Congatec conga-IA3 User manual

conga-IA3 Thin Mini-ITX SBC
Detailed Description Of The congatec Thin Mini-ITX Based On 3rd Generation Intel Atom/Celeron SoC
User's Guide
Revision 1.0

Copyright © 2015 congatec AG IA30m10 2/82
Revision History
Revision Date (yyyy.mm.dd) Author Changes
0.1 2015.04.29 AEM •Preliminary release
1.0 2016.01.19 AEM •Corrected the AMI Aptio BIOS version in section 2.1 "Feature List".
•Added note about using symmetrical memory modules because of Bay Trail memory limitation.
•Official release

Copyright © 2015 congatec AG IA30m10 3/82
Preface
This user's guide provides information about the components, features and connectors available on the conga-IA3 Thin Mini-ITX Single Board
Computer.
Disclaimer
The information contained within this user’s guide, including but not limited to any product specification, is subject to change without notice.
congatec AG provides no warranty with regard to this user’s guide or any other information contained herein and hereby expressly disclaims
any implied warranties of merchantability or fitness for any particular purpose with regard to any of the foregoing. congatec AG assumes
no liability for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for
discrepancies between the product and the user’s guide. In no event shall congatec AG be liable for any incidental, consequential, special, or
exemplary damages, whether based on tort, contract or otherwise, arising out of or in connection with this user’s guide or any other information
contained herein or the use thereof.
Intended Audience
This user's guide is intended for technically qualified personnel. It is not intended for general audiences.
Lead-Free Designs (RoHS)
All congatec AG products are created from lead-free components and are completely RoHS compliant.
Electrostatic Sensitive Device
All electronic parts described in this user’s guide are electrostatic sensitive devices and are packaged accordingly. Do not open or handle a
carrier board or module except at an electrostatic-free workstation. Additionally, do not ship or store electronic devices near strong electrostatic,
electromagnetic, magnetic, or radioactive fields unless the device is contained within its original manufacturer’s packaging.

Copyright © 2015 congatec AG IA30m10 4/82
Symbols
The following symbols are used in this user's guide:
Warning
Warnings indicate conditions that, if not observed, can cause personal injury.
Caution
Cautions warn the user about how to prevent damage to hardware or loss of data.
Note
Notes call attention to important information that should be observed.
Connector Type
Describes the connector used on the Single Board Computer.
Copyright Notice
Copyright © 2015, congatec AG. All rights reserved. All text, pictures and graphics are protected by copyrights. No copying is permitted
without written permission from congatec AG.
congatec AG has made every attempt to ensure that the information in this document is accurate yet the information contained within is
supplied “as-is”.

Copyright © 2015 congatec AG IA30m10 5/82
Trademarks
Product names, logos, brands, and other trademarks featured or referred to within this user’s guide, or the congatec website, are the property
of their respective trademark holders. These trademark holders are not affiliated with congatec AG, our products, or our website.
Warranty
congatec AG makes no representation, warranty or guaranty, express or implied regarding the products except its standard form of limited
warranty (“Limited Warranty”) per the terms and conditions of the congatec entity, which the product is delivered from. These terms and
conditions can be downloaded from www.congatec.com. congatec AG may in its sole discretion modify its Limited Warranty at any time and
from time to time.
The products may include software. Use of the software is subject to the terms and conditions set out in the respective owner’s license
agreements, which are available at www.congatec.com and/or upon request.
Beginning on the date of shipment to its direct customer and continuing for the published warranty period, congatec AG represents that the
products are new and warrants that each product failing to function properly under normal use, due to a defect in materials or workmanship or
due to non conformance to the agreed upon specifications, will be repaired or exchanged, at congatec’s option and expense.
Customer will obtain a Return Material Authorization (“RMA”) number from congatec AG prior to returning the non conforming product freight
prepaid. congatec AG will pay for transporting the repaired or exchanged product to the customer.
Repaired, replaced or exchanged product will be warranted for the repair warranty period in effect as of the date the repaired, exchanged
or replaced product is shipped by congatec, or the remainder of the original warranty, whichever is longer. This Limited Warranty extends to
congatec’s direct customer only and is not assignable or transferable.
Except as set forth in writing in the Limited Warranty, congatec makes no performance representations, warranties, or guarantees, either
express or implied, oral or written, with respect to the products, including without limitation any implied warranty (a) of merchantability, (b) of
fitness for a particular purpose, or (c) arising from course of performance, course of dealing, or usage of trade.
congatec AG shall in no event be liable to the end user for collateral or consequential damages of any kind. congatec shall not otherwise be
liable for loss, damage or expense directly or indirectly arising from the use of the product or from any other cause. The sole and exclusive
remedy against congatec, whether a claim sound in contract, warranty, tort or any other legal theory, shall be repair or replacement of the
product only.
Certification
congatec AG is certified to DIN EN ISO 9001 standard.
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Copyright © 2015 congatec AG IA30m10 6/82
Technical Support
congatec AG technicians and engineers are committed to providing the best possible technical support for our customers so that our products
can be easily used and implemented. We request that you first visit our website at www.congatec.com for the latest documentation, utilities
and drivers, which have been made available to assist you. If you still require assistance after visiting our website then contact our technical
support department by email at [email protected]
Terminology
Term Description
PCI Express (PCIe) Peripheral Component Interface Express – next-generation high speed Serialized I/O bus
PCI Express Lane One PCI Express Lane is a set of 4 signals that contains two differential lines for
Transmitter and two differential lines for Receiver. Clocking information is embedded into the data stream.
x1, x2, x4, x16 x1 refers to one PCI Express Lane of basic bandwidth; x2 to a collection of two PCI Express Lanes; etc.. Also referred to as x1, x2, x4 or x16 link.
PCI Express Mini Card PCI Express Mini Card add-in card is a small size unique form factor optimized for mobile computing platforms.
MMCplus MMCplus was defined for first time in MMC System Specification v4.0. MMCplus is backward compatible with MMC. MMCplus has 13 pins.
SDIO card SDIO (Secure Digital Input Output) is a non-volatile memory card format developed for use in portable devices.
USB Universal Serial Bus
SATA Serial AT Attachment: serial-interface standard for hard disks
HDA High Definition Audio
S/PDIF S/PDIF (Sony/Philips Digital Interconnect Format) specifies a Data Link Layer protocol and choice of Physical Layer specifications for carrying
digital audio signals between devices and stereo components.
HDMI High Definition Multimedia Interface. Supports standard, enhanced, or high-definition video, plus multi-channel digital audio on a single cable.
TMDS Transition Minimized Differential Signaling. TMDS is a signaling interface defined by Silicon Image that is used for DVI and HDMI.
DVI Digital Visual Interface is a video interface standard developed by the Digital Display Working Group (DDWG).
LPC Low Pin-Count: a low speed interface used for peripheral circuits such as Super I/O controllers, which typically combine legacy device support into
a single IC.
I²C Bus Inter-Integrated Circuit Bus: is a simple two-wire bus with a software-defined protocol that was developed to provide the communications link
between integrated circuits in a system.
SM Bus System Management Bus: is a popular derivative of the I²C-bus.
CAN Controller Area Network
SPI Serial Peripheral Interface
GBE Gigabit Ethernet
LVDS Low-Voltage Differential Signaling
DDC Display Data Channel is an I²C bus interface between a display and a graphics adapter.
PN Part Number - the part number for placing orders.
N.C Not connected
N.A Not available
T.B.D To be determined

Copyright © 2015 congatec AG IA30m10 7/82
Contents
1 Introduction ............................................................................... 9
1.1 Mini-ITX Concept....................................................................... 9
1.2 conga-IA3 .................................................................................. 9
1.2.1 Options Information................................................................. 10
1.2.2 Optional Accessories/Cables................................................... 10
2 Specification ............................................................................ 12
2.1 Feature List .............................................................................. 12
2.2 Supported Operating Systems ................................................ 13
2.3 Mechanical Dimensions ........................................................... 14
2.4 Environmental Specifications................................................... 14
3 Block Diagram.......................................................................... 15
4 Cooling Solution ...................................................................... 16
4.1 Cooling Installation.................................................................. 17
4.2 Heatspreader ........................................................................... 18
5 Connector Description............................................................. 19
5.1 Power Supply ........................................................................... 19
5.1.1 DC Power Jack (Rear I/O) ........................................................ 19
5.1.2 Power Supply (Internal Connector) .......................................... 20
5.1.3 Optional SBM3Power Connector (Internal Connector) ........... 20
5.1.3.1 Optional SBM3 Signal Connector............................................ 21
5.1.4 PWR_OK Signal........................................................................ 22
5.1.5 Power Status LEDs ................................................................... 22
5.2 CMOS Battery/RTC.................................................................. 23
5.3 Audio Interfaces....................................................................... 23
5.3.1 Rear Audio Connectors............................................................ 23
5.3.2 Internal Audio Connectors....................................................... 24
5.3.2.1 Stereo Speaker Header............................................................ 24
5.3.2.2 Digital Microphone/SPDIF ....................................................... 25
5.3.2.3 Front Panel HD Audio.............................................................. 25
5.4 Communication Bus................................................................. 26
5.4.1 SMBus...................................................................................... 26
5.4.2 I²C Bus .................................................................................... 26
5.4.3 SPI Bus ..................................................................................... 26
5.5 Universal Serial Bus (USB) ........................................................ 27
5.5.1 Rear USB Connectors............................................................... 27
5.5.2 Internal USB Connectors.......................................................... 28
5.6 Ethernet 10/100/1000.............................................................. 29
5.7 SATA Interfaces........................................................................ 30
5.7.1 Standard SATA Ports................................................................ 30
5.7.2 SATA Power ............................................................................. 31
5.7.3 Mini SATA................................................................................. 31
5.8 Display Interfaces..................................................................... 33
5.8.1 Display Port Interface DP++ .................................................... 33
5.8.2 LVDS......................................................................................... 33
5.8.3 Embedded Display Port (eDP) ................................................. 35
5.8.3.1 Backlight Power Connector ..................................................... 36
5.8.3.2 Backlight/Panel Power Selection ............................................. 37
5.8.3.3 Monitor OFF connector ........................................................... 38
5.9 PCI Express ............................................................................. 38
5.9.1 x1 PCIe Slot.............................................................................. 38
5.9.2 Mini PCIe (Half Size) ................................................................ 39
5.9.3 Mini PCIe (Full Size).................................................................. 41
5.9.4 PCI Express Routing................................................................. 42
6 Additional Features.................................................................. 43
6.1 Front Panel Connector............................................................. 43
6.2 Case Open Intrusion Connector .............................................. 44
6.3 Trusted Platform Module – TPM (Optional) ............................. 44
6.4 congatec Board Controller (cBC) ............................................. 44
6.4.1 Fan Control .............................................................................. 44
6.4.2 GPIs.......................................................................................... 45
6.4.3 Power Loss Control.................................................................. 45
6.4.4 Board Information.................................................................... 45
6.5 LPC Super I/O Device.............................................................. 45
6.5.1 Serial Ports (COM) ................................................................... 45
6.5.2 GPOs........................................................................................ 46
6.5.3 CPU/System Fan Connector & Power Configuration............... 46
6.6 OEM BIOS Customization........................................................ 47

Copyright © 2015 congatec AG IA30m10 8/82
6.6.1 OEM Default Settings .............................................................. 47
6.6.2 OEM Boot Logo....................................................................... 47
6.6.3 OEM POST Logo ..................................................................... 47
6.6.4 OEM BIOS Code/Data............................................................. 48
6.6.5 OEM DXE Driver...................................................................... 48
6.7 congatec Battery Management Interface ................................ 48
6.8 API Support (CGOS) ................................................................ 49
6.9 GPIOs....................................................................................... 49
6.10 Thermal/Voltage Monitoring.................................................... 49
6.11 Beeper ..................................................................................... 49
6.12 External System Wake Event ................................................... 49
6.13 Feature Connector................................................................... 50
7 conga-IA3 Mechanical Drawing............................................... 51
8 BIOS Setup Description........................................................... 52
8.1 Entering the BIOS Setup Program........................................... 52
8.1.1 Boot Selection Popup.............................................................. 52
8.2 Setup Menu and Navigation.................................................... 52
8.3 Main Setup Screen................................................................... 53
8.4 Advanced Setup ...................................................................... 54
8.4.1 Watchdog Submenu ................................................................ 55
8.4.2 Graphics Submenu................................................................... 57
8.4.3 Hardware Health Monitoring Submenu ................................... 58
8.4.4 Trusted Computing Submenu.................................................. 59
8.4.5 RTC Wake Submenu................................................................ 59
8.4.6 Reserve Legacy Interrupt Submenu......................................... 59
8.4.7 ACPI Submenu......................................................................... 60
8.4.8 SIO Submenu........................................................................... 60
8.4.8.1 Serial Port 1 Submenu ............................................................. 60
8.4.8.2 Serial Port 2 Submenu ............................................................. 61
8.4.9 Intel(R) Smart Connect Technology Submenu ......................... 61
8.4.10 Serial Port Console Redirection Submenu............................... 62
8.4.10.1 Console Redirection Settings COM0 Submenu....................... 62
8.4.10.2 Console Redirection Settings Out-of-Band Management
Submenu 63
8.4.11 CPU Configuration Submenu................................................... 63
8.4.11.1 Socket 0 CPU Information Submenu ....................................... 64
8.4.11.2 CPU Thermal Configuration Submenu..................................... 64
8.4.12 PPM Configuration Submenu .................................................. 64
8.4.13 Thermal Configuration Submenu............................................. 65
8.4.14 IDE Configuration Submenu.................................................... 66
8.4.15 Miscellaneous Configuration Submenu ................................... 66
8.4.16 SCC Configuration Submenu................................................... 67
8.4.17 PCI Subsystem Setting Submenu ............................................ 67
8.4.17.1 PCI Express Setting Submenu ................................................. 68
8.4.18 PCI Express GEN 2 Settings Submenu .................................... 69
8.4.19 Network Stack.......................................................................... 70
8.4.20 CSM Submenu......................................................................... 70
8.4.21 SDIO Submenu ........................................................................ 71
8.4.22 USB Submenu.......................................................................... 71
8.4.23 Platform Trust Technology ....................................................... 71
8.4.24 Security Configuration ............................................................. 72
8.4.25 Intel(R) Ethernet Connection I210 Submenu ........................... 72
8.4.25.1 NIC Configuration Submenu ................................................... 73
8.4.26 Driver Health Submenu............................................................ 73
8.4.26.1 Intel(R) PRO/1000 Submenu .................................................... 73
8.5 Chipset Setup .......................................................................... 73
8.5.1 North Bridge Submenu............................................................ 73
8.5.2 South Bridge Submenu............................................................ 74
8.5.2.1 Azalia HD Audio....................................................................... 74
8.5.2.2 USB Submenu.......................................................................... 75
8.5.2.3 PCI Express Configuration Submenu....................................... 76
8.6 Boot Setup............................................................................... 76
8.6.1 Boot Settings Configuration .................................................... 76
8.7 Security Setup.......................................................................... 78
8.7.1 Security Settings ...................................................................... 78
8.7.2 Hard Disk Security.................................................................... 78
8.8 Save & Exit Menu..................................................................... 78
9 Additional BIOS Features ........................................................ 79
9.1 Supported Flash Devices ......................................................... 79
9.2 Updating the BIOS................................................................... 79
10 Industry Specifications ............................................................. 80

Copyright © 2015 congatec AG IA30m10 9/82
1 Introduction
1.1 Mini-ITX Concept
The Mini-ITX form factor provides enthusiasts and manufacturers with a standardized ultra compact platform for development. With a footprint
of 170mm x170mm, this scalable platform promotes the design of highly integrated, energy efficient systems. Due to its small size, the Mini-ITX
form factor enables PC appliance designers not only to design attractive low cost devices but also allows them to explore a huge variety of
product development options - from compact space-saving designs to fully functional Information Station and Value PC systems. This helps to
reduce product design cycle and encourages rapid innovation in system design, to meet the ever-changing needs of the market.
Additionally, the boards can also be passively cooled, presenting opportunities for fanless designs. The Mini-ITX boards are equipped with
various interfaces such as PCI Express, SATA, USB 2.0/3.0, Ethernet, Displays and Audio.
1.2 conga-IA3
The conga-IA3 is a Single Board Computer designed based on the Thin Mini-ITX specification. The conga-IA3 SBC features the Intel 3rd
generation Atom/Celeron processors. With maximum 10W TDP processors, the SBC offers Ultra Low Power boards with high computing
performance and outstanding graphics. Additionally, the SBC supports dual channel DDR3L up to 1333 MT/s for a maximum system memory
capacity of 16 GB, multiple I/O interfaces, up to two independent displays and various congatec embedded features.
With smaller board size and lower height keep-out zones, the conga-IA3 SBC provides manufacturers and enthusiasts with the opportunity to
design compact systems for space restricted areas. With appropriate I/O shield, the same conga-IA3 SBC can be used in either a Thin Mini-ITX
or a Mini-ITX design.
The various features and capabilities offered by the conga-IA3 makes it ideal for the design of compact, energy efficient, performance-oriented
embedded systems.

Copyright © 2015 congatec AG IA30m10 10/82
1.2.1 Options Information
The conga-IA3 is currently available in four variants. This user’s guide describes all of these variants. The tables below show the different
configurations available. Check for the Part No. that applies to your product. This will tell you what options described in this user’s guide are
available on your particular module
conga-IA3
Part-No. 052300 052301 052310 052311
Processor Intel®Atom™ E3845 1.91 GHz
Quad Core™
Intel®Atom™ E3826 1.46 GHz
Dual Core™
Intel®Celeron™ J1900 2.0 GHz
Quad Core™
Intel®Celeron™ N2930 1.83 GHz
Quad Core™
L2 Cache 2 MByte 1 MByte 2 MByte 2 MByte
Burst Frequency N/A N/A 2.41 GHz 2.16 GHz
Memory (DDR3L) 1333 MT/s dual channel 1066 MT/s dual channel 1333 MT/s dual channel 1333 MT/s dual channel
Processor Graphics Intel®HD Graphics (GT1) Intel®HD Graphics (GT1) Intel®HD Graphics (GT1) Intel®HD Graphics (GT1)
Graphics Base/Burst Freq. 542 / 792 MHz 533 / 667 MHz 688 / 854 MHz 313 / 854 MHz
VGA No No No No
LVDS Single/Dual 18/24bit Single/Dual 18/24bit Single/Dual 18/24bit Single/Dual 18/24bit
DDI DP / HDMI / DVI DP / HDMI / DVI DP / HDMI / DVI DP / HDMI / DVI
Processor TDP (Max) 10 W 7 W 10 W 7.5 W *
* Scenario Design Power (SDP) of 4.5W
1.2.2 Optional Accessories/Cables
Accessories Part No. Description
conga-IA30/CSP 052351 Passive cooling solution with Thin Mini-ITX height (for conga-IA3)
conga-IA30/Retention Frame 052355 Retention frame for conga-IA3 standard cooling
conga-IA30/IO Bracket Standard Size 052356 IO shield for conga-IA3 with Mini-ITX height
conga-IA30/IO Bracket Thin Size 052357 IO shield for conga-IA3 with Thin Mini-ITX height
DDR3L-SODIMM-1600 (2 GB) 068755 Certified 2 GB DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S)
DDR3L-SODIMM-1600 (4 GB) 068756 Certified 4 GB DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S)
DDR3L-SODIMM-1600 (8 GB) 068757 Certified 8 GB DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S)

Copyright © 2015 congatec AG IA30m10 11/82
Cables Part No. Description
cab-ThinMini-ITX-SATA-Power 14000120 Power cable for SATA and micro-SATA devices.
cab-ThinMini-ITX-UART 14000121 UART cable with 2x5 pin female housing and D-Sub Male connector.
cab-ThinMini-ITX-USB2.0-Single 14000122 USB 2.0 cable with 1x5 pin female housing and USB 2.0 Type A female connector.
cab-ThinMini-ITX-USB2.0-Twin 14000123 USB 2.0 cable with Twin USB 2.0 Type A female connector and 2x5 pin Housing.
cab-ThinMini-ITX-USB3.0-Twin 14000124 USB 3.0 cable with Twin USB 3.0 Type A female connector and 2x10 pin Housing.
cab-ThinMini-ITX-LVDS-Open End 14000125 ACES 40 pin LVDS cable with open end.
cab-ThinMini-ITX-BKLT 14000127 CHYAO SHIUNN 8 pin Backlight cable with open end.
cab-ThinMini-ITX-LVDS 14000129 ACES 50204-40 LVDS cable for Thin Mini-ITX.
cab-DP to HDMI 14000128 20 pin male DisplayPort to 19 pin female HDMI
cab-ThinMini-ITX-SATA-Power (50cm lenght) 14000135 50cm SATA power cable with 2x15 pin female connectors.
cab-ThinMini-ITX-SATA-Power (30cm length) 14000136 30cm SATA power cable with 2x15 pin female connectors.
SATA III cable (straight/straight) 48000029 30cm SATA III data cable with straight/straight connectors
SATA III cable (straight/right-angled) 48000030 30cm SATA III data cable with straight/right-angled connectors

Copyright © 2015 congatec AG IA30m10 12/82
2 Specification
2.1 Feature List
Table 1 Feature Summary
Form Factor Based on Thin Mini-ITX form factor (170 x 170 mm).
Processor Intel®3rd Generation Atom/Celeron SoC
Memory 2x SO-DIMM dual channel non-ECC DDR3L memory, up to 1333 MT/s with 16GB maximum capacity. Sockets located top side of module.
cBC Multi-stage watchdog, non-volatile user data storage, manufacturing and board information, board statistics, I2C bus, Power loss control.
Chipset Integrated in the SoC
Audio Realthek ALC888s 7.1 channel High Definition Audio codec
Ethernet 2x Gigabit Ethernet support via the onboard Intel®I210/I211 Phy.
Graphics Intel®HD Graphics with support for DirectX11, OpenGL 3.0, OpenCL 1.2, OpenGLES 2.0, full HW acceleration for decode/encode of MPEG2, H.264,
MVC and dual simultaneous display support and support for dual simultaneous displays.
Graphic Interfaces 1x DD1 (DP, HDMI/DVI) and 1x eDP/LVDS
Back Panel I/O
Connectors
1x DisplayPort ++ (DP++). Supports DP/DVI/HDMI
-1x HDMI 1.4: Multiplexed with DisplayPort (DP)/DVI. Hot-plug
detect support.
-1x DVI: Multiplexed with HDMI/DP ports. Hot-Plug detect
support.
1x VGA
1x Audio OUT/MIC
2x Gigabit Ethernet (without AMT)
2x USB 2.0
2x USB 3.0
1x DC-IN
Onboard I/O
Connectors
1x LVDS (top side)
1x eDP interface (bottom side)
1x Backlight
1x Monitor OFF
SATA Interfaces
-2x Standard SATA II (3.0 Gb/s).
-1x mini SATA II (shared with mini PCIe Slot )
-1x SATA power header connector (3.3V, 5V or 12V)
PCI Express Interfaces
-1x PCI Express®Slot (x1 Gen 2 link).
-1x Hall size mini PCIe Slot
-1x Full size mini PCIe Slot (shared with mSATA)
-optional SIM card slot via connector X6 (Full size mPCIe/mSATA)
2x USB 2.0
2x USB 3.0
1x MicroSD slot (located at the bottom side)
1x Front panel HD audio
1x SPDIF/Digital microphone
1x Stereo speaker
Connectors supported via Super IO
-2x COM ports (COM 1 can be used optionally as ccTALK)
-1x CPU fan with selectable voltage
-1x System fan with selectable voltage
-1x Case Open Intrusion Detection header
-GPOs on feature connector
Feature connector (GPIOs, SPI, SMB, LPC, LID/SLEEP etc)
1x Front panel header (Power button, reset, LEDs etc)
1x optional SBM3support header
1x Internal power header (12-24V)
1x optional SBM3power
Other Features Thermal and voltage monitoring
CMOS Battery
Beeper
congatec Standard BIOS (also possible to boot from an external BIOS by triggering the BIOS_DISABLE# signal on the feature connector)

Copyright © 2015 congatec AG IA30m10 13/82
BIOS AMI Aptio®UEFI 5.x firmware, 8/16 MByte serial SPI with congatec Embedded BIOS features.
Power
Management
ACPI 4.0 compliant with battery support. Also supports Suspend to RAM (S3).
Configurable TDP
Ultra low standby power consumption, Deep Sx.
Security Optional discrete Trusted Platform Module “TPM 1.2/2.0”, new AES Instructions for faster and better encryption.
Note
Some of the features mentioned in the above feature summary are optional. Check the article number of your module and compare it to the
option information list on page 11 of this user’s guide to determine what options are available on your particular module.
The conga-IA3 supports only DDR3L memory modules and the memory modules in the sockets must be symmetrical - that is, same raw
cards and same memory sizes. This is because the Bay Trail SoC on the conga-IA3 does not support mixed raw cards or same raw cards with
mixed memory sizes. Although the conga-IA3 might boot up with asymmetrical memory modules, this may however cause memory errors or
instabilities. Therefore use only symmetrical DDR3L memory modules on the conga-IA3 and also make sure the memory module supports the
data transfer rate of the particular variant.
In addition, if you use only one memory module then you must insert this memory module only in the first memory slot of the conga-IA3
(top side). Due to the Bay Trail architecture, the conga-IA3 will ignore the second memory socket (bottom side) if the first memory slot is
not populated. This means that you cannot boot up the conga-IA3 if the first memory slot is empty. See the Bay Trail datasheet for more
information.
2.2 Supported Operating Systems
The conga-IA3 supports the following operating systems.
•Microsoft®Windows® 8
•Microsoft®Windows®7
•Microsoft®Windows®7/8 Embedded Standard
•Linux
Note
Intel does not currently provide validated eMMC and SD drivers for Win 7/WES7.
For the installation of Windows 7/8 and WES7/8, congatec AG requires a minimum storage capacity of 16 GB. congatec will not offer support
for systems with less than 16 GB storage space.

Copyright © 2015 congatec AG IA30m10 14/82
2.3 Mechanical Dimensions
•170mm x 170mm
•Height approximately 20mm
2.4 Environmental Specifications
Temperature Operation: 0° to 60°C Storage: -20° to +80°C
Humidity Operation: 10% to 90% Storage: 5% to 95%
Note
The above operating temperatures must be strictly adhered to at all times. Humidity specifications are for non-condensing conditions.

Copyright © 2015 congatec AG IA30m10 15/82
3 Block Diagram
*1The mSATA/mPCIe connector supports both mPCIe
and mSATA devices. The devices are detected automatically.
*2Located at the bottom side.
*3Optional feature.
2x SO-DIMM DDR3L
LPC
HDA
Speaker
HD Audio
ALC888S
congatec
Board Controller
4-wire
System FAN
2x USB 3.0
Front Panel
HD Audio
4-wire
CPU FAN
Intrusion
Header
SBM
3
Batt. Mgmt *
3
Feature
Connector
UART 0
UART 1
ccTALK *
3
Super I/O
Reverse Polarity
Protection
TPM
External I/O
Power IN
Internal I/O
SPI Flash
SATA1
mSATA/mPCIe *
1
PCIe x1 Slot
mPCIe (half-size)
SATA0
PCIe
PCIe
i211
USB Hub
USB Hub
i211
eDP to LVDS
Ethernet
Ethernet
DP++
VGA
Audio OUT/MIC
Buzzer
Internal speaker
Digital Mic
USB2.0
SPI
eDP *
2
LVDS
DDI1
DDI0
VGA
2x24 bit
LVDS
2x USB3.0
2x USB2.0
USB3.0
SATA0
SATA1
PCIe0
PCIe1
2x USB3.0
Front Panel
Micro SD Card *
3
SATA Power
Power IN
Backlight
SPDIF Out
Intel Bay Trail SoC
Memory Controller
Tri-gate 3D 22nm Single/Dual/Quad Core
1MB L2 Cache Shared By 2 Cores
64 Architecture
SSE4.2 AES-NI Thermal Mgmt.
Virtualization (VT-x)
3D
Multimedia Features
DisplayPort 1.2
Dual Channel Low Power
HDMI 1.4 (3D, 4k)
embedded DP VGA
Display Interfaces
COMPUTE UNIT
SoC TRANSACTION ROUTER
OCL 1.2
MPEG-2 OpenCL 1.2
H.264 OpenGL 3.0
WMV9 OpenGLES 2.0
MJPEG DirectX 11
INTEGRATED I/O
SATA
High Definition Audio
USB 2.0
LPC BusPCIe
I/O Interfaces
GPIOs
USB 3.0

Copyright © 2015 congatec AG IA30m10 16/82
4 Cooling Solution
The conga-IA3 SBC offers Ultra Low Power boards with high computing performance and outstanding graphics. Due to its low power
consumption, the SBC generates less heat and therefore requires less active cooling, allowing the use of quieter, lower profile coolers that are
better suited to small form factor systems.
Nonetheless, all electronics contain semiconductor devices which have operating temperature ranges that should be adhered to. This means
that for reliable operation, the thermal design of the conga-IA3 must be carefully considered. For this reason, it is imperative to provide
sufficient air flow to each of the components, to ensure the specified operating temperature of the conga-IA3 is maintained.
congatec AG offers two cooling possibilities for the conga-IA3:
•A congatec heatspreader in combination with the conga-IA3 retention frame. This cooling solution is adapted to the Thin Mini-ITX
height specification and features a Hi-Flow 225UT pressure sensitive, phase change thermal interface. Refer to section 4.2 “Heatspreader
Dimensions” for the dimensions of the congatec heatspreader.
•The use of a custom cooling solution in combination with the conga-IA3 retention frame.
Note
When a passive cooling is used, the end user must ensure that adequate air flow is maintained.
See section 1.2.2 “Optional Accessories/Cables” for the part numbers of the cooling accessories.
Heatspreader Retention Frame

Copyright © 2015 congatec AG IA30m10 17/82
4.1 Cooling Installation
Assembly Instruction:
•Flip over the SBC and locate the position of the CPU
•Place retention frame on the bottom side of the board with insulating foil facing the PCB and standoffs inserted to PCB mounting holes.
•Remove the heatspreader's protection pull tab foil from the phase changer and carefully place the heatspreader to the CPU.
•Insert assembling screws.
•Hold the heatspreader with one hand so that it does not tilt while tightening the screws.
•Slightly tighten each of the 4 screws so that they hold the heatspreader in place. To do so, start with one screw and then slightly tighten the
other screws in a crossover pattern. All the while keep holding the cooling adapter straight with one hand.
•Now you can fully tighten the screws. Once again start with one and then continue to tighten the other screws in a crossover pattern. All the
while keep holding the cooling adapter straight with one hand
Caution
congatec cooling solutions have been specifically designed for use within commercial temperature ranges (0° to 60°C) only. It is the responsibility
of the end user to design an optimized thermal solution that meets the needs of their application within the industrial environmental conditions
it is required to operate in. Attention must be given to the mounting solution used to mount the cooling solution and SBC into the system
chassis.

Copyright © 2015 congatec AG IA30m10 18/82
4.2 Heatspreader
Note
All measurements are in millimeters. Torque specification for cooling solution screws is 0.6 Nm. Mechanical system assembly mounting shall
follow the valid DIN/IS0 specifications.
Caution
When using the heatspreader in a high shock and/or vibration environment, congatec recommends the use of a thread-locking fluid on the
cooling solution screws to ensure the above mentioned torque specification is maintained.

Copyright © 2015 congatec AG IA30m10 19/82
5 Connector Description
5.1 Power Supply
You can power the conga-IA3 SBC with a 12V-24V laptop type DC power supply (on connector X43) or a 4 pin internal power supply (on
connector X44).
Additionally, the SBC offers an optional SBM3power connector (only BOM option). When this connector (X45) is populated, you can power the
SBC with it.
Note
The supplied voltages must be within a tolerance of ± 10%
5.1.1 DC Power Jack (Rear I/O)
The conga-IA3 SBC can be powered from a laptop type external power supply connected to the DC power jack on the rear I/O. This power
input protects against polarity reversal and over/under voltage.
Connector X43 Pinout Description
Pin Function
Inner Shell +12 - 24V
Outer Shell GND
Connector Type
X43 : DC Power Jack, 7.4x5.1mm Diameter
Note
The default conga-IA3 BIOS configuration enables the system to boot-up immediately an external is supplied.
Caution
The absolute maximum rating of the input voltage is 36 volts. Do not exceed this rating or expose the conga-IA3 to the absolute maximum
voltage for a prolonged time. Doing so may damage the system or affect system reliability.
DC Plug 1 = + DC (12-24V)
2 = GND
12-24 V max. 120 Watt
Plug: 7.4 x 5.0 mm
+
-
inner
outer
center
DC Power Jack - Connector X43

Copyright © 2015 congatec AG IA30m10 20/82
5.1.2 Power Supply (Internal Connector)
The conga-IA3 offers an internal 4-pin power connector. This connector makes it possible to use customized power supply cables/connector
and also offers under/over voltage protection to the input voltage.
Connector X44 Pinout Description
Pin Signal Description
1 GND Ground
2 GND Ground
3 +12V - 24V Power Supply +12V-24V
4 +12V - 24V Power Supply +12V-24V
Connector Type
X44 : 4 Pos, Pitch 4.2mm Internal Power Connector (PN: 41500079).
Mating Connector: A possible mating connector for X44 is the Molex 39-01-2045.
Note
The default conga-IA3 BIOS configuration enables the system to boot-up immediately an external is supplied.
Caution
The absolute maximum rating of the input voltage is 36 volts. Do not exceed this rating or expose the conga-IA3 to the absolute maximum
voltage for a prolonged time. Doing so may damage the system or affect system reliability.
5.1.3 Optional SBM3Power Connector (Internal Connector)
You can also power the conga-IA3 SBC optionally with an SBM battery kit. The battery kit requires two connections - the SBM battery power
on connector X50 and the SBM battery signals on connector X45. The SBM3feature requires a firmware update.
Internal Power Connector X44
1
2
3
4