HP AP-503H Assembly instructions

MF877-00 Page 1
Template Revision B, 18-Nov-2016
HPE instructions for this template are available at MF877-01
Product End-of-Life Disassembly Instructions
Product Category
: Networking
Marketing Name / Model
[List multiple models if applicable.]
AP-503H
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
1
Batteries
All types including standard alkaline and lithium
coin or button style batteries
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers

MF877-00 Page 2
Template Revision B, 18-Nov-2016
HPE instructions for this template are available at MF877-01
Item Description Notes
Quantity
of items
included
in product
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
screwdriver
TT8
tweezers
NA
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Use TT8 screwdriver to remove the 4 screws on chassis.
2. Remove lower cover.
3. Remove 2 antennas with tweezers.
4. Remove PCBA from the upper cover.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

MF877-00 Page 3
Template Revision B, 18-Nov-2016
HPE instructions for this template are available at MF877-01
1. Use TT8 screwdriver to remove 4 screws on the chassis.
2. Remove lower cover.
3. Remove 2 antennas with tweezers.
5. Remove the PCBA from upper cover.