Fujitsu MHY2250BH - Mobile 250 GB Hard Drive User manual

C141-E262-01EN
MHY2250BH, MHY2200BH, MHY2160BH,
MHY2120BH, MHY2100BH, MHY2080BH,
MHY2060BH, MHY2040BH
DISK DRIVES
PRODUCT/MAINTENANCE MANUAL

FOR SAFE OPERATION
Handling of This Manual
This manual contains important information for using this product. Read thoroughly before using
the product. Use this product only after thoroughly reading and understanding especially the
section “Important Alert Items” in this manual. Keep this manual handy, and keep it carefully.
FUJITSU makes every effort to prevent users and bystanders from being injured or from suffering
damage to their property. Use the product according to this manual.
IMPORTANT NOTE TO USERS
READ THE ENTIRE MANUAL CAREFULLY BEFORE USING THIS PRODUCT.
INCORRECT USE OF THE PRODUCT MAY RESULT IN INJURY OR DAMAGE TO
USERS, BYSTANDERS OR PROPERTY.
While FUJITSU has sought to ensure the accuracy of all information in this manual, FUJITSU
assumes no liability to any party for any damage caused by any error or omission contained in this
manual, its updates or supplements, whether such errors or omissions result from negligence,
accident, or any other cause. In addition, FUJITSU assumes no liability with respect to the
application or use of any product or system in accordance with the descriptions or instructions
contained herein; including any liability for incidental or consequential damages arising therefrom.
FUJITSU DISCLAIMS ALL WARRANTIES REGARDING THE INFORMATION
CONTAINED HEREIN, WHETHER EXPRESSED, IMPLIED, OR STATUTORY.
FUJITSU reserves the right to make changes to any products described herein without further
notice and without obligation.
This product is designed and manufactured for use in standard applications such as office work,
personal devices and household appliances. This product is not intended for special uses (atomic
controls, aeronautic or space systems, mass transport vehicle operating controls, medical devices
for life support, or weapons firing controls) where particularly high reliability requirements exist,
where the pertinent levels of safety are not guaranteed, or where a failure or operational error could
threaten a life or cause a physical injury (hereafter referred to as "mission-critical" use). Customers
considering the use of these products for mission-critical applications must have safety-assurance
measures in place beforehand. Moreover, they are requested to consult our sales representative
before embarking on such specialized use.
The contents of this manual may be revised without prior notice.
The contents of this manual shall not be disclosed in any way or reproduced in any media without
the express written permission of Fujitsu Limited.
All Rights Reserved, Copyright ©FUJITSU LIMITED 2007

C141-E262
Revision History
(1/1)
Edition Date Revised section (*1)
(Added/Deleted/Altered) Details
01 2007-05-18
*1 Section(s) with asterisk (*) refer to the previous edition when those were deleted.

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Preface
ii C141-E262
Acronyms and Abbreviations
This section gives the meanings of the definitions used in this manual.
Conventions for Alert Messages
This manual uses the following conventions to show the alert messages. An alert
message consists of an alert signal and alert statements. The alert signal consists
of an alert symbol and a signal word or just a signal word.
The following are the alert signals and their meanings:
This indicates a hazardous situation could result in
minor or moderate personal injury if the user does
not perform the procedure correctly. This alert
signal also indicates that damages to the product or
other property may occur if the user does not perform
the procedure correctly.
This indicates information that could help the user
use the product more efficiently.
In the text, the alert signal is centered, followed below by the indented message.
A wider line space precedes and follows the alert message to show where the alert
message begins and ends. The following is an example:
(Example)
Data corruption: Avoid mounting the disk drive near strong
magnetic sources such as loud speakers. Ensure that the disk drive
is not affected by external magnetic fields.
The main alert messages in the text are also listed in the "Important Alert Items."
Operating Environment
This product is designed for mobile system as notebook PCs, and to be used
within environmental specification. (please refer to the Chapter 1 in this manual.)

C141-E262 i
Preface
This manual describes MHY2250BH, MHY2200BH, MHY2160BH, MHY2120BH,
MHY2100BH, MHY2080BH, MHY2060BH, MHY2040BH model of the MHY
Series, 2.5-inch hard disk drives. These drives have a built-in controller that is
compatible with the Serial-ATA interface.
This manual describes the specifications and functions of the drives and explains
in detail how to incorporate the drives into user systems. This manual assumes
that the reader has a basic knowledge of hard disk drives and their
implementations in computer systems.
This manual consists of seven chapters and sections explaining the special
terminology and abbreviations used in this manual:
Overview of Manual
CHAPTER 1 Device Overview
This chapter gives an overview of the disk drive and describes their features.
CHAPTER 2 Device Configuration
This chapter describes the internal configurations of the disk drive and the
configuration of the systems in which they operate.
CHAPTER 3 Installation Conditions
This chapter describes the external dimensions, installation conditions, and switch
settings of the disk drive.
CHAPTER 4 Theory of Device Operation
This chapter describes the operation theory of the disk drive.
CHAPTER 5 Interface
This chapter describes the interface specifications of the disk drive.
CHAPTER 6 Operations
This chapter describes the operations of the disk drive.
CHAPTER 7 Maintenance and Diagnosis
This chapter explains the maintenance requirements, operation verification,
troubleshooting, and removal/replacement of the disk drives.
Glossary
The glossary describes the technical terms that need to be understood to read this
manual.

Preface
C141-E262 iii
Conventions
An MHY series device is sometimes simply referred to as a "hard disk drive,"
"HDD," "drive," or "device" in this document.
Decimal numbers are represented normally.
Hexadecimal numbers are represented as shown in the following examples:
X'17B9', 17B9h, 17B9H, or 17B9H.
Binary numbers are represented as shown in the following examples: 010 or 010b.
Serial-ATA may be referred to as "SATA".
Representation of the data storage capacity
One gigabyte (GB) = one billion bytes; accessible capacity will be
less and actual capacity depends on the operating environment and
formatting.
Attention
Please forward any comments you may have regarding this manual.
To make this manual easier for users to understand, opinions from readers are
needed. Please write your opinions or requests on the Comment at the back of
this manual and forward it to the address described in the sheet.
Liability Exception
"Disk drive defects" refers to defects that involve adjustment, repair, or
replacement.
Fujitsu is not liable for any other disk drive defects, such as those caused by user
misoperation or mishandling, inappropriate operating environments, defects in the
power supply or cable, problems of the host system, or other causes outside the
disk drive.

Preface
iv C141-E262
Hot Plug
These drives support Hot Plug which is based on Serial ATA Revision 2.5
Specification.
However, the disk drive installation and removal notes on safety precautions with
regard to hot-plugging vary depending on the specific requirements and
environment-related conditions of the system to which the drive is connected by
hot-plugging.
When using the drive under general conditions of use (i.e., without hot-plugging),
observe the important alert messages and notes on safety precautions given in this
manual.
For the electrical recommendation to the host system which supports hot-plugging
with this drives, refer to Section 5.1.6.
Compliance with Administration on the Control of Pollution Caused by Electronic
Information Products of the People's Republic of China
This product is shipped as a component to manufacture the final products. Therefore, the packaging material
code provided in GB18455-2001 is not marked on any packaging part of this product.

C141-E262 v
Important Alert Items
Important Alert Messages
The important alert messages in this manual are as follows:
A hazardous situation could result in minor or moderate personal
injury if the user does not perform the procedure correctly. Also,
damage to the product or other property, may occur if the user does not
perform the procedure correctly.
Task Alert message Page
Normal Operation Data corruption: Avoid mounting the disk near strong
magnetic sources such as loud speakers. Ensure that the disk
drive is not affected by external magnetic fields.
Damage: Do not press the cover of the disk drive. Pressing
it too hard, the cover and the spindle motor contact, which
may cause damage to the disk drive.
Static: When handling the device, disconnect the body
ground (500 kΩor greater). Do not touch the printed circuit
board, but hold it by the edges.
3-7
Maintenance Static, Damage
1. Don’t install or remove a PCA or connect or disconnect
a cable or connector plug when the drive is powered.
This may give you an electric shock.
2. Keep away from mechanical assemblies in the unit
during operation. This may cause injuries.
3. Avoid dangerous detergent when the disk drive is
cleaned.
7-2

Important Alert Items
vi C141-E262
Task Alert message Page
Maintenance Device damage
1. Before touching a PCA or the drive, wear a wrist strap
and perform the human body grounding to discharge
static electricity from your body. This will prevent
irreparable damage to the PCA and the head of the drive.
2. Don’t install or remove a PCA or connect or disconnect
a cable or connector plug when the drive is powered.
This will prevent electrical damage to the disk drive.
3. Operating the disk drive with one or more PCA missing
will be unpredictable. Only power the drive with all
boards installed.
4. Avoid any detergent which may cause short circuits
when cleaning assemblies.
5. Keep all vents open opened and unblocked. Avoid other
conditions which may cause circuits to overheat.
7-2
6. Do not apply excessive force to the cover under any
circumstances. Doing so may cause irreparable damage
to the cover.
Device damage
The DE is completely sealed. Do not open the DE in the
field.
7-3
Data corruption
When asking for repair, save all data stored in the disk drive
beforehand. Fujitsu Limited is not responsible for any loss of
data during service and repair.
7-4
Device damage
The disk enclosure (DE) must never to be opened in the field.
Opening the disk enclosure may cause irreparable damage.
7-14
Damage or Device damage
1. Perform any removal after the system power is
completely disconnected. The cable must not be
disconnected and the screws that attach the drive must
not be removed with the power ON.
2. Do not move the drive and attach or detach the connector
until it comes to a complete stop (about 30 s after the
power is turned OFF).
3. Perform the human body grounding to discharge any
static electricity from your body. (Be sure to wear a
wrist strap)
7-15

C141-E262 vii
Manual Organization
MHY2250BH, MHY2200BH,
MHY2160BH, MHY2120BH,
MHY2100BH, MHY2080BH,
MHY2060BH, MHY2040BH
DISK DRIVES
PRODUCT/MAINTENANCE
MANUAL
(C141-E262)
<This manual>
• Device Overview
• Device Configuration
• Installation Conditions
• Theory of Device Operation
• Interface
• Operations
• Maintenance and Diagnosis

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C141-E262 ix
Contents
CHAPTER 1 Device Overview ....................................................................... 1-1
1.1 Features .............................................................................................................. 1-2
1.1.1 Functions and performance..................................................................... 1-2
1.1.2 Adaptability............................................................................................. 1-2
1.1.3 Interface .................................................................................................. 1-3
1.2 Device Specifications......................................................................................... 1-4
1.2.1 Specifications summary .......................................................................... 1-4
1.2.2 Model and product number ..................................................................... 1-5
1.3 Power Requirements .......................................................................................... 1-7
1.4 Environmental Specifications .......................................................................... 1-10
1.5 Acoustic Noise ................................................................................................. 1-11
1.6 Shock and Vibration......................................................................................... 1-11
1.7 Reliability......................................................................................................... 1-12
1.8 Error Rate ......................................................................................................... 1-13
1.9 Media Defects .................................................................................................. 1-13
1.10 Load/Unload Function ................................................................................... 1-13
1.10.1 Recommended power-off sequence .................................................... 1-14
1.11 Advanced Power Management (APM) .......................................................... 1-14
1.12 Interface Power Management (IPM) ............................................................. 1-16
1.12.1 Host-initiated interface power management (HIPM) ......................... 1-16
1.12.2 Device-initiated interface power management (DIPM)...................... 1-16
CHAPTER 2 Device Configuration................................................................ 2-1
2.1 Device Configuration......................................................................................... 2-2

Contents
x C141-E262
2.2 System Configuration.........................................................................................2-3
2.2.1 SATA interface........................................................................................2-3
2.2.2 Drive connection .....................................................................................2-3
CHAPTER 3 Installation Conditions.............................................................. 3-1
3.1 Dimensions.........................................................................................................3-2
3.2 Mounting ............................................................................................................3-3
3.3 Connections with Host System ..........................................................................3-9
3.3.1 Device connector.....................................................................................3-9
3.3.2 Signal segment and power supply segment ..........................................3-10
3.3.3 Connector specifications for host system..............................................3-10
3.3.4 SATA interface cable connection .........................................................3-11
3.3.5 Note about SATA interface cable connection.......................................3-11
CHAPTER 4 Theory of Device Operation......................................................4-1
4.1 Outline ................................................................................................................4-2
4.2 Subassemblies ....................................................................................................4-2
4.2.1 Disk .........................................................................................................4-2
4.2.2 Spindle.....................................................................................................4-2
4.2.3 Actuator ...................................................................................................4-2
4.2.4 Air filter...................................................................................................4-3
4.3 Circuit Configuration .........................................................................................4-3
4.4 Power-on Sequence ............................................................................................4-6
4.5 Self-calibration...................................................................................................4-8
4.5.1 Self-calibration contents..........................................................................4-8
4.5.2 Execution timing of self-calibration .......................................................4-9
4.5.3 Command processing during self-calibration .........................................4-9
4.6 Read/write Circuit ............................................................................................4-10
4.6.1 Read/write preamplifier (PreAMP).......................................................4-10
4.6.2 Write circuit...........................................................................................4-10

Contents
C141-E262 xi
4.6.3 Read circuit ........................................................................................... 4-11
4.6.4 Digital PLL circuit ................................................................................ 4-12
4.7 Servo Control ................................................................................................... 4-13
4.7.1 Servo control circuit.............................................................................. 4-13
4.7.2 Data-surface servo format..................................................................... 4-15
4.7.3 Servo frame format ............................................................................... 4-17
4.7.4 Actuator motor control.......................................................................... 4-18
4.7.5 Spindle motor control ........................................................................... 4-19
CHAPTER 5 Interface..................................................................................... 5-1
5.1 Physical Interface............................................................................................... 5-2
5.1.1 Interface signals ...................................................................................... 5-2
5.1.2 Signal interface regulation ...................................................................... 5-4
5.1.3 Electrical specifications .......................................................................... 5-6
5.1.4 Connector pinouts ................................................................................... 5-7
5.1.5 P11 function ............................................................................................ 5-8
5.1.6 Hot Plug ................................................................................................ 5-10
5.2 Logical Interface .............................................................................................. 5-11
5.2.1 Communication layers .......................................................................... 5-12
5.2.2 Outline of the Shadow Block Register.................................................. 5-13
5.2.3 Outline of the frame information structure (FIS) ................................. 5-14
5.2.4 Shadow block registers ......................................................................... 5-22
5.3 Host Commands ............................................................................................... 5-27
5.3.1 Command code and parameters ............................................................ 5-27
5.3.2 Command descriptions.......................................................................... 5-30
(1) RECALIBRATE (X '10' to X '1F')................................................ 5-31
(2) READ SECTOR(S) (X '20' or X '21') ........................................... 5-32
(3) WRITE SECTOR(S) (X '30' or X '31') ......................................... 5-34
(4) WRITE VERIFY (X '3C') ............................................................. 5-36
(5) READ VERIFY SECTOR(S) (X '40' or X '41')............................ 5-38
(6) SEEK (X '70' to X '7F') ................................................................. 5-40
(7) EXECUTE DEVICE DIAGNOSTIC (X '90')............................... 5-41
(8) INITIALIZE DEVICE PARAMETERS (X '91') .......................... 5-42

Contents
xii C141-E262
(9) DOWNLOAD MICROCODE (X '92').......................................... 5-43
(10) STANDBY IMMEDIATE (X '94' or X 'E0') ................................ 5-46
(11) IDLE IMMEDIATE (X '95' or X 'E1')/UNLOAD
IMMEDIATE (X '95' or X 'E1') .................................................... 5-47
(12) STANDBY (X '96' or X 'E2') ........................................................ 5-49
(13) IDLE (X '97' or X 'E3').................................................................. 5-50
(14) CHECK POWER MODE (X '98' or X 'E5').................................. 5-52
(15) SLEEP (X '99' or X 'E6') .............................................................. 5-53
(16) SMART (X 'B0')............................................................................ 5-54
(17) DEVICE CONFIGURATION (X 'B1') ......................................... 5-84
(18) READ MULTIPLE (X 'C4').......................................................... 5-89
(19) WRITE MULTIPLE (X 'C5')........................................................ 5-92
(20) SET MULTIPLE MODE (X 'C6')................................................. 5-94
(21) READ DMA (X 'C8' or X 'C9')..................................................... 5-96
(22) WRITE DMA (X 'CA' or X 'CB').................................................. 5-98
(23) READ BUFFER (X 'E4')............................................................. 5-100
(24) FLUSH CACHE (X 'E7') ............................................................ 5-101
(25) WRITE BUFFER (X 'E8')........................................................... 5-102
(26) IDENTIFY DEVICE (X 'EC')..................................................... 5-103
(27) IDENTIFY DEVICE DMA (X 'EE')........................................... 5-104
(28) SET FEATURES (X 'EF') ........................................................... 5-119
(29) SECURITY SET PASSWORD (X 'F1')...................................... 5-126
(30) SECURITY UNLOCK (X 'F2')................................................... 5-128
(31) SECURITY ERASE PREPARE (X 'F3') .................................... 5-130
(32) SECURITY ERASE UNIT (X 'F4') ............................................ 5-131
(33) SECURITY FREEZE LOCK (X 'F5')......................................... 5-132
(34) SECURITY DISABLE PASSWORD (X 'F6')............................ 5-134
(35) READ NATIVE MAX ADDRESS (X 'F8')................................ 5-136
(36) SET MAX (X 'F9') ...................................................................... 5-137
(37) READ SECTOR (S) EXT (X '24') .............................................. 5-143
(38) READ DMA EXT (X '25') .......................................................... 5-144
(39) READ NATIVE MAX ADDRESS EXT (X '27') ....................... 5-145
(40) READ MULTIPLE EXT (X '29')................................................ 5-146
(41) READ LOG EXT (X '2F') ........................................................... 5-147
(42) WRITE SECTOR (S) EXT (X '34') ............................................ 5-153

Contents
C141-E262 xiii
(43) WRITE DMA EXT (X '35') ........................................................ 5-154
(44) SET MAX ADDRESS EXT (X '37') .......................................... 5-155
(45) WRITE MULTIPLE EXT (X '39').............................................. 5-157
(46) WRITE DMA FUA EXT (X '3D') .............................................. 5-158
(47) WRITE LOG EXT (X '3F')......................................................... 5-159
(48) READ VERIFY SECTOR (S) EXT (X '42')............................... 5-163
(49) WRITE UNCORRECTABLE EXT (X '39')............................... 5-164
(50) READ LOG DMA EXT (X '47')................................................. 5-166
(51) WRITE LOG DMA EX (X '57') ................................................. 5-167
(52) READ FP DMA QUEUED (X '60')............................................ 5-168
(53) WRITE FP DMA QUEUED (X '61') .......................................... 5-169
(54) WRITE MULTIPLE FUA EXT (X 'CE').................................... 5-170
(55) FLUSH CACHE EXT (X 'EA')................................................... 5-171
5.3.3 Error posting ....................................................................................... 5-172
5.4 Command Protocol ........................................................................................ 5-174
5.4.1 Non-data command protocol............................................................... 5-175
5.4.2 PIO data-in command protocol ........................................................... 5-177
5.4.3 PIO data-out command protocol ......................................................... 5-179
5.4.4 DMA data-in command protocol ........................................................ 5-181
5.4.5 DMA data-out command protocol ...................................................... 5-182
5.4.6 Native Command Queuing protocol ................................................... 5-183
5.5 Power-on and COMRESET ........................................................................... 5-186
CHAPTER 6 Operations................................................................................. 6-1
6.1 Reset and Diagnosis ........................................................................................... 6-2
6.1.1 Response to power-on ............................................................................. 6-2
6.1.2 Response to COMRESET ....................................................................... 6-4
6.1.3 Response to a software reset ................................................................... 6-7
6.2 Power Save......................................................................................................... 6-8
6.2.1 Power save mode .................................................................................... 6-8
6.2.2 Power commands .................................................................................. 6-10
6.3 Power Save Controlled by Interface Power Management (IPM) .................... 6-11

Contents
xiv C141-E262
6.3.1 Power save mode of the interface .........................................................6-11
6.4 Read-ahead Cache ............................................................................................6-13
6.4.1 Data buffer structure..............................................................................6-13
6.4.2 Caching operation .................................................................................6-14
6.4.3 Using the read segment buffer ..............................................................6-16
6.5 Write Cache......................................................................................................6-20
6.5.1 Cache operation.....................................................................................6-20
CHAPTER 7 Maintenance and Diagnosis .....................................................7-1
7.1 Maintenance .......................................................................................................7-2
7.1.1 Rules for maintenance.............................................................................7-2
7.1.2 Maintenance requirements ......................................................................7-3
7.1.3 Maintenance levels..................................................................................7-5
7.1.4 Disk drive revision number.....................................................................7-6
7.1.5 Tools and test equipment.........................................................................7-8
7.1.6 Self-diagnostics .......................................................................................7-8
7.1.7 Test ..........................................................................................................7-8
7.2 Operation Confirmation ...................................................................................7-11
7.2.1 Operation test ........................................................................................7-11
7.2.2 Diagnostic test .......................................................................................7-11
7.3 Troubleshooting Procedure ..............................................................................7-12
7.3.1 Troubleshooting procedure ...................................................................7-12
7.3.2 Troubleshooting disk drive replaced in field ........................................7-12
7.3.3 Troubleshooting at factory ....................................................................7-14
7.4 Disk Drive Removal Procedure........................................................................7-15
7.5 Spare Disk Drive ..............................................................................................7-15

Contents
C141-E262 xv
Glossary............................................................................................................GL-1
Acronyms and Abbreviations ........................................................................ AB-1
Index ..................................................................................................................IN-1

Contents
xvi C141-E262
Illustrations
Figures
Figure 1.1 Permissible range of +5V rise slope.....................................................1-7
Figure 1.2 The example of negative voltage waveform at +5 V when
power is turned off ...............................................................................1-8
Figure 1.3 Current fluctuation (Typ.) at +5 V when power is turned on.............1-10
Figure 2.1 Disk drive outerview ............................................................................2-2
Figure 2.2 Drive system configuration ..................................................................2-3
Figure 3.1 Dimensions ...........................................................................................3-2
Figure 3.2 Mounting frame structure.....................................................................3-4
Figure 3.3 Location of breather .............................................................................3-5
Figure 3.4 Surface cover temperature measurement points ..................................3-6
Figure 3.5 Service area ..........................................................................................3-7
Figure 3.6 Handling cautions.................................................................................3-8
Figure 3.7 Connector locations..............................................................................3-9
Figure 3.8 Power supply pins (CN1) ...................................................................3-10
Figure 4.1 Power supply configuration..................................................................4-4
Figure 4.2 Circuit configuration ............................................................................4-5
Figure 4.3 Power-on operation sequence...............................................................4-7
Figure 4.4 Read/write circuit block diagram .......................................................4-10
Figure 4.5 Frequency characteristic of programmable filter ...............................4-11
Figure 4.6 Block diagram of servo control circuit...............................................4-13
Figure 4.7 Physical sector servo configuration on disk surface ..........................4-16
Figure 4.8 Servo frame format.............................................................................4-17
Figure 5.1 Interface signals....................................................................................5-2
Figure 5.2 Example of the circuit for driving Activity LED .................................5-9
Figure 5.3 Conceptual diagram of communication layers...................................5-11
Figure 5.4 Register - Host to Device FIS layout .................................................5-15
Figure 5.5 Register - Device to Host FIS layout .................................................5-16
Figure 5.6 DMA Active - Device to Host FIS layout ..........................................5-16
Figure 5.7 DMA Setup - Device to Host or Host to Device FIS layout ..............5-17
Figure 5.8 BIST Active - Bidirectional FIS layout..............................................5-18
Figure 5.9 Data FIS (Bidirectional) layout ..........................................................5-19