while simplifying system integration. Most importantly, COM Express™
modules are scalable, which means once an application has been created there is the ability to diversify the product range through the use
of different performance class or form factor size modules. Simply unplug one module and replace it with another, no redesign is necessary.

Copyright © 2017 congatec AG MA50m17 11/60
conga-MA5 Options Information
The conga-MA5 is available in five commercial and three industrial variants. The tables below show the different configurations available. Check
the Part No. that applies to your product. This will tell you what options described in this user’s guide are available on your particular module.
Table 2 conga-MA5 Commercial Variants
Part-No. 048000 048001 048002 048020 048022
Processor Intel®Atom®x7-E3950
Quad Core 1.6 GHz
Burst 2.0 GHz
Intel®Atom®x5-E3940
Quad Core 1.6 GHz
Burst 1.8 GHz
Intel®Atom®x5-E3930
Dual Core 1.3 GHz
Burst 1.8 GHz
Intel®Pentium®N4200
Quad Core 1.1 GHz
Burst 2.5 GHz
Intel®Celeron®N3350
Dual Core 1.1GHz
Burst 2.4 GHz
L2 Cache 2 MB 2 MB 2 MB 2 MB 2 MB
Onboard Memory 8 GB 1866 MT/s DDR3L 4 GB 1866 MT/s DDR3L 2 GB 1866 MT/s DDR3L 8 GB 1866 MT/s DDR3L 4 GB 1866 MT/s DDR3L
Graphics Intel®HD Graphics 505 Intel®HD Graphics 500 Intel®HD Graphics 500 Intel®HD Graphics 505 Intel®HD Graphics 500
GFX Base/Burst Freq. 500/650 Mhz 400/600 MHz 400/550 MHz 200/750 MHz 200/650 MHz
LVDS/eDP Single Channel LVDS
18/24 bpp
Single Channel LVDS
18/24 bpp
Single Channel LVDS
18/24 bpp
Single Channel LVDS
18/24 bpp
Single Channel LVDS
18/24 bpp
DDI Dual-mode DP 1.2/
HDMI 1.4b/DVI
Dual-mode DP 1.2/
HDMI 1.4b/DVI
Dual-mode DP 1.2/
HDMI 1.4b/DVI
Dual-mode DP 1.2/
HDMI 1.4b/DVI
Dual-mode DP 1.2/
HDMI 1.4b/DVI
eMMC Onboard 32 GB MLC Onboard 16 GB MLC Onboard 16 GB MLC Onboard 32 GB MLC Onboard 16 GB MLC
Ethernet Controller Intel® I211 Intel® I211 Intel® I211 Intel® I211 Intel® I211
SOC TDP 12 W 9.5 W 6.5 W 6 W 6 W
Table 3 conga-MA5 Industrial Variants
Part-No. 048010 048011 048012
Processor Intel®Atom®x7-E3950
Quad Core 1.6 GHz
Burst 2.0 GHz
Intel®Atom®x5-E3940
Quad Core 1.6 GHz
Burst 1.8 GHz
Intel®Atom®x5-E3930
Dual Core 1.3 GHz
Burst 1.8 GHz
L2 Cache 2 MB 2 MB 2 MB
Onboard Memory 8 GB 1866 MT/s DDR3L 4 GB 1866 MT/s DDR3L 4 GB 1866 MT/s DDR3L
Graphics Intel®HD Graphics 505 Intel®HD Graphics 500 Intel®HD Graphics 500
GFX Base / Burst 500/650 MHz 400/600 MHz 400/550 MHz
LVDS / eDP Single Channel LVDS
18/24 bpp
Single Channel LVDS
18/24 bpp
Single Channel LVDS
18/24 bpp
DDI Dual-mode DP 1.2/
HDMI 1.4b/DVI
Dual-mode DP 1.2/
HDMI 1.4b/DVI
Dual-mode DP 1.2/
HDMI 1.4b/DVI
eMMC (SLC / MLC) Onboard 16 GB MLC Onboard 16 GB MLC Onboard 16 GB MLC
Ethernet Controller Intel® I210 Intel® I210 Intel® I210
SOC TDP 12 W 9.5 W 6.5 W

Copyright © 2017 congatec AG MA50m17 12/60
2 Specifications
2.1 Feature List
Table 4 Feature Summary
Form Factor Based on COM Express™ standard pinout Type 10 Rev. 2.1 (mini size 84 mm x 55 mm)
Processor Intel®Atom®, Pentium®and Celeron®(Codename: Apollo Lake)
Memory conga-MA5: Up to 8 GB non-ECC DDR3L onboard memory interface with data rates up to 1866 MT/s.
Chipset Integrated in SoC
Onboard Storage eMMC 5.0 interface up to 128 GB
Audio Intel®High Definition Audio (Intel®HD Audio)
Ethernet Onboard Intel®Ethernet Controller I211 (Commercial Variants) or I210 (Industrial Variants) connected to SOC PCIe port 4 - connected via one PCI
Express®x1 link by default
Graphics Options Intel®HD Graphics Gen9-LP supporting DirectX12, OpenGL 4.3, OpenGL ES 3.0, OpenCL 1.2, full HW acceleration for HEVC (H2.65), H2.64, MVC,
VP8, VP9, MPEG2, VC-1, WMV9 and JPEG/MJPEG
1x Single Channel LVDS 18/24 bpp (default) or eDP interface (assembly option)
*1
1x Dedicated DDI with support for:
-1x Dual-mode DisplayPort 1.2
-1x HDMI 1.4b *2
-1x DVI *2
NOTE:
*1 Either eDP or LVDS signals supported. Both signals are not supported.
*2 Requires an external level shifter on the carrier board.
Peripheral
Interfaces
2x SATA 6 Gb/s
Up to 4x PCI Express®Gen2 x1 links without LAN (requires custom BIOS)
6x USB 2.0 and 2x USB 3.0/2.0
SD (MMC not supported)
2x UART (LPC to Dual-UART as assembly option)
GPIOs muxed with SD card (not both types simultaneously)
SPI Bus (For external BIOS FLASH only)
LPC Bus
I²C Bus, multimaster
SMBus
BIOS AMI Aptio®UEFI 5.x firmware; 8 MByte serial SPI with congatec Embedded BIOS features (OEM Logo, OEM CMOS Defaults, LCD Control, Display Auto
Detection, Backlight Control, Flash Update)
Power Mgmt. ACPI 5.0 compliant with battery support. Also supports Suspend to RAM (S3).
congatec Board
Controller
Multi Stage Watchdog, non-volatile User Data Storage, Manufacturing and Board Information, Board Statistics, BIOS Setup Data Backup, I²C bus (fast
mode, 400 kHz, multi-master), Power Loss Control
Security Integrated Intel®PTT (TPM 2.0). Infineon SLB9665 (LPC TPM 2.0) or SLB9660 (LPC TPM 1.2) available by assembly option.
Note
Some of the features mentioned in the above Feature Summary are optional and require customized articles. Check the part number of your
module and compare it to the options information list on page 11 to determine what options are available on your particular module. For
more information, contact congatec support.

Copyright © 2017 congatec AG MA50m17 13/60
2.2 Supported Operating Systems
The conga-MA5 supports the following operating systems
• Microsoft®Windows®10 Enterprise (64-bit)
• Microsoft®Windows®10 IoT Core (64-bit)
• Linux 3.x/4.x
• Yocto 2.x
Note
For the installation of Microsoft®Windows®10 (64-bit), congatec recommends a minimum storage capacity of 20 GB. congatec will not offer
technical support for systems with less than 20 GB storage space.
2.3 Mechanical Dimensions
•84.0mm x 55.0mm
•Height approximately 18 or 21mm (including heatspreader) depending on the carrier board connector that is used. If the 5mm (height) carrier
board connector is used then approximate overall height is 18mm. If the 8mm (height) carrier board connector is used then approximate
overall height is 21mm
4.00
Heatspreader
Module PCB
Carrier Board PCB
7.00
5.00 1.60
4.50
12.60 17.60

Copyright © 2017 congatec AG MA50m17 14/60
2.4 Supply Voltage Standard Power
•4.75V - 20V (Wide input range)
2.4.1 Electrical Characteristics
Power supply pins on the module’s connectors limit the amount of input power. The following table provides an overview of the limitations for
pinout Type 10 (single connector, 220 pins).
Table 5 Power Limits on Type 10 Connector
Power Rail Module Pin Current
Capability (A)
Nominal
Input (V)
Input Range
(V)
Derated
Input (V)
Max. Input Ripple
(10Hz to 20MHz)
(mV)
Max. Module Input
Power (w. derated input)
(W)
Assumed
Conversion
Efficiency
Max. Load
Power
(W)
Wide Input 6 4.75-20.0 4.75 +/- 100 28 85% 23.8
VCC_5V-SBY 2 5 4.75-5.25 4.75 +/- 50 9
VCC_RTC 0.5 3 2.5-3.3 +/- 20
2.4.2 Rise Time
The input voltages shall rise from 10% of nominal to 95% of nominal within 0.1 ms to 20 ms (0.1 ms ≤ Rise Time ≤ 20 ms). Each DC input voltage
must rise from 10% to 90% of its nominal voltage in a smooth, continuous ramp and the slope of the turn-on waveform must be positive.
Static Range
+
Absolute Minimum
Absolute Maximum20.00V
4.75V
Ripple

Copyright © 2017 congatec AG MA50m17 15/60
2.5 Power Consumption
The power consumption values were measured with the following setup:
•conga-MA5 COM
•modified congatec carrier board
•conga-MA5 cooling solution
•Microsoft Windows®10 (64-bit)
Note
The CPU was stressed to its maximum workload with the Intel®Thermal Analysis Tool.
Table 6 Measurement Description
The power consumption values were recorded during the following system states:
System State Description Comment
S0: Minimum value Lowest frequency mode (LFM) with minimum core voltage during
desktop idle.
S0: Maximum value Highest frequency mode (HFM/Turbo Boost). The CPU was stressed to its maximum frequency.
S0: Peak value Highest current spike during the measurement of “S0: Maximum
value”. This state shows the peak value during runtime
Consider this value when designing the system’s power supply to
ensure that sufficient power is supplied during worst case scenarios.
S3 COM is powered by VCC_5V_SBY.
S5 COM is powered by VCC_5V_SBY.
Note
1. The fan and SATA drives were powered externally.
2. All other peripherals except the LCD monitor were disconnected before measurement.

Copyright © 2017 congatec AG MA50m17 16/60
Table 7 Power Consumption Values
The tables below provide additional information about the power consumption data for each of the conga-MA5 variants offered. The values
are recorded at various operating modes.
Part
No.
Memory
Size
H.W
Rev.
BIOS
Rev.
OS
(64-bit)
CPU Current (Amp.) at 12V (S0) or 5V (S3, S5)
Variant Cores Base / Burst Freq.
(GHz)
S0:
Min
S0:
Max
S0:
Peak
S3 S5
048000 8 GB A.1 M50R019 Windows®10 Intel®Atom®x7-E3950 4 1.6/2.0 0.14 1.71 1.87 0.10 0.10
048001 4 GB A.1 M50R019 Windows®10 Intel®Atom®x5-E3940 4 1.6/1.8 0.12 1.23 1.33 0.11 0.09
048002 2 GB A.1 M50R019 Windows®10 Intel®Atom®x5-E3930 2 1.3/1.8 0.12 0.88 0.94 0.12 0.10
048020 8 GB A.1 M50R019 Windows®10 Intel®Pentium® N4200 4 1.1/2.5 0.14 1.02 1.95 0.11 0.10
048022 4 GB A.1 M50R019 Windows®10 Intel®Celeron®N3350 2 1.1/2.4 0.12 0.91 1.64 0.10 0.09
048010 8 GB A.1 M50R019 Windows®10 Intel®Atom®x7-E3950 4 1.6/2.0 0.14 1.71 1.87 0.10 0.10
048011 4 GB A.1 M50R019 Windows®10 Intel®Atom®x5-E3940 4 1.6/1.8 0.12 1.23 1.33 0.11 0.09
048012 4 GB A.1 M50R019 Windows®10 Intel®Atom®x5-E3930 2 1.3/1.8 0.12 0.88 0.94 0.12 0.10
Note
With fast input voltage rise time, the inrush current may exceed the measured peak current.
2.6 Supply Voltage Battery Power
Table 8 CMOS Battery Power Consumption
RTC @ Voltage Current
-10oC 3V DC 1.90 µA
20oC 3V DC 2.31 µA
70oC 3V DC 5.46 µA

Copyright © 2017 congatec AG MA50m17 17/60
Note
1. Do not use the CMOS battery power consumption values listed above to calculate CMOS battery lifetime.
2. Measure the CMOS battery power consumption in your customer specific application in worst case conditions (for example, during high
temperature and high battery voltage).
3. Consider also the self-discharge of the battery when calculating the lifetime of the CMOS battery. For more information, refer to application
note AN9_RTC_Battery_Lifetime.pdf on congatec AG website at www.congatec.com/support/application-notes.
4. We recommend to always have a CMOS battery present when operating the conga-MA5.
2.7 Environmental Specifications
Temperature (commercial variants) Operation: 0° to 60°C Storage: -20° to +80°C
Temperature (industrial variants) Operation: -40° to 85°C Storage: -40° to +85°C
Humidity Operation: 10% to 90% Storage: 5% to 95%
Caution
The above operating temperatures must be strictly adhered to at all times. When using a congatec heatspreader, the maximum operating
temperature refers to any measurable spot on the heatspreader’s surface.
Humidity specifications are for non-condensing conditions.

Copyright © 2017 congatec AG MA50m17 18/60
3 Block Diagram
Intel Apollo Lake
COMPUTE UNIT
Core #1 Core #2
Core #4
Tri-gate 3-D 14nm Quad core SoC
1MB L2 cache shared by 2 cores
PROCESSOR CORE
Core #3
SSE4.2
AES
HEVC
UNCORE UNIT
Multimedia Features
Interfaces
DirectX 12.0 OpenGL 4.3
OpenGL ES 3.0 OpenCL 2.0
Intel®Gen9 LP
VP8 MPEG2 WMV9
H.264 VP9 M/JPEG VC-1
DISPLAY & GRAPHICS @MEDIA
DisplayPort HDMI / DVI eDP
SATA USB 3.0/2.0
LPC BusPCIe
Integrated I/O Interfaces
GPIOs
emmC/SDHD Audio UART
SPI
INTEGRATED I/O
PCIe1
PCIe2
PCIe4GBE
PCIe0
SDv3
eMMC
HS400
MIPI
CSI x2
MIPI
CSI x4
LPC
SSD MIPI-CSI2 on-module DDR3L
2 / 4 / 8GB
BIOS
TPM
PCIe-GBE
Intel i210 / i211
MUX
eDP LVDS
0R0
PCIe3
Support max. 4 links (inc. for Lan)*
1
LVDS/eDP Assembly Option
DDR3L
1866
DDR3L
1866
DDI0
2x SATA 6Gb/s
2x USB_SS
8x USB 2.0
HDA
UARTs
FSPI
GPIO
eDP
congatec
Board Controller
SIO Assembly Option
LS
SIO
Ethernet
SATA Port 1-0
DDI
COM Express 2.1
Type 10
A-B Connector
LPC Bus
USB SS Ext. 1-0
USB 2.0 Port 7-0
SD / GPIO
PWR control
FAN control
PCIe Port 2
PCIe Port 3
PCIe Port 1
PCIe Port 0
HDA I/F
UART Port 1-0
SPI Bus
I2C Bus
SM Bus
LVDS_A / eDP
Notes:
*
1
: PCIe 3 is available only for config x4 or no GbE

Copyright © 2017 congatec AG MA50m17 19/60
4 Cooling Solutions
congatec AG offers the cooling solutions listed in Table 9 for conga-MA5. The dimensions of the cooling solutions are shown in the sub-sections.
All measurements are in millimeters.
Table 9 Cooling Solution Variants
Cooling Solution Part No Description
1 HSP 048057 Heatspreader with 2.7 mm bore-hole standoffs for lidded CPU Intel Atom CPU variants
048056 Heatspreader with M2.5 mm threaded standoffs for lidded Intel Atom CPU variants
048053 Heatspreader with 2.7 mm bore-hole standoffs for bare-die Intel Pentium and Celeron CPU variants
048052 Heatspreader with M2.5 mm threaded standoffs for bare-die Intel Pentium and Celeron CPU variants
2 CSP 048055 Passive cooling with 2.7 mm bore-hole standoffs for lidded Intel Atom CPU variants
048054 Passive cooling with M2.5 mm threaded standoffs for lidded Intel Atom CPU variants
048051 Passive cooling with 2.7 mm bore-hole standoffs for bare-die Intel Pentium and Celeron CPU variants
048050 Passive cooling with M2.5 mm threaded standoffs for bare-die Intel Pentium and Celeron CPU variants
Note
1. We recommend a maximum torque of 0.4 Nm for carrier board mounting screws.
2. The gap pad material used on congatec heatspreaders may contain silicon oil that can seep out over time depending on the environmental
conditions it is subjected to. For more information about this subject, contact your local congatec sales representative and request the gap
pad material manufacturer’s specification.
Caution
1. The congatec heatspreaders/cooling solutions are tested only within the commercial temperature range of 0° to 60°C. Therefore, if your
application that features a congatec heatspreader/cooling solution operates outside this temperature range, ensure the correct operating
temperature of the module is maintained at all times. This may require additional cooling components for your final application’s thermal
solution.
2. For adequate heat dissipation, use the mounting holes on the cooling solution to attach it to the module. Apply thread-locking fluid on
the screws if the cooling solution is used in a high shock and/or vibration environment. To prevent the standoff from stripping or cross-
threading, use non-threaded carrier board standoffs to mount threaded cooling solutions.
3. For applications that require vertically-mounted cooling solution, use only coolers that secure the thermal stacks with fixing post. Without
the fixing post feature, the thermal stacks may move.

Copyright © 2017 congatec AG MA50m17 20/60
4.1 CSP Dimensions
For Lidded Variants
25
21.4
55
84
M2.5 x 6 mm threaded standoff for threaded version
or
ø2.7 x 6 mm non-threaded standoff for borehole version