Congatec conga-CEVAL User manual

COM Express™ conga-CEVAL
Detailed description of the congatec COM Express™ Type 2 evaluation carrier board
User’s Guide (Rev C.x)
Revision 1.0

Copyright © 2012 congatec AG CEVA_c_m10 2/47
Revision History
Revision Date (yyyy.mm.dd) Author Changes
1.0 2013.09.17 AEM • Initial release.

Copyright © 2012 congatec AG CEVA_c_m10 3/47
Preface
This user’s guide provides information about the components, features and connectors available on the congatec COM Express™ Type 2
evaluation carrier board.
Disclaimer
The information contained within this user’s guide, including but not limited to any product specication, is subject to change without notice.
congatec AG provides no warranty with regard to this user’s guide or any other information contained herein and hereby expressly disclaims
any implied warranties of merchantability or tness for any particular purpose with regard to any of the foregoing. congatec AG assumes
no liability for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for
discrepancies between the product and the user’s guide. In no event shall congatec AG be liable for any incidental, consequential, special, or
exemplary damages, whether based on tort, contract or otherwise, arising out of or in connection with this user’s guide or any other information
contained herein or the use thereof.
Intended Audience
This user’s guide is intended for technically qualied personnel. It is not intended for general audiences.
Lead-Free Designs (RoHS)
All congatec AG designs are created from lead‑free components and are completely RoHS compliant.
Electrostatic Sensitive Device
All congatec AG products are electrostatic sensitive devices and are packaged accordingly. Do not open or handle a congatec AG product
except at an electrostatic‑free workstation. Additionally, do not ship or store congatecAG products near strong electrostatic, electromagnetic,
magnetic, or radioactive elds unless the device is contained within its original manufacturer’s packaging. Be aware that failure to comply with
these guidelines will void the congatec AG Limited Warranty.

Copyright © 2012 congatec AG CEVA_c_m10 4/47
Symbols
The following symbols are used in this user’s guide:
Warning
Warnings indicate conditions that, if not observed, can cause personal injury.
Caution
Cautions warn the user about how to prevent damage to hardware or loss of data.
Note
Notes call attention to important information that should be observed.
Connector Type
Describes the connector that must be used with the conga‑CEVAL evaluation carrier board, not the connector found on the conga‑CEVAL
evaluation carrier board.
Link to connector layout diagram
This link icon is located in the top left corner of each page. It provides a direct link to the conga‑CEVAL connector layout diagram.
Copyright Notice
Copyright © 2007, congatecAG.All rights reserved. All text, pictures and graphics are protected by copyrights. No copying is permitted without
written permission from congatec AG.
congatec AG has made every attempt to ensure that the information in this document is accurate yet the information contained within is
supplied “as‑is”.

Copyright © 2012 congatec AG CEVA_c_m10 5/47
Trademarks
Product names, logos, brands, and other trademarks featured or referred to within this user’s guide, or the congatec website, are the property
of their respective trademark holders. These trademark holders are not afliated with congatec AG, our products, or our website.
Warranty
congatec AG makes no representation, warranty or guaranty, express or implied regarding the products except its standard form of limited
warranty (“Limited Warranty”). congatec AG may in its sole discretion modify its Limited Warranty at any time and from time to time.
Beginning on the date of shipment to its direct customer and continuing for the published warranty period, congatec AG represents that the
products are new and warrants that each product failing to function properly under normal use, due to a defect in materials or workmanship or
due to non conformance to the agreed upon specications, will be repaired or exchanged, at congatec AG’s option and expense.
Customer will obtain a Return Material Authorization (“RMA”) number from congatec AG prior to returning the non conforming product freight
prepaid. congatec AG will pay for transporting the repaired or exchanged product to the customer.
Repaired, replaced or exchanged product will be warranted for the repair warranty period in effect as of the date the repaired, exchanged or
replaced product is shipped by congatec AG, or the remainder of the original warranty, whichever is longer. This Limited Warranty extends to
congatec AG’s direct customer only and is not assignable or transferable.
Except as set forth in writing in the Limited Warranty, congatec AG makes no performance representations, warranties, or guarantees, either
express or implied, oral or written, with respect to the products, including without limitation any implied warranty (a) of merchantability, (b) of
tness for a particular purpose, or (c) arising from course of performance, course of dealing, or usage of trade.
congatec AG shall in no event be liable to the end user for collateral or consequential damages of any kind. congatec AG shall not otherwise
be liable for loss, damage or expense directly or indirectly arising from the use of the product or from any other cause. The sole and exclusive
remedy against congatec AG, whether a claim sound in contract, warranty, tort or any other legal theory, shall be repair or replacement of the
product only
Certication
congatec AG is certied to DIN EN ISO 9001 standard.
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Copyright © 2012 congatec AG CEVA_c_m10 6/47
Technical Support
congatec AG technicians and engineers are committed to providing the best possible technical support for our customers so that our products
can be easily used and implemented. We request that you rst visit our website at www.congatec.com for the latest documentation, utilities and
drivers, which have been made available to assist you. If you still require assistance after visiting our website then contact our technical support
department by email at [email protected]
Terminology
Term Description
PCI Express (PCIe) Peripheral Component Interface Express – next‑generation high speed Serialized I/O bus
PCI Express Lane One PCI Express Lane is a set of 4 signals that contains one differential line for
transmitter and one differential line for receiver. Clocking information is embedded into the
data stream.
x1, x2, x4, x16 x1 refers to one PCI Express Lane of basic bandwidth; x2 to a collection of two PCI Express
Lanes; etc. Also referred to as x1, x2, x4 or x16 link.
ExpressCard A PCMCIA standard built on the latest USB 2.0 and PCI Express buses.
USB Universal Serial Bus
SATA Serial AT Attachment: serial‑interface standard for hard disks
AC ‘97/HDA Audio CODEC (Coder-Decoder) / High Denition Audio
LPC Low Pin‑Count Interface: a low speed interface used for peripheral circuits such as Super
I/O controllers, which typically combine legacy‑device support into a single IC.
I²C Bus Inter-Integrated Circuit Bus: is a simple two-wire bus with a software-dened protocol that
was developed to provide the communications link between integrated circuits in a system.
SM Bus System Management Bus: is a popular derivative of the I²C-bus.
SPI Bus Serial Peripheral Bus
GBE Gigabit Ethernet
LVDS Low‑Voltage Differential Signaling
SDVO Serial Digital Video Out is a proprietary technology introduced by Intel®to add additional
video signaling interfaces to a system.
CRT Cathode Ray Tube
DDC Display Data Channel is an I²C bus interface between a display and a graphics adapter.
N.C. Not connected
N.A. Not available
T.B.D. To be determined

Copyright © 2012 congatec AG CEVA_c_m10 7/47
Contents
1 COM Express™ Specication Overview....................................8
1.1 Concept of COM Express™.......................................................8
1.2 Module Form Factors.................................................................8
1.3 Module Types Overview...........................................................10
2 Connector Layout.....................................................................12
3 Specications...........................................................................13
3.1 Mechanical Dimensions...........................................................13
3.2 Power Supply...........................................................................13
3.2.1 Status LEDs D1‑D4..................................................................15
3.2.2 PWR_OK Signal ......................................................................15
3.2.3 Power‑up Control.....................................................................16
3.2.4 Module Type Detection............................................................16
3.3 CMOS Battery..........................................................................17
3.4 Environmental Specications...................................................17
4 Connector Subsystems Rows A,B,C,D ....................................18
4.1 Connector Pinout Rows A and B..............................................18
4.1.1 SM Bus ....................................................................................19
4.1.2 I²C Bus .....................................................................................20
4.1.3 SPI Bus ....................................................................................20
4.1.4 HDAAudio................................................................................21
4.1.4.1 HDA/AC97 Header X49...........................................................22
4.1.4.2 Low Pin Count Bus (LPC) ........................................................22
4.1.4.3 LPC Super I/O device..............................................................23
4.1.4.4 LPC Firmware Hubs.................................................................25
4.1.5 Universal Serial Bus (USB)......................................................25
4.1.6 LAN 10/100/1000.....................................................................26
4.1.7 Serial ATA™.............................................................................26
4.1.8 VGA..........................................................................................27
4.1.9 LVDS Flat Panel Interface........................................................28
4.1.9.1 Flat Panel and Backlight Power Supply ...................................29
4.1.9.2 Flat Panel and Backlight Power Supply Connection................30
4.1.10 PCI Express x1 Connectors.....................................................31
4.1.11 ExpressCard and PCI Express Mini Card................................33
4.1.11.1 ExpressCard............................................................................33
4.1.11.2 PCI Express Mini Card.............................................................34
4.1.12 TV‑Out......................................................................................36
4.2 Connector Pinout Rows C and D.............................................37
4.2.1 PCI Express Graphics (PEG)...................................................38
4.2.2 PATA 100..................................................................................39
4.2.3 CompactFlash Socket..............................................................40
4.2.4 PCI BUS...................................................................................41
5 Additional Features..................................................................42
5.1 Reset .......................................................................................42
5.2 PC Speaker (Beeper)...............................................................42
5.3 Debug Display..........................................................................43
5.4 TPM Physical Presence Pin.....................................................43
5.5 Ground Test Points ..................................................................43
5.6 Fan Connector and Power Conguration.................................44
5.7 SMART Battery Management Module .....................................44
5.8 Feature Connector...................................................................45
6 Mechanical Drawing conga‑CEVAL.........................................46
7 Industry Specications .............................................................47

Copyright © 2012 congatec AG CEVA_c_m10 8/47
1 COM Express™ Specication Overview
1.1 Concept of COM Express™
Computer On Module (COM) is off‑the‑shelf technology that has been in the embedded computer industry for years. A Computer On Module
integrates all the core components and standard I/O interfaces of a common PC onto an application specic carrier board. The key advantage
of the COM in the embedded computer industries is that all the highly integrated, high speed components such as CPU, chipsets and memory
are combined on a small module form factor for easy adaptation to different applications across multiple market segments.
COM Express™ modules have standardized form factors and have specied pinouts on the two system connectors that remain the same
regardless of the vendor. The COM Express™ module reects the functional requirements for a wide range of embedded applications. These
functions include, but are not limited to, PCI Express, PCI, Graphics, High Denition Audio, parallel ATA, serial ATA, Gigabit Ethernet and USB
ports. Two ruggedized, shielded connectors provide the carrier board interface and carry all the I/O signals to and from the COM Express™
module.
Carrier board designers can utilize as little or as many of the I/O interfaces as deemed necessary. Therefore the carrier board can provide all
the interface connectors required to attach the system to the application specic peripherals. This versatility allows the designer to create a
dense and optimized package, which results in a more reliable product while simplifying system integration. Most importantly COM Express™
applications are scalable, which means once a product has been created there is the ability to diversify the product range through the use of
different performance class COM Express™ modules. Simply unplug one module and replace it with another ‑ no redesign is necessary.
1.2 Module Form Factors
The COM Express™ specication was developed by the PCI Industrial Computer Manufacturing Group (PICMG) in close collaboration with
many leading companies across the embedded industry in order to nd an implementation solution to handle high speed serial I/Os, processors
and chipsets. COM Express™ 2.0 species three form factors, as well as seven different types of connector pinouts.
The three form factors are Compact, Basic and Extended. With a form factor of 95x95mm and single (or two stacked) horizontal mount SO‑
DIMM, the Compact module targets space-constrained mobile systems The Basic module footprint is 125mm x 95mm and focuses also on
space‑constrained, low power systems which typically contain one (or two stacked) horizontal mounted SO‑DIMM. The Extended footprint is
slightly larger at 155mm x 110mm and supports up to two full size DIMM (or mini DIMM) modules or two horizontal/vertical mount SO‑DIMMS to
accommodate larger memory congurations for high-performance CPUs, chipsets and multiprocessor systems. The placement of the shielded
220‑pin connectors and the mounting holes are identical between these form factors.
Note
The conga-CEVAL COM Express™ Type 2 evaluation carrier board can host either Compact or Basic form factor CPU modules.

Copyright © 2012 congatec AG CEVA_c_m10 9/47
Compact, Basic and Extended Form Factor

Copyright © 2012 congatec AG CEVA_c_m10 10/47
1.3 Module Types Overview
The COM Express™ specication 2.0 denes seven different pinout types.
Table 1 COM Express™ Specication 2.0 Pinout Types Denitions
Types Connector
Rows
PCI Express
Lanes PEG/ SDVO PCI IDE Ports SATA Ports LAN Ports USB 2.0/ SuperSpeed USB Display Interfaces
Type 1 A-B Up to 6 4 1 8/0 VGA, TV Out, LVDS
Type 2 A-B C-D Up to 22 1/2 32 bit 1 4 1 8/0 VGA, TV Out, LVDS, PEG/SDVO
Type 3 A-B C-D Up to 22 1/2 32 bit 4 3 8/0 VGA, TV Out, LVDS, PEG/SDVO
Type 4 A-B C-D Up to 32 1/2 1 4 1 8/0 VGA, TV Out, LVDS, PEG/SDVO
Type 5 A-B C-D Up to 32 1/2 4 3 8/0 VGA, TV Out, LVDS, PEG/SDVO
Type 6 A-B C-D Up to 24 1/‑ 4 1 8/4 3xDDI, PEG, VGA, LVDS
Type 10 A-B Up to 4 ‑/1 2 1 8/0 1xDDI
The conga-CEVAL evaluation board uses the Type 2 pin-out denition. This pinout offers the balance between older technology such as PCI
and Parallel ATA while providing the latest technologies including PCI Express, Serial ATA and PCI Express graphics.
The Type 2 pinout denition features the following:
• Dual 220 pin connectors (A-B and C-D)
• 32bit PCI interface
• IDE port (to support legacy ATA devices)
• Up to 22 PCI Express lanes (up to 6 on A-B and up to 16 on C-D)
• 16 of the 22 PCI Express lanes commonly used for PCI Express Graphics
• Option for SDVO (pins shared with PCI Express Graphics)
• Up to 8 USB 2.0 ports
• Up to 4 Serial ATA
• Up to 6 PCI Express lanes (Gen1/Gen2)
• Support pins for up to 2 ExpressCards

Copyright © 2012 congatec AG CEVA_c_m10 11/47
• Dual 24‑bit LVDS channels ExpressCards
• Analog VGA
• TV Out
• HDA/AC ‘97 digital audio interface
• Gigabit Ethernet
• LPC interface
• 8 GPIO pins

Copyright © 2012 congatec AG CEVA_c_m10 12/47
2 Connector Layout
The conga‑CEVAL rev C.x
evaluation board layout
picture on the right features
component description overlay
that includes pinout indicators
as well as name designators.
Select the Adobe ‘Zoom‑
In‑Tool’ and zoom in on a
given component to see the
descriptive text. Hover over the
component and the ‘Zoom‑In‑
Tool’ will change, indicating a
link.Clickonthelinktonavigate
to the area in the document
where the component is
described in detail.
Use the mouse icon in the
top left hand corner of the
destination page to return to
the connector layout picture.
COM1
LPT1
VGA
S1
U16
LAN
USB4
USB5
X47
X39
X1
1-
1
1
2
2
2
9-
9
9
10
10
10
19- 20
X5
X2
D1 10 20 30 40 50 60 70
80 90 100 D110
10
5 15 20 25 30 35 40 45
50 55 60 65 70 75 80
10
5 15 20 25 30 35 40 45
50 55 60 65 70 75 80
AB2
X13
AB1
BB1
LED D21 (WWAN)
LED D22 (WLAN)
LED D21 (WPAN)
A2
S3
A1
B1 B2
C1 10 20 30 40 50 60 70
80 90 100 C110
B1 10 20 30 40 50 60 70
80 90 100 B110
A1 10 20 30 40 50 60 70
80 90 100 A110
X14
U33
LED D28
X28
X25
X26
X21
Compact Flash Master/Slave
LED D25
M2 X70
Fan PowerCong
X63
PwrGood Cong
X11
X12
X7
M6
X72
X45 X44
M3
TEST PT
TEST PT
TEST PT TEST PT
COMe PWROK
M1
Backlight Power Cong
X67
LCD PowerCong
X66 Backlight Polariy
X69
X16
M40
1
1
1
2
2
5
10
15
20
25
30
33 34
9 10
19
20
1224
13
5VSBY
LED D1 LED D3 LED D4LED D2
Power Mode
Cong
COM 2
COM 4
optional
COM 3
optional
COM Express A-B Connector
Feature Connector
12V 5V 3.3V
X6
M7
U47 M16
M15
M12
M47
M11
M10
M50
M50
SW1 ON: Enables PC Speaker (beeper)
SW2 ON: Disables HDA
For port selection
M45
X27
EXCD OC
ExpressCard Overcurrent Event
LED D24
X29
X30
X17 X18
X49
X31 X32 X33
XCD1
X34
X41 X42
X35
XAB1
PLCCSOCKE T
U27
U25
U31
X54
(Up)
(Down)
X55 X51
L1
L8
ACT LINK
X50
X57
X53
(up)
(down)
C6
C1 V5 V1
V6
V11
V10
V15
13 1
1425
C5
C9
FWH ENA
COMPACT FLASH
+12V
GND
PATA
PATA ACT
Mouse
USB 3
USB 2
USB 1
USB 0
Keyboard
U21
M53 M52 M46
C199 C197
1
9 10
2
4
21
2014
13
529
1
9 10
2
1
9 10
2
....
....
....
....
....
....
ATX
SATA 1
TV OUT
Line IN
Line Out
Mic
SATA 3
SATA 0
RESET
SATA 2
PEG
DEBUG DISPLAY
PCI1
PCIe0
PCIe3 PCIe4
PCIe1
HDA/AC97
PCI4
I2C EEPROM
Socket
EPI EEPROM
Socket
Express Card
LCD Power
Mini PCI Express
PCI2 PCI3
Pwr On
LCD
FAN
Battery SMB3
I2C Digital I/O
Speaker
Battery

Copyright © 2012 congatec AG CEVA_c_m10 13/47
3 Specications
3.1 Mechanical Dimensions
294.0 mm x 244.0mm
Height approx. 43mm
3.2 Power Supply
The conga‑CEVAL can be used with standardATX (Connector X70) power supplies.
When using anATX power supply, the COM Express™ module starts after the power‑on button M1 is pressed. TheATX power supply can also
be used in AT mode. In this case the module will start after the power switch on the power supply is turned on
Jumper X6 Conguration
1 ‑ 2 ATX Power supply mode (default)
2 ‑ 3 ATX Power supply runs in AT mode
Connector Type
X6: 2.54mm grid jumper.
The conga‑CEVAL can also be used with 12V DC power supply (connector M2 and M7).
Connector Conguration
M7 Ground
M2 +12VDC (11,4 – 12,6V)
Connector Type
4mm diameter plug
1
2
3
Power Mode
Config
(X6)
Pwr On
(M1)
GND
(M7) +12V (M2)

Copyright © 2012 congatec AG CEVA_c_m10 14/47
The +3.3V and +5V used by some devices on the COM Express™ evaluation carrier board are generated onboard only if 12V DC input (M2,
M7) is used and ATX power connector not plugged in. Otherwise the voltages +3.3V and +5V are delivered by ATX power supply with voltage
regulators disabled.
The voltages used are the +3.3V and +5V. The ‑5V is not available and the ‑12V is not used.
The following table lists the pinout for connector X70.
Table 2 Connector X70 Pinout
Pin Signal Description Pin Signal Description
1 +3.3V Power Supply +3.3VDC 13 +3.3V Power Supply +3.3VDC
2 +3.3V Power Supply +3.3VDC 14 ‑12V Power Supply ‑12DC
3 GND Power Ground 15 GND Power Ground
4 +5V Power Supply +5VDC 16 PS_ON# Power Supply On (active low). Short this pin to GND to switch
power supply ON, disconnect from GND to switch OFF.
5 GND Power Ground 17 GND Power Ground
6 +5V Power Supply +5VDC 18 GND Power Ground
7 GND Power Ground 19 GND Power Ground
8 PWR_OK Power Ok: Astatus signal generated by the power supply
to notify the computer that the DC operating voltages are
within the ranges required for proper computer operation.
20 NC
95V_SB Standby Power Supply +5VDC 21 +5V Power Supply +5VDC
10 +12V Power Supply +12DC 22 +5V Power Supply +5VDC
11 +12V Power Supply +12DC 23 +5V Power Supply +5VDC
12 +3.3V Power Supply +3.3VDC 24 GND Power Ground
ATX Power
X70

Copyright © 2012 congatec AG CEVA_c_m10 15/47
3.2.1 Status LEDs D1-D4
The four status LEDs D1, D2, D3 and D3 indicate different power states of the conga‑CEVAL. The LEDs indicate if the power rail is ON or OFF
even if the power rail is generated by ATX PSU or by onboard voltage regulator. Refer to the following table for detailed information.
Table 3 Power LEDs
LEDs D1-D4 Power state
All Off No power applied.
D1 Indicates that 12V is present on the baseboard
D2 Indicates that 5V standby is present on the baseboard
D3 Indicates that 5V is present on the baseboard
D4 Indicates that 3.3V is present on the baseboard
3.2.2 PWR_OK Signal
The COM Express™ specication denes the signal PWR_OK, which is a HIGH active input from the main power supply to the module and
indicates whether the power is good.
Jumper X11 on the conga‑CEVAL provides the ability to choose different settings for this signal.
Jumper X11 Conguration
1 ‑ 2 Add 3.3V Pullup with 10K to signal PWR_OK.
3 ‑ 4 Connect PWRGOOD of ATX power supply (default).
5 ‑ 6 Connect PWRGOOD of onboard DCDC regulator.
Connector Type
X11: 2.54 mm grid jumper.
D3 D4D2 D1
LEDs D1-D4
13
24
PWRGOOD Config.
(X11)
5
6

Copyright © 2012 congatec AG CEVA_c_m10 16/47
3.2.3 Power-up Control
The Power‑up control switches the ATX power supply on or off. The SUS_S3# activates the ATX power supply by driving the PS_ON# signal.
If DC power input (M2, M7) is used, voltage regulators start after applying +12V.
The native system power‑up support of congatec modules uses the ‘SUS_S3#’ signal to control the ‘PS_ON#’ signal, which switches the ATX
power supply on or off. When using the SUS_S3#’ signal, the COM Express™ module is capable of supporting Suspend to RAM (S3).
When the system goes to Suspend to RAM (S3) or Soft Off (S5), the ‘SUS_S3#’ signal is asserted by the chipset of the module. Through the
use of an inverter, the low active ‘PS_ON#’ signal goes high and switches off the ATX power supply. If the system resides in a power‑down
system state, any system wake‑up event invokes the chipset of the module to deassert the ‘SUS_S3#’ signal. This transitions the system to
Full‑on (S0).
How Suspend to RAM is implemented on a COM Express™ module may differ depending on the module manufacturer. For this reason, it is
recommended that a hardware jumper be implemented on the carrier board in order to provide the ability to choose if the ‘PS_ON#’ signal
should be controlled either by the ‘SUS_S3#’ signal or ‘SUS_S5#’ signal. This is accomplished on earlier conga‑CEVAL revisions through the
use of jumper X63. The conga-CEVAL revision B.0 and later do not implement the jumper X63 (see note below).
Note
On conga-CEVAL revision B.0 and later, the X63 4-pin jumper connector that switches between SUS_S3# and SUS_S5# is not available
because the PS_ON# is driven only by SUS_S3#.
3.2.4 Module Type Detection
The COM Express™ Specication includes four signals (‘TYPE0#’, ‘TYPE1#’, ‘TYPE2#’ and ‘TYPE10#’) to determine the pinout type of the
module connected to the carrier board. These pins are either left open (NC) or strapped to ground (GND) by the module to encode the pinout
type according to the table below. The ‘TYPE10#’ pin is for dual use. It indicates to the carrier board that a Type 10 module is installed. It also
indicates that a Rev 1.0 or Rev 2.0 module is installed. For more information, refer to the COM Express™ Specication Rev 2.0.
Table 4 Module Type Detection
Module Type Pin TYPE0# Pin TYPE1# Pin TYPE2# Pin TYPE10#
Module Type 1 X (not present) X (not present) X (not present) NC
Module Type 2 NC NC NC NC
Module Type 3 GND NC NC NC No IDE interface
Module Type 4 NC GND NC NC No PCI interface
Module Type 5 GND GND NC NC No IDE, no PCI interface
Module Type 6 NC NC GND NC No IDE, no PCI interface

Copyright © 2012 congatec AG CEVA_c_m10 17/47
Module Type Pin TYPE0# Pin TYPE1# Pin TYPE2# Pin TYPE10#
Module Type 10 X (not present) X (not present) X (not present) NC/PD (4.7k)/12V NC indicates Pin‑out Rev. 2.0
PD (4.7k) indicates Pin‑out Type 10
12V indicates Pin‑out Rev.1.0
Note
If an incompatible module pinout type is detected on the conga-CEVAL, an onboard logic will prevent the board from powering up the whole
system by controlling the ‘PS_ON#’ signal of the ATX power supply.
The ‘TYPE[0:2]0#’ signals are not present in Type 1 and Type 10 modules.
3.3 CMOS Battery
The conga‑CEVAL includes a battery that supplies power to the RTC circuit of the COM Express™ CPU module. The battery provides 3V of
power. The specied battery type is CR2032.
Note
To fulll the requirements of the EN60950, the conga-CEVAL incorporates two current-limiting devices (resistor and diode) in the battery power
supply path.
Warning
Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the manufacturer.
Dispose used batteries according to the manufacturer’s instructions.
3.4 Environmental Specications
Temperature Operation: 0° to 60°C Storage: ‑20° to +80°C
Humidity Operation: 10% to 90% Storage: 5% to 95%
Note
The above operating temperatures must be strictly adhered to at all times.
Humidity specications are for non-condensing conditions.

Copyright © 2012 congatec AG CEVA_c_m10 18/47
4 Connector Subsystems Rows A,B,C,D
4.1 Connector Pinout Rows A and B
Table 5 Module Type 2 Connector Pinout Rows A and B
Pin Row A Pin Row B Pin Row A Pin Row B
A1 GND (FIXED) B1 GND (FIXED) A56 PCIE_TX4‑ B56 PCIE_RX4‑
A2 GBE0_MDI3- B2 GBE0_ACT# A57 GND B57 GPO2
A3 GBE0_MDI3+ B3 LPC_FRAME# A58 PCIE_TX3+ B58 PCIE_RX3+
A4 GBE0_LINK100# B4 LPC_AD0 A59 PCIE_TX3‑ B59 PCIE_RX3‑
A5 GBE0_LINK1000# B5 LPC_AD1 A60 GND (FIXED) B60 GND (FIXED)
A6 GBE0_MDI2- B6 LPC_AD2 A61 PCIE_TX2+ B61 PCIE_RX2+
A7 GBE0_MDI2+ B7 LPC_AD3 A62 PCIE_TX2‑ B62 PCIE_RX2‑
A8 GBE0_LINK# B8 LPC_DRQ0# A63 GPI1 B63 GPO3
A9 GBE0_MDI1- B9 LPC_DRQ1# A64 PCIE_TX1+ B64 PCIE_RX1+
A10 GBE0_MDI1+ B10 LPC_CLK A65 PCIE_TX1‑ B65 PCIE_RX1‑
A11 GND (FIXED) B11 GND (FIXED) A66 GND B66 WAKE0#
A12 GBE0_MDI0- B12 PWRBTN# A67 GPI2 B67 WAKE1#
A13 GBE0_MDI0+ B13 SMB_CK A68 PCIE_TX0+ B68 PCIE_RX0+
A14 GBE0_CTREF B14 SMB_DAT A69 PCIE_TX0‑ B69 PCIE_RX0‑
A15 SUS_S3# B15 SMB_ALERT# A70 GND (FIXED) B70 GND (FIXED)
A16 SATA0_TX+ B16 SATA1_TX+ A71 LVDS_A0+ B71 LVDS_B0+
A17 SATA0_TX‑ B17 SATA1_TX‑ A72 LVDS_A0‑ B72 LVDS_B0-
A18 SUS_S4# B18 SUS_STAT# A73 LVDS_A1+ B73 LVDS_B1+
A19 SATA0_RX+ B19 SATA1_RX+ A74 LVDS_A1‑ B74 LVDS_B1-
A20 SATA0_RX‑ B20 SATA1_RX‑ A75 LVDS_A2+ B75 LVDS_B2+
A21 GND (FIXED) B21 GND (FIXED) A76 LVDS_A2‑ B76 LVDS_B2-
A22 SATA2_TX+ B22 SATA3_TX+ A77 LVDS_VDD_EN B77 LVDS_B3+
A23 SATA2_TX‑ B23 SATA3_TX‑ A78 LVDS_A3+ B78 LVDS_B3-
A24 SUS_S5# B24 PWR_OK A79 LVDS_A3‑ B79 LVDS_BKLT_EN
A25 SATA2_RX+ B25 SATA3_RX+ A80 GND (FIXED) B80 GND (FIXED)
A26 SATA2_RX‑ B26 SATA3_RX‑ A81 LVDS_A_CK+ B81 LVDS_B_CK+
A27 BATLOW# B27 WDT A82 LVDS_A_CK‑ B82 LVDS_B_CK-
A28 (S)ATA_ACT# B28 AC/HDA_SDIN2 A83 LVDS_I2C_CK B83 LVDS_BKLT_CTRL
A29 AC/HDA_SYNC B29 AC/HDA_SDIN1 A84 LVDS_I2C_DAT B84 VCC_5V_SBY
A30 AC/HDA_RST# B30 AC/HDA_SDIN0 A85 GPI3 B85 VCC_5V_SBY
A31 GND (FIXED) B31 GND (FIXED) A86 KBD_RST# B86 VCC_5V_SBY
A32 AC/HDA_BITCLK B32 SPKR A87 KBD_A20GATE B87 VCC_5V_SBY
A33 AC/HDA_SDOUT B33 I2C_CK A88 PCIE0_CK_REF+ B88 BIOS_DIS1#

Copyright © 2012 congatec AG CEVA_c_m10 19/47
Pin Row A Pin Row B Pin Row A Pin Row B
A34 BIOS_DIS0# B34 I2C_DAT A89 PCIE0_CK_REF‑ B89 VGA_RED
A35 THRMTRIP# B35 THRM# A90 GND (FIXED) B90 GND (FIXED)
A36 USB6- B36 USB7- A91 SPI_POWER B91 VGA_GRN
A37 USB6+ B37 USB7+ A92 SPI_MISO B92 VGA_BLU
A38 USB_6_7_OC# B38 USB_4_5_OC# A93 GPO0 B93 VGA_HSYNC
A39 USB4- B39 USB5- A94 SPI_CLK B94 VGA_VSYNC
A40 USB4+ B40 USB5+ A95 SPI_MOSI B95 VGA_I2C_CK
A41 GND (FIXED) B41 GND (FIXED) A96 GND B96 VGA_I2C_DAT
A42 USB2- B42 USB3- A97 TYPE10# B97 SPI_CS#
A43 USB2+ B43 USB3+ A98 RSVD B98 RSVD
A44 USB_2_3_OC# B44 USB_0_1_OC# A99 RSVD B99 RSVD
A45 USB0- B45 USB1- A100 GND (FIXED) B100 GND (FIXED)
A46 USB0+ B46 USB1+ A101 RSVD B101 RSVD
A47 VCC_RTC B47 EXCD1_PERST# A102 RSVD B102 RSVD
A48 EXCD0_PERST# B48 EXCD1_CPPE# A103 RSVD B103 RSVD
A49 EXCD0_CPPE# B49 SYS_RESET# A104 VCC_12V B104 VCC_12V
A50 LPC_SERIRQ B50 CB_RESET# A105 VCC_12V B105 VCC_12V
A51 GND (FIXED) B51 GND (FIXED) A106 VCC_12V B106 VCC_12V
A52 PCIE_TX5+ B52 PCIE_RX5+ A107 VCC_12V B107 VCC_12V
A53 PCIE_TX5‑ B53 PCIE_RX5‑ A108 VCC_12V B108 VCC_12V
A54 GPI0 B54 GPO1 A109 VCC_12V B109 VCC_12V
A55 PCIE_TX4+ B55 PCIE_RX4+ A110 GND (FIXED) B110 GND (FIXED)
4.1.1 SM Bus
On the COM Express™ module, the System Management Bus (SMB) is powered by the standby power rail in order to have control over the
system during the system states S0‑S5. The devices on the conga‑CEVAL(e.g. PCI Express clock buffer or PCI Express connectors) using the
SMB are normally powered by the 3.3V main power. To avoid current leakage between the main power of the carrier board and the standby
power of the module, a bus switch separates the SMB on the conga-CEVAL carrier board from the SMB of the module.
The SM Bus signals are available on the feature connector (X27) described in section 5.8.

Copyright © 2012 congatec AG CEVA_c_m10 20/47
4.1.2 I²C Bus
The I²C signals are available in different locations on the conga‑CEVAL including the feature connector (X27) described in section 5.8 of this
document.
The conga‑CEVAL includes a socket for an I²C EEPROM (U17) that can be used for test purposes during the system development. This 8 pin
DIP socket can be used with different 2‑wire serial EEPROMS (for example 24C04 / 08 / 16 ...) and can be accessed easily by using the I²C
control commands implemented in the congatec CGOS API driver. Refer to the COM Express™ module's user's guide and CGOS manual for
details.
Furthermore, the conga‑CEVAL includes an I²C application implemented by a PCA9555 device from Philips, a 16‑bit I²C I/O port with interrupt.
This device provides 16 bits of general purpose parallel Input/Output (GPIO) expansion for I²C applications. It provides the ability to display and
read different byte congurations via the I²C digital I/O jumper connectors X5 and X12.
Contact the congatec AG support team for more information.
Connector Type
X5/X12: 2.54mm grid header
4.1.3 SPI Bus
The SPI Bus is connected to the SPI BIOS ash that supports off-module BIOS ash boot. The conga-CEVAL revision C1 has onboard an SPI
socket for 8‑lead Small Outline Integrated Circuit (200 mils).
I2C EEPROM
(S3)
1
2
3
4
5
6
7
8
9
10
I²C Digital I/O
X5
X12
11
12
13
14
15
16
17
18
19
20
13
24
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20