Congatec COM Express conga-TC175 User manual

Copyright © 2017 congatec AG TCKLm10 1/71
COM Express™ conga-TC175
7th Generation Intel®Core™ i7, i5, i3 and Celeron®Single Chip Ultra Low TDP Processors
User’s Guide
Revision 1.0

Copyright © 2017 congatec AG TCKLm10 2/71
Revision History
Revision Date (yyyy.mm.dd) Author Changes
0.1 2017.02.10 AEM •Preliminary release
1.0 2017.08.02 AEM •Updated sections 2.5 “Power Consumption” and 2.6 “Supply Voltage Battery Power”
•Updated table 35 “Connector C-D Pinout”
•Updated the note in section 6.1.2.6 “Fan Control”
•Updated section 10 “BIOS Setup Description”

Copyright © 2017 congatec AG TCKLm10 3/71
Preface
This user’s guide provides information about the components, features, connectors and BIOS Setup menus available on the conga-TC175. It is
one of three documents that should be referred to when designing a COM Express™ application. The other reference documents that should
be used include the following:
COM Express™Design Guide
COM Express™Specification
The links to these documents can be found on the congatec AG website at www.congatec.com
Disclaimer
The information contained within this user’s guide, including but not limited to any product specification, is subject to change without notice.
congatec AG provides no warranty with regard to this user’s guide or any other information contained herein and hereby expressly disclaims
any implied warranties of merchantability or fitness for any particular purpose with regard to any of the foregoing. congatec AG assumes
no liability for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for
discrepancies between the product and the user’s guide. In no event shall congatec AG be liable for any incidental, consequential, special, or
exemplary damages, whether based on tort, contract or otherwise, arising out of or in connection with this user’s guide or any other information
contained herein or the use thereof.
Intended Audience
This user’s guide is intended for technically qualified personnel. It is not intended for general audiences.
Lead-Free Designs (RoHS)
All congatec AG designs are created from lead-free components and are completely RoHS compliant.
Electrostatic Sensitive Device
All congatec AG products are electrostatic sensitive devices and are packaged accordingly. Do not open or handle a congatec AG product
except at an electrostatic-free workstation. Additionally, do not ship or store congatec AG products near strong electrostatic, electromagnetic,
magnetic, or radioactive fields unless the device is contained within its original manufacturer’s packaging. Be aware that failure to comply with
these guidelines will void the congatec AG Limited Warranty.

Copyright © 2017 congatec AG TCKLm10 4/71
Symbols
The following symbols are used in this user’s guide:
Warning
Warnings indicate conditions that, if not observed, can cause personal injury.
Caution
Cautions warn the user about how to prevent damage to hardware or loss of data.
Note
Notes call attention to important information that should be observed.
Copyright Notice
Copyright © 2017, congatec AG. All rights reserved. All text, pictures and graphics are protected by copyrights. No copying is permitted
without written permission from congatec AG.
congatec AG has made every attempt to ensure that the information in this document is accurate yet the information contained within is
supplied “as-is”.
Trademarks
Product names, logos, brands, and other trademarks featured or referred to within this user’s guide, or the congatec website, are the property
of their respective trademark holders. These trademark holders are not affiliated with congatec AG, our products, or our website.

Copyright © 2017 congatec AG TCKLm10 5/71
Warranty
congatec AG makes no representation, warranty or guaranty, express or implied regarding the products except its standard form of limited
warranty (“Limited Warranty”) per the terms and conditions of the congatec entity, which the product is delivered from. These terms and
conditions can be downloaded from www.congatec.com. congatec AG may in its sole discretion modify its Limited Warranty at any time and
from time to time.
The products may include software. Use of the software is subject to the terms and conditions set out in the respective owner’s license
agreements, which are available at www.congatec.com and/or upon request.
Beginning on the date of shipment to its direct customer and continuing for the published warranty period, congatec AG represents that the
products are new and warrants that each product failing to function properly under normal use, due to a defect in materials or workmanship or
due to non conformance to the agreed upon specifications, will be repaired or exchanged, at congatec’s option and expense.
Customer will obtain a Return Material Authorization (“RMA”) number from congatec AG prior to returning the non conforming product freight
prepaid. congatec AG will pay for transporting the repaired or exchanged product to the customer.
Repaired, replaced or exchanged product will be warranted for the repair warranty period in effect as of the date the repaired, exchanged
or replaced product is shipped by congatec, or the remainder of the original warranty, whichever is longer. This Limited Warranty extends to
congatec’s direct customer only and is not assignable or transferable.
Except as set forth in writing in the Limited Warranty, congatec makes no performance representations, warranties, or guarantees, either
express or implied, oral or written, with respect to the products, including without limitation any implied warranty (a) of merchantability, (b) of
fitness for a particular purpose, or (c) arising from course of performance, course of dealing, or usage of trade.
congatec AG shall in no event be liable to the end user for collateral or consequential damages of any kind. congatec shall not otherwise be
liable for loss, damage or expense directly or indirectly arising from the use of the product or from any other cause. The sole and exclusive
remedy against congatec, whether a claim sound in contract, warranty, tort or any other legal theory, shall be repair or replacement of the
product only.
Certification
congatec AG is certified to DIN EN ISO 9001 standard.
C
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Copyright © 2017 congatec AG TCKLm10 6/71
Technical Support
congatec AG technicians and engineers are committed to providing the best possible technical support for our customers so that our products
can be easily used and implemented. We request that you first visit our website at www.congatec.com for the latest documentation, utilities
and drivers, which have been made available to assist you. If you still require assistance after visiting our website then contact our technical
support department by email at [email protected]
Terminology
Term Description
GB Gigabyte
GHz Gigahertz
kB Kilobyte
MB Megabyte
Mbit Megabit
kHz Kilohertz
MHz Megahertz
TDP Thermal Design Power
PCIe PCI Express
SATA Serial ATA
PEG PCI Express Graphics
PCH Platform Controller Hub
eDP Embedded DisplayPort
DDI Digital Display Interface
HDA High Definition Audio
N.C Not connected
N.A Not available
TBD To be determined

Copyright © 2017 congatec AG TCKLm10 7/71
Contents
1 Introduction ............................................................................. 10
2 Specifications........................................................................... 12
2.1 Feature List .............................................................................. 12
2.2 Supported Operating Systems ................................................ 13
2.3 Mechanical Dimensions ........................................................... 13
2.4 Supply Voltage Standard Power .............................................. 14
2.4.1 Electrical Characteristics .......................................................... 14
2.4.2 Rise Time ................................................................................. 14
2.5 Power Consumption ................................................................ 15
2.6 Supply Voltage Battery Power ................................................. 16
2.7 Environmental Specifications................................................... 17
3 Block Diagram.......................................................................... 18
4 Cooling Solutions..................................................................... 19
4.1 CSP Dimensions....................................................................... 19
4.2 Heatspreader ........................................................................... 20
5 Connector Rows....................................................................... 22
5.1 Primary Connector Rows A and B............................................ 22
5.1.1 Serial ATA™ (SATA).................................................................. 22
5.1.2 USB 2.0 .................................................................................... 22
5.1.3 High Definition Audio (HDA) Interface .................................... 22
5.1.4 Gigabit Ethernet ..................................................................... 23
5.1.5 LPC Bus.................................................................................... 23
5.1.6 I²C Bus Fast Mode ................................................................... 23
5.1.7 PCI Express™........................................................................... 23
5.1.8 ExpressCard™ ......................................................................... 23
5.1.9 VGA.......................................................................................... 24
5.1.10 LVDS/eDP................................................................................. 24
5.1.11 General Purpose Serial Interface ............................................. 24
5.1.12 GPIOs....................................................................................... 25
5.1.13 Power Control .......................................................................... 25
5.1.14 Power Management................................................................. 28
5.2 Secondary Connector Rows C and D....................................... 29
5.2.1 PCI Express™........................................................................... 29
5.2.2 PCI Express Graphics (PEG) ..................................................... 29
5.2.3 Digital Display Interface........................................................... 29
5.2.3.1 HDMI........................................................................................ 30
5.2.3.2 DVI ........................................................................................... 30
5.2.3.3 DisplayPort (DP) ....................................................................... 30
5.2.4 USB 3.0 .................................................................................... 31
6 Additional Features.................................................................. 32
6.1 eMMC 5.0 ................................................................................ 32
6.2 congatec Board Controller (cBC) ............................................. 32
6.2.1 Board Information.................................................................... 32
6.2.2 Watchdog ................................................................................ 32
6.2.3 General Purpose Input/Output................................................ 33
6.2.4 I2C Bus...................................................................................... 33
6.2.5 Power Loss Control.................................................................. 33
6.2.6 Fan Control .............................................................................. 33
6.3 OEM BIOS Customization........................................................ 33
6.3.1 OEM Default Settings .............................................................. 34
6.3.2 OEM Boot Logo....................................................................... 34
6.3.3 OEM POST Logo ..................................................................... 34
6.3.4 OEM BIOS Code/Data............................................................. 34
6.3.5 OEM DXE Driver...................................................................... 34
6.4 congatec Battery Management Interface ................................ 35
6.5 API Support (CGOS) ................................................................ 35
6.6 Security Features...................................................................... 35
6.7 Suspend to Ram....................................................................... 35
7 conga Tech Notes .................................................................... 36
7.1 Intel®PCH-LP Features ............................................................ 36
7.1.1 Intel®Rapid Storage Technology ............................................ 36
7.1.1.1 AHCI ........................................................................................ 36
7.1.1.2 RAID......................................................................................... 36
7.1.1.3 Intel®Smart Response Technology ......................................... 36

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7.2 Intel®Processor Features ......................................................... 37
7.2.1 Intel®Turbo Boost Technology ................................................ 37
7.2.2 Adaptive Thermal Monitor and Catastrophic Thermal Protection
37
7.2.3 Processor Performance Control ............................................... 38
7.2.4 Intel®64 Architecture............................................................... 39
7.2.5 Intel®Virtualization Technology ............................................... 39
7.2.6 Thermal Management ............................................................. 40
7.3 ACPI Suspend Modes and Resume Events.............................. 41
7.4 DDR4 Memory ......................................................................... 41
8 Signal Descriptions and Pinout Tables..................................... 42
8.1 A-B Connector Signal Descriptions ......................................... 43
8.2 A-B Connector Pinout.............................................................. 52
8.3 C-D Connector Signal Descriptions......................................... 54
8.4 C-D Connector Pinout ............................................................. 63
8.5 Boot Strap Signals ................................................................... 65
9 System Resources .................................................................... 66
9.1 I/O Address Assignment.......................................................... 66
9.1.1 LPC Bus.................................................................................... 66
9.2 PCI Configuration Space Map ................................................. 67
9.3 I2C............................................................................................ 68
9.4 SM Bus..................................................................................... 68
10 BIOS Setup Description........................................................... 69
10.1 Navigating the BIOS Setup Menu ........................................... 69
10.2 BIOS Versions........................................................................... 69
10.3 Updating the BIOS................................................................... 69
10.4 Supported Flash Devices ......................................................... 70
11 Industry Specifications ............................................................. 71

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List of Tables
Table 1 COM Express™ 2.1 Pinout Types ............................................ 10
Table 2 conga-TC175 Variants.............................................................. 11
Table 3 Feature Summary..................................................................... 12
Table 4 Measurement Description........................................................ 15
Table 5 Power Consumption Values ..................................................... 16
Table 6 CMOS Battery Power Consumption ........................................ 16
Table 7 Display Combination (U-processor line)................................... 29
Table 8 Wake Events............................................................................. 41
Table 9 Terminology Descriptions ........................................................ 42
Table 10 Intel®High Definition Audio Link Signals Descriptions............ 43
Table 11 Gigabit Ethernet Signal Descriptions....................................... 43
Table 12 SATA Signal Descriptions......................................................... 44
Table 13 PCI Express Signal Descriptions (general purpose) ................. 45
Table 14 ExpressCard Support Pins Signal Descriptions........................ 46
Table 15 LPC Signal Descriptions........................................................... 46
Table 16 USB Signal Descriptions........................................................... 46
Table 17 CRT Signal Descriptions........................................................... 47
Table 18 LVDS Signal Descriptions......................................................... 47
Table 19 Embedded DisplayPort Signal Descriptions............................ 48
Table 20 SPI BIOS Flash Interface Signal Descriptions........................... 49
Table 21 Miscellaneous Signal Descriptions........................................... 49
Table 22 General Purpose I/O Signal Descriptions ................................ 50
Table 23 Power and System Management Signal Descriptions ............. 50
Table 24 General Purpose Serial Interface Signal Descriptions.............. 51
Table 25 Power and GND Signal Descriptions....................................... 51
Table 26 Connector A-B Pinout.............................................................. 52
Table 27 PCI Express Signal Descriptions (general purpose) ................. 54
Table 28 USB 3.0 Signal Descriptions..................................................... 54
Table 29 PCI Express Signal Descriptions (x16 Graphics)....................... 55
Table 30 DDI Signal Description............................................................. 57
Table 31 HDMI Signal Descriptions........................................................ 59
Table 32 DisplayPort (DP) Signal Descriptions ....................................... 60
Table 33 Module Type Definition Signal Description ............................. 62
Table 34 Power and GND Signal Descriptions....................................... 62
Table 35 Connector C-D Pinout ............................................................. 63
Table 36 Boot Strap Signal Descriptions ................................................ 65
Table 37 References ............................................................................... 71

Copyright © 2017 congatec AG TCKLm10 10/71
1 Introduction
COM Express™ Concept
COM Express™ is an open industry standard defined specifically for COMs (computer on modules). Its creation makes it possible to smoothly
transition from legacy interfaces to the newest technologies available today. COM Express™ modules are available in following form factors:
•Mini 84mm x 55mm
•Compact 95mm x 95mm
•Basic 125mm x 95mm
•Extended 155mm x110mm
Table 1 COM Express™ 2.1 Pinout Types
Types Connector Rows PCIe Lanes PCI IDE SATA Ports LAN ports USB 2.0/ USB 3.0 Display Interfaces
Type 1 A-B Up to 6 - 4 1 8 / 0 VGA, LVDS
Type 2 A-B C-D Up to 22 32 bit 1 4 1 8 / 0 VGA, LVDS, PEG/SDVO
Type 3 A-B C-D Up to 22 32 bit - 4 3 8 / 0 VGA,LVDS, PEG/SDVO
Type 4 A-B C-D Up to 32 1 4 1 8 / 0 VGA,LVDS, PEG/SDVO
Type 5 A-B C-D Up to 32 - 4 3 8 / 0 VGA,LVDS, PEG/SDVO
Type 6 A-B C-D Up to 24 - 4 1 8 / 4* VGA,LVDS/eDP, PEG, 3x DDI
Type 10 A-B Up to 4 - 2 1 8 / 0 LVDS/eDP, 1xDDI
* The SuperSpeed USB ports (USB 3.0) are not in addition to the USB 2.0 ports. Up to 4 of the USB 2.0 ports can support SuperSpeed USB.
The conga-TC175 modules use the Type 6 pinout definition and comply with COM Express 2.1 specification. They are equipped with two high
performance connectors that ensure stable data throughput.
The COM (computer on module) integrates all the core components and is mounted onto an application specific carrier board. COM modules
are legacy-free design (no Super I/O, PS/2 keyboard and mouse) and provide most of the functional requirements for any application. These
functions include, but are not limited to a rich complement of contemporary high bandwidth serial interfaces such as PCI Express, Serial ATA,
USB 2.0, and Gigabit Ethernet. The Type 6 pinout provides the ability to offer PCI Express, Serial ATA, and LPC options thereby expanding
the range of potential peripherals. The robust thermal and mechanical concept, combined with extended power-management capabilities, is
perfectly suited for all applications.
Carrier board designers can use as little or as many of the I/O interfaces as deemed necessary. The carrier board can therefore provide all
the interface connectors required to attach the system to the application specific peripherals. This versatility allows the designer to create a
dense and optimized package, which results in a more reliable product while simplifying system integration. Most importantly, COM Express™

Copyright © 2017 congatec AG TCKLm10 11/71
modules are scalable, which means once an application has been created there is the ability to diversify the product range through the use
of different performance class or form factor size modules. Simply unplug one module and replace it with another; no redesign is necessary.
conga-TC175 Options Information
The conga-TC175 is currently available in four variants. The table below shows the different configurations available. Check for the Part No. that
applies to your product. This will tell you what options described in this user’s guide are available on your particular module.
Table 2 conga-TC175 Variants
Part-No. 045250 045251 045252 045253
Processor Intel®Core™ i7-7600U
2.8 GHz Dual Core™
Intel®Core™ i5-7300U
2.6 GHz Dual Core™
Intel®Core™ i3-7100U
2.4 GHz Dual Core™
Intel®Celeron®3965U
2.2 GHz Dual Core
Intel®Smart Cache 4 MByte 3 MByte 3 MByte 2 MByte
Max. Turbo Frequency 3.9 GHz 3.5 GHz N.A N.A
Processor Graphics Intel®HD Graphics 620
(GT2)
Intel®HD Graphics 620
(GT2)
Intel®HD Graphics 620
(GT2)
Intel®HD Graphics 610
(GT1)
Graphics Max. Dynamic Freq 1.15 GHz 1.1 GHz 1.0 GHz 0.9 GHz
Memory (DDR4) 2133 MT/s dual channel 2133 MT/s dual channel 2133 MT/s dual channel 2133 MT/s dual channel
LVDS Yes Yes Yes Yes
DisplayPort (DP) Yes Yes Yes Yes
HDMI Yes Yes Yes Yes
Processor TDP (cTDP) 15 (7.5) W 15 (7.5) W 15 (7.5) W 15 (10) W

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2 Specifications
2.1 Feature List
Table 3 Feature Summary
Form Factor Based on COM Express™ standard pinout Type 6 Rev. 2.1 (Compact size 95 x 95 mm)
Processor 7th Generation Intel®Core™ i7,i5, i3 Single Chip Ultra Low TDP Processors
Memory Two memory sockets (located on the top and bottom side of the conga-TC175). Supports
-SO-DIMM non-ECC DDR4 modules
-Data rates up to 2133 MT/s
-Maximum 32 GB capacity (16 GB each)
congatec Board
Controller
Multi-stage watchdog, non-volatile user data storage, manufacturing and board information, board statistics, hardware monitoring, fan control, I2C bus,
Power loss control
Chipset Intel®100 Series PCH-LP integrated in the Multi-Chip Package
Audio High Definition Audio interface with support for multiple codecs
Ethernet Gigabit Ethernet (Intel®i219-LM controller) with support for AMT 11
Graphics
Options
Next Generation Intel® HD (610/620). Supports:
-API (DirectX 12, OpenGL 5.0, OpenCL 2.1)
-Intel®QuickSync & Clear Video Technology HD (hardware accelerated video decode/encode/processing/transcode)
-Switchable/Hybrid graphics
-Up to 3 independent displays (must be two DDI’s (DP, HDMI/DVI) and one eDP/LVDS)
1x LVDS
Up to 2x DDIs with support for:
-2x DisplayPort++ (DisplayPort 1.2)
-2x HDMI 1.4a*1 or HDMI 2.0 *1 *2
-2x DVI port *1
-Resolutions up to 4K
Optional Interface (assembly options):
-1x eDP 1.4
-1x VGA *3
NOTE:
*1 Requires an external level shifter on the carrier board.
*2 Requires a Level Shifter Protocol Converter (LSPCON) on the carrier board.
*3 Display combination with this option is 1x DDI, 1x VGA and 1x LVDS/eDP
Peripheral
Interfaces
USB Interfaces:
-Up to 8x USB 2.0
-Up to 4x USB 3.0
Buses
-LPC
-I²C (fast mode, multi-master)
-SMB
-SPI
3x SATA®(6Gb/s with RAID 0/1/5 support)
Up to 8x PCI Express®Gen. 3 lanes *1 *3
2x UART
GPIOs
Optional PEG port (x1 or x2) *2
NOTE:
*1 Intel Chipset supports only 6 PCIe devices at any time.
*2 Requires re-routing of PCIe lanes 5 or 6 or both (assembly option)
*3 Seven PCIe lanes if x1 PEG port is implemented or 6 PCIe lanes if x2 PEG
port is implemented.
BIOS AMI Aptio®UEFI 5.x firmware, 8 or 16 MByte serial SPI with congatec Embedded BIOS features.
Storage Optional eMMC 5.0 onboard flash

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Power
Management
ACPI 4.0 compliant with battery support. Also supports Suspend to RAM (S3) and Intel AMT 10.
Configurable TDP
Ultra low standby power consumption, Deep Sx.
Security Optional discrete Trusted Platform Module “TPM 1.2/2.0”; new AES Instructions for faster and better encryption.
Note
Some of the features mentioned above are optional. Check the part number of your module and compare it to the Options Information list
on page 11 to determine what options are available on your particular module.
2.2 Supported Operating Systems
The conga-TC175 supports the following operating systems.
•Microsoft®Windows® 10
•WindRiver®VxWorks®(VX7 or later)
•Linux
Note
The Intel®Kaby Lake SoC supports only 64-bit operating systems.
2.3 Mechanical Dimensions
•95.0 mm x 95.0 mm
•Height approximately 18 or 21 mm (including heatspreader) depending on the carrier board connector that is used. If the 5 mm (height)
carrier board connector is used, then approximate overall height is 18 mm. If the 8 mm (height) carrier board connector is used, then
approximate overall height is 21 mm.
4.00
Heatspreader
Module PCB
Carrier Board PCB
7.00
5.00 2.00
4.50
13.0018.00

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2.4 Supply Voltage Standard Power
•12 V DC ± 5 %
The dynamic range shall not exceed the static range.
2.4.1 Electrical Characteristics
Power supply pins on the module’s connectors limit the amount of input power. The following table provides an overview of the limitations for
pinout Type 6 (dual connector, 440 pins).
Power Rail Module Pin
Current Capability
(Amps)
Nominal
Input (Volts)
Input
Range
(Volts)
Derated
Input (Volts)
Max. Input
Ripple (10Hz to
20MHz)
(mV)
Max. Module Input
Power (w. derated
input)
(Watts)
Assumed
Conversion
Efficiency
Max. Load
Power
(Watts)
VCC_12V 12 12 11.4-12.6 11.4 +/- 100 137 85% 116
VCC_5V-SBY 2 5 4.75-5.25 4.75 +/- 50 9
VCC_RTC 0.5 3 2.0-3.3 +/- 20
2.4.2 Rise Time
The input voltages shall rise from 10 percent of nominal to 90 percent of nominal at a minimum slope of 250 V/s. The smooth turn-on requires
that, during the 10 percent to 90 percent portion of the rise time, the slope of the turn-on waveform must be positive.
Nominal Static Range
Dynamic Range
Absolute Minimum
Absolute Maximum12.60V
11.40V
12V
12.10V
11.90V

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2.5 Power Consumption
The power consumption values were measured with the following setup:
•conga-TC175 COM
•Modified congatec carrier board
•conga-TC175 cooling solution
•Microsoft Windows 10 (64 bit)
Note
The CPU was stressed to its maximum workload with the Intel®Thermal Analysis Tool
Table 4 Measurement Description
The power consumption values were recorded during the following system states:
System State Description Comment
S0: Minimum value Lowest frequency mode (LFM) with minimum core voltage during desktop
idle.
S0: Maximum value Highest frequency mode (HFM/Turbo Boost). The CPU was stressed to its maximum frequency.
S0: Peak current Highest current spike during the measurement of “S0: Maximum value”.
This state shows the peak value during runtime.
Consider this value when designing the system’s power supply to
ensure that sufficient power is supplied during worst case scenarios.
S3 COM is powered by VCC_5V_SBY.
S5 COM is powered by VCC_5V_SBY.
Note
1. The fan and SATA drives were powered externally.
2. All other peripherals except the LCD monitor were disconnected before measurement.

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Table 5 Power Consumption Values
The tables below provide additional information about the power consumption data for each of the conga-TC175 variants offered. The values
are recorded at various operating mode.
Part
No.
Memory
Size
H.W
Rev.
BIOS
Rev.
OS
(64 bit)
CPU Current (Amp.)
Variant Cores Freq. /Turbo
(GHz)
S0:
Min
S0:
Max
S0:
Peak
S3 S5
045250 4 GB C.1 R005 Windows 10 Intel®Core™ i7-7600U 2 2.8 / 3.5 0.33 2.38 3.31 0.06 0.05
045251 4 GB C.1 R004 Windows 10 Intel®Core™ i5-7300U 2 2.6 / 3.0 0.32 2.10 3.25 0.06 0.05
045252 4 GB C.1 R004 Windows 10 Intel®Core™ i3-7100U 2 2.4 / N.A 0.32 2.32 2.89 0.07 0.05
045253 4 GB C.1 R004 Windows 10 Intel®Celeron®3965U 2 2.2 / N.A 0.29 1.37 1.42 0.06 0.05
2.6 Supply Voltage Battery Power
Table 6 CMOS Battery Power Consumption
RTC @ Voltage Current
-10oC 3V DC 1.48 µA
20oC 3V DC 1.63 µA
70oC 3V DC 2.31 µA
Note
1. Do not use the CMOS battery power consumption values listed above to calculate CMOS battery lifetime.
2. Measure the CMOS battery power consumption of your application in worst case conditions (for example, during high temperature and
high battery voltage).
3. Consider the self-discharge of the battery when calculating the lifetime of the CMOS battery. For more information, refer to application
note AN9_RTC_Battery_Lifetime.pdf on congatec AG website at www.congatec.com/support/application-notes.
4. We recommend to always have a CMOS battery present when operating the conga-TC175.

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2.7 Environmental Specifications
Temperature Operation: 0° to 60°C Storage: -20° to +80°C
Humidity Operation: 10% to 90% Storage: 5% to 95%
Caution
The above operating temperatures must be strictly adhered to at all times. When using a congatec heatspreader, the maximum operating
temperature refers to any measurable spot on the heatspreader’s surface.
Humidity specifications are for non-condensing conditions.

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3 Block Diagram
Intel
®
ULT SOC (CPU + PCH)
Integrated Intel HD Graphics
Vector Graphics3D
Turbo Boost 2.0 Technology
HT Technology
AVX2
AES-NI
SSE4.2 TSX
VT
64 Architecture
TXT
2D DXVA2
MPEG-2
Video Codecs APIs
Hardware Graphics Accelerators
DisplayPort 1.2 HDMI 2.0 (3D, 4k)
Digital Display Interfaces
7
th
Generation Intel
®
Core
™
Processor
VC1/WMV9
HEVC/H.265
OpenCL 2.1
DirectX 12
OpenGL 4.4
Intel
®
100 Series PCH-LP
High Definition Audio
ASRC
SATA USB 2.0
LPC BusPCIe
I/O Interfaces
GPIOs
USB 3.0
MGMNT
PECI
Dual Channel DDR4
eDP
PCIe #1
PCIe #2
PCIe #3
PCIe #4
PCIe #5
PCIe #6
PCIe #9
PCIe #10
PCIe #11
X
2x SO-DIMM (X1/X2)
SPI Flash
0
LVDS
eDP (assembly option)
TPM
Mux
LPC
SDIO
SATA 6G
USB 2.0
SM Bus
eMMC
UART0/1
GPIOs
Low Power Interconnect
congatec System
Management
Controller
Optional DP to VGA
Ethernet 10/100/1000
Intel i219LM
eDP to LVDS
Bridge
eMMC Flash *1
Note:
*
1
Not supported by default (assembly option)
*
1
*
1
*
1
*
1
Ethernet
VGA
LVDS/eDP
COM Express
Type 6
A-B Connector
LPC Bus
HDA I/F
SER0/1
USB Port 0 - 7
SATA Port 0 - 2
SM Bus
I2C Bus
GPIOs/SDIO
SPI
SPI
LID#/SLEEP#
FAN control
PCIe Port 0
PCIe Port 1
PCIe Port 2
PCIe Port 3
PCIe Port 4
PCIe Port 5
USB 3.0 Port 0
USB 3.0 Port 1
USB 3.0 Port 2
USB 3.0 Port 3
(TX BC)
congatec custom
PCIe Port 7
PCIe Port 6
COM Express
Type 6
C-D Connector
PEG x2
DP/HDMI Port C
DP/HDMI Port B
DP/HDMI Port D

Copyright © 2017 congatec AG TCKLm10 19/71
4 Cooling Solutions
congatec AG offers two cooling solutions for the conga-TC175:
•Passive cooling solution (CSP)
•Heatspreader
The dimensions of the cooling solutions are shown below and all measurements are in millimeters. The mechanical system assembly mounting
shall follow the valid DIN/ISO specifications.
The maximum torque specification for all screws is 0.3 Nm. Higher torque may damage the module and/or carrier board.
4.1 CSP Dimensions

Copyright © 2017 congatec AG TCKLm10 20/71
4.2 Heatspreader
The heatspreader acts as a thermal coupling device to the module and is thermally coupled to the CPU via a thermal gap filler. On some
modules, it may also be thermally coupled to other heat generating components with the use of additional thermal gap fillers. Although the
heatspreader is the thermal interface where most of the heat generated by the module is dissipated, it is not to be considered as a heatsink. It
has been designed as a thermal interface between the module and the application specific thermal solution.
The application specific thermal solution may use heatsinks with fans, and/or heat pipes, which can be attached to the heatspreader. Some
thermal solutions may also require that the heatspreader is attached directly to the systems chassis thereby using the whole chassis as a heat
dissipater.
7 ±0,1
95
95