Huawei Ascend G510 User manual

G510 Maintenance Manual
V1.0
Prepared by
Date
Reviewed by
Date
Approved by
Date
Huawei Technologies Co., Ltd.
All rights reserved.

G510 Maintenance Manual V1.0
INTERNAL
2013-01-28
Huawei Confidential
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Change History
Date
Version
Change Reason
Changed
Chapter
Change
Description
Author
2012-11-15
V1.0
Released the first issue.

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Contents
1 Brief Introduction .........................................................................................................................5
1.1 Appearance.......................................................................................................................................................5
1.2 Features............................................................................................................................................................5
2 Applicable Scope and Precautions ............................................................................................7
2.1 Applicable Scope..............................................................................................................................................7
2.2 Precautions.......................................................................................................................................................7
2.3 How to Obtain Product and Repair Information .............................................................................................7
3 Exploded View...............................................................................................................................8
4 Components on the Main PCB .................................................................................................10
5 Software Upgrade .......................................................................................................................13
5.1 Preparing for Upgrade....................................................................................................................................13
5.2 Hardware Connection.....................................................................................................................................13
5.3 Installing the USB Driver...............................................................................................................................14
5.3.1 Performing a Normal Upgrade..............................................................................................................16
5.3.2 Performing a Forcible Upgrade.............................................................................................................18
5.4 Upgrading the G510 Using the microSD Card...............................................................................................18
5.4.1 Performing a Normal Upgrade..............................................................................................................18
5.4.2 Performing a Forcible Upgrade.............................................................................................................20
5.5 Troubleshooting Upgrade Failures .................................................................................................................20
6 Repair Tools .................................................................................................................................22
7 Disassembly Procedure..............................................................................................................24
8 Assembly Procedure...................................................................................................................30
9 Principles and Failure Analysis ...............................................................................................33
9.1 Principle Block Diagram and Introduction.....................................................................................................33
9.2 Baseband Unit................................................................................................................................................34
9.2.1 Power-On Management Circuit ............................................................................................................34
9.2.2 Charging Management Circuit..............................................................................................................39
9.2.3 Clock Circuit.........................................................................................................................................44
9.2.4 Flash Memory Circuit...........................................................................................................................46
9.3 RF Unit...........................................................................................................................................................50

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9.4 Peripheral Circuits..........................................................................................................................................59
9.4.1 LCD Circuit ..........................................................................................................................................59
9.4.2 Vibrator Circuit .....................................................................................................................................63
9.4.3 Receiver and Speaker............................................................................................................................65
9.4.4 Microphone...........................................................................................................................................69
9.4.5 Headset Circuit......................................................................................................................................72
9.4.6 SIM Card Circuit...................................................................................................................................74
9.4.7 I/O Interface Circuit..............................................................................................................................77
9.4.8 microSD Card Port Circuit....................................................................................................................78
9.4.9 FM and Bluetooth Circuit .....................................................................................................................79
10 Solder Points on the PCB Board and BGA Chip.................................................................83
11 Functional Tests.........................................................................................................................94
11.1 Key Introduction...........................................................................................................................................94
11.2 MMI Tests ....................................................................................................................................................95
11.3 Voice Call Test..............................................................................................................................................95

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1 Brief Introduction
1.1 Appearance
Figure 1-1 shows the appearance of the G510.
Figure 1-1 Appearance of the G510
1.2 Features
Item
Description
Dimensions (H x W x D)
9.9 mm x 134 mm x 67 mm (0.39 in. x 5.28 in. x

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Item
Description
2.64 in.)
Technical standard
WCDMA
Frequency bands
GSM: 850/900/1800/1900 MHz
WCDMA: 900/2100 MHz
Weight
About 150g (including the battery)
Form factor
Bar-type
Antenna
Built-in
Charger
Output: 5 V, 1A
Flash memory
ROM: 4 GB
RAM: 768 MB
Camera
Rear camera: 5 MP
Front camera: 0.3 MP
Bluetooth
WCN2243
Bluetooth v2.1
Wi-Fi
802.11b/g/n
Battery
Li-ion battery
1750 mAh
Display
Resolution
854 x 540 pixels
Type
TFT
Color
16 M
Size
4.5 inches
Ports
Charger port
micro-USB connector
USB port
micro-USB connector
microSD card port
microSD card port
Headset jack
3.5 mm
Temperature
Operating temperature: –10ºC to +55ºC
Storage temperature: –40ºC to +70ºC
Operating
humidity
5% to 95% RH

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2 Applicable Scope and Precautions
2.1 Applicable Scope
This document provides repair instructions for technicians at service sites authorized by
Huawei. This maintenance manual is confidential and accessible to authorized service centers
(ASCs) and authorized service providers (ASPs) only. While every effort has been made to
ensure the accuracy of this document, errors may still exist. If you find any mistake or have
any suggestion, contact Huawei's customer service.
2.2 Precautions
Pay attention to the following precautions:
Only qualified technicians are allowed to perform repair and calibration.
Perform all operations in electrostatic discharge (ESD) rooms and wear ESD wrist straps
throughout the operations.
Ensure that all components, screws, and insulators are installed properly after repair and
calibration, and that all cables and wires are installed and connected correctly.
Ensure that the soldering is lead-free and compliant with eco-friendly requirements.
2.3 How to Obtain Product and Repair Information
To obtain product and maintenance information, visit Huawei website at:
http://www.huaweidevice.com/cn/technicaIndex.do
ESD is the main cause of damage to electrostatic-sensitive components. EachASC
must exercise caution to avoid ESD damage and comply with the ESD protection
requirements in this manual.

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3 Exploded View
Figure 3-1 shows the exploded view of the G510.
Figure 3-1 Exploded view of the G510
Figure 3-2 shows the components in the exploded view.
Figure 3-2 Components in the exploded view

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序号
描述
数量
1
TP
1
2
LCD
1
3
Front housing assy
1
4
EARJACK-Mylar
1
5
Front camera
1
6
Rear camera support
1
7
receiver
1
8
Main board
1
9
Rear camera
1
10
Flash FPC
1
11
Volume-power on key FPC
1
12
Speaker
1
13
WIFI antenna
1
14
GPS antenna
1
15
Sim-TF-FPC
1
16
Back housing assy
1
17
Main antenna
1
18
Battery cover
1
NOTE
The components shown in the Figure 3-2 are structural parts of the G510, and cannot be used as
reference when spare parts are requested.

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4 Components on the Main PCB

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The following component list is for reference only. It is subject to changes without notices.
The latest component list is available in Huawei's ITEM information system. If you have any
question, contact your local technical support center.

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No.
BOM
Description
1
39110740
LDO,2.85V,3%,0.3A,DFN,Terminal Dedicated
2
39200332
Power Management
IC(PM8029),3.0~4.4V,140WLNSP(pb-free),Terminal
Dedicated
3
39200151
CDMA RF Transceiver
RTR6500,2.0V~2.17V,68mQFN,Terminal Dedicated
4
40060324
MCP,4GB eMMC,52MHz,1024KB,3.3V/1.8V,FBGA153(Pb
free),4Gb (128M*32) LPDDR1,Terminal Dedicated
5
39200401
Terminal Baseband process IC,WCDMA/GSM Dualmode
BASEBAND PROCESSOR
MSM8225-0,1.2V/1.8V/2.85V,576 NSP(Pb free)
6
47100362
RF gain module,824~849MHz,26.4dB(High
Gain)/14.1dB(Low Gain),3x3, LGA,1000V,Terminal
Dedicated
7
47140032
RF
Switch,824-960MHz/1710--2170MHz,1.2/2.8,1.6/2.8,30/24,Te
rminal Dedicated,TS16949
8
39110620
Power Driver,1.5A LED flash driver IC,CSP,Terminal
Dedicated
9
38140064
Semiconductor Sensor,Accelerometer,LGA,3axis,Terminal
Dedicated
10
38140024
Semiconductor
Sensor,E-Compass,WL-CSP(Pb-free),3axis,Terminal
Dedicated
11
39110626
Switching Regulators,Vin~38V,0.02A,QFN-2*2,SMT,2*2,10
LED Driver,Terminal Dedicated
12
39110566
Switching Regulators,1~4V,1.5A,SMT,Terminal Dedicated
13
39210039
Terminal peripheral IC ,Single Band 2.4GHz WLAN
chip-AR6005,1.3V 1.8V 3.3V,BGA67-16,Terminal Dedicated
14
15040295
Transient Suppression Diode,6V,25V,3A,9 channel TVS+EMI
filter-CSP,Terminal Dedicated
15
14240163
Card Socket,SIM Socket,6PIN,Horizontal,2.54mm,Without
Hold Peg,Without Clip,Pin Tail Length 0mm,SMT,height
1.8mm,Terminal Dedicated
16
14240249
Card Connecter,MicroSD
Receptacle,8pin,PUSH-PUSH,1.1mm,Without Lock,Without
Hold Peg,1.45mm,Terminal Dedicated
17
14240163
Card Socket,SIM Socket,6PIN,Horizontal,2.54mm,Without
Hold Peg,Without Clip,Pin Tail Length 0mm,SMT,height
1.8mm,Terminal Dedicated

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5 Software Upgrade
5.1 Preparing for Upgrade
Category
Item
Remarks
Upgrade
environment
Battery
Two bars or more battery power is remained.
microSD card
512 MB or more.
Computer
Used to copy the upgrade files.
Upgrade package
Main upgrade
package
Provided for reference only. Use the latest
released version.
Customization
package
Upgrade the software using the customization
package provided by the operator.
Upgrade method
Upgrade using the
microSD card
Normal upgrade or forcible upgrade.
5.2 Hardware Connection
Figure 5-1 shows the hardware connection.
Figure 5-1 Hardware connection
U8825-1
便携机 1
PC
USB
cable
Computer

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5.3 Installing the USB Driver
To install the USB driver:
Step 1 Double-click DriverSetup.exe and click Install in the dialog box shown in Figure 5-2, to
start the installation.
Figure 5-2 Installing the USB driver
Figure 5-3 shows the installation progress.
Figure 5-3 Installation progress

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Step 2 After the installation is complete, click Close, as shown in Figure 5-4.
Figure 5-4 Closing the dialog box
Step 3 Power on the G510, connect it to the computer using a USB cable, and click Device Manager
to display the Computer Management window to check that the port information is correct,
as shown in Figure 5-5.
Figure 5-5 Computer Management window

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----End
5.3.1 Performing a Normal Upgrade
To perform a normal upgrade:
Step 1 Power on the G510, and use a USB cable to connect the G510 to the computer on which the
USB driver and 10KNewMu have been installed.
Step 2 Double-click 10KNewMu.
Step 3 Click to display the Open dialog box, select the upgrade file, and click Next, as shown
in Figure 5-6.
Figure 5-6 Select Bin File dialog box
Step 4 Click Scan && Download to start the upgrade, as shown in Figure 5-7.

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Figure 5-7 Starting the upgrade
Figure 5-8 shows the upgrade progress.
Figure 5-8 Upgrade progress
If the upgrade is complete, Download Success is displayed, as shown in Figure 5-9.

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Figure 5-9 Download Success
----End
5.3.2 Performing a Forcible Upgrade
With the G510 powered off, press and hold the power key and the volume up and volume
down keys to drive the G510 to enter forcible upgrade mode. Then perform the steps as you
conduct a normal upgrade.
5.4 Upgrading the G510 Using the microSD Card
5.4.1 Performing a Normal Upgrade
To perform a normal upgrade:
Step 1 Delete the data on the microSD card or format the microSD card.
Step 2 Create a folder dload in the root directory of the microSD card and copy UPDATA.APP
from the main upgrade package to the dload folder.
Step 3 Insert the microSD card into the G510, enter *#*#2846579#*#* on the dialer, and touch
ProjectMenu > Upgrade > Upgrade using microSD card > OK, as shown in Figure 5-10.

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Figure 5-10 Performing a normal upgrade

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The G510 starts to upgrade and then restarts automatically after the upgrade is complete.
----End
5.4.2 Performing a Forcible Upgrade
If the G510 fails to start, perform a forcible upgrade as follows:
Step 1 Delete the data on the microSD card or format the microSD card.
Step 2 Create a folder dload in the root directory of the microSD card and copy UPDATA.APP
from the main upgrade package to the dload folder.
Step 3 With the G510 powered off, press and hold the power key and the volume up and volume
down keys to drive the G510 to enter forcible upgrade mode.
Figure 5-11 shows how to perform a forcible upgrade.
Figure 5-11 Performinga forcible upgrade
The phone restarts automatically after the forcible upgrade is complete.
----End
5.5 Troubleshooting Upgrade Failures
Failure
Solution
(Computer) Failed to
detect the G510.
1. Check that no other driver conflicts with the USB driver for
the upgrade.
2. Check that the USB driver has been properly installed.
3. Check that the USB cable has been properly connected to the
computer.