
MF877-00 Page 2
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Item Description Notes
of items
included
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
Description #1 Tamper Resistant Torx screwdriver
Description #2 Tamper Resistant Torx screwdriver
Description #3 Phillips Screwdriver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove accessories.
2. Remove four M5 screws by using T25 Tamper Resistant Torx screwdriver from holder, then remove the holder.
3. Remove eight M5 screws by using T25 Tamper Resistant Torx screwdriver, then remove the Top Cover.
4. Remove five M3 screws by using PH2 Phillips Screwdriver.
5. Remove six Antenna cables from the Antenna Plate by hand, then remove it (include O-ring).
6. Remove ten M3 screws by using PH2 Phillips screwdriver.
7. Remove PSU connector from the PCBA by hand ,then remove the PCBA.
8. Remove five M3 and one M4 screws by using PH2 Phillips screwdriver, then remove the PSU.
9. Remove the air vent.
10. Remove four M3 screws by using T8 Tamper Resistant Torx screwdriver, then remove the GPS Cover.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).