Congatec conga-TCA 047001 User manual

COM Express™ conga-TCA
2nd Generation Dual Core Intel®Atom™ processor with an Intel®NM10 express chipset
User’s Guide
Revision 1.0

Copyright © 2012 congatec AG TCEDm10 2/94
Revision History
Revision Date (yyyy.mm.dd) Author Changes
0.1 2012.08.27 AEM • Preliminary release
0.2 2013.03.13 AEM • Added Microsoft Windows 8 support in section 1.2 “Supported Operating System“.
• Updated section 1.3 “Mechanical Dimension” and section 3 “Heatspreader” to reect the actual heatspreader thickness of 4mm.
• Corrected the statement that the Intel® CG82NM10 (NM10) PCH found on the conga-TCA offers a single channel LVDS interface in
section 4.1.10 “LCD”.
• Updated section 4.1.14 “Power Control”.
• Deleted the wake event signal “PME#” from section 6.4 “ACPI Suspend Modes and Resume Events” because this signal is not supported
in COM Express type 6 specication.
• Updated section 9 “BIOS Setup Description”.
• Added BIOS binary size in section 10 “Additional BIOS Features”.
• Added section 10.1 “Supported Flash Devices”.
1.0 2013.08.09 AEM • Updated section 9 “BIOS Setup Description”.
• Updated section 10.1 “Supported Flash Devices”.
• Ofcial release

Copyright © 2012 congatec AG TCEDm10 3/94
Preface
This user’s guide provides information about the components, features, connectors and BIOS Setup menus available on the conga-TCA. It is
one of three documents that should be referred to when designing a COM Express™ application. The other reference documents that should
be used include the following:
COM Express™ Design Guide
COM Express™ Specication
The links to these documents can be found on the congatec AG website at www.congatec.com
Disclaimer
The information contained within this user’s guide, including but not limited to any product specication, is subject to change without notice.
congatec AG provides no warranty with regard to this user’s guide or any other information contained herein and hereby expressly disclaims
any implied warranties of merchantability or tness for any particular purpose with regard to any of the foregoing. congatec AG assumes
no liability for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for
discrepancies between the product and the user’s guide. In no event shall congatec AG be liable for any incidental, consequential, special, or
exemplary damages, whether based on tort, contract or otherwise, arising out of or in connection with this user’s guide or any other information
contained herein or the use thereof.
Intended Audience
This user’s guide is intended for technically qualied personnel. It is not intended for general audiences.
Lead-Free Designs (RoHS)
All congatec AG designs are created from lead-free components and are completely RoHS compliant.
Electrostatic Sensitive Device
All congatec AG products are electrostatic sensitive devices and are packaged accordingly. Do not open or handle a congatec AG product
except at an electrostatic-free workstation. Additionally, do not ship or store congatec AG products near strong electrostatic, electromagnetic,
magnetic, or radioactive elds unless the device is contained within its original manufacturer’s packaging. Be aware that failure to comply with
these guidelines will void the congatec AG Limited Warranty.

Copyright © 2012 congatec AG TCEDm10 4/94
Symbols
The following symbols are used in this user’s guide:
Warning
Warnings indicate conditions that, if not observed, can cause personal injury.
Caution
Cautions warn the user about how to prevent damage to hardware or loss of data.
Note
Notes call attention to important information that should be observed.
Terminology
Term Description
GB Gigabyte (1,073,741,824 bytes)
GHz Gigahertz (one billion hertz)
kB Kilobyte (1024 bytes)
MB Megabyte (1,048,576 bytes)
Mbit Megabit (1,048,576 bits)
kHz Kilohertz (one thousand hertz)
MHz Megahertz (one million hertz)
TDP Thermal Design Power
PCIe PCI Express
SATA Serial ATA
PEG PCI Express Graphics
PCH Platform Controller Hub
PATA Parallel ATA
T.O.M. Top of memory = max. DRAM installed
HDA High Denition Audio
I/F Interface
N.C. Not connected
N.A. Not available
TBD To be determined

Copyright © 2012 congatec AG TCEDm10 5/94
Trademarks
Product names, logos, brands, and other trademarks featured or referred to within this user’s guide, or the congatec website, are the property
of their respective trademark holders. These trademark holders are not afliated with congatec AG, our products, or our website.
Warranty
congatec AG makes no representation, warranty or guaranty, express or implied regarding the products except its standard form of limited
warranty (“Limited Warranty”). congatec AG may in its sole discretion modify its Limited Warranty at any time and from time to time.
Beginning on the date of shipment to its direct customer and continuing for the published warranty period, congatec AG represents that the
products are new and warrants that each product failing to function properly under normal use, due to a defect in materials or workmanship or
due to non conformance to the agreed upon specications, will be repaired or exchanged, at congatec AG’s option and expense.
Customer will obtain a Return Material Authorization (“RMA”) number from congatec AG prior to returning the non conforming product freight
prepaid. congatec AG will pay for transporting the repaired or exchanged product to the customer.
Repaired, replaced or exchanged product will be warranted for the repair warranty period in effect as of the date the repaired, exchanged or
replaced product is shipped by congatec AG, or the remainder of the original warranty, whichever is longer. This Limited Warranty extends to
congatec AG’s direct customer only and is not assignable or transferable.
Except as set forth in writing in the Limited Warranty, congatec AG makes no performance representations, warranties, or guarantees, either
express or implied, oral or written, with respect to the products, including without limitation any implied warranty (a) of merchantability, (b) of
tness for a particular purpose, or (c) arising from course of performance, course of dealing, or usage of trade.
congatec AG shall in no event be liable to the end user for collateral or consequential damages of any kind. congatec AG shall not otherwise
be liable for loss, damage or expense directly or indirectly arising from the use of the product or from any other cause. The sole and exclusive
remedy against congatec AG, whether a claim sound in contract, warranty, tort or any other legal theory, shall be repair or replacement of the
product only

Copyright © 2012 congatec AG TCEDm10 6/94
COM Express™ Concept
COM Express™ is an open industry standard dened specically for COMs (computer on modules). It’s creation provides the ability to make a
smooth transition from legacy parallel interfaces to the newest technologies based on serial buses available today. COM Express™ modules
are available in following form factors:
• Compact 95mm x 95mm
• Basic 125mm x 95mm
• Extended 155mm x 110mm
The COM Express™ specication 2.0 denes seven different pinout types.
Types Connector Rows PCI Express Lanes PCI IDE Channels LAN ports
Type 1 A-B Up to 6 1
Type 2 A-B C-D Up to 22 32 bit 1 1
Type 3 A-B C-D Up to 22 32 bit 3
Type 4 A-B C-D Up to 32 1 1
Type 5 A-B C-D Up to 32 3
Type 6 A-B C-D Up to 24 1
Type 10 A-B Up to 4 1
conga-TCA module utilize the Type 6 pinout denition. They are equipped with two high performance connectors that ensure stable data
throughput.
The COM (computer on module) integrates all the core components and is mounted onto an application specic carrier board. COM modules
are a legacy-free design (no Super I/O, PS/2 keyboard and mouse) and provide most of the functional requirements for any application. These
functions include, but are not limited to, a rich complement of contemporary high bandwidth serial interfaces such as PCI Express, Serial ATA,
USB 2.0, and Gigabit Ethernet. The Type 6 pinout provides the ability to offer PCI Express, Serial ATA, and LPC options thereby expanding
the range of potential peripherals. The robust thermal and mechanical concept, combined with extended power-management capabilities, is
perfectly suited for all applications.
Carrier board designers can utilize as little or as many of the I/O interfaces as deemed necessary. The carrier board can therefore provide all
the interface connectors required to attach the system to the application specic peripherals. This versatility allows the designer to create a
dense and optimized package, which results in a more reliable product while simplifying system integration. Most importantly, COM Express™
modules are scalable, which means once an application has been created there is the ability to diversify the product range through the use of
different performance class or form factor size modules. Simply unplug one module and replace it with another, no redesign is necessary.

Copyright © 2012 congatec AG TCEDm10 7/94
Certication
congatec AG is certied to DIN EN ISO 9001 standard.
Technical Support
congatec AG technicians and engineers are committed to providing the best possible technical support for our customers so that our products
can be easily used and implemented. We request that you rst visit our website at www.congatec.com for the latest documentation, utilities and
drivers, which have been made available to assist you. If you still require assistance after visiting our website then contact our technical support
department by email at [email protected]
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Copyright © 2012 congatec AG TCEDm10 8/94
conga-TCA Options Information
The conga-TCA is available in four different variants. This user’s guide describes all of these variants. The table below shows the different
congurations available. Check for the Part No. that applies to your product. This will tell you what options described in this user’s guide are
available on your particular module.
conga-TCA
Part-No. 047001 047002 047003 047004
Processor Intel® Atom™ N2600 Dual Core
1.60 GHz
Intel® Atom™ N2800 Dual Core
1.86 GHz
Intel® Atom™ D2550 Dual Core
1.86 GHz
Intel® Atom™ D2550 (USB 3.0) Dual Core
1.86 GHz
L2 Cache 1 MByte 1 MByte 1 MByte 1 MByte
PEG No No No No
SDVO No No No No
DisplayPort (DP) Yes Yes Yes Yes
HDMI Yes Yes Yes Yes
Processor TDP 3.5 W 6.5 W 10 W 10 W

Copyright © 2012 congatec AG TCEDm10 9/94
Contents
1 Specications...........................................................................12
1.1 Feature List..............................................................................12
1.2 Supported Operating Systems.................................................13
1.3 Mechanical Dimensions...........................................................13
1.4 Supply Voltage Standard Power..............................................14
1.4.1 Electrical Characteristics..........................................................14
1.4.2 Rise Time .................................................................................14
1.5 Power Consumption.................................................................15
1.5.1 conga-TCA Intel® Atom™ N2600 Dual Core 1.6 GHz 1MB Cache
16
1.5.2 conga-TCA Intel® Atom™ N2800 Dual Core 1.86 GHz 1MB Cache
16
1.5.3 conga-TCA Intel® Atom™ D2550 Dual Core 1.86 GHz 1MB Cache
17
1.5.4 conga-TCA Intel® Atom™ D2550 (USB 3.0) Dual Core 1.86 GHz
1MB Cache..............................................................................17
1.6 Supply Voltage Battery Power .................................................18
1.6.1 CMOS Battery Power Consumption ........................................18
1.7 Environmental Specications...................................................18
2 Block Diagram..........................................................................19
3 Heatspreader...........................................................................20
3.1 Heatspreader Dimensions .......................................................21
4 Connector Subsystems Rows A, B, C, D .................................22
4.1 Primary Connector Rows A and B............................................23
4.1.1 Serial ATA™ (SATA).................................................................23
4.1.2 USB 2.0....................................................................................23
4.1.3 High Denition Audio (HDA) Interface......................................23
4.1.4 Gigabit Ethernet ......................................................................23
4.1.5 LPC Bus...................................................................................24
4.1.6 I²C Bus Fast mode ...................................................................24
4.1.7 PCI Express™ .........................................................................24
4.1.8 ExpressCard™.........................................................................24
4.1.9 Graphics Output (VGA/CRT) ...................................................24
4.1.10 LCD..........................................................................................25
4.1.11 SPI...........................................................................................25
4.1.12 General Purpose Serial Interface.............................................25
4.1.13 General Purpose Input/Output.................................................25
4.1.14 Power Control..........................................................................26
4.1.15 Power Management.................................................................28
4.2 Secondary Connector Rows C and D......................................29
4.2.1 USB 3.0....................................................................................29
4.2.2 HDMI........................................................................................29
4.2.3 DisplayPort (DP)......................................................................29
5 Additional Features ..................................................................30
5.1 congatec Board Controller (cBC).............................................30
5.2 Board Information ....................................................................30
5.3 Watchdog.................................................................................30
5.4 I2C Bus.....................................................................................30
5.5 Power Loss Control..................................................................31
5.6 Embedded BIOS......................................................................31
5.6.1 CMOS Backup in Non Volatile Memory ...................................31
5.6.2 OEM CMOS Default Settings and OEM BIOS Logo................31
5.6.3 OEM BIOS Code......................................................................31
5.6.4 congatec Battery Management Interface .................................32
5.6.5 API Support (CGOS/EAPI) ......................................................32
5.7 Security Features.....................................................................33
5.8 Suspend to Ram ......................................................................33
6 conga Tech Notes ....................................................................34
6.1 Intel®Matrix Storage Technology ............................................34
6.1.1 AHCI ........................................................................................34
6.2 Intel® Processor Features ........................................................34
6.2.1 Thermal Monitor and Catastrophic Thermal Protection ...........34
6.2.2 Processor Performance Control...............................................35
6.3 Thermal Management..............................................................35
6.4 ACPI Suspend Modes and Resume Events ............................37
6.5 USB 2.0 EHCI Host Controller Support ...................................38
7 Signal Descriptions and Pinout Tables.....................................39

Copyright © 2012 congatec AG TCEDm10 10/94
7.1 A-B Connector Signal Descriptions..........................................40
7.2 A-B Connector Pinout..............................................................50
7.3 C-D Connector Signal Descriptions.........................................52
7.4 C-D Connector Pinout..............................................................62
7.5 Boot Strap Signals ...................................................................64
8 System Resources...................................................................65
8.1 System Memory Map...............................................................65
8.2 I/O Address Assignment...........................................................65
8.2.1 LPC Bus...................................................................................65
8.3 Interrupt Request (IRQ) Lines..................................................66
8.4 PCI Conguration Space Map .................................................68
8.5 PCI Interrupt Routing Map .......................................................69
8.6 I²C Bus.....................................................................................69
8.7 SM Bus ....................................................................................69
9 BIOS Setup Description...........................................................70
9.1 Entering the BIOS Setup Program...........................................70
9.1.1 Boot Selection Popup ..............................................................70
9.2 Setup Menu and Navigation.....................................................70
9.3 Main Setup Screen ..................................................................71
9.3.1 Intel RC Version Submenu.......................................................72
9.4 Advanced Setup.......................................................................72
9.4.1 Graphics Submenu ..................................................................73
9.4.2 Watchdog Submenu.................................................................74
9.4.3 Hardware Monitoring Submenu ...............................................76
9.4.4 PCI Submenu...........................................................................77
9.4.4.1 PIRQ Routing & IRQ Reservation Submenu ...........................78
9.4.5 ACPI Submenu ........................................................................78
9.4.6 RTC Wake Settings Submenu .................................................79
9.4.7 CPU Submenu .........................................................................79
9.4.8 Memory Submenu....................................................................80
9.4.9 Chipset Submenu ....................................................................80
9.4.9.1 IO Hub Devices Submenu .......................................................81
9.4.9.2 PCI Express Port Submenu .....................................................82
9.4.10 SATA Submenu ........................................................................83
9.4.11 iFFS Submenu .........................................................................83
9.4.12 USB Submenu .........................................................................84
9.4.13 Super I/O Submenu .................................................................85
9.4.14 Console Redirection Submenu ................................................85
9.4.14.1 Console Redirection Settings Submenu ..................................86
9.4.14.2 Console Redirection Settings (EMS) Submenu .......................86
9.4.15 Network Stack Submenu .........................................................87
9.5 Boot Setup ...............................................................................87
9.5.1 Boot Settings Conguration .....................................................87
9.5.1.1 CSM & Option ROM Parameters Submenu.............................89
9.6 Security Setup..........................................................................90
9.6.1 Security Settings ......................................................................90
9.6.1.1 Trusted Computing...................................................................90
9.6.2 Hard Disk Security ...................................................................90
9.6.3 Save & Exit Menu ....................................................................91
10 Additional BIOS Features ........................................................92
10.1 Supported Flash Devices.........................................................92
10.2 Updating the BIOS...................................................................92
10.3 BIOS Security Features ...........................................................92
10.4 Hard Disk Security Features....................................................93
11 Industry Specications .............................................................94

Copyright © 2012 congatec AG TCEDm10 11/94
List of Tables
Table 1 Feature Summary ....................................................................12
Table 2 Signal Tables Terminology Descriptions ..................................39
Table 3 Intel® High Denition Audio Link Signals Descriptions .............40
Table 4 Gigabit Ethernet Signal Descriptions .......................................41
Table 5 Serial ATA Signal Descriptions.................................................42
Table 6 PCI Express Signal Descriptions (general purpose)................43
Table 7 ExpressCard Support Pins Descriptions..................................44
Table 8 LPC Signal Descriptions ..........................................................44
Table 9 USB Signal Descriptions..........................................................45
Table 10 CRT Signal Descriptions ..........................................................45
Table 11 LVDS Signal Descriptions ........................................................46
Table 12 SPI BIOS Flash Interface Signal Descriptions .........................47
Table 13 Miscellaneous Signal Descriptions ..........................................47
Table 14 General Purpose I/O Signal Descriptions ................................48
Table 15 Power and System Management Signal Descriptions .............48
Table 16 General Purpose Serial Interface Signal Descriptions.............49
Table 17 Power and GND Signal Descriptions .......................................49
Table 18 Connector A-B Pinout ..............................................................50
Table 19 PCI Express Signal Descriptions (general purpose)................52
Table 20 USB Signal Descriptions..........................................................52
Table 21 PCI Express Signal Descriptions (x16 Graphics).....................53
Table 22 DDI Signal Description.............................................................55
Table 23 HDMI Signal Descriptions ........................................................57
Table 24 DisplayPort (DP) Signal Descriptions ......................................59
Table 25 Module Type Denition Signal Description ..............................61
Table 26 Power and GND Signal Descriptions .......................................61
Table 27 Connector C-D Pinout..............................................................62
Table 28 Boot Strap Signal Descriptions ................................................64
Table 29 Memory Map ............................................................................65
Table 30 IRQ Lines in PIC mode ............................................................66
Table 31 IRQ Lines in APIC mode ..........................................................67
Table 32 PCI Conguration Space Map .................................................68
Table 33 PCI Interrupt Routing Map .......................................................69

Copyright © 2012 congatec AG TCEDm10 12/94
1 Specications
1.1 Feature List
Table 1 Feature Summary
Form Factor Based on COM Express™ standard pinout Type 6 Rev. 2.1 (Compact size 95 x 95mm)
Processor Intel® Atom™ N2600 Dual Core 1.60 GHz 1-MByte L2 Cache
Intel® Atom™ N2800 Dual Core 1.86 GHz 1-MByte L2 Cache
Intel® Atom™ D2550 Dual Core 1.86 GHz 1-MByte L2 Cache
Intel® Atom™ D2550 (USB 3.0) Dual Core 1.86 GHz 1-MByte L2 Cache
Memory 1 socket: SO-DIMM DDR3 up to 1066MT/s, maximum 4-GByte.
Chipset Intel® NM10 Express Chipset: Intel®CG82NM10 PCH
Audio HDA (High Denition Audio)/digital audio interface with support for multiple codecs
Ethernet Gigabit Ethernet: Realtek 8111E
Graphics Options Integrated graphics with OpenGL3.0 and DirectX9 support.
Two independent pipelines for full dual view support.
• CRT Interface 350 MHz RAMDAC Resolutions up to 1920x1200 @ 60Hz
• Flat panel Interface (integrated) with 25-112MHz single-channel LVDS Transmitter.
Supports:
• Single-channel LVDS interface: 1 x 18 bpp (D2000/N2000 series) or 1 x 24 bpp
(D2000 series only).
• VESA LVDS color mappings.
• Automatic Panel Detection via EPI (Embedded Panel Interface based on VESA
EDID™ 1.3)
• Resolutions up to 1366x768 (WXGA) for 18 bpp and up to 1440x900 (WXGA+) for
24 bpp
• 2x DDI (Digital Display Interface) with support for:
• 2x DisplayPort 1.1 on digital ports B and C.
Multiplexed with HDMI/DVI ports. Supports hot plug
detect.
• 2x HDMI ports on digital ports B and C. Multiplexed
with DP/DVI ports. Supports hot plug detect.
• 2x DVI ports on digital ports B and C. Multiplexed
with DP/HDMI ports. Supports hot plug detect.
Peripheral
Interfaces • 2x Serial ATA® II, with up to 3 Gb/s data transfer rate.
• Up to x5 PCI Express®Lanes if the optional USB 3.0 is not implemented. Each root
port supports full 2.5 Gb/s bandwidth in each direction per x1 link
• 8x USB 2.0 (UHCI and EHCI)
• 2x USB 3.0
• LPC Bus
• I²C Bus, Fast Mode, multimaster
• SM Bus
BIOS AMI Aptio® UEFI 2.x rmware, 4MByte serial SPI with congatec Embedded BIOS features
Power Management ACPI 3.0 compliant with battery support. Also supports Suspend to RAM (S3).
Note
Some of the features mentioned in the above Feature Summary are optional. Check the article number of your module and compare it to the
option information list on page 8 of this user’s guide to determine what options are available on your particular module.

Copyright © 2012 congatec AG TCEDm10 13/94
1.2 Supported Operating Systems
The conga-TCA supports the following operating systems.
• Microsoft®Windows® 8 (32 bit)
• Microsoft®Windows®7
• Microsoft®Windows®XP
• Microsoft®Windows® Embedded Standard
• Linux
1.3 Mechanical Dimensions
• 95.0 mm x 95.0 mm (3.75” x 3.75”)
• Height approximately 18 or 21mm (including heatspreader) depending on the carrier board connector that is used. If the 5mm
(height) carrier board connector is used then approximate overall height is 18mm. If the 8mm (height) carrier board connector is
used then approximate overall height is 21mm.
4.00
Heatspreader
Module PCB
Carrier Board PCB
7.00
5.00 2.00
4.50
13.0018.00

Copyright © 2012 congatec AG TCEDm10 14/94
1.4 Supply Voltage Standard Power
• 12V DC ± 5%
The dynamic range shall not exceed the static range.
1.4.1 Electrical Characteristics
Power supply pins on the module’s connectors limit the amount of input power. The following table provides an overview of the limitations for
pinout Type 6 (dual connector, 440 pins).
Power Rail Module Pin Current
Capability (Amps) Nominal Input (Volts) Input Range (Volts) Derated Input (Volts) Max. Input Ripple (10Hz to 20MHz)
(mV)
Max. Module Input Power
(w. derated input)
(Watts)
Assumed
Conversion
Efciency
Max. Load
Power
(Watts)
VCC_12V 12 12 11.4-12.6 11.4 +/- 100 137 85% 116
VCC_5V-SBY 25 4.75-5.25 4.75 +/- 50 9
VCC_RTC 0.5 3 2.0-3.3 +/- 20
1.4.2 Rise Time
The input voltages shall rise from 10% of nominal to 90% of nominal at a minimum rise time of 250V/s. The smooth turn-on requires that, during
the 10% to 90% portion of the rise time, the slope of the turn-on waveform must be positive.
Nominal Static Range
Dynamic Range
Absolute Minimum
Absolute Maximum12.60V
11.40V
12V
12.10V
11.90V

Copyright © 2012 congatec AG TCEDm10
15/94
1.5 Power Consumption
The power consumption values listed in this document were measured under a controlled environment. The hardware used for testing includes
a conga-TCA module, conga-Cdebug carrier board, CRT monitor, SATA drive, and USB keyboard. The conga-Cdebug is modied so that
the 12V input is only routed to the module and all other circuity on the carrier itself is powered by the 5V input. The SATA drive was powered
externally by an ATX power supply so that it does not inuence the power consumption value that is measured for the module. The USB
keyboard was detached once the module was congured within the OS. All recorded values were averaged over a 30 second time period.
Cooling of the module was done by the module specic heatspreader and a fan cooled heatsink to measure the power consumption under
normal thermal conditions.
The conga-Cdebug originally does not provide 5V standby power. Therefore, an extra 5V_SB connection without any external loads was made.
Using this setup, the power consumption of the module in S3 (Standby) mode was measured directly.
Each module was measured while running Windows 7 Professional 32Bit, Hyper Threading enabled, Speed Step enabled and Power Plan set
to “Power Saver”. This setting ensures that Core™ processors run in LFM (lowest frequency mode) with minimal core voltage during desktop
idle. Each module was tested while using a 1GB memory modules. Using different sizes of RAM will cause slight variances in the measured
results.
To measure the worst case power consumption the cooling solution was removed and the CPU core temperature was allowed to run up to
between 95° and 100°C while running 100% workload with the Power Plan set to “Balanced”. The peak current value was then recorded. This
value should be taken into consideration when designing the system’s power supply to ensure that the power supply is sufcient during worst
case scenarios.
Power consumption values were recorded during the following stages:
Windows 7 (32 bit)
• Desktop Idle (power plan = Power Saver)
• 100% CPU workload (see note below, power plan = Power Saver)
• 100% CPU workload at approximately 100°C peak power consumption (power plan = Balanced)
• Suspend to RAM. Supply power for S3 mode is 5V.
Note
A software tool was used to stress the CPU to maximum frequency.

Copyright © 2012 congatec AG TCEDm10
16/94
Processor Information
In the following power tables, there is some additional information about the processors.
Intel® describes the type of manufacturing process used for each processor. The following term is used:
nm=nanometer
The manufacturing process description is included in the power tables as well. See example below. For information about the manufacturing
process visit Intel®’s website.
Intel® Atom™ N2600 1.6 GHz 1MB L2 Cache
32nm
1.5.1 conga-TCA Intel®Atom™ N2600 Dual Core 1.6 GHz 1MB Cache
conga-TCA Art. No. 047001 Intel®Atom™ N2600 1.6 GHz 1MB L2 Cache
32nm
Layout Rev. TCEDLA0 /BIOS Rev. TCEDR006
Max Turbo Frequency Not supported
Memory Size 1GB
Operating System Windows 7 (32 bit)
Power State Desktop Idle 100% workload 100% workload approx.
100°C CPU temp (peak) Suspend to Ram (S3) 5V Input Power
Power consumption (measured in Amperes/Watts) 0.46 A/5.5 W (12V) 0.66 A/7.9 W (12V) 0.68 A/8.2 W (12V) 0.1 A/0.5 W (5V)
1.5.2 conga-TCA Intel®Atom™ N2800 Dual Core 1.86 GHz 1MB Cache
conga-TCA Art. No. 047002 Intel®Atom™ N2800 1.86 GHz 1MB L2 Cache
32nm
Layout Rev. TCEDLA0 /BIOS Rev. TCEDR006
Max Turbo Frequency Not supported
Memory Size 1GB
Operating System Windows 7 (32 bit)
Power State Desktop Idle 100% workload 100% workload approx.
100°C CPU temp (peak) Suspend to Ram (S3) 5V Input Power
Power consumption (measured in Amperes/Watts) 0.57 A/6.8 W (12V) 0.83 A/9.9 W (12V) 1.03 A/12.3 W (12V) 0.1 A/0.5 W (5V)

Copyright © 2012 congatec AG TCEDm10 17/94
1.5.3 conga-TCA Intel®Atom™ D2550 Dual Core 1.86 GHz 1MB Cache
conga-TCA Art. No. 047003 Intel®Atom™ D2550 1.86 GHz 1MB L2 Cache
32nm
Layout Rev. TCEDLA0 /BIOS Rev. TCEDR006
Max Turbo Frequency Not supported
Memory Size 1GB
Operating System Windows 7 (32 bit)
Power State Desktop Idle 100% workload 100% workload approx.
100°C CPU temp (peak) Suspend to Ram (S3) 5V Input Power
Power consumption (measured in Amperes/Watts) 0.67 A/8.0 W (12V) 0.97 A/11.6 W (12V) 1.07 A/12.8 W (12V) 0.1 A/0.5 W (5V)
1.5.4 conga-TCA Intel®Atom™ D2550 (USB 3.0) Dual Core 1.86 GHz 1MB Cache
conga-TS67 Art. No. 047004 Intel®Atom™ D2550 1.86 GHz 1MB L2 Cache
32nm
Layout Rev. TCEDLA0 /BIOS Rev. TCEDR006
Max Turbo Frequency Not supported
Memory Size 1GB
Operating System Windows 7 (32 bit)
Power State Desktop Idle 100% workload 100% workload approx.
100°C CPU temp (peak) Suspend to Ram (S3) 5V Input Power
Power consumption (measured in Amperes/Watts) 0.7 A/8.4 W (12V) 1.0 A/11.9 W (12V) 1.2 A/14.6 W (12V) 0.1 A/0.5 W (5V)
Note
All recorded power consumption values are approximate and only valid for the controlled environment described earlier. 100% workload refers
to the CPU workload and not the maximum workload of the complete module. Supply power for S3 mode is 5V while all other measured modes
are supplied with 12V power. Power consumption results will vary depending on the workload of other components such as graphics engine,
memory, etc.

Copyright © 2012 congatec AG TCEDm10 18/94
1.6 Supply Voltage Battery Power
• 2.0V-3.5V DC
• Typical 3V DC
1.6.1 CMOS Battery Power Consumption
RTC @ 20ºC Voltage Current
Integrated in the Intel®CG82NM10 PCH 3V DC 3.51 µA
The CMOS battery power consumption value listed above should not be used to calculate CMOS battery lifetime. You should measure the
CMOS battery power consumption in your customer specic application in worst case conditions, for example during high temperature and
high battery voltage. The self-discharge of the battery must also be considered when determining CMOS battery lifetime. For more information
about calculating CMOS battery lifetime refer to application note AN9_RTC_Battery_Lifetime.pdf, which can be found on the congatec AG
website at www.congatec.com.
1.7 Environmental Specications
Temperature Operation: 0° to 60°C Storage: -20° to +80°C
Humidity Operation: 10% to 90% Storage: 5% to 95%
Caution
The above operating temperatures must be strictly adhered to at all times. When using a heatspreader the maximum operating temperature
refers to any measurable spot on the heatspreader’s surface.
congatec AG strongly recommends that you use the appropriate congatec module heatspreader as a thermal interface between the module
and your application specic cooling solution.
If for some reason it is not possible to use the appropriate congatec module heatspreader, then it is the responsibility of the operator to ensure
that all components found on the module operate within the component manufacturer’s specied temperature range.
For more information about operating a congatec module without heatspreader contact congatec technical support.
Humidity specications are for non-condensing conditions.

Copyright © 2012 congatec AG TCEDm10 19/94
2 Block Diagram
C-D
A-B
PCIe GBE
RTL8111E
PCIe
Switch
Hardware
Monitoring
PCIe2USB3
Intel®NM10
Express Chipset
CG82NM10 PCH
congatec
Board Controller
STM32F100R8
Watchdog
TPM
Intel®Atom™
Processor
N2800
N2600
D2550
DDR3-SODIMM
max. 4 GByte
BIOS
(Flash)
RTC
2x SATA II
8x USB 2.0
HDA
PCIe x1
Gbit Ethernet
Fan Control
SM Bus
SM Bus
SPI
LPC
DMI
x2 (N2000)
x4 (D2000)
SM Bus
Memory Types
(up to 1066MTs)
GPIs/GPOs
2x DP or HDMI
LVDS
2x USB 3.0 optional
CRT
GPIs/GPOs
I²C
PCIe x1 PCIe x1 PCIe x1
PCIe x1
PCIe x1
PCIe x1 If No USB 3.0
PCIe x1

Copyright © 2012 congatec AG TCEDm10 20/94
3 Heatspreader
An important factor for each system integration is the thermal design. The heatspreader acts as a thermal coupling device to the module and
its aluminum plate is 4mm thick.
The heatspreader is thermally coupled to the CPU via a thermal gap ller and on some modules it may also be thermally coupled to other heat
generating components with the use of additional thermal gap llers.
Although the heatspreader is the thermal interface where most of the heat generated by the module is dissipated, it is not to be considered as a
heatsink. It has been designed as a thermal interface between the module and the application specic thermal solution. The application specic
thermal solution may use heatsinks with fans, and/or heat pipes, which can be attached to the heatspreader. Some thermal solutions may also
require that the heatspreader is attached directly to the systems chassis thereby using the whole chassis as a heat dissipater.
For additional information about the conga-TCA heatspreader, refer to section 3.1 of this document.
Caution
There are mounting holes on the heatspreader designed to attach the heatspreader to the module. These mounting holes must be used to
ensure that all components that are required to make contact with heatspreader do so. Failure to utilize these mounting holes will result in
improper contact between these components and heatspreader thereby reducing heat dissipation efciency.
Attention must be given to the mounting solution used to mount the heatspreader and module into the system chassis. Do not use a threaded
heatspreader together with threaded carrier board standoffs. The combination of the two threads may be staggered, which could lead to
stripping or cross-threading of the threads in either the standoffs of the heatspreader or carrier board.
Caution
When using PN: 047003 conga-TCA/D2550 and/or PN: 047004 conga-TCA/D2550 xHCI modules in conjunction with the conga-TCA/CSP-T(B)
passive cooling solution, active airow must be provided over the cooling ns. The conga-TCA/CSP-T(B) is not capable of dissipating the heat
generated by these modules without an active airow present.