Hewlett Packard Enterprise ProLiant DL20 Gen10 Plus Installation instructions

MF877-00 Page 1
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Servers
Marketing Name / Model
[List multiple models if applicable.]
HPE ProLiant DL20 Gen10 Plus
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by
Directive 2012/19/EU of the European Parliament and of the Council on Waste Electrical and Electronic Equipment
(WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
7
Batteries
All types including standard alkaline and lithium
coin or button style batteries
2
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
Depending on Power Supply Model
5
External electrical cables and cords
1
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0

MF877-00 Page 2
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Item Description
Notes
Quantity
of items
included
in product
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Torx Driver
T-15/ T-10
Screw Driver Cross Type
Cross/Flat
Sharp Nose Pliers
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. System Board Battery - Remove the side panel and remove the battery from the system board.
2. Capacitors in 350W power supply => Remove the power supply from the system. With a screw driver remove the
screws securing the top cover and loosen the screws securing the PCA. Then use Sharp Nose Pliers to remove the
daughter card, and electrolyte-capacitor.
3. Capacitors in 500W/800W PSU => Push latch and remove PSU from the system. With a screw driver remove the
screws securing the cover and take the PCA out. Then use Sharp Nose Pliers to remove the daughter card, and
electrolyte-capacitor. Then use Sharp Nose Pliers to remove the daughter card, and electrolyte-capacitor.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

MF877-00 Page 3
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Attachment 1 –System exploding drawing
1. NHP config
2. LFF HP
3. SFF HP

MF877-00 Page 4
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01

MF877-00 Page 5
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Attachement2 - Remove Latch Ears and Front Panel
1. Remove latch ears from chassis by using T-15 screwdriver.
2. Use T-15 screwdriver to remove front panel from chassis
Following screw is for hot plug HDD cage (2LFF / 4SFF) only

MF877-00 Page 6
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Attachement3- Remove System Fans and PCIE Fan

MF877-00 Page 7
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Attachement4- Remove CPU Heatsink and CPU
1. Remove CPU Heatsink by using T15 screwdriver.
2. Remove CPU

MF877-00 Page 8
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Attachement5- Remove DIMM Guard
1. Remove DIMM guard by using T-15 screwdriver.
Attachment6- Remove RTC battery
1. To remove RTC battery by pushing the latch as drawing below.

MF877-00 Page 9
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Attachment7- Remove MB
1. Use T-15 screwdriver to remove screws to release MB from chassis

MF877-00 Page 10
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Attachment8- Remove PCIE Riser Cage and PCIE adaptor
1. Pull up the PCIE cage/Riser from MB
2. Remove PCIE cards
3. Use T-15 screwdriver to release 2 screws to remove PCIE Riser from PCIE cage

MF877-00 Page 11
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Attachment 9- Remove Megacell Battery Holder
1. Use T-15 screw driver to remove megacell battery holder
Attachment 10- Remove 2LFF NHP HDD cage
2. Remove ODD blank and pull tab
3. Use T-15 screwdriver to release 2 screws to remove 2LFF NHP HDD cage

MF877-00 Page 12
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Attachment 11- Remove 2LFF Backplane
4. Remove ODD blank and pull tab
5. Use T-10 screwdriver to release screws to remove EAR and front bezel
6. Use T-15 screwdriver to release screws to remove HDD cage
7. Remove HDD
8. Use T-15 screwdriver to release screws to remove 2LFF HDD board

MF877-00 Page 13
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Attachment 12- Remove 4SFF Backplane
9. Remove pull tab
10. Use T-10 screwdriver to release screws to remove EAR and front bezel
11. Use T-15 screwdriver to release screws to remove HDD cage
12. Remove SFF HDD
13. Use T-15 screwdriver to release screws to remove HDD board

MF877-00 Page 14
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Attachment 13- Remove 2SFF Backplane
1. Use T-10 screwdriver to release screws to remove HDD cage
2. Remove SFF HDD
3. Remove HDD board
Attachment 14- Remove ODD
1. NHP Config

MF877-00 Page 15
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
2. LFF HP config
3. SFF HP config
1) Use T-10 screwdriver to release screws to remove ODD tray
2) Use T-10 screwdriver to release screws to remove ODD

MF877-00 Page 16
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Attachment 15- Remove Single Output PSU
1. Pull up two connector
2. Use T-10 screwdriver to release screws to remove ATX PSU

MF877-00 Page 17
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Attachment 16- Remove PDB
1. Pull out two RPSU.
2. Use T-15 screwdriver to release screws to remove PDB cage
3. Use T-15 screwdriver to release screws to remove PDB board

MF877-00 Page 18
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Attachment 17- Remove RPSU Cage and RPSU
1. Pull out two RPSU
2. Use T-15 screwdriver to release screws to remove PDB cage

MF877-00 Page 19
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
3. If AROC is installed into system, please remove PCIE cage and AROC first
1) Pull up the Primary PCIE cage/Riser from MB
2) Release AROC thumb screws to remove AROC card (if AROC card is installed in system)

MF877-00 Page 20
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
4. Use T-15 screwdriver to release screws to remove MEGACELL holder
5. Use T-10 screwdriver to release screws to remove RPSU cage