HP HP27110B Installation and operating manual

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HP 9000 Series 500 and Series 800 Computer Systems
Hewlett-Packard Company
Roseville Networks Division
8000 Foothills Boulevard
Roseville, California
95678
HP27110B
CIO HP-IB Interface Card
Installation and Reference Manual
r/iPW HEWLETT
a:~ PACKARD
Manual Part Number 27110-90005
E0288
Printedin U.s.A.
February 1988
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2
Printing History
New editions are complete revisions of the manual. Update packages,
which are issued between editions, contain additional and replacement
pages to be merged into the manual by the customer. The dates on the
title page change only when a new edition or a new update is published.
No information is incorporated into a reprinting unless it appears as a
prior update; the edition does not change when an update is incorporated.
Edition 1. . . . . . . . . . . . . . . . . . . . . . . November 1986
Edition 2. . . . . . . . . . . . . . . . . . . . . .. February 1988
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Notice
The information contained in this document is subject to change without
notice.
HEWLEIT-PACKARD COMAPANY MAKES
NO WARRANTY OF ANY
KIND WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT
LIMITED TO, THE IMPLIEDWARRANTIES OF MERCHANT·
ABILI1Y AND FITNESS
FOR A PARTICULAR PURPOSE. Hewlett-
Packardshall not be liable for errors contained herein or for incidental or
consequential damages in connection with the furnishing, performance, or
use of this material.
Hewlett-Packard assumes no responsibility for the use or reliability of its
software
on equipment that is not furnished by Hewlett-Packard.
This document contains proprietaryinformation, which is
protected by
copyright. All rights
are reserved. No part of this document maybe
photocopied, reproduced, or translated into another language without the
prior written consent of Hewlett-Packard Company.
Copyright © 1986,1988 by HEWLEIT-PACKARD COMPANY
3
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4
Notice
For U.S.A. Only
The Federal Communications Commission (in 47 CFR 15.838) has
specified that the following notice be brought to the attention of the users
of this product.
FEDERAL COMMUNICATIONS COMMISSION
RADIO FREQUENCY INTERFERENCE
STATEMENT
Warning: This equipment generates and uses radio frequency energy
and, if not installed and used properly, that is, in strict accordance with
the manufacturer's instructions, may cause interference to radio and
television reception. It has been type tested and found to comply with
the limits for a Class A computing device in accordance with the specifica-
tions in Subpart J of Part 15 of FCC Rules, which are designed to provide
reasonable protection against such interference when operated in a com-
mercial environment. Operation of this equipment in a residential area is
likely to cause interference in which case the user at his own expense will
be required to take whatever measures may be required to correct the
interference.
If this equipment does cause interference to radio or television reception,
which can be determined by turning the equipment offand on, the user is
encouraged to try to correct the interference by one or more of the follow-
ing measures: re-orient the receiving antenna; relocate the equipment
with respect to the receiver; move the equipment away from the receiver;
plug the equipment into a different branch circuit. If necessary, the user
should consult the dealer or authorized field service representative for
additional suggestions. The user may find the following booklet prepared
by the Federal Communications Commission helpful: "How to Identify
and Resolve Radio-TV Interference Problems". This booklet is available
from the U.S. Government Printing Office, Washington, DC 20402. Stock
No. 004-000-00345-4.
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Notice
For JAPAN Only
VCCI
RADIO FREQUENCY INTERFERENCE
STATEMENT
This device is a Class 1 ITE (data processing equipment for use in indus-
trial
and commercial areas), and meets the VCCI standards for prevention
of radio interference in industrial and commercial areas. The operation of
this device in residential or adjacent areas may interfere with radio and
television reception.
Use this device in accordance with its operating manuals.
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6
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General
Safety Symbols
'hi'l,""·)
I Caution I
Servicing
Safety Considerations
This product and related documentation must be reviewed for familiariza-
tion with safety markings before operation.
Instruction manual symbol: the product will
be markedwith this symbol
when it is necessary for the user
to refer to the instruction manual in order
to protect the product against damage.
Indicates hazardous voltages.
Indicates
earth (ground) terminal. This symbol is sometimes used in the
manual to indicate circuit common connected to a grounded chassis.
Thewarning sign denotes a
hazard. It calls attention to a procedure,
practice,or
the like,which, if not correctly performed or adhered to, could
result in injury. Do not proceed beyond a warning sign until the indi-
cated conditions
are fully understood and met.
The caution sign denotes a hazard. It calls attention to an operating proce-
dure, practice, or the like, which, if not correctly performed or adhered to,
could result in damage to
or destruction of part or all of the product. Do
not proceed beyond a caution sign until the indicated conditions are fully
understood
and met.
Any servicing, adjustment, maintenance,
or repair of this product must
be performed only by service-trained personnel.
7
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Grounding
''1,u"n.)
Handling
ICaution I
8
SAFElY EARTH GROUND-The computer onwhich this product is in-
stalledis a safetyclass I
product and is providedwith a protective earth-
ing terminal. An un interruptible safety earth ground must be provided
from
the main power source to the product input wiring terminals, power
cord,
or supplied power cord set. Whenever it is likely that the protec-
tion
has been impaired, the product must be made inoperative and be
secured against anyunintended operation.
BEFOREAPPLYING POWER-Verify
that the computer system is con-
figured
to match the available main power. Consult your system installa-
tion
manuals.
STATICSENSITIVE DEVICES - When any two materials make contact,
their surfaces
are crushed on the atomic level and electrons pass back and
forth between the objects. On separation, one surface comes away with ex-
cess electrons (negatively charged) while
the other surface is electron defi-
cient (positively charged).
The level of charge that is developed depends
on·the type
of material. Insulators can easilybuild up charges in excess of
20,000 volts. A personworking at a bench or walking across a floor can
build up a charge of many thousands of volts. The amount of staticvolt-
age developed depends
on the rate of generation of tht.charge and the
capacitance of the bodyholding the charge. If the discharge happens to
go through a semiconductor device and the transient current pulse is not
effectively diverted by protection circuitry, the resulting current flow
through the device can raise
the temperature of internaljunctions to their
melting points. MOS structures
are also susceptible to dielectric damage
due to high fields.
The resulting damage can range from complete destruction to latent
degradation. Small geometrysemiconductor devices
are especially suscep-
tible to damage by static discharge.
This product contains static devices. Transport or store the printed cir-
cuit
board assembly in an antistatic container. When installing or remov-
ing the printed circuit
board assembly, do not touch any components.
Hold the board byits edges. Component replacement operations must be
performed at a static-free workstation using proper anti-static procedures.
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Preface
This is the second edition of the HP 27110B CIO/HP-IB Interface Card
Reference Manual. The manual contains information needed to install
and check out the operation
of the interface card. There are twelve
chapters in the manual:
Chapter 1 General Information-introductory and should
be read rust.
Chapter 2 Site Preparation-not applicable to the product covered by
this manual.
Chapter 3 Installation
and Configuration -should be read before
installing the product.
Chapter 4 Preventive Maintenance-read this before attempting any
repairs
or maintenance of the product.
Chapter 5 Functional Description -read when it is necessary to under-
stand the technical operation
of the product.
Chapter 6 Removal
and Replacement-refer to this chapterwhen it is
necessary to remove or replace this product in the host computer.
Chapter 7 Adjustments -refer to this chapter
if it is considered necesary
to tune the product.
Chapter8 Troubleshooting-refer to this chapter when it is necessary to
diagnose a problem in the product.
Chapter 9 Component Parts-refer to this chapter when it is necessary
to identify a component in the product that must
be removed and a new
component installed.
Chapter
10 Reference -lists information source for the product.
Chapter
11 Product History-compares previous versions of this
product.
Chapter 12 Diagrams -contains functional block and schematic draw-
ings for the product.
9
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10
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Contents
1 General Information
Standard Product . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-1
Specifications
................................. 1-2
Maximum Transfer Rates
........................ 1-2
Data Settling Time ............................ 1-2
HP-IB Address ............................. 1-2
HP-IB Signal Line Terminations .................... 1-2
HP-mSignal Line Drivers ...................... .1-2
HP-IB Line Receivers .......................... 1-2
Maximum Cable Length
........................ 1-3
Environmental Limits
.......................... 1-3
Physical Characteristics ......................... 1-3
Power Requirements .......................... 1-3
HP-IB Supported Functions ......................... 1-4
2 Site Preparation
3 Installation
Unpacking and Examining the HP-IB Card .... . . . . . . . . . . . .3-1
Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-1
General Guidelines for HP-IB Configuration
.............. .3-2
Slow-Speed and Medium-Speed Configurations . . . . . . . . . . .3-3
High-Speed Configuration ...................... .3-3
Installation and Checkout ..........................3- 5
Reshipment
............... . . . . . . . . . . . . . . . . . . .3-8
4 Preventive Maintenance
Preventive Maintenance and Cleaning Instructions . . . . . . . . . . . .4-1
5 Functional Description
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-1
Backplane Interface
............................ .5-2
HP-IB Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-7
DMA Requirements ............................ 5-10
HP-IB Chip DMA Read Timing ................... 5-11
HP-IB Chip DMA Write Timing ................... 5-13
Z8 Interface
.............................. 5-15
Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-18
Switch Register Interface . . . . . . . . . . . . . . . . . . . . . . . 5-18
11
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12
Revision Code Register . . . . . . . . . . . . . . . . . . . . . . . . 5-19
Z8 Control Signals . . . . . . . . . . . . . . . . . . . . . . . . . . .5-19
SEND:ATN, SEND:EOI, LAST:EOI, and LED:ON
....... 5-20
Interrupts ................................ 5-21
Direct Memory Access Interface (DMA)
.............. 5-22
DMA Write ......................... ..... 5-24
DMA Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-25
6 Removal and Replacement
Required Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-1
Repair Environment ............................ .6-1
Removal and Replacement Procedures
.................. 6-2
7 Adjustments
8 Troubleshooting
Card Self-Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-1
LED Interpretation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-2
9 Replaceable Parts
Replaceable Parts .............................. 9-1
Ordering Parts ............................... .9-1
10 Reference
HP Computer Users Documentation Index ............... 10-1
HP-IB Tutorial Description
........................ 10-1
11 Product History
12 Diagrams
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1
Standard Product
General Information
The HP 27110B Hewlett-Packard Interface Bus (HP-IB) Interface Card is
Hewlett-Packard's implementation of the IEEE Standard 488-1978 and
Supplement 488-1978A-19SO. The HP 27110B is an input/output (I/O)
card and is used with the Hewlett-Packard HP 9000, Series 500 and Series
800, computers.
The HP 27110B can connect up to 14 slow-speed to medium-speed
peripheral devices (such as instruments), or up to eight high-speed
peripheral devices (such as disc drives). (Standard-speed and high-speed
devices can NOT be mixed on the high-speed bus.)
The HP 27110B supports Command Set SO protocol for HP CS/SO-based
discs and tape drives.
For error detection, the HP 27110B has paritycheck and cyclic redundan-
cy check (CRC) as included features, and a firmware-based self-test is in
read-only-memory (ROM). Parallel-poll mode can be programmatically
enabled or disabled. A no-listener-detection circuit can be enabled or dis-
abled with a switch on the HP 27110B.
The standard HP 27110B HP-IB Interface Card consists of the following
parts:
Item
HP-IB printed circuit card assembly
HP 27110B to HP-IB cable
HP 27110B manual (this manual)
HP -IB connector backing plate
Part Number
27110-60301
27110-63001
27110-90005
30070-00043
The descriptors that identify the card are product number, card assembly
number, and date code. The card assembly number and date code are
printed on a sticker attached to the card.
General Information 1-1
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Specifications
Maximum Transfer
Rates
Data Settling Time
HP-IB Address
HP-IB Signal Line
Terminations
HP-IB Signal Line
Drivers
HP-IB Line Receivers
1-2 General Information
Medium/Slow-Speed:
High-Speed:
SOO kilobytes/second
980 kilobytes/second
(Note: transfer rates are host-computer and software dependent)
Medium/Slow-Speed Operation:
High-Speed
Operation:
May exceed SOO ns (i.e., 2 J.Ls)
3S0 ns maximum
Switch-selectable (set
to 30 decimal when acting as the HP-IB System
Controller).
Without
the optional load resistor pack installed (the card configured for
medium/slow-speed operation),
each of the 16 HP-IB signal lines is termi-
nated with a 2.3K-ohm resistor to Vee and a 4.7K-ohm resistor to com-
mon. With the installation of the load resistor pack for high-speed
operation, signal line termination values
are changed except for the REN
line, which is not affected.
Each of the 16 HP -IB signal lines is driven with a circuit having the follow-
ing typical characteristics:
Type:
Output Voltage, Low State:
Output Voltage, High State:
Tri-state, open collector
O.SV,48mA
2.S V, -S.2 rnA
Each of the 16 HP -IB signal lines is received with a circuit having the fol-
lowing characteristics:
Type:
Threshold, Positive
Transition:
Threshold, Negative Transition:
Input Current, Low State:
Input Current, High State:
SchmittTrigger
1.6 V
0.9 V for
data lines, 1.0 V for
control lines
-1.3 rnA minimum
to -3.2 rnA
maximum @ 0.5V
0.7 rnA minimum
to 2.S rnA
maximum, between SV and S.5V
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Maximum Cable
Length
Environmental Limits
Physical
Characteristics
Power Requirements
Medium/Slow-Speed Operation:
High-Speed Operation:
Number of Devices
1
2
3
4
5
6
7
S (maximum)
Operating Temperatures:
Operating Humidity:
Operating Altitude:
2 metres
per device connected,
or 20 metres total, whichever is
less
Maximum Total Cable Length
(metres)
S
9
10
11
12
13
14
15
00 to 5SO Celsius
5% to 95% relative humidity at
40
0 Celsius
4600
metres (15,000 feet)
maximum
(Before operatingthis unit in any extreme environment, consult your HP
Customer Engineer or your nearest HP Sales and Support Office.)
Size:
Weight:
I/O Channel Connector:
Device Connector:
Voltage
+5V
Current
1.68 A
172.7
mm (6.80 inches) long,
172.0 mm (7.75 inches) wide
265 grams
SO-pin connector, Jl
26-pin connector, J2
Power Usage
S.4 Watts
General Information 1-3
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HP-IB Supported
Functions
1-4 General Information
The HP 27ll0B card is designed to support the following HP-IB Interface
Functions as dermedby
the IEEE Standard 488-1978. These functions
are fully supportedby the
HP 27ll0B unless noted otherwise.
Mnemonic
Cl
C2
C3
C4
C5
Mnemonic
SRI
RL2
PPI
DCl
DTI
ControllerFunctions
System Controller
Send Interface Clear and Take Charge
Send Remote Enable
Respond to Service Request
Send Interface Messages, Receive Control, Pass
Contro~ Pass Control to Self, Parallel Poll, Take
Control Synchronously
Controlled Device Functions
Service Request
Remote Local
Parallel Poll
Device Clear
Device Trigger
The following utility functions are provided to support the above listed
functions:
Mnemonic
SHI
AHI
Tl
TEl
Ll
LEI
UtilityFunctions
Source Handshake
Acceptor Handshake
Basic Talker, Serial Poll, Talk Only
Basic Extended Talker, Serial Poll, Talk Only,
Unaddress if My Listener Address and My Secondary
Address (requires host software support)
Basic Listener, Listen Only
Mode
Basic Extended Listener, Listener Only Mode,
Unaddress if My Secondary Address and Talker
Primary
Addressed State (requires host software
support)
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2
INote I
Site Preparation
There are no site preparation requirements specific to the HP 27110B HP-
IB interface card. Refer to your computer system manuals for general site
preparation procedures.
Site Preparation 2-1
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2-2 Site Preparation
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3
Unpacking and
Examining the
HP-IB Card
I Caution I
Storage
Installation
This chapter provides information for you to install, configure, and verify
correct operation ofthe HP 27110B HP-IB Interface card. You will also
need your computer system installation manual for reference.
Many of the components ofthe HP 27110B are susceptible to destruction
or degradation by electrostatic discharge. See the safety considerations
in the front of this manual. To handle this card, use only the edges and
extractor levers to avoid damage to components.
Remove the HP -IB card from its protective envelope and place it on anti-
static material in a clean workspace. Inspect the card itselffor damage or
missing parts, andverify the part number. Also, check the other sub-
assemblies (cables, etc.) for damage.
If you store the card for any reason, place it in an electrically and mechani-
cally safe container. The safest place for the card is in the computer card
cage. If you must store the card outside of the computer, use the original
packaging material or have the card packedby a commercial packaging
firm. You must protect the card from static electricity and impact. Place
the package containing the card upright (like a book on a shelf) to avoid
crushing.
Installation 3-1
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