HP HP27110B Installation and operating manual
-~
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HP
9000 Series 500
and
Series 800 Computer Systems
Hewlett-Packard Company
Roseville Networks Division
8000
Foothills Boulevard
Roseville, California
95678
HP27110B
CIO HP-IB Interface
Card
Installation and Reference Manual
r/iPW
HEWLETT
a:~
PACKARD
Manual
Part
Number
27110-90005
E0288
Printedin U.s.A.
February
1988
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2
Printing History
New editions are complete revisions
of
the manual.
Update
packages,
which are issued between editions, contain additional and replacement
pages to
be
merged into the manual by the customer.
The
dates
on
the
title page change only when a new edition
or
a new update
is
published.
No information
is
incorporated into a reprinting unless it appears as a
prior update; the edition does not change when an update
is
incorporated.
Edition
1.
. . . . . . . . . . . . . . . . . . . . . . November 1986
Edition
2.
. . . . . . . . . . . . . . . . . . . .
..
February 1988
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Notice
The
information contained in this document is subject
to
change without
notice.
HEWLEIT-PACKARD COMAPANY MAKES
NO
WARRANTY
OF
ANY
KIND
WITH
REGARD
TO
THIS
MATERIAL, INCLUDING, BUT
NOT
LIMITED TO,
THE
IMPLIEDWARRANTIES
OF
MERCHANT·
ABILI1Y AND FITNESS
FOR
A PARTICULAR PURPOSE. Hewlett-
Packardshall not
be
liable for
errors
contained herein
or
for incidental
or
consequential damages in connection with the furnishing, performance,
or
use
of
this material.
Hewlett-Packard assumes
no
responsibility for
the
use
or
reliability
of
its
software
on
equipment that
is
not
furnished by Hewlett-Packard.
This document contains proprietaryinformation, which is
protected
by
copyright. All rights
are
reserved. No
part
of
this document maybe
photocopied, reproduced,
or
translated into
another
language without
the
prior written consent
of
Hewlett-Packard Company.
Copyright © 1986,1988 by HEWLEIT-PACKARD COMPANY
3
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4
Notice
For
U.S.A.
Only
The
Federal Communications Commission (in 47
CFR
15.838) has
specified that the following notice
be
brought
to
the attention
of
the users
of
this product.
FEDERAL
COMMUNICATIONS COMMISSION
RADIO
FREQUENCY
INTERFERENCE
STATEMENT
Warning: This equipment generates and uses radio frequency energy
and, if not installed and used properly, that
is,
in strict accordance with
the manufacturer's instructions, may cause interference to radio and
television reception.
It
has been type tested and found to comply with
the limits for a Class A computing device in accordance with the specifica-
tions in Subpart J
of
Part
15
of
FCC Rules, which
are
designed
to
provide
reasonable protection against such interference when operated in a com-
mercial environment. Operation
of
this equipment in a residential area
is
likely to cause interference in which case the user at his own expense will
be
required to take whatever measures may
be
required to correct the
interference.
If
this equipment does cause interference to radio
or
television reception,
which can
be
determined by turning the equipment offand on, the user
is
encouraged to try to correct the interference by one
or
more
of
the follow-
ing measures: re-orient the receiving antenna; relocate the equipment
with respect to the receiver; move the equipment away from the receiver;
plug the equipment into a different branch circuit.
If
necessary, the user
should consult the dealer
or
authorized field service representative for
additional suggestions.
The
user may find the following booklet
prepared
by the Federal Communications Commission helpful: "How to Identify
and Resolve Radio-TV Interference Problems". This booklet
is
available
from the U.S. Government Printing Office, Washington,
DC
20402. Stock
No. 004-000-00345-4.
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Notice
For
JAPAN
Only
VCCI
RADIO
FREQUENCY
INTERFERENCE
STATEMENT
This device is a Class 1
ITE
(data
processing equipment for use in indus-
trial
and
commercial areas),
and
meets
the
VCCI standards for prevention
of
radio interference in industrial
and
commercial areas.
The
operation
of
this device in residential
or
adjacent areas may interfere with radio
and
television reception.
Use
this device in accordance with its operating manuals.
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General
Safety Symbols
'hi'l,""·)
I
Caution
I
Servicing
Safety Considerations
This product and related documentation must
be
reviewed for familiariza-
tion with safety markings before operation.
Instruction manual symbol: the product will
be
markedwith this symbol
when it is necessary for the user
to
refer to the instruction manual in
order
to protect the product against damage.
Indicates hazardous voltages.
Indicates
earth
(ground) terminal. This symbol is sometimes used in the
manual to indicate circuit common connected to a grounded chassis.
Thewarning sign denotes a
hazard.
It
calls
attention
to
a procedure,
practice,or
the
like,which,
if
not
correctly performed
or
adhered
to, could
result
in injury. Do
not
proceed beyond a warning sign until the indi-
cated conditions
are
fully understood
and
met.
The
caution sign denotes a hazard.
It
calls attention
to
an
operating proce-
dure, practice,
or
the like, which,
if
not correctly performed
or
adhered
to,
could result in damage to
or
destruction
of
part
or
all
of
the product.
Do
not
proceed
beyond a caution sign until the indicated conditions
are
fully
understood
and
met.
Any servicing, adjustment, maintenance,
or
repair
of
this
product
must
be performed only by service-trained personnel.
7
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Grounding
''1,u"n.)
Handling
ICaution I
8
SAFElY
EARTH GROUND-The
computer
onwhich
this
product
is in-
stalledis a safetyclass I
product
and
is providedwith a protective
earth-
ing terminal. An
un
interruptible
safety
earth
ground
must
be
provided
from
the
main
power source
to
the
product
input
wiring terminals, power
cord,
or
supplied power
cord
set. Whenever
it
is likely
that
the
protec-
tion
has
been impaired,
the
product
must
be
made
inoperative
and
be
secured
against
anyunintended operation.
BEFOREAPPLYING POWER-Verify
that
the
computer
system is con-
figured
to
match
the
available
main
power.
Consult
your
system installa-
tion
manuals.
STATICSENSITIVE
DEVICES
-
When
any two materials make contact,
their surfaces
are
crushed
on
the
atomic level
and
electrons pass back
and
forth between
the
objects.
On
separation,
one
surface comes away with ex-
cess electrons (negatively charged) while
the
other
surface is electron defi-
cient (positively charged).
The
level
of
charge that is developed depends
on·the type
of
material. Insulators
can
easilybuild
up
charges in excess
of
20,000 volts. A personworking
at
a
bench
or
walking across a floor
can
build
up
a charge
of
many thousands
of
volts.
The
amount
of
staticvolt-
age developed depends
on
the
rate
of
generation
of
tht.charge
and
the
capacitance
of
the
bodyholding
the
charge.
If
the
discharge
happens
to
go through a semiconductor device
and
the
transient current pulse is not
effectively diverted by protection circuitry, the resulting current flow
through the device can raise
the
temperature
of
internaljunctions
to
their
melting points. MOS structures
are
also susceptible
to
dielectric damage
due
to
high fields.
The
resulting damage
can
range from complete destruction
to
latent
degradation. Small geometrysemiconductor devices
are
especially suscep-
tible to damage by static discharge.
This product contains static devices.
Transport
or
store
the
printed
cir-
cuit
board
assembly in
an
antistatic container.
When
installing
or
remov-
ing the printed circuit
board
assembly,
do
not
touch any components.
Hold
the
board
byits edges. Component replacement operations must
be
performed at a static-free workstation using
proper
anti-static procedures.
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Preface
This
is
the second edition
of
the
HP
27110B CIO/HP-IB Interface Card
Reference Manual. The manual contains information needed to install
and check out the operation
of
the interface card. There are twelve
chapters in the manual:
Chapter 1 General Information-introductory and should
be
read
rust.
Chapter 2 Site Preparation-not applicable to the product covered by
this manual.
Chapter 3 Installation
and
Configuration -should
be
read before
installing the product.
Chapter 4 Preventive Maintenance-read this before attempting any
repairs
or
maintenance
of
the product.
Chapter 5 Functional Description -read when it is necessary to under-
stand the technical operation
of
the product.
Chapter 6 Removal
and
Replacement-refer to this chapterwhen it
is
necessary to remove or replace this product in the host computer.
Chapter 7 Adjustments -refer to this chapter
if
it is considered necesary
to tune the product.
Chapter8 Troubleshooting-refer to this chapter when it is necessary to
diagnose a problem in the product.
Chapter 9 Component Parts-refer to this chapter when it is necessary
to identify a component in the product that must
be
removed and a new
component installed.
Chapter
10
Reference
-lists
information source for the product.
Chapter
11
Product History-compares previous versions of this
product.
Chapter 12 Diagrams -contains functional block and schematic draw-
ings for the product.
9
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10
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Contents
1 General Information
Standard Product . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-1
Specifications
.................................
1-2
Maximum Transfer Rates
........................
1-2
Data
Settling Time
............................
1-2
HP-IB Address
.............................
1-2
HP-IB Signal Line Terminations
....................
1-2
HP-mSignal Line Drivers
......................
.1-2
HP-IB Line Receivers
..........................
1-2
Maximum Cable Length
........................
1-3
Environmental Limits
..........................
1-3
Physical Characteristics
.........................
1-3
Power Requirements
..........................
1-3
HP-IB Supported Functions
.........................
1-4
2 Site Preparation
3 Installation
Unpacking and Examining the HP-IB Card
....
. . . . . . . . . . .
.3-1
Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-1
General Guidelines for HP-IB Configuration
..............
.3-2
Slow-Speed and Medium-Speed Configurations . . . . . . . . . . .3-3
High-Speed Configuration
......................
.3-3
Installation and Checkout
..........................3-
5
Reshipment
...............
. . . . . . . . . . . . . . . . . . .3-8
4 Preventive Maintenance
Preventive Maintenance and Cleaning Instructions . . . . . . . . . . . .4-1
5 Functional Description
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-1
Backplane Interface
............................
.5-2
HP-IB Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-7
DMA
Requirements
............................
5-10
HP-IB Chip
DMA
Read
Timing
...................
5-11
HP-IB Chip
DMA
Write Timing
...................
5-13
Z8 Interface
..............................
5-15
Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-18
Switch Register Interface . . . . . . . . . . . . . . . . . . . . . . . 5-18
11
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12
Revision Code Register . . . . . . . . . . . . . . . . . . . . . . . . 5-19
Z8 Control Signals . . . . . . . . . . . . . . . . . . . . . . . . . . .5-19
SEND:ATN, SEND:EOI, LAST:EOI, and LED:ON
.......
5-20
Interrupts
................................
5-21
Direct Memory Access Interface (DMA)
..............
5-22
DMA
Write
.........................
.....
5-24
DMA
Read
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-25
6 Removal and Replacement
Required Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.6-1
Repair Environment
............................
.6-1
Removal and Replacement Procedures
..................
6-2
7 Adjustments
8 Troubleshooting
Card Self-Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.8-1
LED
Interpretation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-2
9 Replaceable Parts
Replaceable Parts
..............................
9-1
Ordering Parts
...............................
.9-1
10
Reference
HP
Computer Users Documentation Index
...............
10-1
HP-IB Tutorial Description
........................
10-1
11
Product History
12
Diagrams
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1
Standard Product
General Information
The
HP
27110B Hewlett-Packard Interface Bus (HP-IB) Interface
Card
is
Hewlett-Packard's implementation
of
the
IEEE
Standard 488-1978 and
Supplement 488-1978A-19SO.
The
HP
27110B is
an
input/output (I/O)
card and is used with the Hewlett-Packard
HP
9000, Series 500
and
Series
800, computers.
The
HP
27110B can connect up to 14 slow-speed
to
medium-speed
peripheral devices (such as instruments),
or
up
to
eight high-speed
peripheral devices (such as disc drives). (Standard-speed and high-speed
devices can
NOT
be
mixed on the high-speed bus.)
The
HP
27110B supports Command Set
SO
protocol for
HP
CS/SO-based
discs and tape drives.
For
error detection, the
HP
27110B has paritycheck
and
cyclic redundan-
cy
check (CRC) as included features, and a firmware-based self-test is in
read-only-memory (ROM). Parallel-poll mode can
be
programmatically
enabled
or
disabled. A no-listener-detection circuit can
be
enabled
or
dis-
abled with a switch on the
HP
27110B.
The
standard
HP
27110B HP-IB Interface
Card
consists
of
the following
parts:
Item
HP-IB printed circuit card assembly
HP
27110B to HP-IB cable
HP
27110B manual (this manual)
HP
-IB connector backing plate
Part
Number
27110-60301
27110-63001
27110-90005
30070-00043
The
descriptors that identify the
card
are product number,
card
assembly
number, and date code.
The
card assembly number and date code
are
printed on a sticker attached to the card.
General Information
1-1
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Specifications
Maximum Transfer
Rates
Data Settling Time
HP-IB Address
HP-IB Signal Line
Terminations
HP-IB Signal Line
Drivers
HP-IB Line Receivers
1-2
General Information
Medium/Slow-Speed:
High-Speed:
SOO
kilobytes/second
980 kilobytes/second
(Note: transfer
rates
are
host-computer
and
software
dependent)
Medium/Slow-Speed Operation:
High-Speed
Operation:
May
exceed
SOO
ns
(i.e., 2
J.Ls)
3S0 ns maximum
Switch-selectable (set
to
30 decimal when acting as
the
HP-IB
System
Controller).
Without
the
optional
load
resistor
pack
installed
(the
card
configured for
medium/slow-speed operation),
each
of
the
16
HP-IB
signal lines is termi-
nated
with a 2.3K-ohm resistor
to
Vee
and
a 4.7K-ohm resistor
to
com-
mon.
With
the
installation
of
the
load
resistor
pack
for high-speed
operation, signal line termination values
are
changed
except for
the
REN
line, which is
not
affected.
Each
of
the
16
HP
-IB signal lines is driven with a circuit having
the
follow-
ing typical characteristics:
Type:
Output
Voltage, Low State:
Output
Voltage, High State:
Tri-state,
open
collector
O.SV,48mA
2.S
V, -S.2 rnA
Each
of
the
16
HP
-IB signal lines is received with a circuit having
the
fol-
lowing characteristics:
Type:
Threshold, Positive
Transition:
Threshold, Negative
Transition:
Input
Current,
Low State:
Input
Current,
High State:
SchmittTrigger
1.6 V
0.9 V for
data
lines, 1.0 V for
control
lines
-1.3 rnA minimum
to
-3.2
rnA
maximum @ 0.5V
0.7 rnA minimum
to
2.S
rnA
maximum,
between
SV
and
S.5V
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Maximum Cable
Length
Environmental Limits
Physical
Characteristics
Power Requirements
Medium/Slow-Speed Operation:
High-Speed Operation:
Number
of
Devices
1
2
3
4
5
6
7
S (maximum)
Operating
Temperatures:
Operating
Humidity:
Operating
Altitude:
2 metres
per
device connected,
or
20 metres total, whichever is
less
Maximum Total Cable Length
(metres)
S
9
10
11
12
13
14
15
00
to
5SO
Celsius
5%
to
95% relative humidity
at
40
0 Celsius
4600
metres
(15,000 feet)
maximum
(Before operatingthis unit in any extreme environment, consult your
HP
Customer Engineer
or
your nearest
HP
Sales
and
Support
Office.)
Size:
Weight:
I/O
Channel
Connector:
Device
Connector:
Voltage
+5V
Current
1.68 A
172.7
mm
(6.80 inches) long,
172.0
mm
(7.75 inches) wide
265 grams
SO-pin connector,
Jl
26-pin connector, J2
Power Usage
S.4
Watts
General Information
1-3
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HP-IB Supported
Functions
1-4
General Information
The
HP
27ll0B
card
is designed
to
support the following
HP-IB
Interface
Functions as dermedby
the
IEEE
Standard
488-1978.
These
functions
are fully supportedby the
HP
27ll0B
unless
noted
otherwise.
Mnemonic
Cl
C2
C3
C4
C5
Mnemonic
SRI
RL2
PPI
DCl
DTI
ControllerFunctions
System Controller
Send Interface Clear
and
Take
Charge
Send
Remote
Enable
Respond
to
Service
Request
Send Interface Messages, Receive Control, Pass
Contro~
Pass Control to Self, Parallel Poll,
Take
Control Synchronously
Controlled Device Functions
Service Request
Remote
Local
Parallel Poll
Device Clear
Device Trigger
The
following utility functions are provided
to
support the above listed
functions:
Mnemonic
SHI
AHI
Tl
TEl
Ll
LEI
UtilityFunctions
Source Handshake
Acceptor Handshake
Basic Talker, Serial Poll, Talk Only
Basic Extended Talker, Serial Poll, Talk Only,
Unaddress
if
My Listener
Address
and
My Secondary
Address (requires host software support)
Basic Listener, Listen Only
Mode
Basic Extended Listener, Listener Only Mode,
Unaddress
if
My Secondary
Address
and
Talker
Primary
Addressed
State (requires host software
support)
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2
INote I
Site Preparation
There are no site preparation requirements specific to the
HP
27110B HP-
IB interface card. Refer to your computer system manuals for general site
preparation procedures.
Site Preparation
2-1
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2-2
Site
Preparation
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3
Unpacking and
Examining the
HP-IB Card
I
Caution
I
Storage
Installation
This chapter provides information for you to install, configure,
and
verify
correct operation
ofthe
HP
27110B HP-IB Interface card. You will also
need your computer system installation manual for reference.
Many
of
the components ofthe
HP
27110B
are
susceptible to destruction
or
degradation by electrostatic discharge. See the safety considerations
in the front
of
this manual.
To
handle this card, use only the edges
and
extractor levers to avoid damage to components.
Remove the
HP
-IB card from its protective envelope
and
place it on
anti-
static
material in a clean workspace. Inspect the
card
itselffor damage
or
missing parts, andverify the
part
number. Also, check the other sub-
assemblies (cables, etc.) for damage.
If
you store the card for any reason, place it in
an
electrically
and
mechani-
cally safe container.
The
safest place for the
card
is in the computer
card
cage.
If
you must store the card outside
of
the computer, use the original
packaging material
or
have the card packedby a commercial packaging
firm. You must protect the card from static electricity and impact. Place
the package containing the card upright (like a book on a shelf)
to
avoid
crushing.
Installation
3-1
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