Congatec COM Express conga-BM67 User manual

COM Express™ conga-BM67/BS67
2nd Generation Intel®Core™ i7, i5, i3 or Celeron®processor with an Intel®6 Series QM67 chipset
User’s Guide
Revision 0.2 (Preliminary)

Copyright © 2011 congatec AG BM67_BS67m02 2/101
Revision History
Revision Date (dd.mm.yy) Author Changes
0.1 30.09.11 GDA Preliminary release
0.2 01.06.12 GDA Added power numbers. Corrected description of KBD_A20GATE pin A87 in table 13 “Miscellaneous Signal Descriptions.” It was stated that
this signal should be pulled low on the module but the correct statement is that the signal should be pulled high on the module. Update
section 9 “BIOS Setup Description”.

Copyright © 2011 congatec AG BM67_BS67m02 3/101
Preface
Thisuser’s guide provides information about the components, features, connectors and BIOS Setup menus available on the conga-BM67/BS67.
It is one of three documents that should be referred to when designing a COM Express™ application. The other reference documents that
should be used include the following:
COM Express™ Design Guide
COM Express™ Specication
The links to these documents can be found on the congatec AG website at www.congatec.com
Disclaimer
The information contained within this user’s guide, including but not limited to any product specication, is subject to change without notice.
congatec AG provides no warranty with regard to this user’s guide or any other information contained herein and hereby expressly disclaims
any implied warranties of merchantability or tness for any particular purpose with regard to any of the foregoing. congatec AG assumes
no liability for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for
discrepancies between the product and the user’s guide. In no event shall congatec AG be liable for any incidental, consequential, special, or
exemplary damages, whether based on tort, contract or otherwise, arising out of or in connection with this user’s guide or any other information
contained herein or the use thereof.
Intended Audience
This user’s guide is intended for technically qualied personnel. It is not intended for general audiences.
Lead-Free Designs (RoHS)
All congatec AG designs are created from lead-free components and are completely RoHS compliant.
Electrostatic Sensitive Device
All congatec AG products are electrostatic sensitive devices and are packaged accordingly. Do not open or handle a congatec AG product
except at an electrostatic-free workstation. Additionally, do not ship or store congatecAG products near strong electrostatic, electromagnetic,
magnetic, or radioactive elds unless the device is contained within its original manufacturer’s packaging. Be aware that failure to comply with
these guidelines will void the congatec AG Limited Warranty.

Copyright © 2011 congatec AG BM67_BS67m02 4/101
Symbols
The following symbols are used in this user’s guide:
Warning
Warnings indicate conditions that, if not observed, can cause personal injury.
Caution
Cautions warn the user about how to prevent damage to hardware or loss of data.
Note
Notes call attention to important information that should be observed.
Terminology
Term Description
GB Gigabyte (1,073,741,824 bytes)
GHz Gigahertz (one billion hertz)
kB Kilobyte (1024 bytes)
MB Megabyte (1,048,576 bytes)
Mbit Megabit (1,048,576 bits)
kHz Kilohertz (one thousand hertz)
MHz Megahertz (one million hertz)
TDP Thermal Design Power
PCIe PCI Express
SATA Serial ATA
PEG PCI Express Graphics
PCH Platform Controller Hub
PATA Parallel ATA
T.O.M. Top of memory = max. DRAM installed
HDA High Denition Audio
I/F Interface
N.C. Not connected
N.A. Not available
TBD To be determined

Copyright © 2011 congatec AG BM67_BS67m02 5/101
Trademarks
Product names, logos, brands, and other trademarks featured or referred to within this user’s guide, or the congatec website, are the property
of their respective trademark holders. These trademark holders are not afliated with congatec AG, our products, or our website.
Warranty
congatec AG makes no representation, warranty or guaranty, express or implied regarding the products except its standard form of limited
warranty (“Limited Warranty”). congatec AG may in its sole discretion modify its Limited Warranty at any time and from time to time.
Beginning on the date of shipment to its direct customer and continuing for the published warranty period, congatec AG represents that the
products are new and warrants that each product failing to function properly under normal use, due to a defect in materials or workmanship or
due to non conformance to the agreed upon specications, will be repaired or exchanged, at congatec AG’s option and expense.
Customer will obtain a Return Material Authorization (“RMA”) number from congatec AG prior to returning the non conforming product freight
prepaid. congatec AG will pay for transporting the repaired or exchanged product to the customer.
Repaired, replaced or exchanged product will be warranted for the repair warranty period in effect as of the date the repaired, exchanged or
replaced product is shipped by congatec AG, or the remainder of the original warranty, whichever is longer. This Limited Warranty extends to
congatec AG’s direct customer only and is not assignable or transferable.
Except as set forth in writing in the Limited Warranty, congatec AG makes no performance representations, warranties, or guarantees, either
express or implied, oral or written, with respect to the products, including without limitation any implied warranty (a) of merchantability, (b) of
tness for a particular purpose, or (c) arising from course of performance, course of dealing, or usage of trade.
congatec AG shall in no event be liable to the end user for collateral or consequential damages of any kind. congatec AG shall not otherwise
be liable for loss, damage or expense directly or indirectly arising from the use of the product or from any other cause. The sole and exclusive
remedy against congatec AG, whether a claim sound in contract, warranty, tort or any other legal theory, shall be repair or replacement of the
product only

Copyright © 2011 congatec AG BM67_BS67m02 6/101
COM Express™ Concept
COM Express™ is an open industry standard dened specically for COMs (computer on modules). It’s creation provides the ability to make a
smooth transition from legacy parallel interfaces to the newest technologies based on serial buses available today. COM Express™ modules
are available in following form factors:
• Compact 95mm x 95mm
• Basic 125mm x 95mm
• Extended 155mm x 110mm
The COM Express™ specication 2.0 denes seven different pinout types.
Types Connector Rows PCI Express Lanes PCI IDE Channels LAN ports
Type 1 A-B Up to 6 1
Type 2 A-B C-D Up to 22 32 bit 1 1
Type 3 A-B C-D Up to 22 32 bit 3
Type 4 A-B C-D Up to 32 1 1
Type 5 A-B C-D Up to 32 3
Type 6 A-B C-D Up to 24 1
Type 10 A-B Up to 4 1
conga-BM67/BS67 modules utilize the Type 2 pinout denition. They are equipped with two high performance connectors that ensure stable
data throughput.
The COM (computer on module) integrates all the core components and is mounted onto an application specic carrier board. COM modules
are a legacy-free design (no Super I/O, PS/2 keyboard and mouse) and provide most of the functional requirements for any application. These
functions include, but are not limited to, a rich complement of contemporary high bandwidth serial interfaces such as PCI Express, Serial ATA,
USB 2.0, and Gigabit Ethernet. The Type 2 pinout provides the ability to offer 32-bit PCI, Parallel ATA, and LPC options thereby expanding
the range of potential peripherals. The robust thermal and mechanical concept, combined with extended power-management capabilities, is
perfectly suited for all applications.
Carrier board designers can utilize as little or as many of the I/O interfaces as deemed necessary. The carrier board can therefore provide all
the interface connectors required to attach the system to the application specic peripherals. This versatility allows the designer to create a
dense and optimized package, which results in a more reliable product while simplifying system integration. Most importantly, COM Express™
modules are scalable, which means once an application has been created there is the ability to diversify the product range through the use of
different performance class or form factor size modules. Simply unplug one module and replace it with another, no redesign is necessary.

Copyright © 2011 congatec AG BM67_BS67m02 7/101
Certication
congatec AG is certied to DIN EN ISO 9001 standard.
Technical Support
congatec AG technicians and engineers are committed to providing the best possible technical support for our customers so that our products
can be easily used and implemented. We request that you rst visit our website at www.congatec.com for the latest documentation, utilities and
drivers, which have been made available to assist you. If you still require assistance after visiting our website then contact our technical support
department by email at [email protected]

Copyright © 2011 congatec AG BM67_BS67m02 8/101
conga-BM67/BS67 Options Information
The conga-BM67 is available in four different variants and the conga-BS67 is available in ve different variants. This user’s guide describes all
of these variants. The tables below show the different congurations available. Check for the Part No. that applies to your product. This will tell
you what options described in this user’s guide are available on your particular module.
conga-BM67
Part-No. 046101 046102 046104 046105
Processor Intel®Core™ i7-2710QE 2.1 GHz Intel®Core™ i5-2510E 2.5 GHz Intel®Core™ i3-2330E 2.13 GHz Intel®Celeron®B810 1.6 GHz 2 Core™
Intel®Smart Cache 6 MByte 3 MByte 3 MByte 2 MByte
PEG No No No No
SDVO 1 Port 1 Port 1 Port 1 Port
DisplayPort (DP) Yes Yes Yes Yes
HDMI Yes Yes Yes Yes
Processor TDP 45 W 35 W 35 W 35 W
conga-BS67
Part-No. 046151 046152 046153 046154 046155
Processor Intel®Core™ i7-2655LE 2.2 GHz Intel®Core™ i7-2610UE 1.5 GHz Intel®Core™ i3-2340UE 1.3 GHz Intel®Celeron®847E
1.1 GHz 2 Core™ Intel®Celeron®827E 1.4 GHz 2 Core™
Intel®Smart Cache 4 MByte 4 MByte 3 MByte 2 MByte 1.5 MByte
PEG No No No No No
SDVO 1 Port 1 Port 1 Port 1 Port 1 Port
DisplayPort (DP) Yes Yes Yes Yes Yes
HDMI Yes Yes Yes Yes Yes
Processor TDP 25 W 17 W 17 W 17 W 17 W

Copyright © 2011 congatec AG BM67_BS67m02 9/101
Contents
1 Specications...........................................................................12
1.1 Feature List..............................................................................12
1.2 Supported Operating Systems.................................................13
1.3 Mechanical Dimensions...........................................................13
1.4 Socketed Variant of conga-BM67 ............................................14
1.5 Supply Voltage Standard Power..............................................15
1.5.1 Electrical Characteristics..........................................................15
1.5.2 Rise Time.................................................................................15
1.6 Power Consumption.................................................................16
1.6.1 conga-BM67 Intel®Core™ i7-2710QE 2.1 GHz 6MB Cache ..18
1.6.2 conga-BM67 Intel®Core™ i5-2510E 2.5 GHz 3MB Cache .....18
1.6.3 conga-BM67 Intel®Core™ i3-2330E 2.13 GHz 3MB Cache ...18
1.6.4 conga-BM67 Intel®Celeron®B810 1.6 GHz 4MB Cache.........19
1.6.5 conga-BS67 Intel®Core™ i7-2655LE 2.2 GHz 4MB Cache....19
1.6.6 conga-BS67 Intel®Core™ i7-2610UE 1.5 GHz 4MB Cache ...19
1.6.7 conga-BS67 Intel®Core™ i3-2340UE 1.3 GHz 3MB Cache ...20
1.6.8 conga-BS67 Intel®Celeron®847E 1.1 GHz 2 Core™ 2MB Cache
20
1.6.9 conga-BS67 Intel®Celeron®827E 1.4 GHz 2 Core™ 1.5MB
Cache.......................................................................................21
1.7 Supply Voltage Battery Power .................................................22
1.7.1 CMOS Battery Power Consumption ........................................22
1.8 Environmental Specications...................................................22
2 Block Diagram..........................................................................23
3 Heatspreader...........................................................................24
3.1 Heatspreader Dimensions .......................................................25
3.2 Heatspreader Thermal Imagery...............................................26
4 Connector Subsystems Rows A, B, C, D.................................27
4.1 Primary Connector Rows A and B............................................28
4.1.1 Serial ATA™ (SATA).................................................................28
4.1.2 USB 2.0....................................................................................28
4.1.3 High Denition Audio (HDA) Interface......................................28
4.1.4 Gigabit Ethernet ......................................................................28
4.1.5 LPC Bus...................................................................................29
4.1.6 I²C Bus 400kHz........................................................................29
4.1.7 PCI Express™ .........................................................................29
4.1.8 ExpressCard™.........................................................................29
4.1.9 Graphics Output (VGA/CRT) ...................................................29
4.1.10 LCD..........................................................................................30
4.1.11 TV-Out......................................................................................30
4.1.12 Power Control..........................................................................30
4.1.13 Power Management.................................................................31
4.2 Secondary Connector Rows C and D......................................31
4.2.1 PCI Express Graphics (PEG)...................................................31
4.2.2 SDVO.......................................................................................31
4.2.3 HDMI........................................................................................32
4.2.4 DisplayPort (DP)......................................................................32
4.2.5 PCI Bus....................................................................................32
4.2.6 IDE (PATA)...............................................................................33
5 Additional Features..................................................................34
5.1 congatec Board Controller (cBC).............................................34
5.2 Board Information ....................................................................34
5.3 Watchdog.................................................................................34
5.4 I2C Bus.....................................................................................34
5.5 Power Loss Control..................................................................34
5.6 Embedded BIOS......................................................................35
5.6.1 CMOS Backup in Non Volatile Memory...................................35
5.6.2 OEM CMOS Default Settings and OEM BIOS Logo................35
5.6.3 OEM BIOS Code......................................................................35
5.6.4 congatec Battery Management Interface.................................36
5.6.5 API Support (CGOS/EAPI) ......................................................36
5.7 Security Features.....................................................................37
5.8 Suspend to Ram......................................................................37
6 conga Tech Notes....................................................................38
6.1 Intel Turbo Boost 2...................................................................38
6.2 Intel®Matrix Storage Technology ............................................39
6.2.1 AHCI ........................................................................................39

Copyright © 2011 congatec AG BM67_BS67m02 10/101
6.2.2 RAID ........................................................................................39
6.3 Intel®Processor Features........................................................39
6.3.1 Thermal Monitor and Catastrophic Thermal Protection...........39
6.3.2 Processor Performance Control...............................................40
6.3.3 Intel®64....................................................................................40
6.3.4 Intel®Virtualization Technology................................................41
6.4 Thermal Management..............................................................42
6.5 ACPI Suspend Modes and Resume Events............................44
6.6 USB 2.0 EHCI Host Controller Support ...................................45
7 Signal Descriptions and Pinout Tables.....................................46
7.1 A-B Connector Signal Descriptions..........................................47
7.2 A-B Connector Pinout..............................................................56
7.3 C-D Connector Signal Descriptions.........................................58
7.4 C-D Connector Pinout..............................................................70
7.5 Boot Strap Signals...................................................................72
8 System Resources...................................................................74
8.1 System Memory Map...............................................................74
8.2 I/O Address Assignment...........................................................75
8.2.1 LPC Bus...................................................................................76
8.3 Interrupt Request (IRQ) Lines..................................................76
8.4 PCI Conguration Space Map .................................................78
8.5 PCI Interrupt Routing Map.......................................................79
8.6 PCI Bus Masters......................................................................80
8.7 I²C Bus.....................................................................................80
8.8 SM Bus ....................................................................................80
9 BIOS Setup Description...........................................................81
9.1 Entering the BIOS Setup Program...........................................81
9.1.1 Boot Selection Popup ..............................................................81
9.2 Setup Menu and Navigation.....................................................81
9.3 Main Setup Screen ..................................................................82
9.4 Platform Information.................................................................83
9.5 Advanced Setup.......................................................................83
9.5.1 Graphics Conguration Submenu............................................84
9.5.2 Watchdog Conguration Submenu ..........................................86
9.5.3 PCI and PCI Express Conguration Submenu ........................88
9.5.3.1 PCI Express Root Port Submenu ............................................89
9.5.4 ACPI Conguration Submenu..................................................89
9.5.5 CPU Conguration Submenu...................................................90
9.5.6 Chipset Conguration Submenu ..............................................91
9.5.7 SATA/PATA Conguration Submenu........................................92
9.5.8 USB Conguration Submenu...................................................93
9.5.9 Super I/O Conguration Submenu...........................................94
9.5.10 Serial Port Console Redirection Submenu..............................94
9.5.10.1 Console Redirection Settings Submenu..................................95
9.6 Boot Setup...............................................................................96
9.6.1 Boot Settings Conguration .....................................................96
9.6.1.1 USB Control Submenu.............................................................97
9.7 Security Setup..........................................................................98
9.7.1 Security Settings......................................................................98
9.7.2 Hard Disk Security...................................................................98
9.7.3 Save & Exit Menu ....................................................................98
10 Additional BIOS Features ........................................................99
10.1 Updating the BIOS...................................................................99
10.2 BIOS Security Features...........................................................99
10.3 Hard Disk Security Features....................................................99
11 Industry Specications ...........................................................101

Copyright © 2011 congatec AG BM67_BS67m02 11/101
List of Tables
Table 1 Feature Summary....................................................................12
Table 2 Signal Tables Terminology Descriptions ..................................46
Table 3 Intel® High Denition Audio Link Signals Descriptions .............47
Table 4 Gigabit Ethernet Signal Descriptions.......................................48
Table 5 Serial ATA Signal Descriptions.................................................48
Table 6 PCI Express Signal Descriptions (general purpose)................49
Table 7 ExpressCard Support Pins Descriptions..................................50
Table 8 LPC Signal Descriptions..........................................................50
Table 9 USB Signal Descriptions..........................................................51
Table 10 CRT Signal Descriptions..........................................................51
Table 11 LVDS Signal Descriptions........................................................52
Table 12 SPI BIOS Flash Interface Signal Descriptions.........................53
Table 13 Miscellaneous Signal Descriptions ..........................................53
Table 14 General Purpose I/O Signal Descriptions................................54
Table 15 Power and System Management Signal Descriptions.............54
Table 16 Power and GND Signal Descriptions.......................................55
Table 17 Connector A-B Pinout ..............................................................56
Table 18 PCI Signal Descriptions...........................................................58
Table 19 IDE Signal Descriptions...........................................................60
Table 20 PCI Express Signal Descriptions (x16 Graphics).....................61
Table 21 SDVO Signal Descriptions.......................................................63
Table 22 HDMI Signal Descriptions........................................................64
Table 23 DisplayPort (DP) Signal Descriptions ......................................66
Table 24 Module Type Denition Signal Description ..............................68
Table 25 Power and GND Signal Descriptions.......................................68
Table 26 Miscellaneous Signal Descriptions ..........................................69
Table 27 Connector C-D Pinout..............................................................70
Table 28 Boot Strap Signal Descriptions................................................72
Table 29 Memory Map............................................................................74
Table 30 I/O Address Assignment...........................................................75
Table 31 IRQ Lines in PIC mode............................................................76
Table 32 IRQ Lines in APIC mode..........................................................77
Table 33 PCI Conguration Space Map .................................................78
Table 34 PCI Interrupt Routing Map.......................................................79

Copyright © 2011 congatec AG BM67_BS67m02 12/101
1 Specications
1.1 Feature List
Table 1 Feature Summary
Form Factor Based on COM Express™ standard pinout Type 2 (Basic size 95 x 125mm)
Processor conga-BM67: Intel®Core™ i7-2710QE 2.1 GHz with 6-MByte Intel®Smart Cache (Socketed rPGA988)
conga-BM67: Intel®Core™ i5-2510E 2.5 GHz 3-MByte Intel®Smart Cache (Socketed rPGA988)
conga-BM67: Intel®Core™ i3-2330E 2.13 GHz 3-MByte Intel®Smart Cache (Socketed rPGA988)
conga-BM67: Intel®Celeron®B810 1.6 GHz 2 Core™ with 2-MByte Intel®Smart Cache (Socketed rPGA988)
conga-BS67: Intel®Core™ i7-2655LE 2.2 GHz with 4-MByte Intel®Smart Cache
conga-BS67: Intel®Core™ i7-2610UE 1.5 GHz with 4-MByte Intel®Smart Cache
conga-BS67: Intel®Core™ i3-2340UE 1.3 GHz with 3-MByte Intel®Smart Cache
conga-BS67: Intel®Celeron®847E 1.1 GHz 2 Core™ with 2-MByte Intel®Smart Cache
conga-BS67: Intel®Celeron®827E 1.4 GHz 2 Core™ with 1.5-MByte Intel®Smart Cache
Memory 2 sockets: SO-DIMM DDR3 1333MHz up to 16-GByte. Sockets located top and bottom side of module.
Chipset Intel®6 Series Chipset: Intel®BD82QM67 PCH (BD82HM65 for Celeron®equipped modules)
Audio HDA (High Denition Audio)/digital audio interface with support for multiple codecs
Ethernet Gigabit Ethernet: Integrated within the Intel®QM67 (HM65) + Intel®82579LM Phy.
Graphics Options Intel®HD Graphics Controller, Intel®Dynamic Video Memory Technology (Intel®DVMT) OpenGL 2.1 and DirectX10 support.
Two independent pipelines for full dual view support.
• CRT Interface 350 MHz RAMDAC Resolutions up to 2048x1536 @ 75Hz (QXGA)
• Flat panel Interface (integrated)
2x25-112MHz single/dual-channel LVDS Transmitter
Single-channel LVDS interface support: 1 x 18 bpp OR 1 x 24 bpp
Dual-channel LVDS interface support: 2 x 18 bpp OR 2 x 24 bpp panel support
Supports VESA LVDS color mappings. Automatic Panel Detection via EPI
(Embedded Panel Interface based on VESA EDID™ 1.3) Resolutions 640x480 up to
1900x1200 (WUXGA)
• HDMI: 3x HDMI ports on digital ports B, C and D. Multiplexed with DisplayPort (DP).
• DisplayPort 1.1 (DP): 3x DisplayPorts ports on digital
ports B, C and D. Multiplexed with HDMI ports. Hot-Plug
detect support.
• DVI: 3x DVI ports on digital ports B, C and D. Multiplexed
with HDMI/DP ports. Hot-Plug detect support.
• AUX Output 1 x Intel®compliant SDVO port (serial DVO)
200MPixel/sec on digital port B and multiplexed with
HDMI/DP/DVI ports. Supports external DVI, TV and
LVDS transmitters.
Peripheral
Interfaces • 4x Serial ATA®, with RAID support 0/1/5/10.
• 6 PCI Express®Lanes. Support for full 5 Gb/s bandwidth in each direction per x1
links (can be congured via BIOS rmware to support one x1s and one x4 link. A
special BIOS is required for one x4 link).
• 8x USB 2.0 (EHCI)
• PCI Bus Rev. 2.3
• 1x EIDE (UDMA-66/100)
• LPC Bus
• I²C Bus, Fast Mode (400 kHz) multimaster
BIOS AMI Aptio® UEFI 2.x rmware, 8MByte serial SPI with congatec Embedded BIOS features
Power Management ACPI 3.0 compliant with battery support. Also supports Suspend to RAM (S3).
Note
Some of the features mentioned in the above Feature Summary are optional. Check the article number of your module and compare it to the

Copyright © 2011 congatec AG BM67_BS67m02 13/101
option information list on page 8 of this user’s guide to determine what options are available on your particular module.
1.2 Supported Operating Systems
The conga-BM67/BS67 supports the following operating systems.
• Microsoft®Windows®7
• Microsoft®Windows®XP
• Microsoft®Windows®Embedded Standard
• Linux
• QNX
1.3 Mechanical Dimensions
• 95.0 mm x 125.0 mm (3.74” x 4.92”)
• Height approximately 18 or 21mm (including heatspreader) depending on the carrier board connector that is used. If the 5mm
(height) carrier board connector is used then approximate overall height is 18mm. If the 8mm (height) carrier board connector is
used then approximate overall height is 21mm.

Copyright © 2011 congatec AG BM67_BS67m02 14/101
1.4 Socketed Variant of conga-BM67
The conga-BM67 is equipped with a PGA socket. This socket has 988 contacts and mates with a rPGA package that has a maximum of 988
pins. The insertion and extraction forces are zero when the socket is not engaged (in the “open” position).
There are clear indicator marks located on the actuation mechanism that identify the lock (closed) and unlock (open) positions of the cover as
well as the actuation direction (see picture below). These marks remain visible after the processor is inserted into the socket.
Electrostatic Sensitive Device
The conga-BM67 is an electrostatic sensitive device. Do not handle the conga-BM67, or processor, except at an electrostatic-free workstation.
Failure to do so may cause damage to the module and/or processor and void the manufacturer’s warranty.
Locked (closed)
Unlocked (open)
rPGA-989
SOCKET

Copyright © 2011 congatec AG BM67_BS67m02 15/101
1.5 Supply Voltage Standard Power
• 12V DC ± 5%
The dynamic range shall not exceed the static range.
1.5.1 Electrical Characteristics
Power supply pins on the module’s connectors limit the amount of input power. The following table provides an overview of the limitations for
pinout Type 2 (dual connector, 440 pins).
Power Rail Module Pin Current
Capability (Amps) Nominal Input (Volts) Input Range (Volts) Derated Input (Volts) Max. Input Ripple (10Hz to 20MHz)
(mV)
Max. Module Input Power
(w. derated input)
(Watts)
Assumed
Conversion
Efciency
Max. Load
Power
(Watts)
VCC_12V 12 12 11.4-12.6 11.4 +/- 100 137 85% 116
VCC_5V-SBY 2 5 4.75-5.25 4.75 +/- 50 9
VCC_RTC 0.5 3 2.0-3.3 +/- 20
1.5.2 Rise Time
The input voltages shall rise from 10% of nominal to 90% of nominal at a minimum rise time of 250V/s. The smooth turn-on requires that, during
the 10% to 90% portion of the rise time, the slope of the turn-on waveform must be positive.
Nominal Static Range
Dynamic Range
Absolute Minimum
Absolute Maximum12.60V
11.40V
12V
12.10V
11.90V

Copyright © 2011 congatec AG BM67_BS67m02 16/101
1.6 Power Consumption
The power consumption values listed in this document were measured under a controlled environment. The hardware used for testing includes
a conga-BM67/BS67 module, conga-Cdebug carrier board, CRT monitor, SATA drive, and USB keyboard. The conga-Cdebug is modied
so that the 12V input is only routed to the module and all other circuity on the carrier itself is powered by the 5V input. The SATA drive was
powered externally by an ATX power supply so that it does not inuence the power consumption value that is measured for the module. The
USB keyboard was detached once the module was congured within the OS. All recorded values were averaged over a 30 second time period.
Cooling of the module was done by the module specic heatpipe heatspreader and a fan cooled heatsink to measure the power consumption
under normal thermal conditions.
The conga-Cdebug originally does not provide 5V standby power. Therefore, an extra 5V_SB connection without any external loads was made.
Using this setup, the power consumption of the module in S3 (Standby) mode was measured directly.
Each module was measured while running Windows 7 Professional 64Bit, Hyper Threading enabled, Speed Step enabled, CPU Turbo Mode
enabled and Power Plan set to “Power Saver”. This setting ensures that Core™ processors run in LFM (lowest frequency mode) with minimal
core voltage during desktop idle. Each module was tested while using two 1GB memory modules. Using different sizes of RAM, as well as one
or two memory modules, will cause slight variances in the measured results.
To measure the worst case power consumption the cooling solution was removed and the CPU core temperature was allowed to run up to
between 95° and 100°C while running 100% workload with the Power Plan set to “Balanced”. The peak current value was then recorded. This
value should be taken into consideration when designing the system’s power supply to ensure that the power supply is sufcient during worst
case scenarios.

Copyright © 2011 congatec AG BM67_BS67m02 17/101
Power consumption values were recorded during the following stages:
Windows 7 (64 bit)
• Desktop Idle (power plan = Power Saver)
• 100% CPU workload (see note below, power plan = Power Saver)
• 100% CPU workload at approximately 100°C peak power consumption (power plan = Balanced)
• Suspend to RAM. Supply power for S3 mode is 5V.
Note
A software tool was used to stress the CPU to Max Turbo Frequency.
Processor Information
In the following power tables there is some additional information about the processors. Intel®offers processors that are considered to be low
power consuming. These processors can be identied by their voltage status. Intel uses the following terms to describe these processors. If
none of these terms are used then the processor is not considered to be low power consuming.
Intel®also describes the type of manufacturing process used for each processor. The following term is used:
nm=nanometer
The manufacturing process description is included in the power tables as well. See example below. For information about the manufacturing
process visit Intel®’s website.
Intel®Core™ i7-2710QE 2.1 GHz 6MB Intel® Smart Cache
32nm

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1.6.1 conga-BM67 Intel®Core™ i7-2710QE 2.1 GHz 6MB Cache
conga-BM67 Art. No. 046101 Intel®Core™ i7-2710QE 2.1 GHz 6MB Intel®Smart Cache
32nm
Layout Rev. BM67LX0 /BIOS Rev. BM67R000
Max Turbo Frequency 3.0 GHz
Memory Size 2GB
Operating System Windows 7 (64 bit)
Power State Desktop Idle 100% workload 100% workload approx.
100°C CPU temp (peak) Suspend to Ram (S3) 5V Input Power
Power consumption (measured in Amperes/Watts) 0.75 A/9 W (12V) 3.5 A/42 W (12V) 5.58 A/67 W (12V) 0.1 A/0.5 W (5V)
1.6.2 conga-BM67 Intel®Core™ i5-2510E 2.5 GHz 3MB Cache
conga-BM67 Art. No. 046102 Intel®Core™ i5-2510E 2.5 GHz 3MB Intel®Smart Cache
32nm
Layout Rev. BM67LX0 /BIOS Rev. BM67R000
Max Turbo Frequency 3.1 GHz
Memory Size 2GB
Operating System Windows 7 (64 bit)
Power State Desktop Idle 100% workload 100% workload approx.
100°C CPU temp (peak) Suspend to Ram (S3) 5V Input Power
Power consumption (measured in Amperes/Watts) TBD A/ W (12V) TBD A/ W (12V) TBD A/ W (12V) TBD A/ W (5V)
1.6.3 conga-BM67 Intel®Core™ i3-2330E 2.13 GHz 3MB Cache
conga-BM67 Art. No. 046104 Intel®i3-2330E 2.13 GHz 3MB Intel®Smart Cache
32nm
Layout Rev. BM67LX0 /BIOS Rev. BM67R000
Max Turbo Frequency Not supported
Memory Size 2GB
Operating System Windows 7 (64 bit)
Power State Desktop Idle 100% workload 100% workload approx.
100°C CPU temp (peak) Suspend to Ram (S3) 5V Input Power
Power consumption (measured in Amperes/Watts) TBD A/ W (12V) TBD A/ W (12V) TBD A/ W (12V) TBD A/ W (5V)

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1.6.4 conga-BM67 Intel®Celeron®B810 1.6 GHz 4MB Cache
conga-BS67 Art. No. 046105 Intel®Celeron®B810 1.6 GHz 2 Core™ 2MB Intel® Smart Cache
32nm
Layout Rev. BS67LX0 /BIOS Rev. BM67R000
Max Turbo Frequency Not supported
Memory Size 2GB
Operating System Windows 7 (64 bit)
Power State Desktop Idle 100% workload 100% workload approx.
100°C CPU temp (peak) Suspend to Ram (S3) 5V Input Power
Power consumption (measured in Amperes/Watts) 0.67 A/8.1 W (12V) 2.08 A/25 W (12V) 3.0 A/36 W (12V) 0.1 A/0.5 W (5V)
1.6.5 conga-BS67 Intel®Core™ i7-2655LE 2.2 GHz 4MB Cache
conga-BS67 Art. No. 046151 Intel®Core™ i7-2655LE 2.2 GHz 4MB Intel® Smart Cache
32nm
Layout Rev. BS67LX0 /BIOS Rev. BM67R000
Max Turbo Frequency 2.9 GHz
Memory Size 2GB
Operating System Windows 7 (64 bit)
Power State Desktop Idle 100% workload 100% workload approx.
100°C CPU temp (peak) Suspend to Ram (S3) 5V Input Power
Power consumption (measured in Amperes/Watts) TBD A/ W (12V) TBD A/ W (12V) TBD A/ W (12V) TBD A/ W (5V)
1.6.6 conga-BS67 Intel®Core™ i7-2610UE 1.5 GHz 4MB Cache
conga-BS67 Art. No. 046152 Intel® Core™ i7-2610UE 1.5 GHz 3MB Intel® Smart Cache
32nm
Layout Rev. BS67LX0 /BIOS Rev. BM67R000
Max Turbo Frequency 2.4 GHz
Memory Size 2GB
Operating System Windows 7 (64 bit)
Power State Desktop Idle 100% workload 100% workload approx.
100°C CPU temp (peak) Suspend to Ram (S3) 5V Input Power
Power consumption (measured in Amperes/Watts) 0.67 A/8.1 W (12V) 1.58 A/19 W (12V) 7.5 A/90 W (12V) 0.1 A/0.5 W (5V)

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1.6.7 conga-BS67 Intel®Core™ i3-2340UE 1.3 GHz 3MB Cache
conga-BS67 Art. No. 046153 Intel®Core™ i3-2340UE 1.3 GHz 3MB Intel® Smart Cache
32nm
Layout Rev. BS67LX0 /BIOS Rev. BM67R000
Max Turbo Frequency Not supported
Memory Size 2GB
Operating System Windows 7 (64 bit)
Power State Desktop Idle 100% workload 100% workload approx.
100°C CPU temp (peak) Suspend to Ram (S3) 5V Input Power
Power consumption (measured in Amperes/Watts) TBD A/ W (12V) TBD A/ W (12V) TBD A/ W (12V) TBD A/ W (5V)
1.6.8 conga-BS67 Intel®Celeron®847E 1.1 GHz 2 Core™ 2MB Cache
conga-BS67 Art. No. 046154 Intel®Celeron®847E 1.1 GHz 2 Core™ 3MB Intel® Smart Cache
32nm
Layout Rev. BS67LX0 /BIOS Rev. BM67R000
Max Turbo Frequency Not supported
Memory Size 2GB
Operating System Windows 7 (64 bit)
Power State Desktop Idle 100% workload 100% workload approx.
100°C CPU temp (peak) Suspend to Ram (S3) 5V Input Power
Power consumption (measured in Amperes/Watts) 0.57 A/6.9 W (12V) 1.3 A/15.6 W (12V) 1.39 A/16.7 W (12V) 0.1 A/0.5 W (5V)