FLY IQ458 User manual

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SERVICE MANUAL
Date Version Maintenance Level Author
2014-02-26 V1.0 L1~L4

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CAUTIONS
Please refer to the phone’s user’s guide for instructions relating to
operation, care, and maintenance, which include important safety
information.
1. Servicing and alignment must be undertaken by qualified personnel
only.
2. Ensure all work is carried out at an anti-static workstation and that an
anti-static wrist strap is worn.
3. Use only approved components as specified in the parts list.
4. Ensure all components, modules, screws, and insulators are correctly
re-fitted after servicing and alignment
5. Ensure all cables and wires are repositioned correctly
Electrostatic discharge can easily damage the sensitive components of
electronic products. Therefore, every service supplier must observe the
precautions which mentioned above.

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GENERAL REPAIR INFORMATION
1. Make sure your testing equipment is functioning properly before
beginning repair work.
2. Before starting repairs you must observe ESD precautions such as
being in your ESD protected area and connecting your wristband.
3. Use gloves to avoid corrosion and fingerprints.
4. Cover windows and displays with a protective film to avoid dust and
scratches.
5. Use a lint-free cloth to clean the LCD.
6. When cleaning the pads use a soft cloth\ESD brush and isopropanol .
7. Non-faulty mechanical parts (except shielding lids and bent parts or
soldered components). May be reused if they are not soldered.
8. When removing the shielding lids make sure to cover it back or replace
them with new ones, otherwise the high-frequency leakage can affect the
device.
9. Always use the original spare parts.
10. Check the soldering joints of the parts concerned with regard to the
fault symptom. And re-solder them if necessary.
11. Remove excess soldering flux after repair.
12. Observe the torque requirements when assembling the unit.
13. please aware that some malfunctions may be software related and
solved by an update

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850 Rework station & Solder Iron
Multimeter
Chapter 1
Service tools
DC power supply

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Digital Oscillograph
Screw driver and tweezers
Solder wire

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Wrist grounding strap, Antistatic gloves
Chapter 2
Baseband Circuit Analysis
Flux paste

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2.1 Mobile solution
MT6582 is a highly integrated baseband platform incorporating both
modem and application processing and connectivity subsystems to enable 3G
smart phone applications. The chip integrates a Quad-core ARM Cortex-A7
MPCore operating up to 1.3GHz, an ARM Cortex-R4 MCU and a powerful
multistandard viedo accelerator . The MT6582 interfaces to NAND flash
memory, LPDDR2 and LPDDR3 for optimal performance and also supports
booting from SLC NAND OR EMMC to minimize the overall BOM cost. In
addition, an extensive set of interfaces are included to interface to cameras,
touch-screen displays, MMC/SD cards .
The Application processor, Quad-core ARM Cortex-A7 MPCore which
includes a NEON multimedia processing engine , offers processing power
necessary to support the latest OpenOS along with its demanding applications
such as web browsing, email, GPS navigation and games. All are viewed on a
high resolution touch screen display with graphics enhanced by the 3D graphics
acceleration. The multi-standard video accelerator and an advanced audio
subsystem are also included to provide advanced multimedia applications and
services such as streaming audio and video, a multitude of decoders and
encoders such as H.264 and MPEG-4. Audio supports include FR, EFR,
HR ,AMR RF,AMR HRand Wide-Band AMR vocoders, polyphonic ringtones
and advanced audio functions such as echo cancellation, hands-free
speakerphone operation and noise cancellation.
An ARM Cortex-R4, DSP, and 2G and 3G coprocessors provide a
powerful modem subsystem capable of supporting Category 14(21Mbps)
HSDPA downlink and Category 6 (5.76 Mbps) HSUPA uplink data rates, as well
as Class 12 GPRS , EDGE as well as Category 14(2.8Mbps) TD-HSDPA
downling and Category (2.2Mbps)TD-HSUPA uplink data rates.
2.2 Baseband Block Diagram

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Figure 2-1: Block diagram
MT6572 is a highly integrated 3G system-on-chip (SOC) which incorporates
advanced features e.g. HSPA R8 modem, Quad-Core ARM Cortex-A7MPCore
operating at 1.3GHz, 3D graphics (OpenGL|ES 2.0), 8M camera ISP, LPDDR2/3
533 MHz and High-Definition 1080p video decoder. MT6582 helps phone

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manufacturers build high-performance 3G smart phones with PC-like browser,
3D gaming and cinema class home entertainment experiences.
2.3 Baseband Chip Pin Description (U100 MT6582)
2.3.1 MCU Subsystem
General
Smartphone two MCU subsystems architecture
SLC NAND flash OR EMMC flash bootloader
AP MCU subsystem
Quad-core ARM Cortex-A7 MPCore oprearing at 1.3GHz
NEON multimedia processing engine with SIMv2/VFPv4 ISA support
32KB L1 I-Cache and 32KB L1 D-Cache
512KB unified L2 cache
DVFS technology with adaptive oprating voltage from1.05V to 1.26V
MD MCU subsystem
ARM Cortex-R4 processor with maximum 491.5MHz operation frequency
32KB I-Cache and 16KB D-Cache
256KB TCM (tightly-coupled memory)
DSP for running modem/voice tasks, with maximum 240MHz operation frequency
High-performance AXI and AHB bus
General DMA engine and dedicated DMA channels for peripheral data tranfser
Watchdog timer for systen error recovery
Power management for clock gating control

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Figure2-2: CPUU100CMCUpart
2.3.2 External Memory Interface
Figure 2-3: CPU U100F External Memory part
EM
data
bus
EM
control
channel
EM
addres
b