Freescale Semiconductor 1322x-USB Dongle User manual

Document Number: 1322xUSBRM
Rev. 1.5
11/2010
1322x-USB Dongle
Reference Manual

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1322x-USB Reference Manual, Rev. 1.5
Freescale Semiconductor i
Contents
About This Book
Audience. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii
Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii
Chapter 1
Safety Information
1.1 FCC Guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.2 FCC Labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.2.1 47 C.F.R. Sec. 15.21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.2.2 47 C.F.R. Sec.15.105(b) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
1.2.3 47 C.F.R. Sec.15.203 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
1.3 Regulatory Approval For Canada. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
1.4 Disposal Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
Chapter 2
1322x USB Dongle Overview
2.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2.2 Available Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
2.3 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
2.4 Driver Considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
2.5 Board Level Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
Chapter 3
System Overview and Functional Descriptions
3.1 System Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
3.2 System Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
3.3 Power Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
3.4 Low-cost 2.4 GHz ISM Band radio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
3.5 USB Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
3.6 Clock. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
3.7 Reset Switch and LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
3.8 FLASH Memory Recovery Jumpers and Erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
3.9 Optional Debug/Development Interface (ARM JTAG Interface) . . . . . . . . . . . . . . . . . . . . . . . 3-6
Chapter 4
Schematic, Board Layout, and Bill of Materials
Chapter 5
PCB Manufacturing Specifications
5.1 Single PCB Construction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
5.2 Panelization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2

1322x-USB Reference Manual, Rev. 1.5
ii Freescale Semiconductor
5.3 Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3
5.4 Solder Mask . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3
5.5 Silk Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3
5.6 Electrical PCB Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3
5.7 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3
5.8 Hole Specification/Tool Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4
5.9 File Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4

1322x-USB Reference Manual, Rev. 1.5
Freescale Semiconductor iii
About This Book
This manual describes the Freescale 1322x USB Dongle, which is an IEEE 802.15.4 compliant wireless
node based on the Freescale MC1322x device. The 1322x USB Dongle provides a platform to evaluate the
MC1322x device, develop software and applications, and demonstrate IEEE 802.15.4 and ZigBee
networking capabilities.
Audience
This manual is intended for system designers.
Organization
This document is organized into five chapters.
Chapter 1 Safety Information — Highlights some of the FCC requirements.
Chapter 2 1322x USB Dongle Overview — Introduces the 1322x USB Dongle, which is an
IEEE 802.15.4 compliant wireless node based on the Freescale MC1322X device.
Chapter 3 System Overview and Functional Descriptions — Provides an overview of the
1322x USB Dongle and its connections.
Chapter 4 Schematic and Bill of Material — Provides the schematic, board layout, and Bill
of Materials.
Chapter 5 PCB Manufacturing Specifications — This chapter provides the specifications
used to manufacture the 1322x USB Dongle printed circuit board (PCB).
Revision History
The following table summarizes revisions to this document since the previous release (Rev 1.4).
Revision History
Location Revision
Chapter 2
Chapter 3 Added dimensions to photos.

1322x-USB Reference Manual, Rev. 1.5
iv Freescale Semiconductor
Definitions, Acronyms, and Abbreviations
The following list defines the acronyms and abbreviations used in this document.
ADC Analog to Digital Converter
AES Advanced Encryption Standard
ARM Advanced RISC Machine
CTS Clear to Send
DAC Digital to Analog Converter
DMA Direct Memory Access
I2C Inter-Integrated Circuit is a multi-master serial computer bus
ISM Industrial Scientific Medical 2.4 GHz radio frequency band
JTAG Joint Test Action Group
LGA Land Grid Array
MAC Media Access Controller
MCU Microcontroller Unit
NEXUS An embedded processor development tool interface that helps design engineers
identify software and hardware-level issues.
SN Sensor Node
pcb Printed circuit board
PiP Platform in Package
PWM Pulse-width modulation
RTS Request to Send
SMA Connector SubMiniature version “A” connector
SPI Serial Peripheral Interface
SSI Synchronous Serial Interface
TACT Switch A switch that provides a slight “snap” or “click” to the user to indicate function.
TELCO Telephone Company
USB Universal Serial Bus
VCP Virtual Com Port

1322x-USB Reference Manual, Rev. 1.5
Freescale Semiconductor 1-1
Chapter 1
Safety Information
1.1 FCC Guidelines
This equipment is for use by developers for evaluation purposes only and must not be incorporated into
any other device or system. This device may not be sold to the general public. Integrators will be
responsible for reevaluating the end product (including the transmitter) and obtaining a separate FCC
authorization.
FCC approval of this device only covers the original configuration of this device as supplied. Any
modifications to this product, including changes shown in this manual, may violate the rules of the Federal
Communications Commission and Industry Canada and make operation of the product unlawful.
1.2 FCC Labeling
FCC labels are physically located on the plastic housing.
1.2.1 47 C.F.R. Sec. 15.21
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant
to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or television reception, which can
be determined by turning the equipment off and on, the user is encouraged to try to correct the interference
by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
• Consult the dealer or an experienced radio/TV technician for help.

Safety Information
1322x-USB Reference Manual, Rev. 1.5
1-2 Freescale Semiconductor
1.2.2 47 C.F.R. Sec.15.105(b)
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.
The antenna(s) used for this equipment must be installed to provide a separation distance of at least 8
inches (20cm) from all persons.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following three
conditions:
1. This device may not cause harmful interference.
2. This device must accept any interference received, including interference that may cause undesired
operation.
3. This device is susceptible to electrostatic discharge (ESD) and surge phenomenon.
1.2.3 47 C.F.R. Sec.15.203
An intentional radiator shall be designed to ensure that no antenna other than that furnished by the
responsible party shall be used with the device. The use of a permanently attached antenna or of an
antenna that uses a unique coupling to the intentional radiator shall be considered sufficient to comply with
the provisions of this Section. The manufacturer may design the unit so that a broken antenna can be
replaced by the user, but the use of a standard antenna jack or electrical connector is prohibited. This
requirement does not apply to carrier current devices or to devices operated under the provisions of
Sections 15.211, 15.213, 15.217, 15.219, or 15.221. Further, this requirement does not apply to intentional
radiators that must be professionally installed, such as perimeter protection systems and some field
disturbance sensors, or to other intentional radiators which, in accordance with Section 15.31(d), must be
measured at the installation site. However, the installer shall be responsible for ensuring that the proper
antenna is employed so that the limits in this Part are not exceeded.
1.3 Regulatory Approval For Canada
This Class B digital apparatus complies with Canadian ICES-003 and RSS 210, Issue 7.
Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada.
1.4 Disposal Instructions
This product may be subject to special disposal requirements. For product disposal instructions, refer to
www.freescale.com/productdisposal.

1322x-USB Reference Manual, Rev. 1.5
Freescale Semiconductor 2-1
Chapter 2
1322x USB Dongle Overview
2.1 Introduction
The 1322x USB Dongle is an IEEE 802.15.4 compliant wireless node based on the Freescale MC1322x
device. The heart of the 1322x USB module is Freescale’s MC1322x 99-pin LGA Platform-in-Package
(PiP) solution that can be used for wireless applications ranging from simple proprietary point-to-point
connectivity to complete ZigBee mesh networking. The MC1322x is designed to provide a highly
integrated, total solution, with premier processing capabilities and very low power consumption.
The 1322x USB Dongle provides a platform to evaluate the MC1322x device, develop software and
applications, and demonstrate IEEE 802.15.4 and ZigBee networking capabilities. The dongle connects
the core device to a personal computer (PC) through a USB port, UART port interface device. The small
form factor illustrates an extremely small footprint, 4-layer printed circuit board (PCB) layout with a chip
antenna. The MC1322x node typically interfaces to the PC through a virtual COM port (VCM).
As initially provided from Freescale, the dongle is loaded with a software application that implements a
wireless “sniffer” to monitor over-the-air IEEE 802.15.4 traffic.
Figure 2-1. 1322x USB Dongle Top View
2.36 inches (60 mm)
0.47 inches (12 mm)
0.94 inches
(24 mm)

1322x USB Dongle Overview
1322x-USB Reference Manual, Rev. 1.5
2-2 Freescale Semiconductor
2.2 Available Devices
The MC1322x family is available as two part numbers. These device types differ only in their ROM
contents, all other device hardware, performance, and specifications are identical:
• MC13224V - this is the original version and is the generic part type. It is intended for most IEEE
802.15.4 applications including MAC-based, ZigBee-2007 Profile 1, and ZigBee RF4CE targets.
• MC13226V - this is a more recent version and is intended specifically for ZigBee-2007 Profile 2
(Pro) applications. Only the onboard ROM image has been changed to optimize ROM usage for
the ZigBee Pro profile and maximize the amount of available RAM for application use -
— The IEEE MAC/PHY functionality has been streamlined to include only that functionality
required by the ZigBee specification. The MAC functionality is 802.15.4 compatible.
— Certain drivers present in the MC13224 ROM have been removed including the ADC,
LCD_font, and SSI drivers. These drivers are still available as library functions, but now
compile into the RAM space.
— The Low Level Component (LLC) functionality has also been streamlined for the ZigBee
specification
NOTE
The MC13226 USB dongles will be marked as MC13226 USB.
2.3 Features
The 1322x USB Dongle provides the following features:
• Full IEEE 802.15.4 compliant wireless node; ZigBee capable with Freescale’s BeeStack software
stack
• Based on Freescale’s third-generation MC1322x ZigBee platform which incorporates a complete,
low power, 2.4 GHz radio frequency transceiver, 32-bit ARM7 core based MCU, hardware
acceleration for both the IEEE 802.15.4 MAC and AES security, and a full set of MCU peripherals
into a 99-pin LGA Platform-in-Package (PiP)
• MC1322x provides a highly integrated, low cost RF node
— On-board balun and antenna switch in package
— Typical -95 dBm sensitivity
— Typical 0 dBm output power, with max approximately +4 dBm
— Chip antenna
• Powered from USB interface with power-on green LED
• USB interface is full-speed compatible to the USB 2.0 and 1.1 specifications
• 20-pin site for standard JTAG debug/development interface connector
• Programmable user red LED for application purposes
• Reset switch
• Default 24 MHz crystal reference oscillator

1322x USB Dongle Overview
1322x-USB Reference Manual, Rev. 1.5
Freescale Semiconductor 2-3
2.4 Driver Considerations
When users first plug a 1322x USB Dongle into the system, they may be prompted to install drivers. If
BeeKit is installed and this occurs, do not allow Windows to automatically search for and install the
drivers. Instead, select manual installation and steer Windows to the following directory:
C:\Program Files\Freescale\Drivers
If installing the BeeKit software package to another drive or directory, indicate the Drivers directory
created by the installer in the custom location where BeeKit was installed.
Follow the instructions as they appear on the screen to complete driver installation.
If BeeKit is not installed, be aware of the following:
• The 1322x USB Dongle uses the FTDI serial to USB converter, Virtual COM Port (VCP) driver
for Windows, available at www.ftdichip.com/ftdrivers.htm..
(Direct (D2XX) drivers are also available.)
• The FTDI web site offers drivers for other platforms including Windows®(98 through Vista x64
and CE), MAC OS (8 through X) and Linux.
• Download the appropriate driver and follow the instructions to complete driver installation.
2.5 Board Level Specifications
Table 2-1. 1322x USB Dongle Specifications
Parameter Units Notes/Conditions
MIN TYP MAX
General
Size (Enclosure: X, Y, Z) 60x24x12 mm
Size (PCB: X, Y) 55 x 15
2.165 x 0.590 mm inches
Layer build (PCB) 0.8
0.032 mm inches 4-Layer
Dielectric material (PCB) FR4
Power
Voltage supply (USB) 4.4 5 5.25 V USB 2.0/1.1 standard specification
Current consumption 35 mA
Temperature
Operating temperature (see note) -30 +25 +70 °C Operating temperature is limited to +70 °C
due to switches. Basic circuit is good for a
maximum temperature of +85 °C.
Storage temperature -30 +25 +70 °C
USB interface USB 2.0 and 1.1 full-speed compatible
RF

1322x USB Dongle Overview
1322x-USB Reference Manual, Rev. 1.5
2-4 Freescale Semiconductor
802.15.4 Frequency range 2405 2480 MHz All 16 channels in the 2450 MHz band
Range (outdoor / line of sight) 300 Meters <1%PER for20-bytepackets(point-to-point
in communications with 1322X Sensor
Reference Board)
RF Transmitter
802.15.4 Output power -30 0 +4 dBm Over range of Pout from IC control in 2 dB
steps.
Note: On channel 26, output power should
not exceed -4 dBm (power setting
0x0E) to meet FCC Part 15
requirements.
Harmonics
2nd harmonics
3rd harmonics -38
-35dBm dBm
Harmonics are compliant to ETSI and FCC
regulatory approval standards
RF Receiver
802.15.4 sensitivity -95 dBm <1% PER for 20-byte packets
Regulatory Approval
FCC Product is approved accordingly to the FCC
part 15 standard
CE (ETSI) Product is approved accordingly to the EN
300 328 V1.7.1 (2006-10) standard
CE (EMC) Product is approved accordingly to the EN
301 489-1 V1.6.1 (2005-09) and EN 301
489-17 V1.2.1 (2002-08) standards
Safety
UL Product is approved accordingly to the IEC
60950-1 and EN 60950-1, First Edition
standards
Environment
RoHS Product complies with the EU Directive
2002/95/EC of 27 January 2003
WEEE Product complies with the EU Directive
2002/95/EC of 27 January 2003
Table 2-1. 1322x USB Dongle Specifications (continued)
Parameter Units Notes/Conditions

1322x-USB Reference Manual, Rev. 1.5
Freescale Semiconductor 3-1
Chapter 3
System Overview and Functional Descriptions
This section provides an overview of the 1322x USB Dongle and its connections.
3.1 System Block Diagram
The following is the 1322x USB Dongle system level block diagram.
Figure 3-1. 1322x USB Dongle Block Diagram
3.2 System Overview
The heart of the 1322x USB Dongle is Freescale’s MC1322x 99-pin LGA Platform-in-Package (PiP)
solution that can be used for wireless applications ranging from simple proprietary point-to-point
connectivity to complete ZigBee mesh networking. The MC1322x is designed to provide a highly
integrated, total solution, with premier processing capabilities and very low power consumption.
The MC1322x MCU resources offer superior processing power for ZigBee and IEEE 802.15.4
applications. A full 32-bit ARM7TDMI-S core operates up to 26 MHz. A 128 Kbyte FLASH memory is
mirrored into a 96 Kbyte RAM for upper stack and applications software. In addition, an 80 Kbyte ROM
is available for boot software, peripheral device drivers, standardized IEEE 802.15.4 MAC and
communications stack software. A full set of peripherals and Direct Memory Access (DMA) capability for
transceiver packet data complement the processor core.
MC1322xV
Advanced ZigBee™-
Compliant PiP
USB 2.0 USB
Interface
FT232R
UART
3.3 Vdc
JTAG Debug
Chip Antenna

System Overview and Functional Descriptions
1322x-USB Reference Manual, Rev. 1.5
3-2 Freescale Semiconductor
Figure 3-2. MC1322x Block Diagram
The RF radio interface provides for low cost and high density as shown in Figure 3-3. An onboard balun
along with a TX/RX switch allows direct connection to a single-ended 50-Ωantenna. The integrated PA
provides programmable output power typically from -30 dBm to +4 dBm, and the RX LNA provides -95
dBm sensitivity. This solution also has onboard bypass capacitors and crystal load capacitors for the
smallest footprint in the industry. All components are integrated into the package except the crystal and
antenna.
Figure 3-3. MC1322x RF Interface
TIMER
MODULE
(TMR)
(4 Tmr Blocks)
UART
MODULE
(UART0)
UART
MODULE
(UART1)
SYNC SERIAL
INTERFACE
(SSI/i2S)
KEYBOARD
INTERFACE
(KBI)
INTER-IC BUS
MODULE
(I2C)
SERIAL
PERIPHERAL
INTERFACE
(SPI)
DUAL
12-BIT
ADC
MODULE
GPIO and IO
CONTROL
UP TO 64 IO PINS
ARM7
TDMI-S
32-BIT
CPU
BUS
INTERFACE
& MEMORY
ARBITRATOR
ARM
INTERRUPT
CONTROLLER
(AITC)
JTAG/
Nexus
DEBUG
ADVANCED
SECURITY
MODULE
(ASM)
CLOCK &
RESET
MODULE
(CRM)
RADIO
INTERFACE
MODULE
(RIF)
96KBYTE
SRAM
(24K WORDS x
32 BITS)
80KBYTE
ROM
(20KWORDS x
32 BITS)
RF
OSCILLATOR
&
CLOCK GENERATION
SPI
FLASH
MODULE
(SPIF)
802.15.4
MAC
ACCELERATOR
(MACA)
DIGITAL
MODEM
TX
MODEM
RX
MODEM
128KBYTE
NON-VOLATILE
MEMORY
(SERIAL
FLASH)
ANALOG
TRANSMITTER
ANALOG
RECEIVER
RF
TX/RX
SWITCH
IEEE 802.15.4 TRANSCEIVER
BALUN
ANALOG
POWER
MANAGEMENT
&
VOLTAGE
REGULATION
MC1322x
Platform-in-Package (PiP)
IEEE 802.15.4/ZIGBEE SOLUTION
Buck
Regulator
24 MHz (typ) 32.768 KHz (optional)
BATTERY
DETECT
ANALOG
TRANSMITTER
ANALOG
RECEIVER
RF
TX/RX
SWITCH
BALUN
LNA
PA

System Overview and Functional Descriptions
1322x-USB Reference Manual, Rev. 1.5
Freescale Semiconductor 3-3
Augmenting the core device on the 1322x USB Dongle are:
• Low-cost 2.4 GHz ISM Band radio
• 2.0 USB connection
• User interface LED
• Optional debug / development port
• Reset switch
Users are encouraged to reference the board schematic for the topics covered in the following sections.
Figure 3-4 and Figure 3-5 shows the 1322x USB Dongle PCB top and bottom view with interface
designations.
Figure 3-4. 1322x USB Dongle PCB Top View
Figure 3-5. 1322x USB Dongle PCB Bottom View
3.3 Power Source
The device is powered directly from the USB connection
• The main source is the USB “B” Receptacle
• The USB connection powers the FTDI FT232R USB<>UART interface device. In turn, the
FT232R has an onboard 3.3 V output series regulator that powers the rest of the module.
Reset Switch
Chip Antenna USB “B” Receptacle
NOTE: JTAG header footprint on PCB reverse side.
User LED (D1) Green
Power LED (D5)
Red
2.165 inches (55 mm)
0.59 inches
(15 mm)
J3 J4 J1 (JTAG)
1
20

System Overview and Functional Descriptions
1322x-USB Reference Manual, Rev. 1.5
3-4 Freescale Semiconductor
• A green power-on LED (D5) is provided
3.4 Low-cost 2.4 GHz ISM Band radio
The MC1322x provides an onboard balun, antenna switch, and LNA. The only external component
required for the radio is an antenna. The USB dongle uses a PCB-mounted chip antenna. Figure 3-6 shows
the RF network external to the MC1322x.
• Typical nominal output power is 0 dBm, with +4 dBm max
• Typical sensitivity is -95 dBm.
• Frequency range is 2405 to 2480 MHz
• Typical range (outdoors, line of sight) is 300 meters
Figure 3-6. 1322x USB Dongle RF Network
3.5 USB Interface
Primary connection to the wireless node is the USB port that is provided via a USB “B” receptacle
designated as J2. Figure 3-7 shows the connector pinout.
Figure 3-7. USB Connector Pinout
The port is connected to a FTDI FT232R USB <> UART device that appears as a Virtual COM port (VCP)
to the PC. PC drivers are available with the module. The USB interface is configured as a “Bus Powered”
deviceand drawsallrequired powerfromthe USBinterface.The deviceis USB 2.0, full speed compatible.
RF_RX_TX
CHIP ANTENNA
L3
3.9nH
Not Mounted
NC 2 RF
1
ANT2
2450AT43A100
C4
1pF
Not Mounted
C5
10pF
Not Mounted
RF_GND

System Overview and Functional Descriptions
1322x-USB Reference Manual, Rev. 1.5
Freescale Semiconductor 3-5
3.6 Clock
The MC1322x device has a primary reference oscillator of 24 MHz. Crystal X1 is used with the MC1322x
for the reference oscillator.
3.7 Reset Switch and LEDs
The USB dongle provides the following
• One green Power-On LED (D5)
• One red LED (D1) is driven by the MCU and controlled by the software application.
• Reset switch to the wireless node; does not reset the USB interface device.
Refer to Figure 3-4 for location of switches and LEDs.
3.8 FLASH Memory Recovery Jumpers and Erase
The MC1322x has an onboard serial FLASH that stores the memory image that gets loaded into RAM at
boot. If it becomes necessary to change or update the image in FLASH, there are two possible means of
doing so:
• JTAG Debug Port - if the JTAG connector is mounted and the ARM debug tools are in use, the
FLASH image can be changed.
• Load new FLASH image via USB port:
— The Freescale BeeKit IDE download provides a software tool called Test Tool. This
application runs on a PC and can be used with a client running on the MC1322x to test the
platform.
— Test Tool also has the capability to load a new image into the FLASH through the USB port.
However, the FLASH must first be cleared.
The 1322x USB Dongle has two jumper sites designated as J3 and J4 (see Figure 3-8) located on the
non-component (back) side of the PCB (see Figure 3-5). Use these jumper sites to erase the FLASH.
1. Short Jumper J3 Pin 1 to Pin 2.
2. Short Jumper J4 Pin 1 to Pin 2.
NOTE
For development purposes SMD headers can be soldered to the header sites
to make this action easily done with shorting bars.
3. Power on the USB board by plugging it into a USB port.
Table 3-1. Switch and LED Summary
Item Connection Feature
PWR (green) VCC ‘Power On’ indication
LED1 (red) KBI_1 Application specific
SW5 RESETB Reset to MC1322x

System Overview and Functional Descriptions
1322x-USB Reference Manual, Rev. 1.5
3-6 Freescale Semiconductor
4. Push the reset button on the USB board.
5. Disconnect the USB board from USB port.
6. Remove the jumpers from both J3 and J4.
7. The board is now ready for boot operation. After the FLASH is erased, plug the module into the
USB connection again. The board is now ready to be loaded with a new image using the Freescale
Test Tool application.
NOTE
Refer to the Freescale Test Tool User’s Guide as supplied with Test Tool in
the BeeKit Wireless Connectivity Toolkit download.
Figure 3-8. FLASH Erase Headers
3.9 Optional Debug/Development Interface (ARM JTAG Interface)
The module optionally supports the standard JTAG debug port. A 20-pin footprint is provided for a
standard JTAG debug interface connector. This debug port only requires a simple interface cable to
connect to a PC and use standard ARM software development tools.
The MC1322x supports connection to a subset of the defined ARM JTAG connector. The JTAG interface
is a standard 2.54mm/0.1inch spacing, 20-pin debug interface (J1). The footprint for the 20-pin connector
is located at the rear side of the module. A Pin 1 marking is given for correct plug-in of the development
cable.
Table 3-2 shows the device pins that are connected to the associated JTAG header pin outs if the JTAG
connector is used.
NOTE
The required header is a 20-position, 0.100” straight SMD connector.
Molex/Waldom #15-91-0200 or equivalent.
1
2
J3
HDR_1X2
Not Mounted 1
2
J4
HDR_1X2
Not Mounted
1-2 ADC2_VREFH -> "0"
1-2 ADC2_VREFL -> "1"
Re co ve r y M ode
R104
10K
R103
10K
VCC
VCC
ADC2_VREFH
ADC2_VREFL

System Overview and Functional Descriptions
1322x-USB Reference Manual, Rev. 1.5
Freescale Semiconductor 3-7
Table 3-2. ARM JTAG 20-Pin Connector Assignments (J1)
Name1
1NC means No Connect.
Pin # Pin # Name
VCC 1 2 VCC
NC2
2MC1322x does not support separate JTAG reset TRST.
34GND
TDI 5 6 GND
TMS 7 8 GND
TCK 9 10 GND
RTCK 11 12 GND
TDO 13 14 GND
RESET3
3VCC through a 100k-ohm pullup.
15 16 GND
NC 17 18 GND
NC 19 20 GND

System Overview and Functional Descriptions
1322x-USB Reference Manual, Rev. 1.5
3-8 Freescale Semiconductor